CN217369559U - Surface dust removal device for semiconductor chip packaging - Google Patents
Surface dust removal device for semiconductor chip packaging Download PDFInfo
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- CN217369559U CN217369559U CN202220333393.8U CN202220333393U CN217369559U CN 217369559 U CN217369559 U CN 217369559U CN 202220333393 U CN202220333393 U CN 202220333393U CN 217369559 U CN217369559 U CN 217369559U
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Abstract
The utility model belongs to the technical field of the chip, especially, be a surface dust collector for semiconductor chip encapsulation, which comprises a fixing plate and i, the both sides on fixed plate surface are provided with mount and mounting bracket respectively, the both sides fixed mounting at fixed plate top has electronic slide rail, electronic slide rail is provided with the movable plate through built-in slider, the both sides on mounting bracket surface are provided with elevating gear, elevating gear's top is provided with the fly leaf. When the dust cleaning device is used, the chip is firstly placed on the movable plate, then the electric sliding rail is started to drive the movable plate to move, the movable plate moves to the lower portion of the mounting frame, then the lifting device is started to enable the soft brush disc to be in surface contact with the chip, then the soft brush disc is driven by the motor to rotate, dust on the surface of the chip is cleaned, then the movable plate is moved to the lower portion of the fixing frame, the suction machine is started to suck dust into the waste bin, and therefore the dust on the surface of the chip is cleaned more thoroughly.
Description
Technical Field
The utility model belongs to the technical field of the chip, concretely relates to a surface dust collector for semiconductor chip encapsulation.
Background
The invention relates to a method for miniaturizing circuits (mainly comprising semiconductor equipment, passive components and the like) in electronics, wherein the circuits are manufactured on the surface of a semiconductor wafer frequently, after transistors are invented and produced in large quantities, various solid-state semiconductor components such as diodes, transistors and the like are used in large quantities, the functions and roles of vacuum tubes in the circuits are replaced, the semiconductor manufacturing technology is advanced in the middle and later 20 th century, so that integrated circuits are possible, compared with the manual assembly of circuits by using individual discrete electronic components, the integrated circuits can integrate a large number of micro-transistors into a small chip, the large progress is realized, the mass production capacity and the reliability of the integrated circuits are improved, and the modularized method of circuit design ensures that the standardized integrated circuits are quickly adopted to replace the design of discrete transistors.
In the process of manufacturing and packaging the chip, the surface of the chip must be ensured not to have dust, so that the surface of the chip needs to be subjected to dust removal operation, but the dust on the surface of the chip cannot be completely cleaned up only by adsorption treatment.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a surface dust collector for semiconductor chip encapsulation has solved the not thorough problem of chip surface dust clearance.
In order to achieve the above object, the utility model provides a following technical scheme: a surface dust removing device for semiconductor chip packaging comprises a fixing plate, wherein a fixing frame and a mounting frame are respectively arranged on two sides of the surface of the fixing plate, electric slide rails are fixedly arranged on two sides of the top of the fixed plate, a movable plate is arranged on each electric slide rail through a built-in slide block, the two sides of the surface of the mounting rack are provided with a lifting device, the top of the lifting device is provided with a movable plate, the top of the movable plate is provided with a motor, the motor is provided with a soft brush disc through a rotating shaft at the output end, the top of the mounting rack is provided with a fixed groove, the top of the fixed rack is fixedly provided with a dust absorption port, a waste box is fixedly arranged in the middle of the bottom of the fixed plate, dust suction pipes are fixedly arranged on two sides of the surface of the waste box, and one end of the dust suction pipe is fixedly connected with the dust suction port, and the suction machine is fixedly mounted in the middle of the bottom of the waste bin.
Preferably, elevating gear includes the fixed block, the top fixed mounting of fixed block has electric putter, and electric putter's top and the bottom fixed connection of fly leaf, and electric putter is provided with four.
Preferably, the surface of the moving plate is provided with five placing grooves, and the placing grooves are regular rectangles.
Preferably, the motor and the soft brush disk are provided with three groups, and the soft brush disk is disc-shaped.
Preferably, fixed mounting has the supporting leg all around of fixed plate bottom, and the supporting leg is provided with four, and the bottom of supporting leg is discoid.
Preferably, the bottom of mount and mounting bracket all is provided with fixing bolt, and mount and mounting bracket all are connected through fixing bolt and the bottom of fixed plate.
Preferably, a filter screen is arranged between the suction machine and the waste bin, and two dust suction pipes are arranged.
Compared with the prior art, the beneficial effects of the utility model are that:
when using, can at first put the chip on the movable plate, then start electronic slide rail and drive the movable plate and remove for the movable plate removes to the below of mounting bracket, then start elevating gear makes soft brush dish and chip surface contact, later rethread motor drive soft brush dish rotates, clears up the dust on chip surface, later removes the movable plate to the mount below again, and starts the auto sucking machine and inhales the dust into the waste bin, thereby guarantees more thoroughly to the dust clearance on chip surface.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a first three-dimensional structure diagram of the present invention;
FIG. 2 is a second perspective structural view of the present invention;
fig. 3 is a sectional view of the mounting rack of the present invention.
In the figure: 1. a fixing plate; 2. a fixed mount; 3. a motor; 4. a movable plate; 5. a placement groove; 6. moving the plate; 7. an electric slide rail; 8. an electric push rod; 9. a dust collection pipe; 10. supporting legs; 11. fixing the bolt; 12. a mounting frame; 13. a material suction machine; 14. a waste bin; 15. a fixed block; 16. a soft brush disc; 17. fixing grooves; 18. a dust suction port.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides the following technical solutions: a surface dust removal device for semiconductor chip packaging comprises a fixed plate 1, wherein two sides of the surface of the fixed plate 1 are respectively provided with a fixed frame 2 and an installation frame 12, two sides of the top of the fixed plate 1 are fixedly provided with electric slide rails 7, the electric slide rails 7 are provided with movable plates 6 through built-in sliders, two sides of the surface of the installation frame 12 are provided with lifting devices, the top of each lifting device is provided with a movable plate 4, the top of each movable plate 4 is provided with a motor 3, the motor 3 is provided with a soft brush disc 16 through a rotating shaft of an output end, the top of the installation frame 12 is provided with a fixed groove 17, the top of the fixed frame 2 is fixedly provided with a dust suction port 18, the middle of the bottom of the fixed plate 1 is fixedly provided with a waste box 14, two sides of the surface of the waste box 14 are fixedly provided with dust suction pipes 9, and one end of the dust suction pipe 9 is fixedly connected with the dust suction port 18, and the middle of the bottom of the waste bin 14 is fixedly provided with the suction machine 13.
When the device is used, the chip can be firstly placed on the placing groove 5 of the movable plate 6, the device has the effect of facilitating the placement of the chip, the chip can be prevented from being stirred by the rotation of the soft brush disc 16, a plurality of chips can be placed at one time, the working efficiency of the device can be improved, then the electric slide rail 7 is started to drive the movable plate 6 to move, the movable plate 6 is moved to the lower part of the mounting frame 12, then the electric push rod 8 is started to drive the movable plate 4 to move downwards, the soft brush disc 16 is in contact with the surface of the chip, then the soft brush disc 16 is driven to rotate by the starting motor 3, the dust on the surface of the chip is cleaned, then the movable plate 6 is moved to the lower part of the mounting frame 2, the suction machine 13 is started to suck the dust into the waste bin 14 through the dust suction port 18 and the dust suction pipe 9, and the more thorough cleaning of the dust on the surface of the chip is ensured, and because motor 3 and pappus brush dish 16 all are provided with three groups, when the dust on clearance chip surface, motor 3 and pappus brush dish 16 can start simultaneously, thereby guarantee more thoroughly of dust clearance, it is cleaner, and the setting of supporting leg 10 then can provide good support nature for fixed plate 1, guarantee the stability of device at the operation in-process, and mount 2 and mounting bracket 12 all install the bottom at fixed plate 1 through fixing bolt 11, have the advantage of being convenient for install, and the filter screen that sets up between auto sucking machine 13 and dump bin 14, then can prevent that the dust from getting into auto sucking machine 12, avoid causing the harm to auto sucking machine 13, all consumer all supply power through external power supply in this device.
In an aspect of this embodiment, when placing the chip on movable plate 6, can place the chip in the inside of corresponding standing groove 5, thereby have the effect that makes things convenient for the chip to place, can also prevent that the rotation of soft brush dish 16 from stirring the chip, and can once only place a plurality of chips, can hoisting device's work efficiency, and hoisting device's setting then can be convenient for make the surface of soft brush dish 16 and chip contact, only need start electric putter 8 when using drive fly leaf 4 downstream can, and is easy operation, the advantage of being convenient for realize.
In an aspect of this embodiment, and because motor 3 and pappus brush dish 16 all are provided with three groups, when the dust on clearance chip surface, motor 3 and pappus brush dish 16 can start simultaneously to guarantee the more thorough of dust clearance, cleaner, and the setting of supporting leg 10 then can provide good support nature for fixed plate 1, guarantees the stability of device in the operation, and is discoid because the bottom of supporting leg 10 is, so can guarantee the stability of support.
In an aspect of this embodiment, and mount 2 and mounting bracket 12 are all installed in the bottom of fixed plate 1 through fixing bolt 11, have the advantage of being convenient for install, and can also guarantee the fastness of mount and mounting bracket 12 installation, and the filter screen that sets up between auto sucking machine 13 and waste bin 14, then can prevent that the dust from getting into auto sucking machine 12, avoid causing the harm to auto sucking machine 13, and dust absorption pipe 9 is provided with two, then can guarantee the work efficiency of dust absorption operation, and this device simple structure, be convenient for realize.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A surface dust collector for semiconductor chip package, includes fixed plate (1), its characterized in that: the dust collector is characterized in that a fixing frame (2) and a mounting frame (12) are respectively arranged on two sides of the surface of the fixing plate (1), electric sliding rails (7) are fixedly arranged on two sides of the top of the fixing plate (1), a movable plate (6) is arranged on each electric sliding rail (7) through a built-in sliding block, a lifting device is arranged on two sides of the surface of the mounting frame (12), a movable plate (4) is arranged on the top of each lifting device, a motor (3) is arranged on the top of each movable plate (4), a soft brush disc (16) is arranged on each motor (3) through a rotating shaft of an output end, a fixing groove (17) is formed in the top of the mounting frame (12), a dust suction port (18) is fixedly arranged on the top of the fixing frame (2), a waste box (14) is fixedly arranged in the middle of the bottom of the fixing plate (1), and dust suction pipes (9) are fixedly arranged on two sides of the surface of the waste box (14), and one end of the dust suction pipe (9) is fixedly connected with the dust suction port (18), and the middle of the bottom of the waste box (14) is fixedly provided with a suction machine (13).
2. The surface dust removing device for the semiconductor chip package according to claim 1, wherein: the lifting device comprises a fixing block (15), electric push rods (8) are fixedly mounted at the top of the fixing block (15), the top of each electric push rod (8) is fixedly connected with the bottom of the corresponding movable plate (4), and four electric push rods (8) are arranged.
3. The surface dust removing device for the semiconductor chip package according to claim 1, wherein: the surface of the moving plate (6) is provided with five placing grooves (5), and the placing grooves (5) are regular rectangles.
4. The surface dust removing device for the semiconductor chip package according to claim 1, wherein: the motor (3) and the soft brush disc (16) are provided with three groups, and the soft brush disc (16) is disc-shaped.
5. The surface dust removing device for the semiconductor chip package according to claim 1, wherein: fixed mounting has supporting leg (10) all around of fixed plate (1) bottom, and supporting leg (10) are provided with four, and the bottom of supporting leg (10) is discoid.
6. The surface dust removing device for the semiconductor chip package according to claim 1, wherein: the bottom of mount (2) and mounting bracket (12) all is provided with fixing bolt (11), and mount (2) and mounting bracket (12) all are connected with the bottom of fixed plate (1) through fixing bolt (11).
7. The surface dust removing device for the semiconductor chip package according to claim 1, wherein: a filter screen is arranged between the suction machine (13) and the waste box (14), and two dust suction pipes (9) are arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220333393.8U CN217369559U (en) | 2022-02-18 | 2022-02-18 | Surface dust removal device for semiconductor chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220333393.8U CN217369559U (en) | 2022-02-18 | 2022-02-18 | Surface dust removal device for semiconductor chip packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217369559U true CN217369559U (en) | 2022-09-06 |
Family
ID=83100062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220333393.8U Active CN217369559U (en) | 2022-02-18 | 2022-02-18 | Surface dust removal device for semiconductor chip packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217369559U (en) |
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2022
- 2022-02-18 CN CN202220333393.8U patent/CN217369559U/en active Active
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