CN217214702U

CN217214702U - IGBT module, motor controller comprising same and automobile

Info

Publication number: CN217214702U
Application number: CN202220518772.4U
Authority: CN
Inventors: 梁灵威; 顾捷; 白玉峰; 王明亮
Original assignee: Guangzhou Xiaopeng Motors Technology Co Ltd
Current assignee: Guangzhou Xiaopeng Motors Technology Co Ltd
Priority date: 2022-03-08
Filing date: 2022-03-08
Publication date: 2022-08-16
Anticipated expiration: 2032-03-08

Abstract

The utility model provides a IGBT module, the IGBT module includes base plate and IGBT chip encapsulation subassembly and water course cavity, IGBT chip encapsulation subassembly weld in the upper surface of base plate, the water course cavity weld in the below of base plate. The utility model discloses a weld base plate and water course cavity as an organic whole, can effectively avoid sealed inefficacy. The utility model also provides a motor controller and have this motor controller's car with above-mentioned IGBT module.

Description

IGBT module, motor controller comprising same and automobile

Technical Field

The utility model relates to a new energy automobile trade motor controller technical field especially relates to an IGBT module, including its machine controller and reach the car including this machine controller.

Background

An Insulated Gate Bipolar Transistor (IGBT) module is an insulated Gate Bipolar transistor and is widely applied to a motor controller in the new energy automobile industry at present to invert battery direct current into alternating current to drive a motor.

In the IGBT module according to the prior art, a metal substrate is generally integrated below a chip circuit, and the substrate has heat dissipation fins inserted into a water channel cavity of an electric control housing to form a heat dissipation water channel. The radiating fins and the water channel cavity are generally pressed by bolts, and are sealed by sealing rings. The heat dissipation water channel of the prior art is formed by combining the module substrate and the electric control shell, is sealed by a large-area sealing ring, needs manual installation, is inconvenient to automate, and has sealing failure risk under high and low temperature impact.

Disclosure of Invention

An object of the utility model is to provide an IGBT module, including its machine controller and including this machine controller's car to reduce the use of sealing washer, reduce the sealed inefficacy risk that exists under high low temperature strikes.

An aspect of the utility model provides a IGBT module, the IGBT module includes base plate and IGBT chip encapsulation subassembly and water course cavity, IGBT chip encapsulation subassembly weld in the base plate upper surface, the water course cavity weld in the base plate below.

Another aspect of the utility model provides a motor controller, this motor controller includes foretell IGBT module.

Yet another aspect of the present invention provides an automobile, which includes the above-mentioned motor controller.

The utility model discloses a weld base plate and water course cavity as an organic whole, make and need not connect through bolt and sealing washer between base plate and the water course cavity, consequently can reduce assembly spare part, be favorable to IGBT module automated production to realize and can not have the risk of high low temperature impact lower seal failure.

Drawings

Fig. 1 is a schematic perspective view of an IGBT module according to an embodiment of the present invention.

Fig. 2 is a sectional view of the IGBT module shown in fig. 1.

Fig. 3 is a schematic structural view of an IGBT chip package assembly of the IGBT module shown in fig. 1.

Fig. 4 is a schematic structural view of the substrate of the IGBT module shown in fig. 1.

Fig. 5 is a schematic structural view of a waterway cavity of the IGBT module shown in fig. 1.

Fig. 6 illustrates a waterway cavity according to another embodiment of the present invention, the first cavity wall of the waterway cavity has a transition slope.

Fig. 7 is a schematic flowchart of a method for manufacturing an IGBT module according to still another embodiment of the present invention.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

Fig. 1 and fig. 2 are schematic structural diagrams of an IGBT module according to an embodiment of the present invention. Fig. 3 to 5 respectively show the structure of the IGBT chip package assembly, the substrate and the water channel cavity on the IGBT module in fig. 1. As shown in fig. 1 to 5, in the present embodiment, the IGBT module includes a substrate 20, an IGBT chip package assembly 40, and a water channel cavity 60.

The substrate 20 is a forged part and can be formed by a cold forging process, and the IGBT package assembly 40 is soldered to the upper surface of the substrate 20, for example, by vacuum reflow soldering. The waterway cavity 60 is disposed under the substrate 20 and integrally welded to the substrate 20, for example, by a friction stir welding process.

Further, as shown in fig. 5, the waterway cavity 60 in this embodiment is a die-cast component, and may be integrally formed by high-pressure die-casting. The upper part of the water channel cavity 60 is provided with a first cavity 62, the periphery of the first cavity 62 is provided with a first cavity wall 622, the substrate 20 is embedded in the first cavity 62 and welded with the first cavity wall 622 into a whole by adopting a friction stir welding process.

As shown in fig. 6, in other embodiments of the present invention, the top end of the first cavity wall 622 may be provided with a transition slope 621 extending obliquely upward and outward from the bottom of the top end of the first cavity wall 622 to the top end of the first cavity wall 622, and the transition slope 621 may form a gap with the peripheral wall 202 (see fig. 4) of the substrate 20 for receiving the bonding head. Because the friction stir welding is to melt the welded material locally by the heat generated by the friction between the welding head rotating at high speed and the workpiece, when the welding head moves forwards along the welding interface, the plasticized material flows from the front part to the rear part of the welding head under the action of the rotating friction force of the welding head and forms a compact solid-phase welding seam under the extrusion of the welding head, so that the welding flux does not need to be put into the friction stir welding, the part of the first cavity wall 622 except the transition inclined plane can be tightly attached to the peripheral wall 202 of the substrate 20, and better sealing effect can be obtained by adopting the friction stir welding, which is beneficial to realizing the automation of the welding.

With continued reference to fig. 5, in the present embodiment, the waterway cavity 60 is provided with a second cavity 64 below the first cavity 62, the width of the second cavity 64 is smaller than the width of the first cavity 62, and a supporting surface for supporting the substrate 20 is formed between the first cavity 62 and the second cavity 64.

Referring to fig. 4, the lower surface of the substrate 20 is provided with the heat dissipation fins 22, and the heat dissipation fins 22 are accommodated in the second cavity 64 and can exchange heat with the cooling liquid accommodated in the second cavity 64, which is beneficial to rapid heat dissipation. In the present embodiment, the heat dissipating fins 22 are integrally formed with the base plate 20. In other embodiments of the present invention, the heat dissipation fins 22 may also be welded to the lower surface of the substrate 20. In order to improve the heat exchange efficiency, the heat dissipation fins 22 of the present embodiment are preferably provided as cylindrical heat dissipation fins, and it is understood that the present invention may also adopt heat dissipation fins with other shapes, such as rectangular parallelepiped or quadrangular prism heat dissipation fins. In addition, the heat radiating fins 22 may preferably be fins having high thermal conductivity, such as copper fins or aluminum alloy fins, to further improve heat exchange efficiency.

Furthermore, in this embodiment, a cooling liquid inlet 662 and a cooling liquid outlet 664 are symmetrically disposed below the second cavity 64, and the cooling liquid inlet 662 and the cooling liquid outlet 664 may be disposed on two sides of the water channel cavity 60 and communicate with the bottom of the second cavity 64. In this embodiment, the cooling liquid inlet 662 and the cooling liquid outlet 664 are respectively disposed at two sides of the water channel cavity 60, so as to increase the length of the cooling liquid flow path, so that the cooling liquid can perform sufficient heat exchange with the heat dissipation fins 22, thereby further improving the heat exchange efficiency.

Referring to fig. 7, the method for manufacturing an IGBT module according to the present invention may include the following steps:

s1: placing the substrate 20 in the first cavity 62 of the waterway cavity 60;

s2: welding the first cavity wall 622 of the waterway cavity 60 and the periphery of the substrate 20 together by a friction stir welding process;

s3: coating solder on the upper surface of the substrate 20;

s4: mounting the IGBT chip package assembly 40 over the solder;

s5: the IGBT chip package assembly 40 and the substrate 20 are placed in a vacuum reflow apparatus for heat soldering.

Further, the utility model also provides a machine controller, this machine controller includes foretell IGBT module.

The utility model also provides a car, this car includes foretell machine controller.

To sum up, the utility model discloses a weld base plate and water course cavity as an organic whole, make and need not connect through bolt and sealing washer between base plate and the water course cavity, consequently can reduce assembly spare part, be favorable to the automated production of IGBT module, and can not have the risk of high low temperature impact lower seal failure. And the IGBT module has a more compact overall structure and higher power density.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a IGBT module, the IGBT module includes base plate (20), IGBT chip encapsulation subassembly (40) and water course cavity (60), its characterized in that, IGBT chip encapsulation subassembly (40) weld in the upper surface of base plate (20), water course cavity (60) weld in the below of base plate (20).

2. The IGBT module according to claim 1, wherein a first cavity (62) is disposed at an upper portion of the water channel cavity (60), and the substrate (20) is embedded in the first cavity (62) and welded to the water channel cavity (60) by a friction stir welding process.

3. The IGBT module according to claim 2, characterized in that the periphery of the first cavity (62) has a first cavity wall (622), the top end of the first cavity wall (622) is provided with a transition slope (621), and a gap for receiving a bonding tool is formed between the transition slope (621) and the peripheral wall (202) of the substrate (20).

4. The IGBT module according to claim 3, characterized in that the transition slopes (621) extend obliquely upward and outward from the top lower portion of the first cavity wall (622) to the top end of the first cavity wall (622).

5. The IGBT module according to claim 2, wherein a second cavity (64) is provided in a middle portion of the water channel cavity (60), and a heat dissipation fin (22) is provided on a lower surface of the base plate (20), the heat dissipation fin (22) being received in the second cavity (64).

6. The IGBT module according to claim 5, characterized in that the heat dissipation fins (22) are cylindrical heat dissipation fins.

7. The IGBT module according to claim 5, characterized in that the width of the second cavity (64) is smaller than the width of the first cavity (62), a support surface (63) supporting the substrate (20) being formed between the first cavity (62) and the second cavity (64).

8. The IGBT module according to claim 5, characterized in that a cooling liquid inlet (662) and a cooling liquid outlet (664) are provided below the second cavity (64), the cooling liquid inlet (662) and the cooling liquid outlet (664) being located on both sides of the second cavity (64) and communicating with the second cavity (64).

9. A motor controller characterized in that it comprises an IGBT module according to any of claims 1 to 8.

10. A vehicle, characterized in that the vehicle comprises a motor controller according to claim 9.