CN114833660A - Wafer thinning equipment and use method thereof - Google Patents
Wafer thinning equipment and use method thereof Download PDFInfo
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- CN114833660A CN114833660A CN202210556391.XA CN202210556391A CN114833660A CN 114833660 A CN114833660 A CN 114833660A CN 202210556391 A CN202210556391 A CN 202210556391A CN 114833660 A CN114833660 A CN 114833660A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention discloses a wafer thinning device and a using method thereof, relates to the technical field of wafer processing, and comprises a base, a grinding mechanism, a liquid pumping mechanism and a liquid sucking assembly. According to the invention, the wafer is thinned and ground through the work of the grinding mechanism, the liquid pumping mechanism can be driven to work while grinding, and further, when thinning and grinding are carried out, polishing liquid and waste materials generated by grinding enter the liquid suction assembly under the action of centrifugal force generated by rotation of the grinding mechanism and the turntable and the suction force of the liquid pumping mechanism, so that the top of the wafer is prevented from being damaged by the waste materials generated by grinding, the ground wafer cannot be used, resource waste is caused, the flow rate of the polishing liquid can be increased to a certain extent, ground products can be timely separated from the processing surface, the temperature of the processing area can be reduced, the temperature of the processing surface is relatively consistent, better surface quality is obtained, the quality of the thinned wafer is ensured, and convenience is brought to personnel.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to wafer thinning equipment and a using method thereof.
Background
Advances in integrated circuit manufacturing technology have been derived primarily from market demands and secondarily from competing demands. In the manufacture of integrated circuits, semiconductor silicon materials are important base materials of integrated circuits due to abundant resources, low manufacturing cost and good manufacturability. From the perspective of the cross-sectional structure of the integrated circuit, most integrated circuits are fabricated on a shallow surface layer of silicon substrate material. Due to the requirements of the manufacturing process, high requirements are put on the dimensional accuracy, geometric accuracy, surface cleanliness and surface micro-lattice structure of the wafer. Therefore, in hundreds of technological processes, thinner wafers cannot be adopted, and only wafers with certain thickness can be used for transferring and flowing in the technological process. It is often necessary to remove a certain thickness of excess substrate material from the back side of the wafer prior to packaging of the integrated circuit. The process is called as a wafer back thinning process, and the corresponding equipment is a wafer thinning machine. The wafer substrate is thinned in a thinning/grinding mode, and the heat dissipation effect of the chip is improved. The thinning to a certain thickness is beneficial to the later packaging process.
At present, when the existing wafer thinning equipment is used, the surface of a wafer cannot be subjected to blowing treatment, so that the surface of the wafer is damaged by residual dust particles during thinning operation, waste liquid generated by grinding cannot be effectively absorbed during grinding, impurities generated by grinding can also damage the wafer, and unnecessary loss is caused.
Disclosure of Invention
The invention aims to solve the problems that in the prior art, the surface of a wafer cannot be subjected to blowing treatment, so that the surface of the wafer is damaged by residual dust particles during thinning operation, waste liquid generated during grinding cannot be effectively absorbed during grinding, and impurities generated during grinding can also damage the wafer to cause unnecessary loss.
In order to achieve the purpose, the invention adopts the following technical scheme:
a wafer thinning apparatus comprising:
the grinding device comprises a base, wherein four corners at the bottom of the base are fixedly connected with supporting legs, the middle position of the bottom of the inner side wall at the top of the base is fixedly connected with a rotating motor, an output shaft of the rotating motor is fixedly connected with a turntable, the top of the base is symmetrically and fixedly connected with a guide rail, the opposite sides of the guide rail are slidably connected with electric lifting plates, the top of each electric lifting plate is fixedly connected with a grinding mechanism, and the grinding mechanism is used for grinding wafers and providing partial power for the work of the equipment;
the liquid pumping mechanism is arranged inside the electric lifting plate, is driven by the grinding mechanism and is used for providing power for liquid pumping during grinding;
the clamping mechanism is arranged at the top of the base and is used for clamping a wafer and performing purging operation;
the liquid suction assembly is installed in the base and communicated with the liquid pumping mechanism.
Preferably, the grinding mechanism comprises a driving motor, a rotating shaft, a grinding disc, a liquid tank, a liquid injection hole and a guide groove; the output of driving motor with the top fixed connection of pivot, the bottom of pivot with the top middle part position fixed connection of abrasive disc, the top of abrasive disc with the bottom fixed connection of liquid case, annotate the liquid hole and set up the bottom of liquid case, annotate the liquid hole and run through the top of abrasive disc extends to the bottom of abrasive disc, the guide slot is seted up the bottom of abrasive disc.
Preferably, the liquid pumping mechanism comprises fan blades, an exhaust pipe, a filter screen, a connecting groove, a connecting pipe and a splicing pipe; the flabellum sets up the inside of blast pipe, the top of blast pipe with the bottom fixed connection of filter screen, the opposite end of spread groove with the inside wall fixed connection of blast pipe, the top of connecting pipe with the bottom fixed connection of spread groove, the one end lateral wall of grafting pipe with the connecting pipe is kept away from the one end inside wall looks adaptation of spread groove.
Preferably, the clamping mechanism comprises an electric sliding chute, an electric sliding block, a clamping ring, an air bag, an air blowing pipe, an air bin and a blowing hole; the inner side wall of the electric sliding groove is connected with the outer side wall of the electric sliding block in a sliding mode, the opposite side of the electric sliding block is fixedly connected with the opposite side of the clamping ring, the outer side wall of the air bag is fixedly connected with the opposite side of the electric sliding block, one end of the air blowing pipe is fixedly connected with one side, close to the electric sliding block, of the air bag, the inner side wall of the air bin is fixedly connected with the other end, far away from the air bag, of the air blowing pipe, the blowing holes are formed in the opposite side of the clamping ring, and the blowing holes penetrate through the side wall of the clamping ring and extend into the air bin.
Preferably, the pipetting assembly comprises a pipette hole, a pipette, a liquid storage ring and a drain; the end part of the liquid suction hole is fixedly connected with one end of the liquid suction pipe, the other end of the liquid suction pipe, which is far away from the liquid suction hole, is fixedly connected with the top of the liquid storage ring, and the bottom of the liquid storage ring is fixedly connected with the bottom of the liquid discharge pipe.
Preferably, the rotating shaft penetrates through the top of the electric lifting plate and extends to the bottom of the grinding disc, the grinding disc is opposite to the top of the rotary disc, the bottom of the rotary disc is rotatably connected with the top of the base, and the rotating directions of the driving motor and the rotating motor are opposite.
Preferably, the inside wall of flabellum with the lateral wall fixed connection of pivot, the middle part position of filter screen with the lateral wall of pivot rotates to be connected, the top of filter screen with driving motor's bottom fixed connection, the spread groove is seted up the inside of electric lift board, connecting pipe fixed connection be in electric lift board's bottom both ends.
Preferably, the electric sliding groove is formed in the top of the base, the opposite side of the clamping ring is fixedly connected with a rubber cushion, the bottom of the clamping ring is attached to the top of the rotating disc and can slide, the air blowing pipe is fixedly connected inside the electric sliding block, and the other side, far away from the electric sliding block, of the air bag is fixedly connected with the inner side wall of the electric sliding groove.
Preferably, the liquid suction hole penetrates through the clamping ring and the electric sliding block, one end of the liquid suction pipe close to the liquid suction hole is fixedly connected with the bottom of the electric sliding block, the liquid storage ring is fixedly connected inside the base, and the outer side wall of the liquid storage ring is fixedly connected with the other end, far away from the connecting pipe, of the insertion pipe.
A use method of wafer thinning equipment comprises the following steps:
firstly, a wafer is placed on the top of a turntable, and then a clamping mechanism is started to clamp and blow the wafer;
after the wafer is clamped, the electric lifting plate can be started to drive the grinding mechanism and the liquid pumping mechanism to move downwards;
until the bottom of the grinding mechanism is attached to the top of the wafer, the liquid pumping mechanism is combined;
then, the grinding mechanism can be started to thin the top of the wafer, and the rotating motor is started to drive the turntable while the top of the wafer is thinned, so that the rotation directions of the wafer and the grinding mechanism are opposite;
the grinding mechanism drives the liquid pumping mechanism to work, so that the liquid suction assembly sucks waste liquid generated by grinding of the grinding mechanism into the liquid suction assembly under the action of the liquid pumping mechanism;
in the thinning process, the electric lifting plate slowly moves downwards until the electric lifting plate is ground to a specified position;
after the thinning is finished, waste liquid sucked in the liquid suction assembly can be discharged, so that the grinding mechanism and the clamping mechanism reset, and the thinned wafer is taken down.
Compared with the prior art, the invention has the beneficial effects that:
1. when the invention is used for thinning and grinding the wafer, the thinning and grinding operation is carried out on the wafer through the work of the grinding mechanism, the liquid pumping mechanism can be driven to work while grinding, further, when thinning and grinding are carried out, the polishing liquid and the waste materials generated by grinding enter the liquid absorbing component under the action of the centrifugal force generated by the rotation of the grinding mechanism and the turntable, so that the liquid absorbing component pumps the generated polishing liquid and the waste materials generated by grinding into the liquid absorbing component under the work of the liquid pumping mechanism, the top of the wafer is prevented from being damaged by the waste materials generated by grinding, the wafer obtained after grinding cannot be used, the resource waste is caused, the flow rate of the polishing liquid can be increased to a certain degree, the grinding product can be separated from the processing surface, the temperature of the processing area can also be reduced, the temperature of the processing surface is relatively consistent, the better surface quality is obtained, and the quality of the thinned wafer is ensured, is convenient for personnel to use.
2. When the wafer grinding and thinning device is used, when the clamping mechanism is used for clamping a wafer, dust particles on the surface of the wafer can be effectively swept, the dust particles on the surface of the wafer are prevented from damaging the wafer when the wafer is ground and thinned, the ground and thinned wafer cannot meet the requirements, unnecessary loss is caused, the wafer is well protected, the quality of the thinned wafer is ensured, and the wafer grinding and thinning device is convenient for personnel to use.
Drawings
Fig. 1 is a schematic three-dimensional structure diagram of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 2 is a schematic diagram of a front middle cut-away structure of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 3 is a schematic diagram of a three-dimensional side view of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 4 is a schematic diagram of a three-dimensional structure of a clamping mechanism and a flow guide assembly of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 5 is a schematic view of a three-dimensional bottom structure of a grinding mechanism of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 6 is a schematic view of a three-dimensional structure of a grinding mechanism of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 7 is an enlarged schematic view of a portion A of FIG. 2 illustrating a wafer thinning apparatus and a method for using the same according to the present invention;
fig. 8 is an enlarged schematic structural diagram of a wafer thinning apparatus and a method for using the same according to the present invention, shown at B in fig. 3.
In the figure: 1. a base; 2. a support leg; 3. a guide rail; 4. an electric lifter plate; 5. a grinding mechanism; 51. a drive motor; 52. a rotating shaft; 53. a grinding disk; 54. a liquid tank; 55. a liquid injection hole; 56. a guide groove; 6. a liquid pumping mechanism; 61. a fan blade; 62. an exhaust pipe; 63. filtering with a screen; 64. connecting grooves; 65. a connecting pipe; 66. inserting a pipe; 7. a clamping mechanism; 71. an electric chute; 72. an electric slider; 73. a clamping ring; 74. an air bag; 75. an air blowing pipe; 76. a gas cabin; 77. a purge hole; 8. a wicking assembly; 81. a liquid suction hole; 82. a pipette; 83. a liquid storage ring; 84. a liquid discharge pipe; 9. a rotating electric machine; 10. a turntable.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 8, a wafer thinning apparatus includes:
the grinding device comprises a base 1, wherein four corners at the bottom of the base 1 are fixedly connected with supporting legs 2, the middle position of the bottom of the inner side wall at the top of the base 1 is fixedly connected with a rotating motor 9, an output shaft of the rotating motor 9 is fixedly connected with a turntable 10, the top of the base 1 is symmetrically and fixedly connected with guide rails 3, the opposite sides of the guide rails 3 are slidably connected with electric lifting plates 4, the top of each electric lifting plate 4 is fixedly connected with a grinding mechanism 5, and each grinding mechanism 5 is used for grinding wafers and providing partial power for the work of the equipment;
the liquid pumping mechanism 6 is arranged inside the electric lifting plate 4, the liquid pumping mechanism 6 is driven by the grinding mechanism 5, and the liquid pumping mechanism 6 is used for providing power for liquid pumping during grinding;
the clamping mechanism 7 is installed at the top of the base 1, and the clamping mechanism 7 is used for clamping and purging the wafer;
the liquid suction assembly 8 is arranged in the base 1, and the liquid suction assembly 8 is communicated with the liquid pumping mechanism 6;
through the arrangement of the structure, the blowing operation of dust particles on the surface of the wafer is realized, and the polishing solution and waste materials generated during thinning grinding can be treated, so that the quality of thinning is ensured.
Wherein, the grinding mechanism 5 comprises a driving motor 51, a rotating shaft 52, a grinding disc 53, a liquid box 54, a liquid injection hole 55 and a guide groove 56; the output end of the driving motor 51 is fixedly connected with the top of the rotating shaft 52, the bottom of the rotating shaft 52 is fixedly connected with the middle position of the top of the grinding disc 53, the top of the grinding disc 53 is fixedly connected with the bottom of the liquid tank 54, the liquid injection hole 55 is formed in the bottom of the liquid tank 54, the liquid injection hole 55 penetrates through the top of the grinding disc 53 and extends to the bottom of the grinding disc 53, and the guide groove 56 is formed in the bottom of the grinding disc 53;
through the arrangement of the structure, the thinning operation of the wafer is realized, and through the arrangement of the guide groove 56, the polishing solution and the waste materials generated by grinding can be discharged in time, so that the quality of the thinning operation is ensured.
Wherein, the liquid pumping mechanism 6 comprises fan blades 61, an exhaust pipe 62, a filter screen 63, a connecting groove 64, a connecting pipe 65 and a splicing pipe 66; the fan blades 61 are arranged inside the exhaust pipe 62, the top of the exhaust pipe 62 is fixedly connected with the bottom of the filter screen 63, the opposite ends of the connecting grooves 64 are fixedly connected with the inner side wall of the exhaust pipe 62, the top of the connecting pipe 65 is fixedly connected with the bottom of the connecting groove 64, and the outer side wall of one end of the splicing pipe 66 is matched with the inner side wall of one end, far away from the connecting groove 64, of the connecting pipe 65;
through the arrangement of the structure, the polishing liquid and waste materials generated by grinding are treated, and the heat dissipation of the driving motor 51 can be performed to a certain degree, so that the service life of the driving motor 51 is prolonged.
Wherein, the clamping mechanism 7 comprises an electric sliding chute 71, an electric sliding block 72, a clamping ring 73, an air bag 74, an air blowing pipe 75, an air bin 76 and a blowing hole 77; the inner side wall of the electric sliding groove 71 is connected with the outer side wall of the electric sliding block 72 in a sliding mode, the opposite side of the electric sliding block 72 is fixedly connected with the opposite side of the clamping ring 73, the outer side wall of the air bag 74 is fixedly connected with the opposite side of the electric sliding block 72, one end of the air blowing pipe 75 is fixedly connected with one side, close to the electric sliding block 72, of the air bag 74, the inner side wall of the air bin 76 is fixedly connected with the other end, far away from the air bag 74, of the air blowing pipe 75, the blowing hole 77 is formed in the opposite side of the clamping ring 73, and the blowing hole 77 penetrates through the side wall of the clamping ring 73 and extends into the air bin 76;
through the arrangement of the structure, the centering clamping operation of the wafer is realized, the dust particles on the surface of the wafer can be effectively swept when the wafer is clamped, and the influence of the dust particles on the wafer is prevented when the wafer is ground and thinned.
Wherein, the liquid suction component 8 comprises a liquid suction hole 81, a liquid suction pipe 82, a liquid storage ring 83 and a liquid discharge pipe 84; the end part of the liquid suction hole 81 is fixedly connected with one end of a liquid suction pipe 82, the other end of the liquid suction pipe 82, which is far away from the liquid suction hole 81, is fixedly connected with the top of a liquid storage ring 83, the bottom of the liquid storage ring 83 is fixedly connected with the bottom of a liquid discharge pipe 84, and an electric valve is arranged on the inner side wall of the liquid discharge pipe 84;
through the setting of above-mentioned structure for the polishing solution and the waste material that the attenuate ground produced can get into imbibition subassembly 8 under the effect of centrifugal force in, and the velocity of flow of increase polishing solution that can the certain degree breaks away from the machined surface when can making the lapping product, can also reduce the temperature in machined area, make the machined surface temperature unanimous relatively, thereby obtain better surface quality.
Wherein, pivot 52 runs through the top of electric lift board 4 and extends to the bottom of abrasive disc 53, and abrasive disc 53 just sets up at the top of carousel 10, and the bottom of carousel 10 rotates with the top of base 1 to be connected, and driving motor 51 and rotating electrical machines 9's rotation direction is opposite.
Wherein, the inside wall of flabellum 61 and the lateral wall fixed connection of pivot 52, the middle part position of filter screen 63 rotates with the lateral wall of pivot 52 to be connected, the top of filter screen 63 and driving motor 51's bottom fixed connection, connecting groove 64 sets up in the inside of electric lift board 4, and connecting pipe 65 fixed connection is at the bottom both ends of electric lift board 4.
The electric sliding groove 71 is arranged at the top of the base 1, the opposite side of the clamping ring 73 is fixedly connected with a rubber cushion, the bottom of the clamping ring 73 is attached to the top of the rotary table 10 and can slide, the air blowing pipe 75 is fixedly connected inside the electric sliding block 72, and the other side, far away from the electric sliding block 72, of the air bag 74 is fixedly connected with the inner side wall of the electric sliding groove 71.
Wherein, the liquid suction hole 81 penetrates through the clamping ring 73 and the electric sliding block 72, one end of the liquid suction pipe 82 close to the liquid suction hole 81 is fixedly connected with the bottom of the electric sliding block 72, the liquid storage ring 83 is fixedly connected inside the base 1, and the outer side wall of the liquid storage ring 83 is fixedly connected with the other end of the insertion pipe 66 far away from the connecting pipe 65.
A use method of wafer thinning equipment comprises the following steps:
s1: firstly, a wafer is placed at the top of a turntable 10, and then a clamping mechanism 7 is started to clamp and blow the wafer;
s2: after the wafer is clamped, the electric lifting plate 4 can be started to drive the grinding mechanism 5 and the liquid pumping mechanism 6 to move downwards;
s3: until the bottom of the grinding mechanism 5 is attached to the top of the wafer, the liquid pumping mechanism 6 is combined;
s4: then, the grinding mechanism 5 can be started to thin the top of the wafer, and the rotating motor 9 is started to drive the turntable 10 while the top of the wafer is thinned, so that the rotation directions of the wafer and the grinding mechanism 5 are opposite;
s5: the grinding mechanism 5 drives the liquid pumping mechanism 6 to work, so that the liquid suction assembly 8 sucks waste liquid generated by grinding of the grinding mechanism 5 into the liquid suction assembly 8 under the action of the liquid pumping mechanism 6;
s6: in the process of thinning, the electric lifting plate 4 slowly moves downwards until the electric lifting plate is ground to a specified position;
s7: after the thinning is finished, waste liquid sucked in the liquid suction assembly 8 can be discharged, so that the grinding mechanism 5 and the clamping mechanism 7 are reset, and the thinned wafer is taken down.
In the invention, when in use, firstly, a wafer is placed on the top of the turntable 10, then the electric lifting plate 4 is started to enable the grinding mechanism 5 to move downwards to contact the top of the wafer, at the moment, the inner side wall of the connecting pipe 65 is jointed with the outer side wall of the insertion pipe 66, the electric sliding block 72 and the electric sliding chute 71 can be started to enable the electric sliding block 72 to slide oppositely, the air bag 74 is extruded in the sliding process, when the clamping ring 73 moves oppositely, the gas in the air bag 74 enters the air chamber 76 through the air blowing pipe 75, then the air bag is blown to the upper surface of the wafer through the blowing hole 77, the blowing operation is carried out on dust particles on the upper surface of the wafer until the opposite side of the clamping ring 73 is jointed with the outer surface of the wafer, and the surface of the wafer is sealed by the plurality of clamping rings 73, so that polishing liquid and waste materials can only enter the liquid suction hole 81 through the guide groove 56, and the grinding disc 53 is prevented from being ground and thinned, the polishing solution and the waste are discharged to the outside, causing pollution;
then the driving motor 51 can be started and the rotating motor 9 can be rotated to make the rotation directions of the grinding disc 53 and the rotating disc 10 opposite, then the polishing liquid in the liquid tank 54 enters the surfaces of the grinding disc 53 and the wafer through the liquid injection hole 55, so that the polishing liquid uniformly covers the surface of the wafer, and the rotating shaft 52 is driven to rotate under the rotation of the driving motor 51, so that the fan blade 61 rotates into the connecting groove 64, the connecting pipe 65 and the inserting pipe 66 to extract the gas in the liquid storage ring 83, the polishing liquid produced by grinding and the waste liquid produced by grinding enter the liquid suction hole 81 through the guide groove 56 under the centrifugal force generated by the grinding disc 53 and the rotating disc 10, at this time, due to the work of the liquid suction mechanism 6, the polishing liquid and the waste liquid produced by grinding enter the liquid storage ring 83 through the liquid suction hole 81 and the liquid suction pipe 82 until the grinding is completed, and the polishing liquid can be accelerated to a certain degree while being sucked, the flow rate of the polishing solution can be increased to a certain extent, the grinding product can be separated from the processing surface, the temperature of the processing area can be reduced, the temperature of the processing surface is relatively consistent, better surface quality is obtained, the grinding quality is ensured, and in the grinding process, the electric lifting plate 4 can also slowly descend until the grinding is carried out to a specified position;
as one of the core invention points of the scheme, the matching operation of the grinding mechanism and the liquid pumping mechanism is further expressed, while the grinding mechanism drives the grinding disc 53 to rotate by using the driving motor 51, the suction force generated by the rotation of the fan blade 61 arranged on the outer side wall of the rotating shaft 52 provides a negative pressure basis for the liquid storage ring 83 on the liquid pumping mechanism, so that the cleaning operation of the waste liquid generated in the grinding process is realized, it needs to be explained that the scheme realizes the waste liquid extraction and cleaning operation by using the driving force generated by the grinding per se, the waste liquid extraction operation is realized by additionally increasing the driving force compared with the traditional mode, the manufacturing cost is effectively reduced, and the practicability is higher;
it should be noted that in the scheme, due to the negative pressure generated by the fan blades 61, the extraction of the waste liquid is realized, and in the implementation process, the extraction of the waste liquid after polishing is synchronously realized on the basis of polishing, and because in the synchronous extraction process, the waste liquid can be transported and treated more quickly, the doping rate of the waste liquid to the polishing solution is effectively reduced, the influence on the polishing quality of the wafer is avoided, the purity of the polishing solution in the polishing process is higher, and the polishing quality of the wafer product is further improved;
after the grinding is finished, the driving motor 51 and the rotating motor 9 can be closed, the electric lifting plate 4 is started to move upwards, the electric lifting plate 4 is enabled to restore to the initial position, the grinding mechanism 5 is completely separated from the surface of the wafer at the moment, then the electric sliding chute 71 and the electric sliding block 72 are started again, the electric sliding block 72 is enabled to slide relatively, the initial position is restored, the air bag 74 is enabled to extract air through the blowing hole 77, the air bin 76 and the air blowing pipe 75, the air bag 74 is enabled to restore to the initial position, then the wafer with the finished thinning can be taken down, the electric valve of the liquid discharge pipe 84 is opened, the waste liquid is discharged, and the whole operation is finished.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. A wafer thinning apparatus, comprising:
the wafer grinding device comprises a base (1), wherein four corners at the bottom of the base (1) are fixedly connected with supporting legs (2), a rotating motor (9) is fixedly connected with the middle position of the bottom of the inner side wall at the top of the base (1), an output shaft of the rotating motor (9) is fixedly connected with a turntable (10), guide rails (3) are symmetrically and fixedly connected with the top of the base (1), electric lifting plates (4) are slidably connected with opposite sides of the guide rails (3), a grinding mechanism (5) is fixedly connected with the tops of the electric lifting plates (4), and the grinding mechanism (5) is used for grinding wafers and providing partial power for the work of the device;
the liquid pumping mechanism (6) is installed inside the electric lifting plate (4), the liquid pumping mechanism (6) is driven by the grinding mechanism (5), and the liquid pumping mechanism (6) is used for providing power for liquid pumping during grinding;
the clamping mechanism (7), the clamping mechanism (7) is installed on the top of the base (1), and the clamping mechanism (7) is used for clamping the wafer and performing purging operation;
imbibition subassembly (8), imbibition subassembly (8) are installed in base (1), imbibition subassembly (8) with drawing mechanism (6) are linked together.
2. Wafer thinning apparatus according to claim 1, wherein the grinding mechanism (5) comprises a driving motor (51), a rotating shaft (52), a grinding disc (53), a liquid tank (54), a liquid injection hole (55) and a guide groove (56); the output of driving motor (51) with the top fixed connection of pivot (52), the bottom of pivot (52) with the top middle part position fixed connection of abrasive disc (53), the top of abrasive disc (53) with the bottom fixed connection of liquid case (54), annotate liquid hole (55) and set up the bottom of liquid case (54), it runs through to annotate liquid hole (55) the top of abrasive disc (53) and extend to the bottom of abrasive disc (53), guide slot (56) are set up the bottom of abrasive disc (53).
3. Wafer thinning equipment according to claim 1, wherein the liquid pumping mechanism (6) comprises a fan blade (61), an exhaust pipe (62), a filter screen (63), a connecting groove (64), a connecting pipe (65) and a splicing pipe (66); flabellum (61) set up the inside of blast pipe (62), the top of blast pipe (62) with the bottom fixed connection of filter screen (63), the end in opposite directions of spread groove (64) with the inside wall fixed connection of blast pipe (62), the top of connecting pipe (65) with the bottom fixed connection of spread groove (64), the one end lateral wall of grafting pipe (66) with connecting pipe (65) are kept away from the inside lateral wall adaptation of one end of spread groove (64).
4. Wafer thinning apparatus according to claim 1, wherein the clamping mechanism (7) comprises an electric slide groove (71), an electric slide block (72), a clamping ring (73), an air bag (74), an air blow pipe (75), an air chamber (76) and a purge hole (77); the inner side wall of the electric sliding groove (71) is connected with the outer side wall of the electric sliding block (72) in a sliding mode, the opposite side of the electric sliding block (72) is fixedly connected with the opposite side of the clamping ring (73), the outer side wall of the air bag (74) is fixedly connected with the opposite side of the electric sliding block (72), one end of the air blowing pipe (75) is fixedly connected with one side, close to the electric sliding block (72), of the air bag (74), the inner side wall of the air bin (76) is fixedly connected with the other end, far away from the air bag (74), of the air blowing pipe (75), the blowing hole (77) is formed in the opposite side of the clamping ring (73), and the blowing hole (77) penetrates through the side wall of the clamping ring (73) and extends into the air bin (76).
5. Wafer thinning apparatus according to claim 1, characterized in that the pipetting assembly (8) comprises a pipetting hole (81), a pipette (82), a liquid storage ring (83) and a drain (84); the end part of the liquid suction hole (81) is fixedly connected with one end of the liquid suction pipe (82), the other end, far away from the liquid suction hole (81), of the liquid suction pipe (82) is fixedly connected with the top of the liquid storage ring (83), and the bottom of the liquid storage ring (83) is fixedly connected with the bottom of the liquid discharge pipe (84).
6. Wafer thinning equipment according to claim 2, characterized in that the rotating shaft (52) penetrates through the top of the electric lifting plate (4) and extends to the bottom of the grinding disc (53), the grinding disc (53) is arranged right opposite to the top of the rotating disc (10), the bottom of the rotating disc (10) is rotatably connected with the top of the base (1), and the rotating directions of the driving motor (51) and the rotating motor (9) are opposite.
7. Wafer thinning equipment according to claim 3, wherein the inner side wall of the fan blade (61) is fixedly connected with the outer side wall of the rotating shaft (52), the middle position of the filter screen (63) is rotatably connected with the outer side wall of the rotating shaft (52), the top of the filter screen (63) is fixedly connected with the bottom of the driving motor (51), the connecting groove (64) is arranged in the electric lifting plate (4), and the connecting pipe (65) is fixedly connected with two ends of the bottom of the electric lifting plate (4).
8. Wafer thinning equipment according to claim 4, characterized in that the electric sliding groove (71) is arranged at the top of the base (1), the opposite side of the clamping ring (73) is fixedly connected with a rubber cushion, the bottom of the clamping ring (73) is attached to the top of the turntable (10) in a sliding manner, the air blowing pipe (75) is fixedly connected inside the electric sliding block (72), and the other side of the air bag (74) far away from the electric sliding block (72) is fixedly connected with the inner side wall of the electric sliding groove (71).
9. Wafer thinning equipment according to claim 5, characterized in that the liquid suction hole (81) penetrates through the clamping ring (73) and the electric sliding block (72), one end of the liquid suction pipe (82) close to the liquid suction hole (81) is fixedly connected with the bottom of the electric sliding block (72), the liquid storage ring (83) is fixedly connected inside the base (1), and the outer side wall of the liquid storage ring (83) is fixedly connected with the other end of the insertion pipe (66) far away from the connecting pipe (65).
10. A use method of wafer thinning equipment is characterized by comprising the following steps:
firstly, a wafer is placed at the top of a turntable (10), and then a clamping mechanism (7) is started to clamp and blow the wafer;
after the wafer is clamped, the electric lifting plate (4) can be started to drive the grinding mechanism (5) and the liquid pumping mechanism (6) to move downwards;
until the bottom of the grinding mechanism (5) is attached to the top of the wafer, the liquid pumping mechanism (6) is combined;
then, the grinding mechanism (5) can be started to thin the top of the wafer, and the rotating motor (9) is started to drive the turntable (10) to enable the rotation directions of the wafer and the grinding mechanism (5) to be opposite while the wafer is thinned;
the grinding mechanism (5) drives the liquid pumping mechanism (6) to work, so that the liquid suction assembly (8) sucks waste liquid generated by grinding of the grinding mechanism (5) into the liquid suction assembly (8) under the action of the liquid pumping mechanism (6);
in the thinning process, the electric lifting plate (4) slowly moves downwards until the electric lifting plate is ground to a specified position;
after the thinning is finished, waste liquid sucked in the liquid suction assembly (8) can be discharged, so that the grinding mechanism (5) and the clamping mechanism (7) are reset, and the thinned wafer is taken down.
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| CN117161950A (en) * | 2023-11-02 | 2023-12-05 | 南通海鹰机电集团有限公司 | Polishing device for manufacturing pressure vessel |
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