CN216965532U

CN216965532U - Spray type megasonic equipment for semiconductor wafer surface treatment

Info

Publication number: CN216965532U
Application number: CN202122354298.4U
Authority: CN
Inventors: 孙成; 柳乐红
Original assignee: Siansonic Technology Co ltd
Current assignee: Siansonic Technology Co ltd
Priority date: 2021-09-27
Filing date: 2021-09-27
Publication date: 2022-07-15
Anticipated expiration: 2031-09-27

Abstract

The utility model provides a spray type megasonic device for surface treatment of a semiconductor wafer, which belongs to the technical field of cleaning equipment and comprises: the device comprises a case, a liquid storage tank, a control panel, a spraying assembly, a cleaning tank and a sucker assembly, wherein the liquid storage tank is arranged inside the case; the control panel is arranged on the box wall of the case; the spraying component is arranged on the case and communicated with the liquid storage tank; the cleaning tank is arranged at the top of the case, a circular truncated cone structure is arranged in the middle of the cleaning tank, and a through hole is formed in the middle of the circular truncated cone structure; the sucker component penetrates through the through hole; the sucker component and the spraying component are electrically connected with the control panel. According to the spray type megasonic equipment for surface treatment of the semiconductor wafer, the circular truncated cone structure is arranged in the middle of the cleaning tank, the through hole is formed in the middle of the circular truncated cone structure, the sucker component penetrates through the through hole, cleaning liquid is prevented from leaking into the case in the rotating process of the sucker component, and normal work of the sucker component is guaranteed.

Description

Spray type megasonic equipment for semiconductor wafer surface treatment

Technical Field

The utility model relates to the technical field of cleaning equipment, in particular to a spraying type megasonic device for surface treatment of a semiconductor wafer.

Background

The ultrasonic cleaning technology is one of the most commonly used industrial cleaning technologies, and the traditional ultrasonic cleaning technology is used for removing stains on the surface of an object by using cavitation generated by ultrasonic waves of 20kHz-100kHz in liquid so as to achieve the purpose of cleaning. However, the ultrasonic cavitation is too strong, which may cause some damage to the surface of an object, for example, in the cleaning of precision components such as semiconductor devices and optical precision components, the surface of the device may be damaged by the traditional high-frequency ultrasonic cleaning because the surface of the device has a microstructure. In addition, the higher the ultrasonic frequency is, the smaller the particle size of the impurity particles to be cleaned is, and the impurity particles with the maximum frequency of 100kHz which are cleaned by the traditional ultrasonic cleaning method are difficult to clean and are less than 1 micron.

When the ultrasonic wave with the frequency higher than 400kHz is transmitted in liquid, an extremely-thin acoustic boundary layer with large velocity gradient can be formed near the surface of a cleaned part, the foreign particles fall off from the surface of the part under the vibration effect of megahertz frequency of the liquid, micron and submicron foreign particles on the surface of the part can be cleaned, and the ultra-precise cleaning process is realized. In addition, the high-frequency ultrasonic cleaning process does not damage the surface of the cleaned part due to extremely low cavitation effect, and can effectively solve the problems of corrosion or damage and the like caused after the cleaning of the precision component. Therefore, the megasonic equipment capable of emitting megahertz level is widely applied to the field of semiconductor manufacturing, and can play an important role in key processes such as chemical mechanical polishing, developing, degumming, metal stripping, etching and the like besides the cleaning function. The megasonic equipment is mainly divided into a groove type megasonic equipment and a spray type megasonic equipment, the spray type megasonic equipment has higher sound transmission efficiency compared with the groove type megasonic equipment arranged at the bottom of a processing tank, and can avoid secondary pollution, so the spray type megasonic equipment is more widely applied to developing, degumming, metal stripping and chemical mechanical polishing.

However, in the prior art, the megasonic spraying device is easy to leak liquid into the case in the cleaning process, and the normal operation of the megasonic spraying device is easily affected.

SUMMERY OF THE UTILITY MODEL

The utility model provides a spray type megasonic device for surface treatment of a semiconductor wafer, which is used for overcoming the defect of water leakage in the prior art and prolonging the service life.

The utility model provides a spray type megasonic device for surface treatment of a semiconductor wafer, comprising: the device comprises a case, a liquid storage tank, a control panel, a spraying assembly, a cleaning tank and a sucker assembly, wherein the liquid storage tank is arranged inside the case; the control panel is arranged on the box wall of the case; the spraying assembly is arranged on the case and communicated with the liquid storage tank; the cleaning tank is arranged at the top of the case, a liquid discharging hole is formed in a bottom plate of the cleaning tank, a circular truncated cone structure is arranged in the middle of the cleaning tank, and a through hole is formed in the middle of the circular truncated cone structure; the sucker assembly penetrates through the through hole; the sucking disc assembly with the spraying assembly all with control panel electric connection.

According to the spray type megasonic equipment for the surface treatment of the semiconductor wafer, provided by the utility model, the sucker assembly comprises a first motor, a main rotating shaft, a pneumatic rotating joint and a sucker; an output shaft of the first motor is in transmission connection with the main rotating shaft, the main rotating shaft penetrates through the through hole, and a vent hole is formed in the middle of the main rotating shaft; the top end of the main rotating shaft is connected with the sucking disc, and the bottom end of the main rotating shaft is connected with the pneumatic rotating joint; the first motor and the pneumatic rotary joint are electrically connected with the control panel.

The utility model also provides spraying type megasonic equipment for surface treatment of semiconductor wafers, wherein an output shaft of the first motor is in belt transmission with the main rotating shaft.

The utility model also provides spraying type megasonic equipment for surface treatment of semiconductor wafers, wherein a thrust bearing is arranged at the joint of the main rotating shaft and the bottom of the cleaning tank.

The present invention also provides a spray type megasonic apparatus for surface treatment of a semiconductor wafer, comprising: and a water seal O-shaped ring is arranged at the joint of the main rotating shaft and the circular truncated cone structure.

The utility model also provides spraying type megasonic equipment for surface treatment of the semiconductor wafer, wherein the periphery of the sucker is provided with a plurality of locking blocks for adjusting the position of the wafer.

The present invention also provides a spray megasonic apparatus for surface treatment of semiconductor wafers, comprising: the spraying assembly comprises a second motor, a transmission shaft, a swing arm and a spray head, and the second motor is arranged in the case and is electrically connected with the control panel; the transmission shaft penetrates through a top plate of the case, one end of the transmission shaft is connected with an output shaft of the second motor, and the other end of the transmission shaft is connected with the swing arm; the shower nozzle set up in the swing arm is kept away from the one end of transmission shaft, and through the pipeline with the liquid reserve tank is linked together.

The utility model also provides spraying type megasonic equipment for treating the surface of the semiconductor wafer, wherein the angle between the water column sprayed by the spray head and the surface of the wafer is alpha, and the alpha is more than or equal to 55 degrees and less than or equal to 65 degrees.

The utility model also provides spraying type megasonic equipment for surface treatment of the semiconductor wafer, wherein the two groups of spraying assemblies are arranged side by side.

The utility model also provides spraying type megasonic equipment for surface treatment of the semiconductor wafer, which further comprises a box cover and a supporting rod, wherein the box cover is hinged to one side of the top of the case, one end of the supporting rod is connected with the box cover, and the other end of the supporting rod is connected with the case.

According to the spray type megasonic equipment for surface treatment of the semiconductor wafer, the liquid discharge hole is formed in the bottom plate of the cleaning tank, and cleaning liquid is discharged from the liquid discharge hole; the middle part of the cleaning tank is provided with a circular truncated cone structure, the middle part of the circular truncated cone structure is provided with a through hole, the sucker component penetrates through the through hole, cleaning liquid is prevented from leaking into the interior of the case in the rotating process of the sucker component, and normal work of the sucker component is guaranteed.

Drawings

In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a shower-type megasonic apparatus for surface treatment of a semiconductor wafer according to the present invention;

FIG. 2 is a schematic view of the structure of the cleaning tank and the suction cup assembly provided by the present invention;

FIG. 3 is a schematic structural view of a spray assembly provided by the present invention;

reference numerals are as follows:

1: a chassis; 2: a liquid storage tank; 3: a control panel;

4: a spray assembly; 5: a cleaning tank; 6: a suction cup assembly;

7: a thrust bearing; 8: water sealing the O-shaped ring; 9: a box cover;

10: a support bar; 61: a first motor; 62: a main rotating shaft;

63: a pneumatic rotary joint; 64: a suction cup; 65: a locking block;

41: a second motor; 42: a drive shaft; 43: swinging arms;

44: a spray head; 51: a round platform structure.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The embodiment of the utility model is described below with reference to fig. 1, and discloses a spray type megasonic device for surface treatment of semiconductor wafers, which comprises a case 1, a liquid storage tank 2, a control panel 3, a spray assembly 4, a cleaning tank 5 and a sucker assembly 6, wherein the liquid storage tank 2 is arranged inside the case 1; the control panel 3 is arranged on the wall of the case 1; the spraying component 4 is arranged on the case 1 and is communicated with the liquid storage tank 2; the cleaning tank 5 is arranged at the top of the case 1, a circular truncated cone structure 51 is arranged in the middle of the cleaning tank 5, and a through hole is formed in the middle of the circular truncated cone structure 51; the sucker component 6 penetrates through the through hole; the sucker assembly 6 and the spraying assembly 4 are both electrically connected with the control panel 3.

Specifically, as shown in fig. 2, the suction cup assembly 6 includes a first motor 61, a main rotating shaft 62, a pneumatic rotary joint 63, and a suction cup 64; an output shaft of the first motor 61 is in transmission connection with a main rotating shaft 62, the main rotating shaft 62 penetrates through the through hole, and a vent hole is formed in the middle of the main rotating shaft 62; the top end of the main rotating shaft 62 is connected with a sucker 64, and the bottom end of the main rotating shaft is connected with a pneumatic rotating joint 63; the first motor 61 and the pneumatic rotary joint 63 are electrically connected to the control panel 3. The pneumatic rotary joint 63 is a transition connection sealing device for inputting a gas medium from a static system to a dynamic rotary system, and comprises a joint, a filter, an electromagnetic valve, a cylinder, a vacuum device, a gas pipe and the like, and can provide vacuum suction for the suction cup 64 and ensure that the gas is not leaked, so that a wafer is adsorbed on the surface of the suction cup 64.

It should be noted that the semiconductor wafer in this embodiment is a disk like optical disk, and is horizontally placed on top of the chuck 64.

As shown in fig. 2, a plurality of liquid discharge holes (not shown) are formed in the bottom plate of the cleaning tank 5, and a circular truncated cone structure 51 is disposed in the middle of the cleaning tank, so that after the spray assembly 4 sprays the wafer, the sprayed cleaning liquid can be discharged through the liquid discharge holes; the circular truncated cone structure 51 is 100mm in height and lower than the cleaning tank 5, so that liquid is prevented from splashing into the main rotating shaft 62, the normal use of the sucker assembly 6 is ensured, the service life is prolonged, and the running stability of megasonic equipment is ensured; and the conical design of the circular platform structure 51 saves the space of the case 1, thereby reducing the volume of the whole megasonic equipment.

Furthermore, as shown in fig. 2, the output shaft of the first motor 61 is in belt transmission with the main rotating shaft 62, and the belt transmission structure is stable and low in cost.

The control panel 3 controls the first motor 61 to work, the first motor 61 can drive the main rotating shaft 62 to rotate due to the transmission of the first motor 61 and the main rotating shaft 62, meanwhile, the pneumatic rotary joint 63 provides vacuum suction for the suction cup 64, and the wafer is adsorbed by the suction cup 64; the rotation of the main rotating shaft 62 drives the wafer to rotate at a high speed, and the rotating speed can be over 1000 r/min.

Further, as shown in fig. 2, a thrust bearing 7 is provided at a junction of the main rotating shaft 62 and the bottom of the wash bowl 5, and the thrust bearing 7 serves to prevent the main rotating shaft 62 from rotating at a high speed to cause eccentricity.

Furthermore, as shown in fig. 2, two water seal O-rings 8 are further disposed at the connection between the main rotating shaft 62 and the circular truncated cone structure 51, so as to form a dual-channel water seal leakage prevention protection, and ensure that the whole megasonic apparatus operates stably, thereby improving the working efficiency.

In addition, a plurality of locking blocks 65 for adjusting the position of the wafer are arranged on the periphery of the suction cup 64, the positioning distance of the locking blocks 65 is adjusted according to the size of the wafer, and the position of the wafer and the suction cup 64 in concentricity is ensured. Wherein the adjustment of the locking piece 65 may be automatic, controlled by the control panel 3.

Furthermore, as shown in fig. 3, the spraying assemblies 4 are two groups and are arranged side by side, and each group of spraying assemblies 4 includes a second motor 41, a transmission shaft 42, a swing arm 43 and a spray head 44, the second motor 41 is arranged inside the case 1 and is electrically connected with the control panel 3; the transmission shaft 42 penetrates through the top plate of the case 1, one end of the transmission shaft is connected with the output shaft of the second motor 41, and the other end of the transmission shaft is connected with the swing arm 43; the spray head 44 is disposed at one end of the swing arm 43 away from the transmission shaft 42, and is communicated with the liquid storage tank 2 through a pipeline.

The control panel 3 controls the forward and reverse rotation speed of the second motor 41, the second motor 41 is connected with the transmission shaft 42 through the coupler, the second motor 41 works to drive the transmission shaft 42 to swing, and the spray head 44 is fixedly arranged on the transmission shaft 42, so that the spray head 44 can reciprocate.

Specifically, as shown in fig. 3, the angle between the water jet from the shower head 44 and the wafer surface is α, and is 55 ° to 65 °, in this embodiment, α is 60 °. The inclination of the showerhead 44 at 60 deg. is intended to prevent air bubbles from generating dry combustion in the showerhead 44 and, in addition, to prevent the cleaning fluid from falling vertically into the wafer and causing a large degree of splashing. The definition herein gives an optimum distance, the height of the exit orifice of the showerhead 44 from the wafer surface is 5-20mm, here the ultrasonic focus position, and the sound intensity is maximum. The flow rate of the cleaning liquid should be 0.8-1.5L/min, too large flow rate will obstruct the sound wave of the nozzle 44 and reduce the efficiency, and too low flow rate will cause air to enter and reduce the transmission efficiency.

In addition, it should be added that the shower-type megasonic apparatus for surface treatment of semiconductor wafers disclosed in this embodiment further includes a box cover 9 and a supporting rod 10, the box cover 9 is hinged to one side of the top of the case 1, one end of the supporting rod 10 is connected to the box cover 9, and the other end is connected to the case 1. The support rod 10 can be manual or automatic, and is electrically connected with the control panel 3 when being automatically controlled, and the extension and the contraction of the support rod 10 are controlled by the control panel 3.

The working principle of the spray type megasonic equipment for surface treatment of the semiconductor wafer disclosed by the embodiment of the utility model is as follows: the wafer is absorbed on the sucking disc 64, the control panel 3 controls the first electrode 61 and the second motor 41 to work, the rotating speed of the sucking disc 64 is adjustable, the spray head 44 swings at a constant speed along with the swing arm 43, and the cleaning liquid is uniformly sprayed on the surface of the wafer; the power, the swing speed and the flow of the cleaning liquid of the spray head 44 can be controlled according to the process requirements, so that the cleaning requirement is met, and the cleaning effect is ensured; moreover, the circular truncated cone structure 51 can prevent the cleaning fluid from leaking into the main rotating shaft 62 inside the case 1, thereby ensuring the normal operation of the megasonic equipment and improving the working efficiency.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A shower-type megasonic apparatus for surface processing of semiconductor wafers, comprising: the device comprises a case, a liquid storage tank, a control panel, a spraying assembly, a cleaning tank and a sucker assembly, wherein the liquid storage tank is arranged inside the case; the control panel is arranged on the box wall of the case; the spraying assembly is arranged on the case and communicated with the liquid storage tank; the cleaning tank is arranged at the top of the case, a liquid discharging hole is formed in a bottom plate of the cleaning tank, a circular truncated cone structure is arranged in the middle of the cleaning tank, and a through hole is formed in the middle of the circular truncated cone structure; the sucker assembly penetrates through the through hole; the sucking disc subassembly with spray assembly all with control panel electric connection.

2. The spray megasonic apparatus for semiconductor wafer surface processing of claim 1, wherein the chuck assembly comprises a first motor, a main rotating shaft, a pneumatic rotary joint, and a chuck; an output shaft of the first motor is in transmission connection with the main rotating shaft, the main rotating shaft penetrates through the through hole, and a vent hole is formed in the middle of the main rotating shaft; the top end of the main rotating shaft is connected with the sucker, and the bottom end of the main rotating shaft is connected with the pneumatic rotating joint; the first motor and the pneumatic rotary joint are electrically connected with the control panel.

3. The showering megasonic apparatus for semiconductor wafer surface processing of claim 2, wherein an output shaft of the first motor is belt driven with the main rotating shaft.

4. The showering megasonic apparatus for surface treatment of semiconductor wafers as recited in claim 3, wherein a thrust bearing is disposed at a junction of the main rotating shaft and the bottom of the cleaning tank.

5. The shower-type megasonic apparatus for semiconductor wafer surface treatment according to claim 4, wherein a water seal O-ring is further disposed at a junction of the main rotating shaft and the truncated cone structure.

6. The showering megasonic apparatus for surface treatment of semiconductor wafers as recited in claim 2, wherein the chuck is provided with a plurality of locking blocks at its periphery for adjusting the position of the wafers.

7. The spray megasonic apparatus for surface treatment of semiconductor wafers of claim 1, wherein the spray assembly comprises a second motor, a drive shaft, a swing arm, and a spray head, the second motor disposed inside the cabinet and electrically connected to the control panel; the transmission shaft penetrates through a top plate of the case, one end of the transmission shaft is connected with an output shaft of the second motor, and the other end of the transmission shaft is connected with the swing arm; the shower nozzle set up in the swing arm is kept away from the one end of transmission shaft, and through the pipeline with the liquid reserve tank is linked together.

8. The shower-type megasonic apparatus for semiconductor wafer surface processing as claimed in claim 7, wherein the angle between the water jet emitted from the shower head and the wafer surface is α, and 55 ° α or 65 °.

9. The shower-type megasonic apparatus for semiconductor wafer surface processing of claim 7, wherein the shower assemblies are in two groups and are arranged side-by-side.

10. The spray type megasonic apparatus for surface treatment of semiconductor wafers as claimed in any of claims 1 to 9, further comprising a cover hinged to one side of the top of the housing and a support rod having one end connected to the cover and the other end connected to the housing.