CN216958027U - Mini LED backlight module with protective layer - Google Patents
Mini LED backlight module with protective layer Download PDFInfo
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- CN216958027U CN216958027U CN202123374945.4U CN202123374945U CN216958027U CN 216958027 U CN216958027 U CN 216958027U CN 202123374945 U CN202123374945 U CN 202123374945U CN 216958027 U CN216958027 U CN 216958027U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
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Abstract
The utility model discloses a Mini LED backlight module with a protective layer, which comprises a circuit structure and a light-emitting device, wherein the light-emitting device is electrically connected with the circuit structure; the circuit structure includes: a substrate comprising a first surface and an oppositely disposed second surface; the first surface of the substrate is provided with a groove, and a conductive material is arranged in the groove to form a conductive circuit; the protective layer is arranged on the surface of the circuit structure and at least covers part of the conducting circuit outside the connection position of the light-emitting device. According to the Mini LED backlight module provided by the utility model, the circuit structure adopts a groove type structure, the conducting circuit is arranged in the groove, the cost is greatly reduced, and the protecting layer is arranged in the conducting circuit area, so that the electrical property of the conducting wire circuit is ensured.
Description
Technical Field
The utility model relates to the technical field of Mini LED, in particular to a Mini LED backlight module with a protective layer.
Background
The Mini LED (sub-millimeter Light Emitting Diode) backlight Display technology is a new Display technology different from the conventional Liquid Crystal Display (LCD) and Organic Light-Emitting Diode (OLED) Display. Compared with the latter two, the Mini LED backlight panel has higher color contrast, brightness and color gamut, longer service life and thinner thickness, is a key field for the development of panel industry in recent years, and has wide prospect. However, the current Mini LED backlight panel is limited to its own structural design, and the circuit for driving the Mini LED may protrude above the substrate, and during the production and application process, the circuit may be damaged by friction, collision, etc., resulting in circuit fracture, so that the Mini LED backlight panel has poor functions.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a Mini LED backlight module with a protective layer to solve the above-mentioned problems.
The utility model adopts a technical scheme that:
the utility model provides a Mini LED backlight unit with protective layer, includes circuit structure and luminescent device, its characterized in that: the light-emitting device is electrically connected with the circuit structure; the circuit structure includes: a substrate comprising a first surface and an oppositely disposed second surface; the first surface of the substrate is provided with a groove, and a conductive material is arranged in the groove to form a conductive circuit; the protective layer is arranged on the surface of the circuit structure and at least covers part of the conducting circuit outside the connection position of the light-emitting device.
In one embodiment, the protective layer has at least two layers, and the protective layer close to the conductive circuit has a greater ability to block moisture than the protective layer away from the conductive circuit.
In one embodiment, a chamfer structure or an arc structure is adopted on one side of the protective layer close to the light-emitting device, so that the region provided with the light-emitting device is horn-shaped.
In one embodiment, the aspect ratio of the trench is not less than one third, and the width of the trench is not more than 1 mm.
In one embodiment, a polymer layer is disposed on the first surface of the substrate, a groove is disposed on a surface of the polymer layer away from the substrate, and a conductive material is disposed in the groove to form a conductive circuit.
In one embodiment, the groove comprises two side walls and a bottom surface, an included angle a between the side wall of the groove and the plane of the first surface of the substrate is greater than or equal to 60 degrees and less than 90 degrees, and the groove is in an inverted trapezoidal shape.
In one embodiment, a ratio of an area occupied by the conductive circuit to an area of the entire backlight module is not less than 10%.
In one embodiment, the protective layer covers the conductive circuit region and simultaneously covers a blank region outside the conductive circuit region.
In one embodiment, a polymer layer is disposed on the second surface of the substrate, a groove is disposed on a surface of the polymer layer away from the substrate, and a conductive material is disposed in the groove to form a conductive circuit.
In one embodiment, the conductive traces disposed on the first surface and the second surface of the substrate are electrically connected through the via structure.
The utility model has the beneficial effects that: according to the Mini LED backlight module provided by the utility model, the circuit structure adopts a groove type structure, the conducting circuit is arranged in the groove, the cost is greatly reduced, and the protecting layer is arranged in the conducting circuit area, so that the electrical property of the conducting wire circuit is ensured.
Drawings
FIG. 1 is a schematic plan view of a backlight module according to the present invention;
FIG. 2 is a schematic view of a sectional and partially enlarged structure of a backlight module according to the present invention;
FIG. 3 is a schematic cross-sectional view of a backlight module according to the present invention;
FIG. 4 is a schematic cross-sectional view of a backlight module according to another embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of a backlight module according to another embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of a backlight module according to another embodiment of the present invention;
FIG. 7 is a schematic cross-sectional view of a backlight module according to another embodiment of the present invention;
FIG. 8 is a schematic cross-sectional view of a backlight module according to another embodiment of the present invention;
FIG. 9 is a schematic plane structure diagram of a backlight module according to the present invention;
FIG. 10 is a schematic cross-sectional view of a backlight module according to another embodiment of the present invention;
FIG. 11 is a schematic cross-sectional view of a backlight module according to another embodiment of the present invention;
FIG. 12 is a schematic cross-sectional view of a backlight module according to another embodiment of the present invention;
FIG. 13 is a schematic cross-sectional view of a backlight module according to another embodiment of the present invention;
fig. 14 is another schematic cross-sectional view of a backlight module according to the present invention.
Detailed Description
To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described below. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
A backlight module can be used in the display field, for example miniLED, as the backlight module of demonstration, of course the backlight module also can use as the light source, provide the effect of illumination, wherein, backlight module includes:
a circuit structure, the circuit structure comprising: the substrate comprises a first surface and a second surface which is arranged oppositely, wherein the substrate is a hard substrate or a flexible substrate, the hard substrate is glass or other hard materials, the flexible substrate can be a composite substrate, PET, PMMA, PE, PC, glass fiber and other materials, the composite substrate can be the composite of PET and glass fiber, the composite of PC and glass fiber and the like, and therefore the substrate has certain toughness, can have a good supporting effect and has good mechanical properties; the conductive circuit comprises a conductive circuit, wherein a groove is formed in the first surface of the substrate, a conductive material is arranged in the groove to form the conductive circuit, the groove can be directly formed on the substrate, the depth-to-width ratio of the groove is not less than one third, the width of the groove is not more than 1 millimeter, for example, the depth of the groove is 100 micrometers, the width of the groove is 40 micrometers, the low resistance performance of the conductive circuit is ensured through a structure with a high depth-to-width ratio, the conductive circuit in the circuit structure is a solid structure under the condition, certainly, under the condition of not considering the resistance size, the conductive circuit can be a groove type grid structure, namely, cylinders are arranged in the groove, the cylinders are made of polymers, and the cylinders can be arranged regularly or randomly.
A light emitting device; the light emitting device is electrically connected with the circuit structure, and more specifically, the light emitting device is electrically connected with the conductive circuit in the circuit structure; the backlight module comprises a plurality of partition structures, each partition structure is internally provided with a conductive circuit, and the conductive circuits in each partition are finally connected with a control chip of the backlight module; the light emitting device in each partition is electrically connected with the conductive circuit, the light emitting device can be in a series structure or a parallel structure, and the connection structure of the light emitting device can also be a mixed and matched combination of series and parallel connection; the light-emitting device can be a light-emitting component such as a lamp bead, an LED, a lamp strip and a lamp strip.
The conductive material arranged in the groove is at least one, the conductive material can be a mixture of several conductive materials, different conductive layers can also be formed in the groove, and the outermost layer of conductive material far away from the bottom of the groove in the groove is generally made of metal materials or oxide conductive materials which are not easy to oxidize, such as nickel materials, so that the oxidation of the conductive materials can be well prevented, the conductive performance of the conductive circuit is ensured, and the resistance value of the conductive circuit is stable; normally the metallic conductive material may be: metals such as gold, silver, copper, aluminum, and nickel may be alloy materials, conductive materials such as ITO that are oxides, and organic conductive materials such as PEDOT.
The composite substrate comprises a plurality of layers of materials which are overlapped, and under normal conditions, when the composite substrate is used as a backlight module for display or illumination, the composite substrate needs to have certain mechanical properties or certain hardness so that the composite substrate can have good support smoothness like a glass substrate; so general composite substrate adopts PET + glass fiber layer, for example be equipped with the glass fiber layer between the two-layer PET, form composite substrate like this, wherein glass fiber layer is the one deck at least, can be two-layer, three-layer, four layers etc. improves composite substrate's toughness like this.
In one embodiment, for convenience of description, the conductive traces are further described in detail, that is, the conductive traces include a first conductive trace and a second conductive trace, the first conductive trace is disconnected from the second conductive trace at this time, a bonding block is arranged at one end of the first conductive trace, a bonding block is arranged at one end of the second conductive trace, and the two bonding blocks are arranged oppositely; the light-emitting device is erected between the two overlapping blocks and is electrically connected with the two overlapping blocks, namely the first conducting circuit and the second conducting circuit are conducted through the light-emitting device, and the wiring points of the light-emitting device are electrically connected with the overlapping blocks of the first conducting circuit and the second conducting circuit respectively; of course, the lapping block can be used for lapping the light-emitting device and can also be arranged at the lapping end of the conductive circuit and the external circuit.
In one embodiment, the lapping block is filled with a conductive grid, the conductive grid is of a convex structure or a concave structure, the main use scene of the structure is that when the area of the lapping block is relatively large, the lapping block is arranged by using the grid, and the grid is made of a conductive material.
In one embodiment, the overlapping block is a groove structure, a conductive material is disposed in the groove, the overlapping block and the conductive circuit are integrated, when the area of the overlapping block is small, the overlapping block is a groove, the groove and the conductive circuit are integrated, and the groove is directly filled with the conductive material.
In one embodiment, a polymer layer is disposed on the first surface of the substrate, a groove is disposed on a surface of the polymer layer away from the substrate, a conductive material is disposed in the groove to form a conductive circuit, the groove of the conductive circuit is not directly formed on the surface of the substrate but formed on the surface of the polymer, and the polymer may be a photo-curing or thermal-curing material, such as UV glue; in another embodiment, a bonding layer is arranged between the polymer layer and the substrate to ensure the bonding performance between the polymer layer and the substrate, and in order to increase the adhesion performance of the substrate, an adhesion promoting layer may be arranged on the surface of the substrate, or the surface of the substrate may be roughened to form an undulating recessed structure on the surface of the substrate to increase the bonding performance.
In one embodiment, a layer of structure is further disposed between the polymer layer and the adhesive layer, the layer of structure may also be referred to as a substrate, for example, PET, PC, PE, and the like, and equivalently, the polymer layer is disposed on the surface of the PET, and the polymer layer is provided with a conductive line on the surface of the polymer layer and then disposed on the surface of the substrate through the adhesive layer, where the substrate may be a structure of glass, PMMA, and the like.
In one embodiment, the groove comprises two side walls and a bottom surface, the included angle a between the side walls of the groove and the plane of the first surface of the substrate is more than or equal to 60 degrees and less than 90 degrees, the groove is in an inverted trapezoid shape, the groove in the embodiment is not straight, and the width of the opening of the groove is larger than the width of the bottom surface of the groove; in another embodiment, the cross-sectional shape of the groove may be a rectangular shape, and both side walls of the groove are at a right angle of 90 ° to the bottom surface; in another embodiment, the side walls of the groove may be curved and the bottom surface of the groove may also be curved.
In one embodiment, the surface of the circuit structure is further provided with a protective layer, the protective layer at least covers a part of the conductive circuit except for the connection position of the light emitting device, the part of the conductive circuit, which is used for connecting the light emitting device, is exposed, the rest part of the conductive circuit covers the protective layer, the protective layer can be made of an ink material, such as white ink, the protective layer can directly cover the area of the conductive circuit, and can also cover a blank area except the conductive circuit at the same time, and the protective layer can well block outside water vapor and avoid or reduce oxidation of the conductive circuit.
In one embodiment, the protective layer has at least two layers, and the protective layer close to the conductive circuit has a larger water vapor blocking capability than the protective layer far from the conductive circuit, that is, the protective layer directly close to the surface of the conductive circuit has a higher water vapor blocking performance, and the water vapor blocking performance of the protective layer far from the conductive circuit may be relatively reduced, or may be the same.
In one embodiment, a chamfer structure or an arc structure is adopted on one side of the protective layer close to the light-emitting device, and the protective layer close to the light-emitting device area is made to adopt a chamfer structure or an arc structure, so that the light-emitting device is more convenient to install and the light-emitting device area is trumpet-shaped.
Referring to fig. 1, a backlight module 100 includes a plurality of partition structures 101 and a control chip 102, where each partition structure 101 is provided with a conductive circuit and a plurality of light emitting devices, the partition structure 101 is connected to the control chip 102, and the control chip 102 and the partition structure 101 in fig. 1 are located on the same carrying structure or substrate, although the control chip 102 may also be an external structure, and is not necessarily disposed between the partition structures 101, and may also be a structure in which lead wires of the partition structures 101 are concentrated in a certain area, and then connected to an external control chip through a connection circuit.
Referring to fig. 2, a light emitting device 200 and a conductive trace 30 are disposed in a partition structure 101 in fig. 1, where the conductive trace 30 may be referred to as a first conductive trace and a second conductive trace, and the first conductive trace and the second conductive trace are provided with a bridging block 40, although for convenience of description, the first conductive trace and the second conductive trace may be collectively referred to as a conductive trace, the light emitting device 200 is erected between the bridging blocks 40 to conduct the conductive trace, the bridging block is not necessarily provided, the conductive trace 30 may not be provided with a bridging block, and the light emitting device 200 may be directly electrically connected to the conductive trace 30; the conductive line 30 is a solid conductive line, and may be of a grid structure (conductive grid structure), and the light emitting devices 200 may be connected in series or in parallel (not shown).
Referring to fig. 3, a circuit structure of a backlight module includes a substrate 10, a conductive line 30 and a polymer layer 50, where the substrate 10 includes a first surface and an opposite second surface, the first surface of the substrate 10 is provided with the polymer layer 50, a surface of the polymer layer 50 away from the substrate 10 is provided with a trench, a conductive material is provided in the trench to form the conductive line 30, the conductive material provided in the trench may be a multi-layer structure, the conductive materials of each layer may be the same or different, or the conductive material is formed by mixing at least two conductive materials, the cross section of the trench is a rectangular structure, an aspect ratio of the trench is not less than one third, and the trench is not more than 1 mm wide, for example, the trench has a depth of 80 microns and a width of 40 microns; the substrate 10 may be made of PET, PMMA, PC, or the like, although the substrate 10 in fig. 1 may be made of glass, and is a hard substrate, and the light emitting device (not shown) may be connected to the conductive circuit 30, so that the light emitting device is electrically connected to the conductive circuit.
Referring to fig. 4, a circuit structure of a backlight module includes a substrate 10, a conductive trace 30, an adhesive layer 60, and a polymer layer 50, where the substrate 10 includes a first surface and a second surface opposite to the first surface, the adhesive layer 60 is disposed between the first surface of the substrate 10 and the polymer layer 50, a groove is disposed on a surface of the polymer layer 50 away from the substrate 10, and a conductive material is disposed in the groove to form the conductive trace 30; the bonding layer 60 is arranged on the first surface of the substrate 10, so that the bonding force between the polymer layer 50 and the substrate 10 is increased, the bonding force is increased by only one technical scheme of the bonding layer, and the first surface of the substrate 10 can be provided with a micro-nano structure, so that the intermolecular acting force between the polymer layer and the substrate 10 is increased by adopting the scheme.
Referring to fig. 5, a circuit structure of a backlight module includes a substrate 10, a conductive trace 30, a flexible substrate 20, a polymer layer 50, and an adhesive layer 60, where the substrate 10 includes a first surface and an opposite second surface, the adhesive layer 60 is disposed on the first surface of the substrate 10, the flexible substrate 20 is disposed on a side of the adhesive layer 60 away from the substrate 10, the flexible substrate 20 may be a flexible material such as PET, PMMA, PC, and PE, the polymer layer 50 is disposed on a side of the flexible substrate 20 away from the substrate 10, a groove is disposed on a surface of the polymer layer 50 away from the substrate 10, and the conductive material is disposed in the groove to form the conductive trace 30; since the polymer layer 50 is disposed on the surface of the flexible substrate 20, a roll-to-roll process can be used to manufacture the circuit structure, since it is flexible and can be rolled, so that the manufactured circuit structure is adhered to the surface of the substrate 10 through the adhesive layer 60, in which case the substrate 10 is preferably a hard substrate, such as glass.
Referring to fig. 6, a circuit structure of a backlight module includes a composite substrate, a conductive trace 30 and a polymer layer 50, the composite substrate includes a first flexible substrate 20, a second flexible substrate 21 and a third flexible substrate 22, in fact, the composite substrate includes at least two layers of flexible substrates, the first flexible substrate 20 and the third flexible substrate 22 may be the same, for example, both flexible substrates are PET, PC, PMMA, etc., of course, the two layers of flexible substrate may be of different materials, such as any two of the above materials, wherein, the second flexible substrate 21 is preferably made of glass fiber with glass-like property, and can adopt multi-layer glass fiber material, in this way, it is possible to achieve properties similar to those of glass, so that the composite substrate is formed in the form of an interlayer, of course, the composite substrate may be formed by alternately or alternately stacking flexible substrates of different materials.
Referring to fig. 7, a circuit structure of a backlight module includes a composite substrate, a first conductive trace 30, a first polymer layer 50, a second conductive trace 30, and a second polymer layer 51, where the composite substrate includes a first flexible substrate 20, a second flexible substrate 21, and a third flexible substrate 22, the first polymer layer 50 is disposed on a side of the third flexible substrate 22 away from the second flexible substrate 21, and a groove is disposed on a side of the first polymer layer 50 away from the third flexible substrate 22, and a conductive material is disposed in the groove to form the first conductive trace 30; the second polymer layer 51 is arranged on one side, away from the second flexible substrate 21, of the first flexible substrate 20, a groove is formed in one side, away from the first flexible substrate 20, of the second polymer layer 51, a conductive material is arranged in the groove to form a second conductive circuit 31, and thus conductive circuits are arranged on two surfaces of the composite substrate respectively.
Referring to fig. 8, a circuit structure of a backlight module includes a substrate 10, a conductive trace 33 and a polymer layer 50, where the substrate 10 includes a first surface and a second surface opposite to the first surface, the polymer layer 50 is disposed on the first surface of the substrate 10, a groove is disposed on a surface of the polymer layer 50 away from the substrate 10, and a conductive material is disposed in the groove to form the conductive trace 33; the slot includes two lateral walls and a bottom, the contained angle of lateral wall and horizontal direction is a, the scope of contained angle a is 60 a ≦ a < 90 °, and further, the scope of contained angle a is 80 a ≦ a < 90 °, and the adoption is fallen trapezoidal like this and is set up and can improve the electric conductive property of conducting wire 33, reduces conducting wire 33's resistance, the bottom of slot apart from the distance of basement 10 first surface is not less than 2 microns.
Referring to fig. 9, a bump 40 is disposed at one end of the conductive circuit 30, the bump 40 shown in the figure is a mesh structure, the mesh structure is made of a conductive material, the conductive circuit 30 is electrically connected to the mesh of the bump 40, and the mesh structure is a convex structure or a concave structure, wherein the depth of the concave structure is not less than 6 μm.
The overlapping block may be a groove structure, and is communicated with the groove of the conductive circuit 30, which is equivalent to that the overlapping block and the conductive circuit 30 are an integral structure, and at this time, a conductive material may be directly disposed in the overlapping block, so as to form a conductive circuit.
The conductive circuit structure is a trench, a conductive material is disposed in the trench to form a conductive circuit, where a thickness of the conductive material in the trench may be smaller than a depth of the trench, or the thickness of the conductive material in the trench is equal to the depth of the trench, or the thickness of the conductive material in the trench is greater than the depth of the trench, that is, the conductive material in the trench is higher than a surface of the polymer layer, and a width of a portion of the conductive material higher than the surface of the polymer layer may be equal to a width of the trench, or greater than the width of the trench, or less than the width of the trench. The ratio of the area occupied by the conductive circuit to the area of the whole surface of the backlight module is not less than 10 percent; certainly, in order to meet the requirement of the backlight module for higher brightness, the ratio of the area occupied by the conductive circuit to the area of the whole surface of the backlight module is not less than 20%, or the ratio of the area occupied by the conductive circuit to the area of the whole surface of the backlight module is not less than 30%, or the ratio of the area occupied by the conductive circuit to the area of the whole surface of the backlight module is not less than 45%.
Referring to fig. 10, a circuit structure of a backlight module with a protective layer includes a substrate 10, a conductive circuit 30, a polymer layer 50 and a protective layer 70, where the substrate 10 includes a first surface and a second surface opposite to the first surface, the first surface of the substrate 10 is provided with the polymer layer 50, a groove is formed on a surface of the polymer layer 50 away from the substrate 10, and a conductive material is disposed in the groove to form the conductive circuit 30; the protection layer 70 is arranged on a partial area of the conductive circuit 30, and the protection layer 70 is not arranged on the area of the conductive circuit 30 for installing the light-emitting device 200, namely, the area of the conductive circuit 30 connected with the light-emitting device 200 is exposed; the protective layer 70 may be made of polymers such as UV glue and varnish (which may be UV varnish or PU varnish), and has a main function of protecting the conductive circuit, slowing or preventing oxidation of the conductive circuit, displacement of the conductive material, and the like.
Wherein, the protective layer 70 can only cover the conductive circuit, i.e. the area of the non-conductive circuit is not provided with the protective layer; of course, the protective layer 70 can also cover both the conductive lines and the non-conductive line areas (i.e., the blank areas), and the thickness of the protective layer is not less than 1 μm and not more than 2 mm.
Referring to fig. 11, a backlight module with a protective layer includes a substrate 10, a conductive trace 30, a polymer layer 50, and a protective layer 71; the side of the protection layer 71 close to the exposed area is in a chamfer or arc structure, wherein the conductive circuit of the exposed area is not provided with the protection layer, the exposed area is mainly used for installing the light-emitting device 200, and the exposed area can be used for installing the light-emitting device and also can be connected with an external circuit or other electronic components; the edge of the protective layer is arranged to be in a chamfer or arc (or circular arc) structure, so that the exposed area space range can be enlarged, and a light-emitting device or other external devices can be mounted more easily.
Referring to fig. 12, a backlight module with a protective layer, wherein a circuit structure of the backlight module includes a substrate 10, a conductive circuit 30, a polymer layer 50 and the protective layer; the protective layer comprises a first protective layer 72 and a second protective layer 73, the performance of blocking water vapor of the second protective layer 73 is better than that of the first protective layer 72, and certainly, the water vapor blocking capabilities of the first protective layer 72 and the second protective layer 73 can be the same, so that the materials used by the first protective layer 72 and the second protective layer 73 can be the same or different, the conductive lines are mainly protected, stable operation of the conductive lines is guaranteed, meanwhile, the conductive lines are covered by the protective layer, namely, the conductive lines are shielded, and the whole backlight module is relatively beautiful.
Referring to fig. 13, a circuit structure of a backlight module includes a substrate 10, a conductive circuit 30 and a polymer layer 50, where the substrate 10 includes a first surface and an opposite second surface, the first surface of the substrate 10 is provided with the polymer layer 50, a surface of the polymer layer 50 away from the substrate 10 is provided with a groove, the groove is provided with a conductive material to form the conductive circuit 30, the circuit structure is provided with a through hole, the through hole is provided with the conductive material to form a through hole electrode 80, one side of the substrate 10 away from the polymer layer 50 is provided with a through hole electrode circuit 81, the conductive circuit 30 is electrically connected to the through hole electrode circuit 81 through the through hole electrode 80, and the through hole electrode circuit 81 is a protruding structure; this backlight unit structure is equipped with the partition structure on basement 10 a surface, mainly sets up luminescent device, adopts the mode of punching to drawing forth of every partition structure, passes through the another side of basement 10 is wired, can leave sufficient space in the one side that is equipped with the partition structure like this and set up luminescent device, adopts backlight unit's partition structure and walks the phase separation mode of line, the requirement of satisfying the luminance that like this can be better, can have sufficient space installation luminescent device.
Referring to fig. 14, a circuit structure of a backlight module includes a substrate 10, a conductive trace 30, a first polymer layer 50 and a second polymer layer 52, where the substrate 10 includes a first surface and a second surface opposite to the first surface, the first surface of the substrate 10 is provided with the first polymer layer 50, a surface of the first polymer layer 50 away from the substrate 10 is provided with a trench, and a conductive material is disposed in the trench to form the conductive trace 30; the other side of the substrate 10 is provided with a second polymer layer 52, one side of the second polymer layer 52, which is far away from the substrate, is provided with a perforated electrode line 82, the perforated electrode line is embedded in the second polymer layer 52, the circuit structure is provided with a perforation, a conductive material is arranged in the perforation to form a perforated electrode 80, the conductive circuit 30 is electrically connected with the perforated electrode line 82 through the perforated electrode 80, and the perforated electrode line 82 in this embodiment is an embedded structure, not a convex structure.
For the definition of the first and second conductive traces for better description, the parameters or structures of the first and second conductive traces can be referred to or referred to.
According to the backlight module provided by the utility model, the circuit structure adopts the hard substrate or the flexible substrate, and the groove structure is adopted, so that the conductive circuit is arranged in the groove, the cost is greatly reduced, the traditional circuit structure of the PCB is replaced, the depth-to-width ratio of the groove is not less than one third, the width of the groove is not more than 1 mm, the conductive performance of the traditional PCB can be completely achieved, the preparation process is simple, and the environment is protected.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail. In the above description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Moreover, the technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The utility model provides a Mini LED backlight unit with protective layer, includes circuit structure and luminescent device, its characterized in that: the light-emitting device is electrically connected with the circuit structure; the circuit structure includes: a substrate comprising a first surface and an oppositely disposed second surface; the first surface of the substrate is provided with a groove, and a conductive material is arranged in the groove to form a conductive circuit; the protective layer is arranged on the surface of the circuit structure and at least covers part of the conducting circuit outside the connection position of the light-emitting device.
2. The Mini LED backlight module with the protective layer, according to claim 1, wherein the protective layer has at least two layers, and the protective layer near the conductive traces has a greater ability to block water vapor than the protective layer far from the conductive traces.
3. The Mini LED backlight module with the protection layer according to claim 1, wherein one side of the protection layer close to the light emitting device is in a chamfer structure or an arc structure, so that the area provided with the light emitting device is in a horn shape.
4. The Mini LED backlight module with the protection layer as claimed in any one of claims 1 to 3, wherein the depth-to-width ratio of the trench is not less than one third, and the width of the trench is not more than 1 mm.
5. The Mini LED backlight module with the protection layer, as claimed in claim 1, wherein the first surface of the substrate is provided with a polymer layer, a surface of the polymer layer away from the substrate is provided with a groove, and the groove is provided with a conductive material to form a conductive circuit.
6. The Mini LED backlight module with the protection layer as claimed in claim 1 or 5, wherein the trench comprises two sidewalls and a bottom surface, the sidewall of the trench has an angle a with the plane of the first surface of the substrate in the range of 60 ° or more and less than 90 °, and the trench is in an inverted trapezoid shape.
7. The Mini LED backlight module with the protection layer as claimed in claim 1 or 5, wherein the ratio of the area occupied by the conductive traces to the whole area of the backlight module is not less than 10%.
8. The Mini LED backlight module set according to claim 1, wherein the protective layer covers the conductive trace region and also covers a blank region outside the conductive trace region.
9. The Mini LED backlight module with the protection layer as claimed in claim 5, wherein the second surface of the substrate is provided with a polymer layer, a surface of the polymer layer away from the substrate is provided with a groove, and the groove is provided with a conductive material to form a conductive circuit.
10. The Mini LED backlight module with the protection layer as claimed in claim 9, wherein the conductive traces disposed on the first and second surfaces of the substrate are electrically connected to each other through a via structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2021116226385 | 2021-12-28 | ||
| CN202111622638 | 2021-12-28 |
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| CN216958027U true CN216958027U (en) | 2022-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123374945.4U Active CN216958027U (en) | 2021-12-28 | 2021-12-30 | Mini LED backlight module with protective layer |
| CN202123374966.6U Active CN217361577U (en) | 2021-12-28 | 2021-12-30 | Mini LED backlight module |
| CN202123375017.XU Active CN216957396U (en) | 2021-12-28 | 2021-12-30 | Backlight module |
| CN202111639440.8A Pending CN116417447A (en) | 2021-12-28 | 2021-12-30 | Backlight module |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123374966.6U Active CN217361577U (en) | 2021-12-28 | 2021-12-30 | Mini LED backlight module |
| CN202123375017.XU Active CN216957396U (en) | 2021-12-28 | 2021-12-30 | Backlight module |
| CN202111639440.8A Pending CN116417447A (en) | 2021-12-28 | 2021-12-30 | Backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (4) | CN216958027U (en) |
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2021
- 2021-12-30 CN CN202123374945.4U patent/CN216958027U/en active Active
- 2021-12-30 CN CN202123374966.6U patent/CN217361577U/en active Active
- 2021-12-30 CN CN202123375017.XU patent/CN216957396U/en active Active
- 2021-12-30 CN CN202111639440.8A patent/CN116417447A/en active Pending
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| CN216957396U (en) | 2022-07-12 |
| CN116417447A (en) | 2023-07-11 |
| CN217361577U (en) | 2022-09-02 |
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