CN217158167U - Packaging structure for semiconductor chip - Google Patents

Abstract

The utility model discloses a packaging structure for semiconductor chip relates to semiconductor chip packaging technology field. The packaging structure comprises a substrate, wherein a chip body is arranged at the top of the substrate, a packaging shell for coating the chip body is further arranged at the top of the substrate, a heat dissipation plate is arranged inside the packaging shell, heat conduction silica gel is arranged between the heat dissipation plate and the chip body, a mounting groove is uniformly formed in the top of the heat dissipation plate, a cooling fin is installed in the mounting groove, a clamping plate for limiting and reinforcing the cooling fin is arranged at the top of the cooling fin, and pins penetrating through the packaging shell are arranged on two sides of the chip body. This packaging structure for semiconductor chip through setting up heating panel, fin, cooling tube and graphite alkene heat dissipation layer, can the omnidirectional dispel the heat to the chip body, and then the radiating effect is good.

Description

Packaging structure for semiconductor chip

Technical Field

The utility model relates to a semiconductor chip packaging technology field specifically is a packaging structure for semiconductor chip.

Background

Generally, when a semiconductor chip is packaged, a large amount of heat is generated, and the generated heat is dissipated in time, which causes the temperature inside the semiconductor package to continuously rise, and the excessive temperature causes the performance degradation or the lifetime reduction of the semiconductor chip, and even causes permanent damage.

In the existing packaging structure, the packaging structure is simple and is packaged by using a shell, and the packaged semiconductor chip has the problem of poor heat dissipation performance.

SUMMERY OF THE UTILITY MODEL

The utility model provides a packaging structure for semiconductor chip to solve the problem in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a packaging structure for semiconductor chip, includes the base plate, the top of base plate is provided with the chip body, the top of base plate still is provided with the packaging shell with chip body cladding, the inside heating panel that is provided with of packaging shell, be provided with heat conduction silica gel between heating panel and the chip body, the mounting groove has evenly been seted up at the top of heating panel, install the fin in the mounting groove, the top of fin is provided with carries out spacing cardboard of strengthening to the fin, the both sides of chip body are provided with the pin that passes the packaging shell.

Furthermore, through holes are uniformly formed in the surface of the radiating fin.

Further, the bottom of cardboard is provided with the fixture block, the fixture block joint is in the radiating groove that forms between the fin.

Furthermore, mounting plates are integrally formed at two ends of the clamping plate and are connected with the packaging shell through bolts.

Furthermore, the packaging shell is provided with a radiating pipe inside the two sides of the chip body.

Further, the base plate comprises heat conduction adhesion layer, graphite alkene heat dissipation layer and metal carrier layer, heat conduction adhesion layer, graphite alkene heat dissipation layer and metal carrier layer set gradually from last to down.

Compared with the prior art, the utility model provides a packaging structure for semiconductor chip possesses following beneficial effect: this packaging structure for semiconductor chip through setting up heating panel, fin, cooling tube and graphite alkene heat dissipation layer, can the omnidirectional dispel the heat to the chip body, and then the radiating effect is good.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic plan view of the present invention;

FIG. 3 is a schematic structural view of a clamping plate of the present invention;

fig. 4 is an enlarged schematic view of the utility model at a;

fig. 5 is a schematic structural diagram of the heat sink of the present invention.

In the figure: 1. a substrate; 2. packaging the shell; 3. a chip body; 4. a heat dissipation plate; 5. a heat sink; 6. clamping a plate; 7. mounting grooves; 8. a through hole; 9. a clamping block; 10. mounting a plate; 11. a pin; 12. a radiating pipe; 13. a thermally conductive adhesive layer; 14. a graphene heat dissipation layer; 15. a metal carrier layer; 16. thermally conductive silicone.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-5, the utility model discloses a packaging structure for semiconductor chip, which comprises a substrate 1, the top of base plate 1 is provided with chip body 3, the top of base plate 1 still is provided with the encapsulation shell 2 with the cladding of chip body 3, 2 inside heating panel 4 that are provided with of encapsulation shell, be provided with heat conduction silica gel 16 between heating panel 4 and the chip body 3, mounting groove 7 has evenly been seted up at the top of heating panel 4, install fin 5 in the mounting groove 7, the top of fin 5 is provided with carries out spacing cardboard 6 of strengthening to fin 5, the both sides of chip body 3 are provided with the pin 11 that passes encapsulation shell 2.

Specifically, through holes 8 are uniformly formed in the surface of the radiating fin 5.

In the present embodiment, the provision of the through holes 8 increases the contact area of the heat sink 5 with air, and reduces the weight of the heat sink 5.

Specifically, the bottom of cardboard 6 is provided with fixture block 9, fixture block 9 joint is in the radiating groove that forms between fin 5.

In this embodiment, cardboard 6 and fixture block 9's setting can strengthen the intensity of fin 5, avoids fin 5 to take place deformation because of the collision to a certain extent.

Specifically, the mounting plates 10 are integrally formed at two ends of the clamping plate 6, and the mounting plates 10 are connected with the packaging shell 2 through bolts.

In the present embodiment, this structure is designed to fix the card 6 and the heat sink 5.

Specifically, the heat dissipation tube 12 is disposed inside the package casing 2 on two sides of the chip body 3.

In this embodiment, the heat dissipation tube 12 is a regular hexagon, which increases the heat dissipation area of the heat dissipation tube 12, and the inner cavity of the heat dissipation tube 12 is communicated with the outside air.

Specifically, base plate 1 comprises heat conduction adhesion layer 13, graphite alkene heat dissipation layer 14 and metal carrier layer 15, heat conduction adhesion layer 13, graphite alkene heat dissipation layer 14 and metal carrier layer 15 set gradually from last to down.

In this embodiment, the heat-conducting adhesive layer 13, the graphene heat dissipation layer 14, and the metal carrier layer 15 are disposed to dissipate heat from the lower side of the chip body 3.

When using, set up chip body 3 on base plate 1, coating heat conduction silica gel 16 on chip body 3, later the rethread packaging shell 2 encapsulates chip body 3, the one end of fin 5 is installed in mounting groove 7, through install cardboard 6 on fin 5, can make fin 5 remain stable and increase its intensity, when chip body 3 work generates heat, heat accessible heating panel 4, fin 5, cooling tube 12 and graphite alkene heat dissipation layer 14 carry out the omnidirectional and dispel the heat.

In summary, the package structure for semiconductor chips can radiate the chip body 3 in all directions by the heat dissipation plate 4, the heat dissipation plate 5, the heat dissipation pipe 12 and the graphene heat dissipation layer 14, and thus has a good heat dissipation effect.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A package structure for a semiconductor chip includes a substrate (1), characterized in that: the top of base plate (1) is provided with chip body (3), the top of base plate (1) still is provided with encapsulating shell (2) with chip body (3) cladding, encapsulating shell (2) inside is provided with heating panel (4), be provided with heat conduction silica gel (16) between heating panel (4) and chip body (3), mounting groove (7) have evenly been seted up at the top of heating panel (4), install fin (5) in mounting groove (7), the top of fin (5) is provided with cardboard (6) that carry out spacing reinforcement to fin (5), the both sides of chip body (3) are provided with pin (11) that pass encapsulating shell (2).

2. The package structure for a semiconductor chip according to claim 1, wherein: through holes (8) are uniformly formed in the surface of the radiating fin (5).

3. The package structure for a semiconductor chip according to claim 1, wherein: the bottom of cardboard (6) is provided with fixture block (9), in the radiating groove of fixture block (9) joint formation between fin (5).

4. The package structure for a semiconductor chip according to claim 3, wherein: mounting plates (10) are integrally formed at two ends of the clamping plate (6), and the mounting plates (10) are connected with the packaging shell (2) through bolts.

5. The package structure for a semiconductor chip according to claim 1, wherein: and the heat radiating pipes (12) are arranged in the packaging shell (2) and positioned at two sides of the chip body (3).

6. The package structure for a semiconductor chip according to claim 1, wherein: base plate (1) comprises heat conduction adhesion layer (13), graphite alkene heat dissipation layer (14) and metal carrier layer (15), heat conduction adhesion layer (13), graphite alkene heat dissipation layer (14) and metal carrier layer (15) set gradually from last to down.

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