CN216843605U - Pipeline structure of heat dissipation device and heat dissipation device - Google Patents
Pipeline structure of heat dissipation device and heat dissipation device Download PDFInfo
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- CN216843605U CN216843605U CN202220420488.3U CN202220420488U CN216843605U CN 216843605 U CN216843605 U CN 216843605U CN 202220420488 U CN202220420488 U CN 202220420488U CN 216843605 U CN216843605 U CN 216843605U
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Abstract
The utility model relates to a heat abstractor's pipeline structure and heat abstractor. Heat abstractor's pipeline structure include first pipe fitting, be equipped with at least one welding hole on the first pipe fitting, first pipe fitting includes body and solder layer, the solder layer cladding is in on the outer wall of body, the inner wall of body is equipped with capillary structure, capillary mechanism with welding hole intercommunication. When heat abstractor's pipeline structure and heat abstractor were applied to the welding of pipeline and pipeline, it had the effect that carries out the water conservancy diversion to the molten solder that flows out welding gap, can guide the molten solder that flows out welding gap to among the capillary structure to reduce the uncertainty of molten solder shape after first pipe fitting internal cooling, improve the solder that current welding process problem leads to and block up the pipeline problem.
Description
Technical Field
The utility model relates to a heat abstractor's pipeline structure and heat abstractor.
Background
The existing water-cooling heat dissipation device generally comprises pipeline structures, and the pipeline structures generally consist of a collecting pipe and a branch pipe. Because the heat transfer performance of metal is relatively excellent, the pipeline structures are generally made of metal materials, and at present, branch pipes and collecting pipes made of metal materials are mainly fixed in a welding mode.
Referring to fig. 1, fig. 1 is a schematic diagram illustrating the position and structure of a conventional collecting pipe a and a branch pipe b. The pipeline structure comprises a collecting pipe a and a branch pipe b, wherein the collecting pipe a and the branch pipe b are mutually communicated and fixed through welding; a welding hole a1 is formed in the collecting pipe a; the branch pipe b is fixed by welding through the welding hole a 1.
However, when the manifold pipe a and the branch pipe b are connected by welding in the above-described piping structure, the molten solder may flow down along the branch pipe b. The phenomenon is light, so that the refrigerants in certain passages are blocked, the amount of the refrigerants in the passages is too small, the heat is unchanged, the gasification reaction is severe, the refrigerants are converted into gas in advance, and the problem of overhigh local temperature can occur in the part of the passages which do not pass through the refrigerants, so that the production efficiency and the product performance are seriously reduced; heavy results in a complete blockage of a branch pipe, resulting in poor product.
The existing method for preventing the solder from blocking the pipeline mainly comprises the following steps: before welding, a water-soluble anti-blocking air bag, a blowing device and a small ball cleaning pipe are used. The water-soluble anti-blocking air bag is suitable for welding a collision port between two long-distance pipelines, the blowing device can only blow away some welding fluxes and sundries with weak adhesion after welding, the welding fluxes with the weak adhesion and blocking the pipelines cannot be treated, the small ball is cleaned at more branch pipes, and when the main pipe and the branch pipes need to be cleaned, the operation difficulty is overlarge.
SUMMERY OF THE UTILITY MODEL
Based on this, the utility model aims at providing a heat abstractor's pipeline structure, when being applied to the welding of pipeline and pipeline, it has the effect that carries out the water conservancy diversion to the molten solder that flows out welding seam, can guide the molten solder that flows out welding seam to among the capillary structure to reduce the uncertainty of molten solder shape after first pipe fitting internal cooling, improve the solder jam pipeline problem that current welding process problem leads to.
A pipeline structure of a heat dissipation device. Including first pipe fitting, be equipped with at least one welding hole on the first pipe fitting, first pipe fitting includes body and solder layer, the solder layer cladding is in on the outer wall of body, the inner wall of body is equipped with capillary structure, capillary mechanism with the welding hole intercommunication.
Heat abstractor's pipeline structure, when being applied to the welding of pipeline and pipeline, it has the effect of carrying out the water conservancy diversion to the molten solder that flows out welding gap, can guide the molten solder that flows out welding gap to among the capillary structure to reduce the uncertainty of molten solder shape after first pipe fitting internal cooling, improve the solder that current welding process problem leads to and block up the pipeline problem.
Further, the capillary structure is a capillary groove formed in the inner wall surface of the tube body. This is a specific embodiment of the capillary structure, and the capillary groove can accommodate the molten solder flowing into the inner wall from the soldering hole, and is convenient to process.
Furthermore, two ends of the capillary groove are connected with the same welding hole, and the capillary groove is arranged around the inner wall of the pipe body in a circle. The holding capacity of the capillary groove to the molten solder can be improved by arranging the capillary groove around the inner wall in a circle.
Further, the width of the capillary groove is 0.05-2 mm. The width range is beneficial to the manufacture of the capillary groove and does not have great challenge to the manufacturing process, and the width range is also beneficial to the solder to be guided into the capillary groove through the capillary action.
Further, in the pipe structure of the heat dissipation device, one of the welding holes is communicated with the plurality of capillary grooves. The plurality of capillary grooves can further improve the accommodating capacity of the capillary grooves to molten solder, so that the pipeline structure can cope with the condition of more solder.
Further, the capillary groove is arranged on the inner wall surface of the pipe body in a curve mode. The curved arrangement can improve the holding capacity of the capillary groove for molten solder.
Further, still include the second pipe fitting, the external diameter of second pipe fitting is less than the internal diameter of welding hole, and with the difference of the internal diameter of welding hole is 1-4 mm. The aforesaid setting can guarantee at first that the second pipe fitting can insert and establish in the welding hole to can also guarantee when the second pipe fitting inserts and establishes the positive center in welding hole, capillary phenomenon's when the second pipe fitting is located any department outer wall in the welding hole and the distance in welding hole all can guarantee that the molten solder flows into the gap emergence.
Further, still include the welding part, the second pipe fitting alternates the welding hole with first pipe fitting intercommunication, and welded fastening in first pipe fitting, the welding part fill in the outer wall of second pipe fitting with between the welding hole. That is, this is a state in which the second pipe member and the first pipe member are fixed by welding.
A heat sink comprising a conduit structure according to any of the above heat sinks.
Further, still include a plurality of third pipe fitting, a plurality of fourth pipe fitting, feed liquor pipe and drain pipe, a plurality of third pipe fitting intercommunication each other, a plurality of fourth pipe fitting intercommunication each other, every the third pipe fitting is equallyd divide with every the fourth pipe fitting do not communicate with each other through second pipe fitting and a plurality of first pipe fitting intercommunication, the feed liquor pipe with third pipe fitting intercommunication, the drain pipe with fourth pipe fitting intercommunication.
For a better understanding and an implementation, the present invention is described in detail below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram illustrating a structure and a positional relationship between a first pipe and a second pipe in a conventional heat dissipation pipe structure;
fig. 2 is a schematic structural view of a pipe structure of the heat dissipation device according to embodiment 1;
FIG. 3 is an expanded view of an inner wall of a first pipe in the pipe structure of the heat dissipating device shown in FIG. 2;
fig. 4 is an expanded view of the inner wall of the first pipe in the pipe structure of the heat dissipating device according to embodiment 2;
FIG. 5 is an expanded view of the inner wall of the first pipe in the pipe structure of the heat dissipating apparatus according to embodiment 4;
FIG. 6 is an expanded view of the inner wall of the first pipe in the pipe structure of the heat dissipating apparatus according to embodiment 5;
FIG. 7 is an expanded view of the inner wall of the first pipe in the pipe structure of the heat dissipating apparatus according to embodiment 6;
FIG. 8 is an expanded view of the inner wall of the first pipe in the pipe structure of the heat dissipating apparatus according to embodiment 7;
fig. 9 is a schematic structural view of the heat dissipation device according to embodiment 8.
Detailed Description
Example 1
Fig. 2 shows a pipe structure of a heat dissipation device of this embodiment, which includes a first pipe 1 and a second pipe 2.
The first pipe fitting 1 is provided with a welding hole 13, the first pipe fitting 1 comprises a welding flux layer 12 and a pipe body 11, and the welding flux layer 12 is obtained by coating molten welding flux on the outer wall of the pipe body 11 and then cooling; in this embodiment, the side of the tube 11 of the first tube 1 not contacting the solder layer 12 is the inner wall of the first tube 1, and the inner wall of the tube 11 of the first tube 1 is provided with a capillary structure surrounding the inner wall.
The outer diameter of the second pipe fitting 2 is smaller than the inner diameter of the welding hole 13, the difference value between the outer diameter of the second pipe fitting 2 and the inner diameter of the welding hole 13 is 1-4mm, after the second pipe fitting 2 is inserted into the welding hole 13, the distance between any position of the outer wall of the second pipe fitting 2 located in the welding hole 13 and the inner wall of the welding hole 13 is 0.05-2mm, and the first pipe fitting 1 and the second pipe fitting 2 are fixed through welding and communicated with each other.
During welding, the second pipe fitting 2 penetrates into a welding hole 13 reserved in the first pipe fitting 1 to be communicated with the first pipe fitting 1, a reflow furnace is used for heating the solder layer 12 near the welding hole 13 to a molten state, molten solder flows into a welding gap under the action of capillary phenomenon, and if the depth of the molten solder flowing into the welding gap exceeds the depth of the welding hole 13, the molten solder flowing into the welding gap further flows into a capillary structure on the inner wall of the first pipe fitting 1 under the action of capillary phenomenon, so that the molten solder is prevented from flowing downwards along the outer wall of the second pipe fitting 2, and further, the pipeline of the second pipe fitting 2 is prevented from being blocked; after the molten solder has cooled, a weld 3 is formed which fills the space between the outer wall of the second pipe member 2 and the weld hole 13.
Fig. 3 is an expanded view of the first tube 1 in the pipe structure of the heat dissipation device according to the present embodiment. In this embodiment, the capillary structure is specifically a capillary groove 14, two ends of the capillary groove 14 are connected to the same welding hole 13, the capillary groove 14 is formed in a circle around the inner wall of the tube body 11 and is linearly arranged on the inner wall surface of the tube body 11, and the width of the capillary groove 14 is 2 mm.
Example 2
The structure and the action principle of the capillary structure for preventing the pipeline of the second pipe fitting 2 from being blocked in the welding process of the pipeline structure of the heat dissipation device provided by the embodiment are the same as those of the embodiment 1, and therefore, the detailed description is omitted in the embodiment. This embodiment differs from embodiment 1 in the specific arrangement of the capillary structure.
Fig. 4 is an expanded view of the first tube 1 in the pipe structure of the heat dissipation device according to the present embodiment. In this embodiment, capillary structure specifically is two capillary grooves 14 that are parallel to each other and adjacent, and the both ends of capillary groove 14 meet with same welding hole 13, and capillary groove 14 encircles the inner wall round of body 11 is seted up and is the sharp setting on the internal wall face of body 11, and the width of recess is 0.8mm, and the interval of two recesses is 1.5 mm. Wherein the spacing between two adjacent capillary grooves 14 is at least 1 mm.
Example 3
The structure and the action principle of the capillary structure for preventing the pipeline of the second pipe fitting 2 from being blocked in the welding process of the pipeline structure of the heat dissipation device provided by the embodiment are the same as those of the embodiment 1, and therefore, the detailed description is omitted in the embodiment. This embodiment differs from embodiment 1 in the specific arrangement of the capillary structure.
Fig. 5 is an expanded view of the first tube 1 in the pipe structure of the heat dissipation device according to the present embodiment. In this embodiment, the capillary structure is specifically a capillary groove 14, two ends of the capillary groove 14 are connected to the same welding hole 13, the capillary groove 14 is formed in a circle around the inner wall of the tube body 11 and is arranged in a curve on the inner wall surface of the tube body 11, and the width of the groove is 0.4 mm.
Example 4
The structure and the action principle of the capillary structure for preventing the pipeline of the second pipe fitting 2 from being blocked in the welding process of the pipeline structure of the heat dissipation device provided by the embodiment are the same as those of the embodiment 1, and therefore, the detailed description is omitted in the embodiment. This embodiment differs from embodiment 1 in the specific arrangement of the capillary structure.
The difference between the capillary structure of this embodiment and embodiment 3 is that the capillary structure of this embodiment is specifically two capillary grooves 14 that are parallel to each other and adjacent to each other, so an expanded view of the inner wall of the first tube 1 in the pipe structure of the heat dissipation device of this embodiment is not shown, and in this embodiment, the width of the capillary groove 14 is 0.1mm, the distance between two grooves is 1mm, and the distance between two adjacent capillary grooves 14 is at least 1 mm.
Example 5
The structure and the action principle of the capillary structure for preventing the pipeline of the second pipe fitting 2 from being blocked in the welding process of the pipeline structure of the heat dissipation device provided by the embodiment are the same as those of the embodiment 1, and therefore, the detailed description is omitted in the embodiment. This embodiment differs from embodiment 1 in the specific arrangement of the capillary structure.
Fig. 6 is an expanded view of the first tube 1 in the pipe structure of the heat dissipation device according to the present embodiment. In this embodiment, the capillary structure is specifically two mutually parallel and nonadjacent capillary grooves 14, one end of the capillary groove 14 is directly connected with the welding hole 13, the other end of the capillary groove 14 is arranged in a straight line on the inner wall after surrounding the inner wall for one circle, and the width of the capillary groove 14 is 1 mm.
Example 6
The structure and the action principle of the capillary structure for preventing the pipeline of the second pipe fitting 2 from being blocked in the welding process of the pipeline structure of the heat dissipation device provided by the embodiment are the same as those of the embodiment 1, and therefore, the detailed description is omitted in the embodiment. This embodiment differs from embodiment 1 in the specific arrangement of the capillary structure.
Fig. 7 is an expanded view of the first tube 1 in the pipe structure of the heat dissipation device according to the present embodiment. In this embodiment, the capillary structure is specifically four capillary grooves 14 that are parallel to each other, wherein two capillary grooves 14 in the same group are adjacent to each other, one end of the capillary groove 14 is directly connected to the welding hole 13, the other end of the capillary groove 14 is cut off on the inner wall after surrounding the inner wall for one circle and is arranged linearly, the width of the capillary groove 14 is 0.8mm, the distance between two adjacent capillary grooves 14 is 1mm, and the distance between two adjacent capillary grooves 14 is at least 1 mm.
Example 7
The structure and the action principle of the capillary structure for preventing the pipeline of the second pipe fitting 2 from being blocked in the welding process of the pipeline structure of the heat dissipation device provided by the embodiment are the same as those of the embodiment 1, and therefore, the detailed description is omitted in the embodiment. This embodiment differs from embodiment 1 in the specific arrangement of the capillary structure.
Fig. 8 is an expanded view of the first pipe 1 in the pipe structure of the heat dissipation device according to the present embodiment. In this embodiment, the capillary structure is specifically two capillary grooves 14 that are parallel to each other and are not adjacent to each other, one end of the capillary groove 14 is directly connected to the welding hole 13, the other end of the capillary groove 14 is arranged in a curve by ending on the inner wall after surrounding the inner wall for one circle, and the width of the capillary groove 14 is 1.5 mm.
Example 8
The structure and the action principle of the capillary structure for preventing the second pipe fitting 2 from being blocked in the welding process of the pipe structure of the heat dissipation device provided by the embodiment are the same as those of the embodiment 1, and therefore, the details are not repeated in the embodiment. This embodiment differs from embodiment 1 in the specific arrangement of the capillary structure.
The difference between the capillary structure of this embodiment and embodiment 7 is that the capillary structure of this embodiment is specifically four capillary grooves 14 parallel to each other, wherein two capillary grooves 14 in the same group are adjacent to each other, and therefore, an expanded view of the first tube 1 in the heat dissipation device of this embodiment is not shown, in this embodiment, the width of the capillary groove 14 is 0.05mm, the distance between two adjacent capillary grooves 14 is 3mm, and the distance between two adjacent capillary grooves 14 is at least 1 mm.
Example 9
The present embodiment provides a heat dissipation apparatus, as shown in fig. 9, which is a schematic structural diagram of the heat dissipation apparatus of the present embodiment, and includes a temperature equalizing plate 4, a plurality of third pipes 5, a plurality of fourth pipes 6, a liquid inlet pipe 7, and a liquid outlet pipe 8, and further includes a pipe structure of the heat dissipation apparatus according to any one of embodiments 1 to 8.
The temperature equalizing plate 4 is arranged below the second pipe fitting 2, the plurality of third pipe fittings 5 are communicated with each other, the plurality of fourth pipe fittings 6 are communicated with each other, each third pipe fitting 5 and each fourth pipe fitting 6 are equally distributed with each other and are not communicated with each other through the second pipe fitting 2 and the plurality of first pipe fittings 1, the liquid inlet pipe 7 is communicated with the third pipe fittings 5, and the liquid outlet pipe 8 is communicated with the fourth pipe fittings 6.
When the device is used, the device is placed on a heating element 9 needing heat dissipation, specifically, a temperature equalizing plate 4 of the device is placed on the heating element 9 needing heat dissipation, then a refrigerant is introduced from a liquid inlet pipe 7, enters and is filled with a plurality of third pipe fittings 5 through the liquid inlet pipe 7, then enters and is filled with a plurality of second pipe fittings 2, then enters and is filled with a plurality of first pipe fittings 1, enters and is filled with a plurality of second pipe fittings 2, enters and is filled with a plurality of fourth pipe fittings 6, and finally flows out through a liquid outlet pipe 8.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, to those skilled in the art, changes and modifications may be made without departing from the spirit of the invention, and it is intended that the invention also encompass such changes and modifications.
Claims (10)
1. The utility model provides a heat abstractor's pipeline structure, its characterized in that, includes first pipe fitting, be equipped with at least one welding hole on the first pipe fitting, first pipe fitting includes body and solder layer, the solder layer cladding is in on the outer wall of body, the inner wall of body is equipped with capillary structure, capillary structure with welding hole intercommunication.
2. The pipe structure of a heat dissipating device according to claim 1, wherein: the capillary structure is a capillary groove formed in the inner wall surface of the tube body.
3. The pipe structure of a heat dissipating device according to claim 2, wherein: the two ends of the capillary groove are connected with the same welding hole, and the capillary groove is arranged around the inner wall of the pipe body in a circle.
4. The pipe structure of a heat dissipating device according to claim 2, wherein: the width of the capillary groove is 0.05-2 mm.
5. The pipe structure of a heat dissipating device according to claim 2, wherein: one of the welding holes is communicated with a plurality of the capillary grooves.
6. The pipe structure of a heat dissipating device according to claim 2, wherein: the capillary groove is arranged on the inner wall surface of the tube body in a curve mode.
7. The pipe structure of a heat dissipating device according to any one of claims 1 to 6, wherein: the welding device is characterized by further comprising a second pipe fitting, wherein the outer diameter of the second pipe fitting is smaller than the inner diameter of the welding hole, and the difference value between the outer diameter of the second pipe fitting and the inner diameter of the welding hole is 1-4 mm.
8. The pipe structure of a heat dissipating device according to claim 7, wherein: still include the welding part, the second pipe fitting alternates the welding hole with first pipe fitting intercommunication, and welded fastening in first pipe fitting, the welding part fill in the outer wall of second pipe fitting with between the welding hole.
9. A heat dissipation device, characterized in that: a duct structure comprising the heat dissipating device of claim 8.
10. The heat dissipating device of claim 9, wherein: still include a plurality of third pipe fitting, a plurality of fourth pipe fitting, feed liquor pipe and drain pipe, a plurality of third pipe fitting communicates each other, and a plurality of fourth pipe fitting communicates each other, every the third pipe fitting is equallyd divide do not through second pipe fitting and a plurality of each other not communicate first pipe fitting intercommunication, the feed liquor pipe with third pipe fitting intercommunication, the drain pipe with fourth pipe fitting intercommunication.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220420488.3U CN216843605U (en) | 2022-02-28 | 2022-02-28 | Pipeline structure of heat dissipation device and heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220420488.3U CN216843605U (en) | 2022-02-28 | 2022-02-28 | Pipeline structure of heat dissipation device and heat dissipation device |
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| Publication Number | Publication Date |
|---|---|
| CN216843605U true CN216843605U (en) | 2022-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220420488.3U Active CN216843605U (en) | 2022-02-28 | 2022-02-28 | Pipeline structure of heat dissipation device and heat dissipation device |
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| CN (1) | CN216843605U (en) |
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- 2022-02-28 CN CN202220420488.3U patent/CN216843605U/en active Active
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