CN217361508U - Multi-chip laser through hole structure - Google Patents
Multi-chip laser through hole structure Download PDFInfo
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- CN217361508U CN217361508U CN202220097331.1U CN202220097331U CN217361508U CN 217361508 U CN217361508 U CN 217361508U CN 202220097331 U CN202220097331 U CN 202220097331U CN 217361508 U CN217361508 U CN 217361508U
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- workstation
- blanking box
- laser
- blanking
- conveyer belt
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Abstract
The utility model provides a multichip laser through-hole structure relates to multichip laser through-hole technical field, draws together the workstation, the mounting bracket is installed at the top of workstation, install the horizontal pole on the mounting bracket, the horizontal pole top of the staff is provided with the laser head, the both sides of mounting bracket all are provided with fixture, the bottom of workstation is provided with pushing equipment, pushing equipment includes blanking groove, blanking box is installed to the bottom of workstation, one side of blanking box is provided with the conveyer belt, the last scraping wings that are provided with of blanking box, electric telescopic handle is installed to one side of scraping wings. The utility model discloses, start electric telescopic handle and drive the scraping wings and to the direction removal that is close to the conveyer belt, will drop on the conveyer belt is carried to the multichip propelling movement in the charging chute, lead to the conveyer belt and shift the multichip, need not close laser through-hole structure when shifting the multichip, improved laser through-hole structure's work efficiency to a certain extent.
Description
Technical Field
The utility model relates to a multi-chip laser through-hole technical field especially relates to a multi-chip laser through-hole structure.
Background
The multi-chip module is a typical advanced hybrid integrated module, in which a plurality of integrated circuit chips are electrically connected to a common circuit substrate and are used to realize interconnection between chips, these components are usually assembled on a multilayer interconnected substrate in an unsealed manner by wire bonding or flip chip, etc., and the multi-chip is usually perforated by using a laser through hole structure in the manufacturing process, so that the material is quickly heated to a vaporization temperature by using the thermophysical process of interaction between laser and a substance, and is vaporized to form a hole.
However, in the prior art, the multi-chip laser through hole structure that has now, after carrying out the through-hole to the multi-chip, generally need the manual work to shift the multi-chip behind the through-hole, need close the laser through hole structure earlier when the manual work is taken, influence the work efficiency of laser through hole structure when having increased artifical amount of labour, and the manual in-process of taking the multi-chip, easily cause the unnecessary to damage the multi-chip.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, after carrying out the through-hole through the laser head to the multicore piece and accomplishing, make the multicore piece drop to the blanking box in back through the charging conduit, start electric telescopic handle and drive the scraping wings and remove to the direction that is close to the conveyer belt, on the multicore piece propelling movement to the conveyer belt that will drop in the charging conduit, lead to the conveyer belt and shift the multicore piece.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the automatic blanking device comprises a workbench, a mounting rack is installed at the top of the workbench, a cross rod is installed on the mounting rack, a laser head is arranged on the cross rod, clamping mechanisms are arranged on two sides of the mounting rack, a material pushing mechanism is arranged at the bottom of the workbench and comprises a blanking groove, the blanking groove is formed in the top of the workbench, a blanking box is installed at the bottom of the workbench, a conveying belt is arranged on one side of the blanking box, a material pushing plate is arranged on the blanking box, and an electric telescopic rod is installed on one side of the material pushing plate.
As a preferred embodiment, the clamping mechanism includes an installation cylinder, the installation cylinder penetrates through one side of the installation frame, a movable rod penetrates through the installation cylinder, and one end of the movable rod, which is far away from the installation cylinder, is provided with a clamping shell.
The technical effect of adopting the further scheme is as follows: the pulling movable rod drives the clamping shell to be far away from the multi-chip until the clamping shell and the multi-chip are separated, so that the clamping of the multi-chip can be removed, and the multi-chip can conveniently fall into the blanking box through the blanking groove.
As a preferred embodiment, a mounting plate is installed on one side of the workbench, one side of the mounting plate, which is far away from the workbench, is installed on the outer surface of one side of the blanking box, which is far away from the conveyor belt, and the electric telescopic rod is installed on the mounting plate.
The technical effect of adopting the further scheme is as follows: drive the scraping wings through electric telescopic handle and with multichip propelling movement to the conveyer belt on, lead to the conveyer belt and shift the multichip.
In a preferred embodiment, a shovel plate is mounted on the front side of the material pushing plate.
The technical effect of adopting the further scheme is as follows: the shovel plate is more convenient for pushing multiple chips.
As a preferred embodiment, a movable groove is formed in the top of the blanking box, and a sliding block is mounted at the bottom of the material pushing plate and penetrates through the movable groove.
The technical effect of adopting the further scheme is that the sliding block moves in the movable groove to limit the moving track of the material pushing plate when the material pushing plate moves.
In a preferred embodiment, a spring is installed between the clamping shell and the mounting cylinder.
The technical effect of adopting the further scheme is as follows: the spring is reset to drive the clamping shells to move towards the direction of the multiple chips until the multiple cores are positioned in the clamping shells on the two sides, and the multiple chips can be clamped.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. the utility model discloses in, after carrying out the through-hole completion to the multicore piece through the laser head, make the multicore piece pass through the charging chute and fall back in the charging chute, start electric telescopic handle and drive the scraping wings to the direction removal that is close to the conveyer belt, on the multicore piece propelling movement to the conveyer belt that will drop in the charging chute, lead to the conveyer belt and shift the multicore piece, need not close laser through-hole structure when shifting the multicore piece, improved the work efficiency of laser through-hole structure to a certain extent, and whole journey need not the manual work and takes the transfer, alleviate the work load.
2. The utility model discloses in, the pulling movable rod drives the centre gripping shell and keeps away from the multicore piece, can remove the centre gripping to the multicore piece, and in the multicore piece of being convenient for dropped the blanking box through the charging chute, when carrying out the centre gripping to the multicore piece again, drive the centre gripping shell through spring reset and remove to the direction of multicore piece, can accomplish the centre gripping to the multicore piece in the centre gripping shell that the multicore is located both sides, and the laser head of being convenient for carries out the through-hole to the multicore piece.
Drawings
Fig. 1 is a schematic structural diagram of a multi-chip laser via structure provided by the present invention;
fig. 2 is a schematic structural diagram of a material pushing mechanism with a multi-chip laser through-hole structure according to the present invention;
fig. 3 is an enlarged schematic structural diagram of a position a in fig. 1 of a multi-chip laser via structure provided by the present invention;
fig. 4 is an enlarged schematic structural diagram of a position B in fig. 2 of a multi-chip laser via structure provided by the present invention.
Illustration of the drawings:
1. a work table; 2. a mounting frame; 21. a cross bar; 22. a laser head; 3. a clamping mechanism; 4. a material pushing mechanism; 5. a conveyor belt; 21. a cross bar; 22. a laser head;
31. a movable rod; 32. mounting the cylinder; 33. a spring; 34. a clamping shell;
41. a charging chute; 42. a blanking box; 43. a movable groove; 44. a material pushing plate; 45. a shovel plate; 46. mounting a plate; 47. an electric telescopic rod; 48. a slide block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
As shown in fig. 1, fig. 2 and fig. 4, the utility model provides a technical solution: a multi-chip laser through hole structure comprises a workbench 1, a mounting frame 2 is mounted at the top of the workbench 1, a cross rod 21 is mounted on the mounting frame 2, a laser head 22 is arranged on the upper hand of the cross rod 21, clamping mechanisms 3 are arranged on two sides of the mounting frame 2, a material pushing mechanism 4 is arranged at the bottom of the workbench 1, the material pushing mechanism 4 comprises a blanking groove 41, the blanking groove 41 is arranged at the top of the workbench 1, a blanking box 42 is mounted at the bottom of the workbench 1, a conveying belt 5 is arranged on one side of the blanking box 42, a material pushing plate 44 is arranged on the blanking box 42, an electric telescopic rod 47 is mounted on one side of the material pushing plate 44, a mounting plate 46 is mounted on one side of the workbench 1, one side of the mounting plate 46 far away from the workbench 1 is mounted on the outer surface of one side of the blanking box 42 far away from the conveying belt 5, the electric telescopic rod 47 is mounted on the mounting plate 46, and a shovel plate 45 is mounted on the front side of the material pushing plate 44, the top of the blanking box 42 is provided with a movable groove 43, the bottom of the material pushing plate 44 is provided with a slide block 48, and the slide block 48 penetrates through the movable groove 43.
In this embodiment, after completing the through-hole of the multiple chips by the laser head 22, the clamping of the clamping mechanism to the multiple chips is released, after the multiple chips drop into the blanking box 42 through the blanking slot 41, the electric telescopic rod 47 is started to drive the material pushing plate 44 to move towards the direction close to the conveyor belt 5, and simultaneously the multiple chips falling into the blanking slot 41 are pushed out into the blanking slot 41, until the multiple chips are pushed onto the conveyor belt 5 by the material pushing plate 44, the multiple chips are transferred by the conveyor belt 5, the laser through-hole structure does not need to be closed when the multiple chips are transferred, so that the working efficiency of the laser through-hole structure is improved to a certain extent, the whole process is free from manual work, the workload is reduced, and when the material pushing plate 44 moves, the slide block 48 moves in the movable slot 43 to limit the moving track of the material pushing plate 44.
Example 2
As shown in fig. 1 and 4, the clamping mechanism 3 includes an installation cylinder 32, the installation cylinder 32 penetrates through one side of the installation frame 2, a movable rod 31 penetrates through the installation cylinder 32, a clamping shell 34 is installed at one end of the movable rod 31 far away from the installation cylinder 32, and a spring 33 is installed between the clamping shell 34 and the installation cylinder 32.
In this embodiment, pulling movable rod 31, spring 33 compresses, it keeps away from the multicore piece to drive centre gripping shell 34 simultaneously, break away from mutually until centre gripping shell 34 and multicore piece, can remove the centre gripping to the multicore piece, the multicore piece of being convenient for drops to blanking box 42 in through chute 41, when carrying out the centre gripping to the multicore piece again, drive centre gripping shell 34 through spring 33 resets and remove to the direction of multicore piece, can 3 accomplish the centre gripping to the multicore piece in the centre gripping shell 34 that is located both sides until the multicore piece, the laser head 22 of being convenient for carries out the through-hole to the multicore piece.
The working principle is as follows:
as shown in fig. 1, 2, 3 and 4, after the through-holes of the multiple chips are completed by the laser head 22, the clamping of the clamping mechanism to the multiple chips is released, so that the multiple chips drop into the blanking box 42 through the blanking slot 41, the electric telescopic rod 47 is started to drive the material pushing plate 44 to move towards the direction close to the conveyor belt 5, and simultaneously the multiple chips dropped into the blanking slot 41 are pushed out of the blanking slot 41 until the multiple chips are pushed onto the conveyor belt 5 by the material pushing plate 44, the multiple chips are transferred through the conveyor belt 5, the moving track of the material pushing plate 44 is limited by the movement of the slide block 48 in the movable slot 43 while the material pushing plate 44 moves, the movable rod 31 is pulled, the spring 33 is compressed, and the clamping shell 34 is driven to be away from the multiple chips until the clamping shell 34 and the multiple chips are separated, so that the clamping of the multiple chips can be released, and the multiple chips can conveniently drop into the blanking box 42 through the blanking slot 41, when the multi-chip is clamped again, the spring 33 resets to drive the clamping shell 34 to move towards the direction of the multi-chip until the multi-chip is positioned in the clamping shells 34 at two sides, so that the multi-chip can be clamped by 3, and the laser head 22 can conveniently pass through the multi-chip.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in other forms, and any person skilled in the art may apply the equivalent embodiments modified or modified by the above technical contents disclosed as equivalent variations to other fields, but any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention will still fall within the protection scope of the technical solution of the present invention.
Claims (6)
1. A multi-chip laser through hole structure comprises a workbench (1), and is characterized in that: mounting bracket (2) are installed at the top of workstation (1), install horizontal pole (21) on mounting bracket (2), horizontal pole (21) top hand is provided with laser head (22), the both sides of mounting bracket (2) all are provided with fixture (3), the bottom of workstation (1) is provided with pushing equipment (4), pushing equipment (4) are including blanking groove (41), blanking groove (41) are seted up at the top of workstation (1), blanking box (42) are installed to the bottom of workstation (1), one side of blanking box (42) is provided with conveyer belt (5), be provided with scraping wings (44) on blanking box (42), electric telescopic handle (47) are installed to one side of scraping wings (44).
2. The multi-chip laser via structure of claim 1, wherein: fixture (3) are including installation section of thick bamboo (32), one side of installation frame (2) is run through in installation section of thick bamboo (32), it has movable rod (31) to run through in installation section of thick bamboo (32), centre gripping shell (34) are installed to the one end that installation section of thick bamboo (32) were kept away from in movable rod (31).
3. The multi-chip laser via structure of claim 1, wherein: mounting panel (46) are installed to one side of workstation (1), one side that workstation (1) was kept away from in mounting panel (46) is installed on blanking box (42) keep away from one side surface of conveyer belt (5), electric telescopic handle (47) are installed on mounting panel (46).
4. The multi-chip laser via structure of claim 1, wherein: a shovel plate (45) is arranged on the front side of the material pushing plate (44).
5. The multi-chip laser via structure of claim 1, wherein: the top of the blanking box (42) is provided with a movable groove (43), the bottom of the material pushing plate (44) is provided with a sliding block (48), and the sliding block (48) penetrates through the movable groove (43).
6. The multi-chip laser via structure of claim 2, wherein: and a spring (33) is arranged between the clamping shell (34) and the mounting cylinder (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220097331.1U CN217361508U (en) | 2022-01-14 | 2022-01-14 | Multi-chip laser through hole structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220097331.1U CN217361508U (en) | 2022-01-14 | 2022-01-14 | Multi-chip laser through hole structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217361508U true CN217361508U (en) | 2022-09-02 |
Family
ID=83041423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220097331.1U Active CN217361508U (en) | 2022-01-14 | 2022-01-14 | Multi-chip laser through hole structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217361508U (en) |
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2022
- 2022-01-14 CN CN202220097331.1U patent/CN217361508U/en active Active
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| TR01 | Transfer of patent right |
Effective date of registration: 20230725 Address after: 710000, 2nd Floor, Tianze Building, Software Park, Keji 2nd Road, High tech Zone, Xi'an City, Shaanxi Province Patentee after: Zhongkedi High System Technology Co.,Ltd. Address before: 727000 building 3, phase II, optical electronics integrated industrial park, Chuangxin Road, new material industrial park, Tongchuan City, Shaanxi Province Patentee before: Tongchuan Jiufang Xunda Microwave System Co.,Ltd. |