CN217376458U - Compatible conveying device - Google Patents
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- CN217376458U CN217376458U CN202220989998.2U CN202220989998U CN217376458U CN 217376458 U CN217376458 U CN 217376458U CN 202220989998 U CN202220989998 U CN 202220989998U CN 217376458 U CN217376458 U CN 217376458U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model discloses a compatible conveying device, which comprises at least two discharging conveying mechanisms and material receiving mechanisms, wherein each discharging conveying mechanism is arranged along a first direction in sequence, and one side or two sides of each discharging conveying mechanism are provided with the material receiving mechanisms; the discharge conveying mechanism comprises a main line conveying line and a reversing conveying line, the main line conveying line conveys silicon wafers along a first direction, an accommodating space is formed in the main line conveying line, the reversing conveying line is arranged in the accommodating space, the reversing conveying line is configured to be adjustable in height relative to the conveying surface of the main line conveying line, and the conveying directions of the reversing conveying line and the main line conveying line are perpendicular to each other; the output end of the reversing conveying belt is in butt joint with the material receiving end of the material receiving mechanism, and the reversing conveying belt is used for reversing the silicon wafers conveyed on the main conveying line to receive the materials to the material receiving mechanism, so that the compatible conveying of multiple sub-wafers to the whole wafers of various sizes is realized.
Description
Technical Field
The invention belongs to the field of silicon wafer collection, and particularly relates to a compatible conveying device.
Background
With the continuous enrichment and diversification of the sizes of silicon wafers and the appearance of multiple wafers such as half silicon wafers and three-third silicon wafers, the current requirement on the compatibility of the silicon wafer receiving is higher and higher, and the traditional material boxes compatible with different sizes cannot meet the current compatibility requirement.
Therefore, how to achieve compatible slice collection from multi-slice to whole slice with various sizes is a technical problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
To how to realize the compatible piece of receiving of many burst to whole piece of various sizes, the utility model provides a compatible conveyor:
the compatible conveying device comprises at least two discharging conveying mechanisms and material receiving mechanisms, wherein each discharging conveying mechanism is sequentially arranged along a first direction, and the material receiving mechanisms are arranged on one side or two sides of each discharging conveying mechanism;
the discharge conveying mechanism comprises a main line conveying line and a reversing conveying line, the main line conveying line conveys silicon wafers along a first direction, an accommodating space is formed in the main line conveying line, the reversing conveying line is arranged in the accommodating space, the reversing conveying line is configured to be adjustable in height relative to the conveying surface of the main line conveying line, and the conveying directions of the reversing conveying line and the main line conveying line are perpendicular to each other;
the main line conveying line comprises a first main line conveying belt and a second main line conveying belt which are arranged in parallel, and the distance between the first main line conveying belt and the second main line conveying belt is adjustable; the reversing conveying line comprises at least three reversing conveying belts arranged in parallel, and at least two adjacent reversing conveying belts are configured to convey silicon wafers;
the output end of the reversing conveying belt is in butt joint with the material receiving end of the material receiving mechanism, and the reversing conveying belt is used for reversing the silicon wafers conveyed on the main line conveying line to receive the silicon wafers to the material receiving mechanism.
The reversing conveying line is arranged in the accommodating space by arranging the accommodating space on the main line conveying line, and the silicon wafers are conveyed from the main line conveying line to the material receiving mechanism under the lifting action of the reversing conveying line; the distance between the first main line conveying belt and the second main line conveying belt is designed to be adjustable, compatible conveying from multi-piece to whole pieces of various sizes can be achieved, at least three reversing conveying belts are arranged in parallel, and compatible conveying from multi-piece to whole pieces of various sizes can be achieved during reversing and after reversing.
Optionally, the main line conveying line further includes a first side plate and a second side plate, and the first end of the first side plate and the first end of the second side plate are both provided with a driving wheel; the second end of the first side plate and the second end of the second side plate are both provided with a driven wheel;
at least three grooves are formed in the first side plate and the second side plate, and at least one driven wheel is arranged at the edge of each groove;
the first main line conveyer belt winds the driving wheel and each driven wheel arranged on the first side plate, and the second main line conveyer belt winds the driving wheel and each driven wheel arranged on the second side plate to form an accommodating space.
At least three grooves are formed in the first side plate and the second side plate, so that installation space is provided for at least three reversing conveyor belts, and the reversing conveyor belts are embedded in the main line conveyor line, so that the silicon wafer is better converted from the main line conveyor line to the auxiliary conveyor line; at least one driven wheel is arranged on the edge of each groove, the shape of the main line conveying belt can be limited, and the main line conveying belt is matched with the grooves to form an accommodating space.
Optionally, the main line conveying line further comprises a mounting bracket, a driving mechanism and a sliding mechanism, the first side plate and the second side plate are connected to the mounting bracket in a sliding manner through the sliding mechanism, and two driving ends of the driving mechanism are respectively and fixedly connected with the first side plate and the second side plate and used for driving the first side plate and the second side plate to move away from each other or move close to each other.
The driving mechanism drives the sliding mechanism, and the sliding mechanism drives the first side plate and the second side plate connected with the sliding mechanism to move away from each other or approach each other, so that the distance between the first main line conveying belt and the second main line conveying belt is adjusted, the structure is simple, and the adjustment is simple and stable.
Optionally, the two end parts and the middle part of the reversing conveying line are provided with adsorption mechanisms, and the adsorption mechanisms are arranged between the adjacent reversing conveying belts.
The adsorption mechanism is arranged on the reversing conveying line, so that the stability of the silicon wafer on the reversing conveying line can be improved when the silicon wafer is jacked on the reversing conveying line; the adsorption mechanisms are arranged at the two end parts and the middle part of the reversing conveying line, so that the adsorption uniformity can be improved, the phenomenon that the silicon wafer is partially tilted due to uneven adsorption can be avoided, and the damage to the silicon wafer is reduced.
Optionally, the reversing conveying line further comprises a position sensor, the position sensor is arranged at a side edge of the first reversing conveying belt along the conveying direction of the main line conveying line, and is used for sensing whether the silicon wafers conveyed to the reversing conveying line by the main line conveying line are in place or not;
the reversing conveying line further comprises a supporting plate and a jacking mechanism, the reversing conveying line is installed on the supporting plate, and the jacking mechanism is arranged below the supporting plate and used for driving the supporting plate to lift.
The reversing conveying line is provided with the position sensor, when the silicon wafer is conveyed to the side edge of the first reversing conveying belt from the main line conveying line, the position information of the silicon wafer is sensed in time, the reversing conveying belt is controlled to lift according to the current sensing information, and the reversing of the silicon wafer can be achieved more accurately.
Optionally, an auxiliary conveying line is arranged between the material receiving mechanism and the reversing conveying line, the auxiliary conveying line comprises auxiliary conveying belts with the same number as the reversing conveying belts, at least two adjacent auxiliary conveying belts are configured to convey silicon wafers, the input ends of the auxiliary conveying belts are in butt joint with the output ends of the reversing conveying belts, and the output ends of the auxiliary conveying belts are in butt joint with the material receiving ends of the material receiving mechanism.
By arranging the auxiliary conveying line between the material receiving mechanism and the reversing conveying line, the silicon wafers after reversing can be stably and transitionally conveyed to the material receiving mechanism, and the material receiving quality is further improved.
Optionally, when only two adjacent reversing conveyor belts and two adjacent auxiliary conveyor belts are configured to convey silicon wafers, the center lines of the two adjacent reversing conveyor belts and the center lines of the two adjacent auxiliary conveyor belts are kept collinear.
The central lines of the two adjacent reversing conveying belts and the central lines of the two adjacent auxiliary conveying belts are kept collinear, and particularly, when a multi-minute silicon wafer is conveyed, namely the long edge of the multi-minute silicon wafer is parallel to the conveying direction, the conveying stability of the multi-minute silicon wafer can be improved.
Optionally, the receiving mechanism comprises a compatible material box, a lifting assembly and a receiving plate, the driving end of the lifting assembly is fixedly connected with the receiving plate, the compatible material box is fixedly connected onto the bearing plate through a connecting piece, and the lifting assembly is driven to receive the plate to drive the compatible material box to lift.
The compatible material box is used in the material receiving mechanism to receive multi-piece or whole pieces with different specifications conveyed by the main line conveying line, so that the compatibility of the whole compatible conveying device is ensured. The height of the compatible material box is controlled by the lifting assembly to be adjusted, the height of the compatible material box can be adjusted when the material is received, the height relation of the silicon wafers reversed by the reversing conveying line is matched in real time, and the stability of the received silicon wafers is facilitated.
Optionally, the connecting piece comprises a sliding plate, an installation block and a rotating shaft, the installation block is fixedly installed on the sliding plate, a first end of the rotating shaft is rotatably installed on the installation block, and the other end of the rotating shaft is fixedly connected with the compatible material box;
the top of the lifting assembly is provided with a sensor matched with the rotary triggering frame, and the sensor is configured to judge whether the rotary triggering frame rotates in place.
The rotary trigger frame is arranged on the compatible material box or the second end of the rotating shaft, the sensor matched with the rotary trigger frame is arranged, whether the compatible material box is reset to the original position after rotation or not can be avoided, and the silicon wafer can not normally enter the compatible material box due to the fact that the compatible material box is not reset to the original position, and the silicon wafer is damaged.
Optionally, a direct-current compatible magazine is disposed at a tail end discharge conveying mechanism sequentially arranged along the first direction, and is used for receiving silicon wafers which are not detected, and a material receiving end of the direct-current compatible magazine is arranged in butt joint with an output end of a main line conveying line of the tail end discharge conveying mechanism.
The direct-current compatible material boxes are arranged at the tail end discharging and conveying mechanisms sequentially arranged along the first direction, unfinished silicon wafers sorted and detected due to machine faults, power failure and the like can be received, and the quality of the silicon wafers in the compatible material boxes in the material receiving mechanisms cannot be interfered when the silicon wafers are received into the compatible material boxes of the material receiving mechanisms.
Drawings
Fig. 1 is a schematic view of an embodiment of a compatible conveying device according to the present invention;
fig. 2 is a schematic view of the main line conveying line and the reversing conveying line of the present invention;
fig. 3 is a schematic view of an embodiment of the main line conveying line according to the present invention;
FIG. 4 is another schematic view of FIG. 3;
fig. 5 is a schematic view of an embodiment of the reversing conveyor line of the present invention;
FIG. 6 is a schematic view of the reversing conveyor line of FIG. 5 conveying a whole wafer;
FIG. 7 is a schematic view of the reversing transfer line of FIG. 5 conveying a second multi-segment silicon wafer;
fig. 8 is a schematic view of an embodiment of the auxiliary conveying line of the present invention for conveying a whole silicon wafer;
FIG. 9 is a schematic view of the auxiliary transfer line of FIG. 8 transferring a second multi-divided silicon wafer;
fig. 10 is a schematic view of an embodiment of a material receiving mechanism of the present invention;
FIG. 11 is a side view of FIG. 10;
FIG. 12 is an enlarged partial schematic view of FIG. 10;
FIG. 13 is a schematic view of the first multi-segment silicon wafer of FIG. 10;
FIG. 14 is a schematic view of the second wafer of FIG. 10.
In the figure: a main line conveyor line 100; a first main line conveyor belt 110; a second main line conveyor belt 120; a reversing conveyor line 200; an accommodating space 130; a first groove 131; a second groove 132; a third groove 133; a first side plate 140; a second side plate 150; a drive wheel 160; a driven wheel 170; a mounting bracket 180; a drive mechanism 191; a first link mechanism 1911; a second link mechanism 1912; an adjusting screw 1913; a vertical slide 1914; a vertical slider 1915; a slide mechanism 192; a lateral slide 1921; transverse slide rails 1922; a reversing conveyor line 200; a first diverting conveyor belt 210; a second diverting conveyor belt 220; a third diverting conveyor belt 230; an adsorption mechanism 240; a position sensor 250; a jacking mechanism 260; a pallet 270; an auxiliary conveyor line 300; a first auxiliary conveyor belt 310; a second auxiliary conveyor belt 320; the third auxiliary conveyor belt 330; a whole silicon wafer 400; a first multi-segment silicon wafer 410; a second multi-segment silicon wafer 420; compatible cartridges 500; a first adjusting plate 520; a second adjusting plate 530; a lifting assembly 600; a motor 610; a synchronous belt 620; a connection block 630; a receiving plate 700; a connecting member 800; a sliding plate 810; a mounting block 820; a rotating shaft 830; a rotating trigger frame 840; a top end 841 of the rotating trigger frame; a sensor 850; the dc compatible magazine 900.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention. The described embodiments are some, but not all embodiments of the invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
Aiming at realizing the compatible receiving of multi-piece to whole piece with various sizes, the utility model provides a compatible conveying device, as shown in figure 1, the compatible conveying device comprises at least two discharging conveying mechanisms and a receiving mechanism, each discharging conveying mechanism is arranged along a first direction in sequence, and one side or two sides of each discharging conveying mechanism are provided with the receiving mechanism;
the discharge conveying mechanism comprises a main line conveying line 100 and a reversing conveying line 200, the main line conveying line 100 conveys silicon wafers along a first direction, an accommodating space 130 is formed in the main line conveying line 100, the reversing conveying line 200 is arranged in the accommodating space 130, the reversing conveying line 200 is configured to be adjustable in height relative to the conveying surface of the main line conveying line 100, and the conveying directions of the reversing conveying line 200 and the main line conveying line 100 are perpendicular to each other;
as shown in fig. 3, the main line conveyor line 100 includes a first main line conveyor belt 110 and a second main line conveyor belt 120 which are arranged in parallel, and the distance between the first main line conveyor belt 110 and the second main line conveyor belt 120 is adjustable; the reversing conveying line 200 comprises at least three reversing conveying belts arranged in parallel, and at least two adjacent reversing conveying belts are configured to convey silicon wafers;
the output end of the reversing conveyor belt is in butt joint with the material receiving end of the material receiving mechanism, and the reversing conveyor belt is used for reversing the silicon wafers conveyed on the main line conveying line 100 to receive the silicon wafers to the material receiving mechanism.
The accommodating space 130 is arranged on the main line conveying line 100, the reversing conveying line 200 is arranged in the accommodating space 130, and the silicon wafers are conveyed from the main line conveying line 100 to the material receiving mechanism under the downward lifting action of the reversing conveying line 200; the distance between the first main line conveying belt 110 and the second main line conveying belt 120 is designed to be adjustable, compatible conveying from multi-piece to whole pieces of various sizes can be achieved, at least three reversing conveying belts are arranged in parallel, and compatible conveying from multi-piece to whole pieces of various sizes can be achieved during reversing and after reversing.
Optionally, the main line conveying line 100 further includes a first side plate 140 and a second side plate 150, and a driving wheel 160 is disposed at each of a first end of the first side plate 140 and a first end of the second side plate 150; the second ends of the first and second side plates 140, 150 are each provided with a driven wheel 170;
the first side plate 140 and the second side plate 150 are respectively provided with at least three grooves, and the edge of each groove is provided with at least one driven wheel 170;
the first main line conveyer belt 110 is wound around the driving wheel 160 and the driven wheels 170 on the first side plate 140, and the second main line conveyer belt 120 is wound around the driving wheel 160 and the driven wheels 170 on the second side plate 150, so as to form the accommodating space 130.
As for the number of the grooves on the first side plate 140 and the second side plate 150 and the arrangement of the driven wheels 170 at the grooves, reference may be made to fig. 3, in which three grooves, that is, a first groove 131, a second groove 132, and a third groove 133, are respectively arranged on the first side plate 140 and the second side plate 150, two driven wheels 170 are arranged on the recessed surface of each groove to form the accommodating space 130, and a section of conveying surface supporting the main line conveying line 100 between the driven wheel 170 and the driving wheel 160 is arranged on the right side surface of the first groove 131; a driven wheel 170 is respectively arranged on the left side surface of the first groove 131 and the right side surface of the second groove 132, and a section of conveying surface of the main line conveying line 100 is supported between the two driven wheels 170; a driven wheel 170 is respectively arranged on the left side surface of the second groove 132 and the right side surface of the third groove 133, and a section of conveying surface of the main line conveying line 100 is supported between the two driven wheels 170; a driven pulley 170 is provided on the left side surface of the third groove 133, and a further section of the conveying surface of the main line conveying line 100 is supported between the driven pulley 170 at the second end of the side plate. Of course, fig. 3 is only one embodiment of the present application, and in actual installation, the number of the driven wheels 170 around the groove can be determined according to requirements.
At least three grooves are formed in the first side plate 140 and the second side plate 150, so that installation space is provided for at least three reversing conveyor belts, and the reversing conveyor belts are embedded in the main line conveyor line 100, so that conversion of silicon wafers from the main line conveyor line 100 to the auxiliary conveyor line 300 is realized better; at least one driven wheel 170 is disposed at the edge of each groove, which can limit the shape of the main line conveyor belt to form the accommodating space 130 in cooperation with the groove.
Optionally, as shown in fig. 4, the main line conveying line 100 further includes a mounting bracket 180, a driving mechanism 191, and a sliding mechanism 192, the first side plate 140 and the second side plate 150 are slidably connected to the mounting bracket 180 through the sliding mechanism 192, and two driving ends of the driving mechanism 191 are fixedly connected to the first side plate 140 and the second side plate 150, respectively, for driving the first side plate 140 and the second side plate 150 to move away from or close to each other.
As for the driving mechanism 191 and the sliding mechanism 192 of the present application, referring to fig. 4, first ends of the first side plate 140 and the second side plate 150 are respectively fixed to two lateral sliding blocks 1921, the two lateral sliding blocks 1921 are slidably mounted on lateral sliding rails 1922, second ends of the first side plate 140 and the second side plate 150 are also respectively fixed to the two lateral sliding blocks 1921, and the two lateral sliding blocks 1921 are slidably mounted on the lateral sliding rails 1922. The mounting bracket 180 is further provided with a vertical slide rail 1914, the vertical slide rail 1914 is provided with a vertical slider 1915 in a matching manner, two mounting blocks protrude from two ends of the vertical slider 1915, the adjusting screw 1913 penetrates through the two mounting blocks, two sides of the vertical slider 1915 are respectively connected with a first link mechanism 1911 and a second link mechanism 1912, and the first link mechanism 1911 and the second link mechanism 1912 are respectively connected to two horizontal sliders 1921 fixedly connected to the first ends of the first side plate 140 and the second side plate 150.
When the distance between the first side plate 140 and the second side plate 150 is adjusted, the height of the vertical slider 1915 can be adjusted by only rotating the adjusting screw 1913, and the first side plate 140 and the second side plate 150 are driven to be away from or close to each other by the first link mechanism 1911 and the second link mechanism 1912.
The driving mechanism 191 drives the sliding mechanism, and the sliding mechanism drives the first side plate 140 and the second side plate 150 connected with the sliding mechanism to move away from each other or move close to each other, so that the distance between the first main line conveying belt 110 and the second main line conveying belt 120 is adjusted, and the structure is simple and the adjustment is simple and stable.
Optionally, as shown in fig. 5 to 7, taking the reversing conveyor line 200 as an example, the reversing conveyor line includes three reversing conveyor belts, which are a first reversing conveyor belt 210, a second reversing conveyor belt 220, and a third reversing conveyor belt 230. When the whole silicon wafer 400 is conveyed by the reversing conveyor line 200, the whole silicon wafer 400 is simultaneously carried by the first reversing conveyor belt 210, the second reversing conveyor belt 220 and the third reversing conveyor belt 230; when the first multi-silicon wafer 410 is conveyed by the reversing conveyor line 200, the first multi-silicon wafer 410 is simultaneously carried by the first reversing conveyor belt 210, the second reversing conveyor belt 220 and the third reversing conveyor belt 230; when the second multi-silicon wafer 420 is conveyed by the reversing conveyor line 200, the first multi-silicon wafer 410 is simultaneously carried by the first reversing conveyor belt 210 and the second reversing conveyor belt 220.
Both ends and the middle part of switching-over transfer chain 200 all are provided with adsorption apparatus 240, and adsorption apparatus 240 sets up between adjacent switching-over conveyer belt.
The adsorption mechanism 240 is arranged on the reversing conveying line 200, so that the stability of the silicon wafer on the reversing conveying line 200 when the silicon wafer is jacked up on the reversing conveying line 200 can be improved; the two end parts and the middle part of the reversing conveying line 200 are respectively provided with the adsorption mechanism 240, so that the adsorption uniformity can be improved, the phenomenon that the silicon wafer is partially tilted due to uneven adsorption can be avoided, and the damage to the silicon wafer is reduced.
Optionally, the reversing conveying line 200 further comprises a position sensor 250, and the position sensor 250 is arranged at a side edge of the first reversing conveying belt along the conveying direction of the main line conveying line 100 and used for sensing whether the silicon wafers conveyed to the reversing conveying line 200 from the main line conveying line 100 are in place. The position sensor 850 is arranged on the reversing conveying line 200, when the silicon wafer is conveyed from the main line conveying line 100 to the side edge of the first reversing conveying belt, the position information of the silicon wafer is sensed in time, the reversing conveying belt is controlled to lift according to the current sensing information, and the silicon wafer can be reversed more accurately.
The reversing conveying line 200 further comprises a supporting plate 270 and a jacking mechanism 260, the reversing conveying line 200 is installed on the supporting plate 270, and the jacking mechanism 260 is arranged below the supporting plate 270 and used for driving the supporting plate 270 to lift.
Optionally, as shown in fig. 2, 8 and 9, an auxiliary conveyor line 300 is disposed between the material receiving mechanism and the reversing conveyor line 200, and the auxiliary conveyor line 300 includes auxiliary conveyor belts having the same number as the reversing conveyor belts, for example, three reversing conveyor belts, which are a first auxiliary conveyor belt 310, a second auxiliary conveyor belt 320 and a third auxiliary conveyor belt 330. When the auxiliary conveyor line 300 conveys the whole silicon wafer 400, the first auxiliary conveyor belt 310, the second auxiliary conveyor belt 320 and the third auxiliary conveyor belt 330 jointly carry the whole silicon wafer 400; when the auxiliary conveyor line 300 conveys the first multi-silicon wafer 410, the first auxiliary conveyor belt 310, the second auxiliary conveyor belt 320 and the third auxiliary conveyor belt 330 jointly carry the first multi-silicon wafer 410; when the auxiliary conveyor line 300 conveys the second multi-divided silicon wafer 420, the first multi-divided silicon wafer 410 is carried by the first auxiliary conveyor belt 310 and the second auxiliary conveyor belt 320 together.
At least two adjacent auxiliary conveyor belts are configured to convey silicon wafers, the input ends of the auxiliary conveyor belts are butted with the output ends of the reversing conveyor belts, and the output ends of the auxiliary conveyor belts are butted with the material receiving ends of the material receiving mechanisms.
By arranging the auxiliary conveying line 300 between the material receiving mechanism and the reversing conveying line 200, the silicon wafers after reversing can be stably and transitionally conveyed to the material receiving mechanism, and the material receiving quality is further improved.
Optionally, when only two adjacent reversing conveyor belts and two adjacent auxiliary conveyor belts are configured to convey silicon wafers, the center lines of the two adjacent reversing conveyor belts and the center lines of the two adjacent auxiliary conveyor belts are kept collinear. As shown in fig. 7 and 9, when only the first diverting conveyor belt 210, the second diverting conveyor belt 220, the first auxiliary conveyor belt 310 and the second auxiliary conveyor belt 320 convey silicon chips, such as the second multi-divided silicon chip 420, the center lines of the first diverting conveyor belt 210 and the second diverting conveyor belt 220 are collinear with the center lines of the first auxiliary conveyor belt 310 and the second auxiliary conveyor belt 320.
The central lines of the two adjacent reversing conveying belts and the central lines of the two adjacent auxiliary conveying belts are kept collinear, and particularly, when a multi-minute silicon wafer is conveyed, namely the long edge of the multi-minute silicon wafer is parallel to the conveying direction, the conveying stability of the multi-minute silicon wafer can be improved.
Optionally, as shown in fig. 10 and 11, the material receiving mechanism includes a compatible magazine 500, a lifting assembly 600 and a receiving plate 700, a driving end of the lifting assembly 600 is fixedly connected to the receiving plate 700, the compatible magazine 500 is fixedly connected to the bearing plate through a connecting member 800, and the lifting assembly 600 drives the receiving plate 700 to drive the compatible magazine 500 to ascend and descend.
The compatible material box 500 is used in the material receiving mechanism to receive multi-piece or whole pieces with different specifications conveyed by the main line conveying line 100, so that the compatibility of the whole compatible conveying device is ensured. The height of the compatible material box 500 is controlled by the lifting assembly 600, the height of the compatible material box 500 can be adjusted when receiving materials, the height relation between the compatible material box 500 and the silicon wafers reversed by the reversing conveying line 200 is matched in real time, and the stability of the silicon wafers is facilitated.
Optionally, as shown in fig. 10, the lifting assembly 600 includes a motor 610, a timing belt 620 and a connection block 630, the connection block 630 is fixedly disposed on the timing belt 620, the connection block 630 is fixedly connected to the bearing plate, the motor 610 drives the timing belt 620 to rotate, and the connection block 630 is configured to lift along with the rotation of the timing belt 620.
Adopt this kind of actuating mechanism of motor 610, hold-in range 620 and connecting block 630, go up and down compatible magazine 500, simple structure, the operation is stable.
Optionally, as shown in fig. 12, the connector 800 includes a sliding plate 810, a mounting block 820 and a rotating shaft 830, the mounting block 820 is fixedly mounted on the sliding plate 810, a first end of the rotating shaft 830 is rotatably mounted on the mounting block 820, and the other end of the rotating shaft 830 is fixedly connected to the compatible magazine 500;
the second end of the rotating shaft 830 is fixedly provided with a rotating trigger frame 840, the rotating trigger frame 840 and the compatible magazine 500 synchronously rotate, the top of the lifting assembly 600 is provided with a sensor 850 matched with the rotating trigger frame 840, and the sensor 850 is configured to judge whether the rotating trigger frame 840 rotates to the position. When the compatible material box 500 is reset to the sheet-receiving position, the top end 841 of the rotary trigger rack on the rotating shaft 830 rotates to the position right below the sensor 850, and when the signal of the sensor 850 changes, the rotary trigger rack 840 is shown to be rotated in place, namely, the material box is rotated to be in place.
Of course, a rotating trigger frame 840 may also be fixedly mounted on the compatible magazine 500, the rotating trigger frame 840 and the compatible magazine 500 rotate synchronously, a sensor 850 engaged with the rotating trigger frame 840 is disposed on the top of the lifting assembly 600, and the sensor 850 is configured to determine whether the rotating trigger frame 840 rotates to the proper position. When the compatible material box 500 is reset to the sheet-receiving position, the top end 841 of the rotation trigger rack on the compatible material box 500 rotates to the position right below the sensor 850 along with the material box, and when the signal of the sensor 850 changes, the rotation trigger rack 840 is shown to be rotated in place, namely the material box is rotated to be in place.
The rotation trigger frame 840 is arranged on the compatible material box 500 or the second end of the rotating shaft 830, the sensor 850 matched with the rotation trigger frame 840 is arranged, whether the compatible material box 500 is reset to the original position after rotation or not can be avoided, and the silicon wafer damage caused by the fact that the silicon wafer cannot normally enter the compatible material box 500 because the compatible material box 500 is not reset to the original position can be avoided.
Optionally, the direct-current compatible material boxes 900 are disposed at the tail end discharge conveying mechanisms sequentially arranged along the first direction, and are used for receiving silicon wafers which are not detected, and the material receiving ends of the direct-current compatible material boxes 900 are arranged in butt joint with the output end of the main line conveying line 100 of the tail end discharge conveying mechanism.
The direct-current compatible material box 900 is arranged at the tail end discharging and conveying mechanism which is sequentially arranged along the first direction, silicon wafers which are not finished to be sorted and detected due to machine faults, power failure and the like can be received, and the quality of the silicon wafers in the compatible material box 500 in the material receiving mechanism can not be interfered when the silicon wafers are received into the compatible material box 500 in the material receiving mechanism.
For the compatible magazine 500, the carrying interval of the compatible magazine 500 can be changed by arranging the first and second adjusting plates 520 and 530 on the magazine, and adjusting the positions of the first and/or second adjusting plates 520 and 530.
As shown in fig. 13, when only the adjustment distance of the first adjustment plate 520 on the base is adjusted, a second bearing region is formed between the first adjustment plate 520 and the base, so as to indicate the state of bearing the first multi-component silicon wafer 410, and after the compatible magazine 500 at the lower layer is rotated by 90 degrees, the wafer taking end of the compatible magazine 500 is close to an operator, so as to conveniently take out the first multi-component silicon wafer 410.
As shown in fig. 14, when only the adjusting distance of the second adjusting plate 530 on the base is adjusted, a third bearing region is formed between the second adjusting plate 530 and the base, so as to indicate the state of bearing the second multi-silicon wafer 420, and after the compatible magazine 500 at the lower layer is rotated by 90 degrees, the wafer taking end of the compatible magazine 500 is close to the operator, so as to conveniently take out the second multi-silicon wafer 420.
The invention will be described in detail hereinafter with reference to the drawings and embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The invention and its embodiments have been described above schematically, without limitation, and the embodiments shown in the drawings are only one of the embodiments of the invention, and the actual structure is not limited thereto. Therefore, if a person skilled in the art receives the teachings of the present invention, without inventive design, a similar structure and an embodiment to the above technical solution should be covered by the protection scope of the present patent.
Claims (10)
1. A compatible conveying device is characterized by comprising at least two discharging conveying mechanisms and material receiving mechanisms, wherein each discharging conveying mechanism is sequentially arranged along a first direction, and the material receiving mechanisms are arranged on one side or two sides of each discharging conveying mechanism;
the discharge conveying mechanism comprises a main line conveying line and a reversing conveying line, the main line conveying line conveys silicon wafers along the first direction, an accommodating space is formed in the main line conveying line, the reversing conveying line is arranged in the accommodating space, the reversing conveying line is configured to be adjustable in height relative to a conveying surface of the main line conveying line, and the conveying directions of the reversing conveying line and the main line conveying line are perpendicular to each other;
the main line conveying line comprises a first main line conveying belt and a second main line conveying belt which are arranged in parallel, and the distance between the first main line conveying belt and the second main line conveying belt is adjustable; the reversing conveying line comprises at least three reversing conveying belts arranged in parallel, and at least two adjacent reversing conveying belts are configured to convey silicon wafers;
the output end of the reversing conveying belt is in butt joint with the material receiving end of the material receiving mechanism, and the reversing conveying belt is used for reversing the silicon wafers conveyed on the main line conveying line to receive the silicon wafers to the material receiving mechanism.
2. The compatible conveying device according to claim 1, wherein the main line conveying line further comprises a first side plate and a second side plate, and a driving wheel is arranged at each of a first end of the first side plate and a first end of the second side plate; a driven wheel is arranged at each of the second end of the first side plate and the second end of the second side plate;
the first side plate and the second side plate are both provided with at least three grooves, and the edge of each groove is provided with at least one driven wheel;
the first main line conveying belt is wound on the driving wheel and each driven wheel on the first side plate, and the second main line conveying belt is wound on the driving wheel and each driven wheel on the second side plate, so that the accommodating space is formed.
3. The compatible conveying device according to claim 2, wherein the main line conveying line further comprises a mounting bracket, a driving mechanism and a sliding mechanism, the first side plate and the second side plate are slidably connected to the mounting bracket through the sliding mechanism, and two driving ends of the driving mechanism are fixedly connected to the first side plate and the second side plate respectively and used for driving the first side plate and the second side plate to move away from or close to each other.
4. The compatible conveying device according to claim 1, wherein the two end parts and the middle part of the reversing conveying line are provided with adsorption mechanisms, and the adsorption mechanisms are arranged between the adjacent reversing conveying belts.
5. The compatible conveying device according to claim 1, wherein the reversing conveying line further comprises a position sensor, the position sensor is arranged on the side edge of the first reversing conveying belt along the conveying direction of the main conveying line and is used for sensing whether the silicon wafers conveyed to the reversing conveying line by the main conveying line are in place;
the reversing conveying line further comprises a supporting plate and a jacking mechanism, the reversing conveying line is installed on the supporting plate, and the jacking mechanism is arranged below the supporting plate and used for driving the supporting plate to lift.
6. The compatible conveying device according to claim 1, wherein an auxiliary conveying line is arranged between the material receiving mechanism and the reversing conveying line, the auxiliary conveying line comprises the same number of auxiliary conveying belts as the reversing conveying belt, at least two adjacent auxiliary conveying belts are configured to convey silicon wafers, the input ends of the auxiliary conveying belts are butted with the output ends of the reversing conveying belts, and the output ends of the auxiliary conveying belts are butted with the material receiving end of the material receiving mechanism.
7. The compliant transport apparatus of claim 2 wherein the centerlines of two adjacent commutating conveyor belts remain collinear with the centerlines of two adjacent auxiliary conveyor belts when only two adjacent commutating conveyor belts, two adjacent auxiliary conveyor belts are configured to transport silicon wafers.
8. The compatible conveying device according to claim 1, wherein the material receiving mechanism comprises a compatible magazine, a lifting assembly and a receiving plate, the driving end of the lifting assembly is fixedly connected with the receiving plate, the compatible magazine is fixedly connected to the receiving plate through a connecting piece, and the lifting assembly drives the receiving plate to drive the compatible magazine to lift.
9. The compatible conveying device according to claim 8, wherein the connecting member comprises a sliding plate, a mounting block and a rotating shaft, the mounting block is fixedly mounted on the sliding plate, a first end of the rotating shaft is rotatably mounted on the mounting block, and the other end of the rotating shaft is fixedly connected with the compatible magazine;
the top of the lifting assembly is provided with a sensor matched with the rotary trigger frame, and the sensor is configured to judge whether the rotary trigger frame rotates in place.
10. The compatible conveying device according to claim 1, wherein a direct current compatible magazine is arranged at a tail end discharge conveying mechanism arranged in sequence along the first direction and used for receiving silicon wafers which are not detected completely, and a material receiving end of the direct current compatible magazine is arranged in butt joint with an output end of a main line conveying line of the tail end discharge conveying mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220989998.2U CN217376458U (en) | 2022-04-24 | 2022-04-24 | Compatible conveying device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220989998.2U CN217376458U (en) | 2022-04-24 | 2022-04-24 | Compatible conveying device |
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| CN217376458U true CN217376458U (en) | 2022-09-06 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117585424A (en) * | 2024-01-18 | 2024-02-23 | 宁德时代新能源科技股份有限公司 | Conversion conveying equipment and production line |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117585424A (en) * | 2024-01-18 | 2024-02-23 | 宁德时代新能源科技股份有限公司 | Conversion conveying equipment and production line |
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