CN217346465U - Epoxy resin demolding and encapsulating mold capable of preventing encapsulating material from overflowing - Google Patents
Epoxy resin demolding and encapsulating mold capable of preventing encapsulating material from overflowing Download PDFInfo
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- CN217346465U CN217346465U CN202220779875.6U CN202220779875U CN217346465U CN 217346465 U CN217346465 U CN 217346465U CN 202220779875 U CN202220779875 U CN 202220779875U CN 217346465 U CN217346465 U CN 217346465U
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Abstract
The utility model discloses an epoxy drawing of patterns embedment mould that can prevent that encapsulation material from spilling over, including the mould support, top open-ended mould cavity, anti-overflow cavity and connecting bolt, the mould cavity is installed on the mould support, the inner chamber degree of depth of mould cavity is the same with the height of waiting to process electronic product, on the anti-overflow cavity, the equal opening of lower extreme, the horizontal shape and the size of anti-overflow cavity are the same with the horizontal shape and the size of mould cavity, the degree of depth of anti-overflow cavity is less than the degree of depth of mould cavity, be equipped with vertical connect the through-hole on the chamber wall of anti-overflow cavity, the chamber wall upper end of mould cavity is equipped with vertical connection screw, connecting bolt from top to bottom passes behind the connect the through-hole and is connected the screw. The utility model discloses an increase the anti-overflow cavity of being convenient for install and remove, can once accomplish epoxy and fill and ensure that product height dimension meets the requirements, improved the product percent of pass when improving production efficiency.
Description
Technical Field
The utility model relates to an epoxy drawing of patterns embedment mould especially relates to an epoxy drawing of patterns embedment mould that can prevent that the embedment material from overflowing.
Background
Epoxy resin demolding, pouring and packaging (potting for short) are frequently applied to electronic product production, for example, capacitors, and the basic potting process is as follows: the method comprises the steps of firstly placing an electronic component to be packaged (such as a capacitor core group) in a cavity of an epoxy resin demolding and encapsulating mold, then injecting liquid epoxy resin into the mold cavity to completely wrap the electronic component to be packaged by the epoxy resin, disassembling the mold after the epoxy resin is cured, demolding and taking out a product to obtain a finished electronic product packaged by the epoxy resin. The epoxy resin demolding and encapsulating process has the characteristics of high production efficiency, low cost and attractive product appearance, so the process is widely applied.
As shown in fig. 1, a conventional epoxy resin demolding and encapsulating mold comprises a mold support 5 and a mold cavity 3 with an opening at the upper part, the mold cavity 3 is installed on the mold support 5, the depth of an inner cavity of the mold cavity 3 is the same as the height of an electronic product (such as a capacitor) to be processed, during encapsulation, an electronic component 4 (such as a capacitor core) to be encapsulated is placed in the mold cavity 3, then liquid epoxy resin 2 is poured, and after the epoxy resin is poured for multiple times and solidified, the mold cavity 3 is disassembled to obtain the electronic product (such as the capacitor). Also shown in fig. 1 is a lead-out 1 with which an electronic component 4 to be packaged is provided.
The above-mentioned traditional epoxy drawing of patterns embedment mould's defect lies in: because the depth of the inner cavity of the mold cavity 3 is the same as the height of an electronic product (such as a capacitor) to be processed, the upper surface of the epoxy resin needs to be flush with the upper end surface of the mold cavity 3 before the filling and sealing operation is finished, however, some gases are inevitably mixed in the epoxy resin filling process, if the gases cannot be smoothly discharged, air holes are formed in an epoxy resin encapsulating layer of the electronic product, the appearance and the sealing performance of the product are influenced, and the product is scrapped; if the depth of the mold cavity 3 is simply increased, the reliability of observing the depth of the epoxy resin liquid level by an operator is influenced, the problem of excessive epoxy resin pouring is easily caused, the size of a product is out of tolerance, and the product is scrapped.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an epoxy drawing of patterns embedment mould that can prevent the embedment material to spill over during evacuation just for solving above-mentioned problem.
The utility model discloses a following technical scheme realizes above-mentioned purpose:
the utility model provides an epoxy drawing of patterns embedment mould that can prevent that encapsulating material from spilling over, includes mould support and top open-ended mould cavity, the mould cavity is installed on the mould support, the inner chamber degree of depth of mould cavity is the same with the height of treating processing electronic product, the epoxy drawing of patterns embedment mould that can prevent that encapsulating material from spilling over still includes anti-overflow cavity and connecting bolt, the equal opening of upper and lower extreme of anti-overflow cavity, the horizontal shape and the size of anti-overflow cavity with the horizontal shape and the size of mould cavity are the same, the degree of depth of anti-overflow cavity is less than the degree of depth of mould cavity, be equipped with vertical connect the through hole on the chamber wall of anti-overflow cavity, the chamber wall upper end of mould cavity is equipped with vertical connection screw, connecting bolt from top to bottom passes behind the connect the through hole with connect the screw and connect.
Preferably, in order to reliably connect the anti-overflow cavity and the mold cavity and facilitate assembly and disassembly, the connecting bolts, the connecting through holes and the connecting screw holes are two and correspond to each other.
The beneficial effects of the utility model reside in that:
the utility model discloses an increase the anti-overflow cavity that is convenient for install and remove, install the anti-overflow cavity when filling epoxy, fill the inner chamber of mould cavity, install the anti-overflow cavity on the mould cavity after filling the completion again, evacuation again, epoxy liquid level come-up is fully held by the anti-overflow cavity and can not spill over, accomplish the automatic upper end that falls back as to the mould cavity of epoxy liquid level after the evacuation and flush, pull down anti-overflow cavity and mould cavity after solidifying, obtain the electronic product, so can once accomplish epoxy and fill and ensure product height size and satisfy the demands, improved the product percent of pass when improving production efficiency.
Drawings
FIG. 1 is a schematic structural diagram of a conventional epoxy resin demolding and potting mold in a front view;
fig. 2 is a schematic structural view of the epoxy resin demolding and encapsulating mold capable of preventing the overflow of the encapsulating material, as seen from the front before assembly;
fig. 3 is the structure of main view schematic diagram when can prevent epoxy drawing of patterns embedment mould that the embedment material spills over from using.
Detailed Description
The present invention will be further explained with reference to the accompanying drawings:
as shown in fig. 2, epoxy drawing of patterns embedment mould that can prevent that the embedment material from overflowing includes mold holder 5, top open-ended mould cavity 10, anti-overflow cavity 7 and connecting bolt 6, mould cavity 10 is installed on mold holder 5, the inner chamber degree of depth of mould cavity 10 is the same with the height of waiting to process electronic product (like the condenser), on anti-overflow cavity 7, the equal opening of lower extreme, the horizontal shape and the size of anti-overflow cavity 7 are the same with the horizontal shape and the size of mould cavity 10, the degree of depth of anti-overflow cavity 7 is less than the degree of depth of mould cavity 10, be equipped with vertical connecting hole 8 on the chamber wall of anti-overflow cavity 7, the chamber wall upper end of mould cavity 10 is equipped with vertical connection screw 9, connecting bolt 6 from top to bottom passes behind connecting hole 8 and is connected screw 9. Preferably, the connecting bolts 6, the connecting through holes 8 and the connecting screw holes 9 are all two and correspond to each other.
As shown in fig. 2 and fig. 3, during the application, firstly, the anti-overflow cavity 7 is not installed, the electronic component 4 to be packaged (such as a capacitor core) is arranged in the mold cavity 10, then the liquid epoxy resin 2 is poured, after the mold cavity is filled with the liquid epoxy resin for one time, the anti-overflow cavity 7 is installed on the mold cavity 10 through the connecting bolt 6, the mold cavity is vacuumized again, the liquid level floating of the epoxy resin 2 is fully accommodated by the anti-overflow cavity 7 and cannot overflow, the liquid level of the epoxy resin 2 automatically falls back to the upper end of the mold cavity 10 and is flushed after the vacuumization is completed, the anti-overflow cavity 7 and the mold cavity 10 are removed after the solidification, the electronic product (such as a capacitor) is obtained, so that the pouring of the epoxy resin 2 can be completed once, the height and size of the electronic product can be ensured to meet the requirements, and the product qualification rate is improved while the production efficiency is improved. Also shown in fig. 3 is a lead-out 1 with which an electronic component 4 to be packaged is provided.
Description of the drawings: the mold cavity 10 corresponds to the mold cavity 3 of the background art, but because the structures of the two are changed, the same name is adopted but the reference numbers are different; the mold support 5, the electronic component 4 to be packaged, the epoxy resin 2, and the lead wire 1 are respectively corresponding to and have the same structure as the mold support 5, the electronic component 4 to be packaged, the epoxy resin 2, and the lead wire 1 in the background art, and therefore, the same names and reference numerals are used.
The above-mentioned embodiment is only the preferred embodiment of the present invention, and is not to the limitation of the technical solution of the present invention, as long as the technical solution can be realized on the basis of the above-mentioned embodiment without creative work, all should be regarded as falling into the protection scope of the right of the present invention.
Claims (2)
1. The utility model provides an epoxy drawing of patterns embedment mould that can prevent that potting material from overflowing, includes mould support and top open-ended mould cavity, the mould cavity is installed on the mould support, the inner chamber degree of depth of mould cavity is the same with the height of waiting to process electronic product, its characterized in that: epoxy drawing of patterns embedment mould that can prevent that encapsulation material from overflowing still includes anti-overflow cavity and connecting bolt, the equal opening of upper and lower extreme of anti-overflow cavity, the horizontal shape and the size of anti-overflow cavity with the horizontal shape and the size of mould cavity are the same, the degree of depth of anti-overflow cavity is less than the degree of depth of mould cavity, be equipped with vertical connect the via hole on the chamber wall of anti-overflow cavity, the chamber wall upper end of mould cavity is equipped with vertical connection screw, connecting bolt from top to bottom passes behind the connect the via hole with it connects to connect the screw.
2. The epoxy resin demolding and potting mold capable of preventing the potting material from overflowing of claim 1, wherein: the connecting bolt, the connecting through hole and the connecting screw hole are two and correspond to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220779875.6U CN217346465U (en) | 2022-04-06 | 2022-04-06 | Epoxy resin demolding and encapsulating mold capable of preventing encapsulating material from overflowing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220779875.6U CN217346465U (en) | 2022-04-06 | 2022-04-06 | Epoxy resin demolding and encapsulating mold capable of preventing encapsulating material from overflowing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217346465U true CN217346465U (en) | 2022-09-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220779875.6U Active CN217346465U (en) | 2022-04-06 | 2022-04-06 | Epoxy resin demolding and encapsulating mold capable of preventing encapsulating material from overflowing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217346465U (en) |
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2022
- 2022-04-06 CN CN202220779875.6U patent/CN217346465U/en active Active
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