CN202024264U

CN202024264U - Composite radiator structure of LED lamp

Info

Publication number: CN202024264U
Application number: CN201120092725XU
Authority: CN
Inventors: 陆启蒙; 冯世
Original assignee: HEFEI ESK OPTICAL-ELECTRICAL TECHNOLOGY Co Ltd
Current assignee: HEFEI ESK OPTICAL-ELECTRICAL TECHNOLOGY Co Ltd
Priority date: 2011-03-31
Filing date: 2011-03-31
Publication date: 2011-11-02
Anticipated expiration: 2021-03-31

Abstract

The utility model discloses a composite radiator structure of an LED lamp, which includes an LED chip, a metal base PCB used for mounting the LED chip and a composite radiator. Via-holes corresponding to the heat sink part of the LED chip are formed on a copper foil layer and an insulated heat conducting layer, thereby facilitating the direct contact between the heat sink of the LED chip and an aluminium alloy heat dissipation layer; a plurality of heat dissipation special ribs are arranged on the back surface of the aluminium alloy layer, and the surfaces of the ribs are subjected to black anodic oxidation treatment; the LED chip and the composite radiator are fixedly connected by adopting reflow soldering; lead-free solder paste is screen-printed on the copper foil layer of the composite radiator; then the LED chip is subjected to SMT (surface mount technology) operation, and finally is sent to reflow soldering equipment for soldering; and the heat sink of the LED chip is directly and firmly soldered with the aluminium alloy layer, so that the heat of the LED chip doesn't pass through the insulated heat conducting layer but is directly transferred to the aluminium alloy layer.

Description

The composite heating radiator structure of LED light fixture

Technical field

The utility model relates to a kind of heat dissipation technology of LED light fixture, especially relates to a kind of composite heating radiator structure of high heat dispersion LED light fixture.

Background technology

The heat sink conception that the high-power LED lamp of present most of enterprises adopts usually is: at first the mode of led chip by Reflow Soldering is welded on the pcb board of aluminium base or copper base, apply one deck heat conductive silica gel then in the pcb board bottom surface, pcb board is bonded on the aluminium alloy lamp body (radiator) at last.The heat of led chip at first is delivered to pcb board (aluminium base or copper base), be delivered to radiator by heat conductive silica gel, radiator is delivered to heat in the light fixture ambient air at last, heat conductive silica gel between pcb board (aluminium base or copper base) and the aluminium alloy radiator is the bottleneck of LED light fixture heat radiation process, the thermal conductivity factor of heat conductive silica gel is very low, cause the heat of led chip can not in time be transmitted on the aluminium section bar radiator, thereby cause the led chip heat accumulation, promptly impel the raising of led chip junction temperature, greatly reduce the output light flux and the working life of led chip, cause the very big wasting of resources, traditional heat sink conception heat dissipation path is longer, heat eliminating medium is more, radiating effect is not good, and pcb board (aluminium base or copper base) separates with radiator, and assembling procedure is more, troublesome poeration, the assembly cost height.

The utility model content

In order to overcome the defective of above-mentioned prior art, the utility model provides a kind of LED lamp radiator structure of simple and reliable high heat dispersion.

The composite heating radiator structure of the utility model LED light fixture takes following technical scheme to realize, a kind of LED light fixture composite heating radiator structure, comprise led chip, be used to install the Metal Substrate pcb board of led chip and the complex of radiator, it is characterized in that: described composite heating radiator has the dual-use function of Metal Substrate pcb board and radiator concurrently, described led chip bottom has positive and negative electrode and heat sink part, heat sinkly carries out thermoelectric separating treatment.

Described composite heating radiator structure comprises protective layer, copper foil layer, insulating heat-conductive layer and aluminium alloy layer; The heat sink part of described copper foil layer, the corresponding led chip of insulating heat-conductive layer has corresponding via hole, directly contacts with the aluminium alloy heat dissipating layer to make things convenient for the heat sink of led chip, reduces heat sink heat dissipation channel, improves radiating efficiency.

The described aluminium alloy layer back side has the special-shaped fin of a plurality of heat radiations, and described special-shaped fin comprises rectangle fin, triangular fin, trapezoidal fin and other special-shaped fin, and the fin surface has the ripple tooth, to increase area of dissipation.

The black anodizing processing is carried out on the special-shaped fin of described aluminium alloy surface, to strengthen the fin thermal radiation capability.

Described led chip adopts Reflow Soldering or other welding method to fixedly connected with composite heating radiator, the copper foil layer silk-screen lead-free tin cream on composite heating radiator surface, then led chip is carried out the paster operation, sending into Reflow Soldering equipment at last welds, the firm welding of the positive and negative electrode of led chip and copper foil layer like this, and the heat sink direct and firm welding of aluminium alloy layer of led chip, thereby the heat of led chip is directly delivered to aluminium alloy layer by the insulating heat-conductive layer.

The utlity model has following beneficial effect in sum: LED light fixture composite heating radiator structure of the present utility model, solve the bottleneck problem of LED light fixture heat dissipation channel effectively, greatly improve the heat-sinking capability of LED light fixture, thereby improved the light efficiency of LED, effectively guaranteed the service life of LED light fixture, simplify the packaging technology of LED light fixture simultaneously, reduced the assembly cost of the whole light fixture of LED.

Description of drawings

Fig. 1 is the utility model general structure schematic diagram;

Fig. 2 is the utility model detailed structure schematic diagram.

Wherein: the 1-LED chip; The 2-composite heating radiator; The 3-copper foil layer; 4-tin cream (the heat sink usefulness of LED); 5-LED chip positive pole; 6-LED is heat sink; 7-LED chip negative pole; 8-tin cream (the LED electrode is used); 9-copper foil layer via hole; 10-insulating heat-conductive layer via hole; The 11-protective layer; 12-insulating heat-conductive layer; The 13-aluminium alloy layer; The 14-fin.

The specific embodiment

As depicted in figs. 1 and 2, a kind of LED light fixture composite heating radiator structure comprises led chip 1, is used to install the composite heating radiator 2 of led chip, double aluminum base PCB plate, thermal component and the lamp body heavy mail done of composite heating radiator.

That described led chip 1 bottom comprises is anodal 5, negative pole 7 and heat sink 6, and this three part will be welded with the composite heating radiator upper surface, and described heat sink 6 carry out electrical separation with anodal 5, negative pole 7, and heat sink 6 only have the function of heat radiation.

Composite heating radiator 2 structures comprise protective layer 11, copper foil layer 3, insulating heat-conductive layer 12 and aluminium alloy layer 13; described copper foil layer 3 mid portions have the via hole 9 corresponding to led chip heat sink 6; described insulating heat-conductive layer 12 mid portion have the via hole 10 corresponding to led chip heat sink 6; via hole 9 and via hole 10 internal thread tin creams, with make things convenient for heat sink 6 of led chip skip copper foil layer 3 and insulating heat-conductive layer 12 directly and aluminium alloy layer 13 weld.

Described aluminium alloy layer 13 back sides have the special-shaped fin 14 of a plurality of heat radiations, described special-shaped fin 14 comprises rectangle fin, triangular fin, trapezoidal fin and other special-shaped fin, flow direction along air, the fin surface has the ripple tooth, to increase area of dissipation, the black anodizing processing is carried out on the fin surface, to increase the fin thermal radiation capability.

Described led chip 1 adopts Reflow Soldering or other welding method to fixedly connected with composite heating radiator 2, the copper foil layer 3 silk-screen tin creams 4 on composite heating radiator surface, tin cream 8, then led chip 1 is carried out the paster operation, closing Reflow Soldering equipment at last welds, the positive pole 5 of led chip 1, negative pole 7 and copper foil layer 3 firm welding like this, and heat sink 6 direct and aluminium alloy layer 13 firm welding of led chip 1, thereby the heat of led chip 1 by insulating heat-conductive layer 12, is not directly delivered to aluminium alloy layer 13.

It should be noted that at last: above embodiment only in order to the explanation the utility model and and the described technical scheme of unrestricted the utility model; Therefore, although this specification has been described in detail the utility model with reference to each above-mentioned embodiment,, those of ordinary skill in the art should be appreciated that still and can make amendment or be equal to replacement the utility model; And all do not break away from the technical scheme and the improvement thereof of spirit and scope of the present utility model, all should be encompassed in the claim scope of the present utility model.

Claims

1. LED light fixture composite heating radiator structure, comprise led chip, be used to install the Metal Substrate pcb board of led chip and the complex of radiator, it is characterized in that: described composite heating radiator has the dual-use function of Metal Substrate pcb board and radiator concurrently, described led chip bottom has positive and negative electrode and heat sink part, heat sinkly carry out thermoelectric separating treatment, described composite heating radiator structure comprises protective layer, copper foil layer, insulating heat-conductive layer and aluminium alloy layer; Described led chip is fixedlyed connected with composite heating radiator.

2. a kind of LED light fixture composite heating radiator structure according to claim 1: it is characterized in that: the heat sink part of described copper foil layer, the corresponding led chip of insulating heat-conductive layer has corresponding via hole, and the heat sink and aluminium alloy heat dissipating layer of led chip directly contacts.

3. a kind of LED light fixture composite heating radiator structure according to claim 1: it is characterized in that: the described aluminium alloy layer back side has the special-shaped fin of a plurality of heat radiations, and described fin surface has the ripple tooth, and its surface is carried out black anodizing and handled.

4. a kind of LED light fixture composite heating radiator structure according to claim 1: it is characterized in that: the copper foil layer silk-screen lead-free tin cream on described composite heating radiator surface, the firm welding of the positive and negative electrode of led chip and copper foil layer, and the heat sink direct and firm welding of aluminium alloy layer of led chip.