CN103238229B - Oled module - Google Patents
Oled module Download PDFInfo
- Publication number
- CN103238229B CN103238229B CN201180050814.0A CN201180050814A CN103238229B CN 103238229 B CN103238229 B CN 103238229B CN 201180050814 A CN201180050814 A CN 201180050814A CN 103238229 B CN103238229 B CN 103238229B
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- Prior art keywords
- oled
- plate
- carrier element
- oled module
- drive electronics
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- 239000011241 protective layer Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 238000007639 printing Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a kind of OLED module, this OLED module comprises OLED plate (10) and plate-shaped support element (30), and this carrier element has for the surface (35) that OLED plate (10) are set. Carrier element (30) has the outburst area (36) outstanding with respect to OLED plate (10). In addition OLED module comprises drive electronics (32), and this drive electronics is for the mode driving OLED plate (10) with electronics. Drive electronics (32) comprises structure member (32 '), and the outburst area (36) that this structure member is arranged on carrier element (30) is located and do not extend beyond OLED plate (10) in the direction (R) perpendicular to surface (35). This layout makes to construct OLED module in flat especially mode, and drive electronics (32) does not affect the minimum constructive height of OLED module.
Description
Technical field
The present invention relates to a kind of OLED module (OLED: Organic Light Emitting Diode), this OLED module comprises OLEDPlate and having for the surperficial plate-shaped support element of this OLED plate is set, wherein carrier element has with respect to describedThe outburst area that OLED plate is outstanding, and this OLED module comprises drive electronics, this drive electronics useIn OLED plate described in the mode control with electronics. In addition the present invention relates to a kind of using this OLED module as lightThe lamp in source.
Background technology
Corresponding OLED module is open in US2008/0231180A1, and wherein carrier element is printed circuit board (PCB).Here drive electronics relatively arranges with respect to OLED plate and printed circuit board (PCB). Be OLED module spy thusLarger structure height can be provided.
Summary of the invention
Task of the present invention is, a kind of improved OLED module is provided, this OLED module especially can with thanLess structure height manufacture. A kind of lamp with this OLED module is provided in addition.
According to the present invention, a kind of OLED module is provided, this OLED module comprises OLED plate and plate-shaped supportElement, this carrier element has for the surface of described OLED plate is set, wherein said carrier element have with respect toThe outstanding outburst area of described OLED plate. In addition, described OLED module comprises drive electronics, this drivingElectronic installation is used for OLED plate described in the mode control of electronics. Drive electronics described here comprises suchStructure member, this structure member is arranged on the outburst area on described carrier element and perpendicular to institute's art surfaceIn direction, do not extend beyond described OLED plate.
By this layout can be especially flat manufacture OLED module, particularly manufacture and make OLED moduleThere is such structure height, this structure height be not more than the thickness of plate-shaped support element and the thickness of OLED plate itWith. Especially, described drive electronics affects the minimum constructive height of OLED module by this way and not.
Particularly advantageously, all structure members of described drive electronics are all arranged on the institute on described carrier elementState on outburst area, described in these all structure members do not extend beyond in the direction perpendicular to described surface hereOLED plate. In addition, construct especially so described OLED module, make all structures of described drive electronicsParts do not extend beyond described surperficial 2.0mm in described direction.
Described carrier element advantageously has the depression or the space that are positioned at described surface on described outburst area, itsIn, at least one structure member of described drive electronics is at least partially disposed in this depression or this space.Thus, can reduce to a great extent structure height. In addition can make on described carrier board with machinery thus,Mode keep the relevant structure member of described drive electronics.
Described OLED plate especially has smooth side, and described OLED plate utilizes this smooth side to be arranged on instituteState on the described surface of carrier element, wherein, all structure members of described drive electronics are all arranged on along thisIn the region of the lateral boundaries of smooth side. Can realize especially in flexible or pliable and tough mode and constructing thusOLED module, this flexible is only limited relatively tinily by the structure member of drive electronics.
Described OLED module especially also has at least one electric contacts, and this electric contacts is for described carrierElectrical connection and mechanical connection between element and described OLED plate. Can set up by this way electric accordinglyConnect, strengthen in addition the mechanical stability of described OLED plate on described carrier element.
In addition advantageously, described OLED module also has protective layer element, and this protective layer element is about describedOLED plate and described carrier element are relatively arranging on described OLED plate. Not only can by this protective layer elementRealize the protection for described OLED plate, and can realize the surperficial complanation of described OLED plate. WhenWhen protective layer element is manufactured in the mode of printing opacity, can realize the light producing from described OLED plate through this protective layerElement is outwards exported.
Particularly printed circuit board (PCB) of described carrier element, this printed circuit board (PCB) with electric means and mechanical system and described inOLED plate connects.
In addition, have such thickness at described carrier element, that is, this thickness is less than 1000 μ m, is especially less than 100In the situation of μ m, can realize the low especially structure height of OLED module.
In addition, described OLED module can advantageously be configured to the OLED of flexible OLED module or rigidityModule.
Also have mould material in described OLED module, this mould material around described drive electronics at leastA structure member, in situation about especially arranging around all structure members of described drive electronics, Neng GoushiThe now particularly preferred stability of the particularly preferred protection to described drive electronics and/or described OLED module. ThisIn especially waterproof and/or the flexible material of described mould material.
By realizing protection to a great extent around the shell of described OLED plate setting. Here this shell is outstandingIt is made with metal. Can fall apart particularly well thus except issuable heat in the time that OLED module is moved.
Described carrier element can advantageously have hexagonal shape. In this case, for example working as will be multiple similarOLED module when combining to forming together the light output area of lamp, this OLED module is particularly suitable for.
According to another aspect of the present invention, provide a kind of lamp, this lamp by least one according to OLED of the present inventionModule is as light source.
Brief description of the drawings
Explain the present invention below with reference to accompanying drawing according to embodiment. In accompanying drawing:
Fig. 1 shows the schematic cross sectional view of the first embodiment of OLED module of the present invention,
Fig. 2 shows the schematic cross sectional view of the second embodiment,
Fig. 3 shows the meaning profile of the 3rd embodiment,
Fig. 4 shows the schematic plan of the 3rd embodiment,
Fig. 5,6a and 6b show another and have the schematic diagram of the embodiment of hexagonal shape,
Fig. 7 and 8 shows the schematic perspective view of the embodiment with hexagonal shape.
Detailed description of the invention
In Fig. 1, schematically show the profile of the first embodiment of OLED module of the present invention. This OLEDModule has OLED plate 10 and plate-shaped support element 30, and this carrier element 30 has for OLED plate 10 is setSurface 35.
OLED plate 10 for example can be constructed as follows: the transparent ITO that approximately 100nm on glass is thick(Indium-Zinn-Oxid (indium tin oxide)), approximately 100 to 200nm thick organic layers (have and reach to 7 sonsLayer) and approximately 100 arrive the thick metallic cathode (for example aluminium) of 500nm.
Carrier element 30 has the outburst area 36 outstanding with respect to OLED plate 10.
In addition OLED module has drive electronics 32, and this drive electronics is for driving in the mode of electronicsOLED plate 10. Here this drive electronics 32 comprises structure member 32 ', and this structure member 32 ' arranges especiallyOn outburst area 36 on surface 35 on carrier element 30, and on perpendicular to surface 35 direction R notExtend beyond OLED plate 10. That is to say with reference to shown in Fig. 1, structure member 32 ' is no more than surface 35 and extends alsoAnd do not continue upwards to extend higher than OLED plate 10. That is to say, calculate the prolonging of structure member 32 ' from surface 35Stretch the extension that is not more than OLED plate 10.
Can be flat especially or with especially little structure height structure OLED module by this layout.
Can specify especially, OLED plate 10 has smooth side 15 (hereinafter also referred to as downside 15), OLEDPlate 10 utilizes this side 15 to be arranged on the surface 35 of carrier element 30. Here represent carrier with outburst area 36Such region of element 30, this region is positioned at downside 15 or side 15 upright projection at carrier element 30Or outside vertical plane P.
When all structure members of drive electronics 32 are all arranged on dashing forward on carrier element 30 corresponding to above-mentioned layoutWhile going out on region 36, can realize flat especially generally frame mode. Realize by this way: drive electricityIn the structure member of sub-device 32, neither one structure member extends beyond on the direction R perpendicular to surface 35OLED plate 10. Can be for example such structure: the structure member neither one of drive electronics 32 extends superCross surperficial 352.0mm or 1.8mm.
On outburst area 36, have at carrier element 30 that to be positioned at surface 35 depression or space (not shown in the figuresGo out) and at least one structure member of drive electronics 32 be at least partially disposed on this depression or this spaceIn situation under, can dwindle to a greater degree structure height. Can advantageously make by this way relevant structural portionPart and carrier element 30 electrical contacts and also mechanically remain on thus on carrier element 30.
In addition OLED module can have at least one electric contacts 31, and this electric contacts is used in carrier unitBetween part 30 and OLED plate 10, be electrically connected and mechanical connection. As illustrative in Fig. 1, OLED plate 10Can there is base members 10 ' and the closure elements 10 for example made by glass ", the wherein downside of OLED plate 10The 15th, closure elements 10 " side or downside. Here base members 10 ' is with respect to closure elements 10 " can haveOutburst area 13, wherein uses this outburst area 13 of base members 10 ' (to be similar to the protruding segments to carrier element 30The above-mentioned definition in territory 36) represent such region of base members 10 ', this region is positioned at downside 15 or sideOutside 15 upright projections or vertical plane P on carrier element 30. At this protruding segments of base members 10 '13 places, territory can arrange the contact-making surface 11 of the electrode of OLED plate 10, this contact-making surface also for electric contacts 31Contact. Can set up thus between OLED plate 10 and carrier element 30 fairly simplely electrical connection reliably andMechanical connection.
That is to say, in this structure, on the one hand outstanding at the surface 35 of carrier element 30 and base members 10 'Between region 13, produce one " space ", this space advantageously can be used for arranging drive electronics 32 at least in part.In the time of top view, this space can be configured to circlewise around closure elements 10 ".
Total can arrange multiple (for example four) this electric contacts 31 or contact-making surface 11.
In addition as a supplement, can between the downside of OLED plate 10 15 and carrier element 30, adhesives be setLayer, it is for the mechanical connection between these two parts.
In addition, OLED module can have the especially protective layer element 20 of printing opacity, this protective layer element aboutOLED plate 10 is relatively arranged on OLED plate 10 with carrier element 30. The correspondingly light of OLED plate 10Output can realize by the protective layer element 20 of the formal construction with printing opacity.
Shown in Fig. 1, that is to say, protective layer element 20 is arranged on OLED plate 10 and upwards providesLight output. Protective layer element 20 can be connected on OLED plate 10 with optical mode and mechanical system system, to makeThe surface 16 of OLED plate 10 forms plane. Protective layer element 20 can be by layer of adhesive material setting or maintenanceOn OLED plate 10.
That is to say, OLED module comprises three layers particularly, and wherein, ground floor is made up of protective layer element 20,The second layer is made up of OLED plate 10, and the 3rd layer is made up of carrier element 30.
Especially printed circuit board (PCB) of carrier element 30, this printed circuit board (PCB) mechanically with electric means and OLEDPlate 10 connects. Here with respect to the as far as possible little structure height of OLED module, carrier element 30 or printingCircuit board advantageously has such thickness: this thickness is less than 1000 μ m, is especially less than 100 μ m.
Drive electronics 32 can have the driver IC of supplying with for the constant current of OLED plate 10, andPassive structural elements, the resistance for example regulating for electric current or coil and capacitor for smooth output voltage. ThisCan be provided for EBI integrated of the external control of OLED module outward. For this reason especially can be integrated one micro-Controller, and optional level converter, and passive structural elements (if needs).
Shown in Fig. 1, that is to say that especially the entire infrastructure parts of drive electronics 32 all have flat knotConfiguration shape, makes these structure members upwards not extend beyond OLED plate 10. Here these structure members arrangeOn the side of OLED plate 10 or be arranged on the surface of outburst area 13 and the carrier element 30 of base members 10 'Between 35. The less structure that has realized OLED module compared with prior art by this flat planform is highDegree. The structural detail of drive electronics 32 can be at carrier element 30 (or printed circuit board (PCB)) and OLED plateIn the region of the contact between 10, be arranged on closure elements 10 " " space " in, this space is utilized particularly well.
In addition OLED module can have electric connection terminal 33 in order to be electrically connected.
That is to say, use at least one electric connecting element 31, drive electronics for OLED plate 1032 active and passive actuator component and splicing ear 33, printed circuit board (PCB) can be outwards simultaneously with machineTool mode and electric means are fastened on OLED plate 10; In addition can strengthen like this mechanically stable of OLED moduleProperty and control.
OLED plate 10, protective layer element 20 and carrier element 30 can be rigidly or pliable and tough ground and flexibleGround forms. Above-mentioned electrical structure parts integrated can be by chip package on the encapsulation of SMD, chip on board, film orThe similar technique of person provides: these techniques are all conducive to flat planform.
The structure member of drive electronics 32 can be arranged on especially in the region of the lateral boundaries of downside 15,That is in the time of top view, be arranged in one of downside 15 annular region. The flexibility of OLED moduleOr pliability can be by this arrangement constraints or only faintly restriction at the most, or flexibility or pliability only existAbove-mentioned around restricted in the region of downside 15.
Fig. 2 has schematically shown another embodiment. Unless otherwise indicated, with respect to the explanation of the first embodimentThe second embodiment is also suitable for and uses similarly Reference numeral. That is to say only explanation and the first enforcement side belowThe difference of formula.
Mould material 40 is provided in addition in the second embodiment; This mould material 40 can be arranged on especially aroundIn the region of OLED plate 10, be exactly arranged between carrier element 30 and protective layer element 20. Thus canEnough mechanical stabilities and/or can implementation structure element or the sealing of contact-making surface of further improving, ensure special thusGood protection. Here this mould material 40 is particularly preferably waterproof.
Such mould material 40 can also be provided, and its cokey, that is to say flexible mould material 40,Thus can bendable ground or pliable and tough the OLED module with mould material 40 of manufacturing.
Fig. 3 has schematically shown the 3rd embodiment; Fig. 4 illustrates corresponding top view. Explanation above correspondingly againInferior being suitable for, so only illustrate the difference for expression above.
In this implementation, OLED module has shell 50 in addition. This shell 50 can have base plate, this endPlate relatively arranges with respect to carrier element 30 and OLED plate 10, that is can say so, as other,That is in the meaning of above-mentioned three layers the 4th layer.
Shell 50 can have the hole for electric connection terminal 33 especially. Can specify, on electric connection terminal 33Welding lead or set up the electrical connection for power supply by spring contact or clip contact.
This shell can arrange around OLED plate 10 especially. Can improve to a great extent by shell 50The sealing of OLED module. Shell 50 is made of metal especially. Can fall apart particularly well thus and remove at OLED plateIssuable heat when 10 operation.
External shape or the profile that can advantageously affect by shell 50 in addition OLED module, make with thisMode is improved the possibility of external form with respect to the external of OLED module.
If remove mould material 40 or shell 50 in Fig. 4, can obtain is the first or second enforcement sideThe corresponding views of formula. Use Reference numeral 12 to represent the light-emitting area of OLED plate 10.
As also found out, can specify that carrier board 30 is for rectangle, the wherein structural portion of drive electronics 32 from Fig. 4Part is only arranged on two relative sides that provide by this shape on carrier board 30. Thus especially in some feelingsUnder condition, limit especially littlely OLED module around the flexible of axis that is parallel to related both sides.
But the rectangular shape on top view is not enforceable. Also can specify according to the present invention, OLED module existsWhile seeing on top view, there is such shape: it is not rectangle, and is for example hexagon. This is according to another enforcement sideFormula is illustrated in Fig. 5,6a and 6b. Explanation above is correspondingly suitable for again, therefore only illustrates with above belowThe difference of explanation.
Fig. 5 represents corresponding profile, and Fig. 6 a represents the top view that there is no protective layer element 20 of OLED module,Fig. 6 b represents the top view with protective layer element 20 of OLED module.
The hexagonal shape of OLED module can obtain by the corresponding shape of carrier element 30. OLED plate 10For example can be configured to octagon and for example there is in addition circular light-emitting area 12.
The hexagonal shape of OLED module is particularly suitable for such situation, that is, and and be by multiple OLED modules as far as possibleNear-earth combines, and makes to form the lamp with light radiating surface, and this light radiating surface is sent out by single OLED moduleLight face composition.
Fig. 7 represents the exploded view of last-mentioned embodiment in the mode of schematic diagram. Here show with Reference numeral 21Show output coupled system, represent optical surface (diffusion/reflection) with Reference numeral 22.
Fig. 8 exemplifies carrier element 30, and here as printed circuit board (PCB), this printed circuit board (PCB) has the electronics of driving dressPut 32 integrated element or structure member. Drive electronics 32 for example can have PWM current driver,DMX512 interface, optionally touch interface; Pwm driver performance parameter: 12V or 24V power supply, 350MAPWM driving, 400:1 dim light degree, 82% efficiency, the structure height of 1.7mm.
The light source that OLED module according to the present invention is particularly suitable as lamp uses, for example room illumination. Therefore rootAlso provide a kind of lamp according to the present invention, it is using at least one OLED module as light source. Here this lamp can be corresponding toExplanation above is advantageously manufactured by especially flat.
Claims (19)
1. an OLED module, this OLED module has:
-OLED plate (10);
-plate-shaped support element (30), this carrier element has for the surface (35) that described OLED plate (10) is set;
Wherein said carrier element (30) has the outburst area (36) outstanding with respect to described OLED plate (10),With
-drive electronics (32), this drive electronics is used for OLED plate described in the mode control of electronics(10)，
It is characterized in that,
Described drive electronics (32) comprises such structure member, and described structure member is arranged on described carrier unitThe described outburst area (36) of part (30) is upper, and this structure member is in the direction perpendicular to described surface (35)(R) on, do not extend beyond described OLED plate (10),
Described OLED plate (10) has downside (15), and described OLED plate (10) utilizes this downside (15) to establishPut on the described surface (35) of described carrier element (30), wherein said OLED plate (10) has substrateElement (10 ') and closure elements (10 "), wherein said downside (15) is described closure elements (10 ")Side, and wherein said base members (10 ') has outburst area with respect to described closure elements (10 ").
2. OLED module according to claim 1,
Wherein, all structure members of described drive electronics (32) are all arranged on described carrier element (30)On described outburst area, and in the direction perpendicular to described surface, do not extend beyond described OLED plate (10).
3. OLED module according to claim 1 and 2,
Wherein, all structure members of described drive electronics (32) do not extend beyond described surface (35) 2.0mm.
4. OLED module according to claim 1,
Wherein, described carrier element (30) has the depression that is positioned at described surface (35) on described outburst areaOr space, and at least one structure member of described drive electronics (32) is at least partially disposed on, and this is recessedFall into or this space in.
5. OLED module according to claim 1,
Wherein, described OLED plate (10) has smooth side (15), and described OLED plate utilizes this side to establishPut upper on the described surface (35) of described carrier element (30), wherein said drive electronics (32) allStructure member is all arranged in the region of the lateral boundaries of described smooth side (15).
6. OLED module according to claim 1,
This OLED module also has,
-at least one electric contacts (31), described electric contacts for described carrier element (30) and described inElectrical connection and mechanical connection between OLED plate (10).
7. OLED module according to claim 1,
This OLED module also has,
-protective layer element (20), this protective layer element is about described OLED plate (10) and described carrier element (30)Relatively be arranged on described OLED plate (10).
8. OLED module according to claim 1,
Wherein, described carrier element (30) is printed circuit board (PCB), and this printed circuit board (PCB) is with electric means and mechanical systemBe connected with described OLED plate (10).
9. OLED module according to claim 1,
Wherein, described carrier element (30) has such thickness, and this thickness is less than 1000 μ m.
10. OLED module according to claim 1,
This OLED module structure becomes flexible OLED module or is configured to the OLED module of rigidity.
11. OLED modules according to claim 1,
This OLED module also has,
-mould material (40), this mould material is around at least one structural portion of described drive electronics (32)Part arranges.
12. OLED modules according to claim 1,
This OLED module also has,
-shell (50), this shell arranges around described OLED plate (10).
13. OLED modules according to claim 1,
Wherein, described carrier element (30) has hexagonal shape.
14. OLED modules according to claim 7,
Wherein, described protective layer element (20) is printing opacity.
15. OLED modules according to claim 9,
Wherein, described thickness is less than 100 μ m.
16. OLED modules according to claim 11, wherein said mould material (40) drives around describedAll structure member settings of moving electronic installation (32).
17. OLED modules according to claim 11, wherein, described mould material (40) is waterproofAnd/or flexible.
18. OLED modules according to claim 12, wherein, described shell (50) is made of metal.
19. 1 kinds of lamps, this lamp using at least one according to the OLED module described in any one in the claims asLight source.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010042727.6 | 2010-10-21 | ||
| DE102010042727A DE102010042727A1 (en) | 2010-10-21 | 2010-10-21 | OLED module |
| PCT/EP2011/068395 WO2012052531A1 (en) | 2010-10-21 | 2011-10-21 | Oled module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103238229A CN103238229A (en) | 2013-08-07 |
| CN103238229B true CN103238229B (en) | 2016-05-18 |
Family
ID=44860360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180050814.0A Expired - Fee Related CN103238229B (en) | 2010-10-21 | 2011-10-21 | Oled module |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2630680A1 (en) |
| CN (1) | CN103238229B (en) |
| DE (1) | DE102010042727A1 (en) |
| WO (1) | WO2012052531A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012223162B4 (en) * | 2012-12-14 | 2022-08-25 | Pictiva Displays International Limited | AREA LIGHT SYSTEM |
| DE102013113001B4 (en) * | 2013-09-13 | 2018-05-24 | Osram Oled Gmbh | Module and arrangement with a module |
| CN104712922B (en) * | 2013-12-11 | 2017-03-15 | 力志国际光电股份有限公司 | Organic light-emitting diode illuminator |
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| JP2004342336A (en) * | 2003-05-13 | 2004-12-02 | Semiconductor Energy Lab Co Ltd | Light emitting device and manufacturing method of same |
| DE102004005370B4 (en) * | 2004-02-03 | 2007-08-16 | Samsung SDI Co., Ltd., Suwon | Electrical device with a housing and an OLED display element and method for its production |
| CN101228649B (en) | 2005-07-27 | 2011-09-28 | 皇家飞利浦电子股份有限公司 | Light-emitting device with a sealing integrated driver circuit |
| JP2007234232A (en) * | 2006-02-27 | 2007-09-13 | Hitachi Displays Ltd | Image display device |
| DE102007046730A1 (en) * | 2007-09-28 | 2009-04-02 | Osram Opto Semiconductors Gmbh | Organic electronic component for organic light emitting diodes, polymer elements, organic photovoltaic cell or electrochromic elements, has substrate and is provided on substrate |
| US20090167171A1 (en) * | 2007-11-22 | 2009-07-02 | Samsung Mobile Display Co., Ltd. | Display device, organic light emitting diode display and manufacturing method of the same |
| DE102008049056A1 (en) * | 2008-09-26 | 2010-04-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Organic photoelectric device and a method for producing an organic photoelectric device |
-
2010
- 2010-10-21 DE DE102010042727A patent/DE102010042727A1/en not_active Withdrawn
-
2011
- 2011-10-21 EP EP11774036.5A patent/EP2630680A1/en not_active Withdrawn
- 2011-10-21 CN CN201180050814.0A patent/CN103238229B/en not_active Expired - Fee Related
- 2011-10-21 WO PCT/EP2011/068395 patent/WO2012052531A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1638554A (en) * | 2003-12-30 | 2005-07-13 | Lg.菲利浦Lcd株式会社 | Organic electroluminescent device and method of fabricating the same |
| CN1822384A (en) * | 2005-02-18 | 2006-08-23 | 株式会社半导体能源研究所 | Semiconductor device and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2630680A1 (en) | 2013-08-28 |
| CN103238229A (en) | 2013-08-07 |
| DE102010042727A1 (en) | 2012-05-10 |
| WO2012052531A1 (en) | 2012-04-26 |
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