CN216626536U

CN216626536U - Pin inserting lead filling device for PCB

Info

Publication number: CN216626536U
Application number: CN202220076426.5U
Authority: CN
Inventors: 王培祥; 李燕; 周潼; 刁伟敏; 李京育; 渠红科; 杨宁; 管仁东
Original assignee: JINAN JINGHENG ELECTRONICS CO Ltd
Current assignee: JINAN JINGHENG ELECTRONICS CO Ltd
Priority date: 2022-01-13
Filing date: 2022-01-13
Publication date: 2022-05-27
Anticipated expiration: 2032-01-13

Abstract

The utility model discloses a lead filling device for inserting a PIN needle into a PCB (printed circuit board), which comprises a lead filling box, a lead baffle and a lead baffle frame, wherein a plurality of lead carrier cavities are formed in the lead filling box, the lead carrier cavities axially penetrate through the upper surface and the lower surface of the lead filling box, and the sizes, the quantities and the positions of the lead carrier cavities correspond to tube seat models on the PCB; the lead baffle is attached to the upper surface or the lower surface of the lead filling box through an adsorption mechanism, and the lead baffle frame is attached to the other surface opposite to the lead baffle through the adsorption mechanism; the lead blocking frame is provided with a plurality of hollow parts, the positions of the hollow parts correspond to the positions of the lead carrier cavity, and the hollow parts are determined to be incapable of obstructing the PIN from being discharged from the lead carrier cavity. The utility model has low cost, high efficiency and stability and is suitable for small-batch production.

Description

Pin inserting lead filling device for PCB

Technical Field

The utility model relates to the field of manufacturing of LED light-emitting devices, in particular to a lead filling device for inserting a PIN into a PCB.

Background

In the PIN assembling process of fig. 5, which is a process of pressing the PCB board to the PIN in fig. 6, the PIN is inserted into the lead filling hole of the PCB board, which is generally manually or by a robot, and this process requires high accuracy in the relative position between the PIN and the lead filling hole of the PCB board. At present, the operation mode of inserting the PIN into the lead wire filling hole of the PCB by using manual work or a manipulator needs to distinguish the head end and the tail end of the PIN in fig. 6, the manual work efficiency is too low, the assembled product is easy to be unqualified or even scrapped due to position angle deviation, and the use cost of the manipulator operation is too high, so that the manipulator operation is not suitable for small-batch production.

Therefore, it is an urgent need to solve the problem of providing a PIN inserting PCB lead loading device that is low in cost, efficient, stable, and suitable for small-scale production.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides the lead filling device for inserting the PIN into the PCB, which is low in cost, efficient and stable and is suitable for small-batch production.

In order to solve the technical problem, the technical scheme adopted by the utility model is as follows: a lead wire filling device for inserting a PIN into a PCB comprises a lead wire filling box, a lead wire baffle and a lead wire baffle frame, wherein a plurality of lead wire carrier cavities are formed in the lead wire filling box, the lead wire carrier cavities axially penetrate through the upper surface and the lower surface of the lead wire filling box, and the sizes, the number and the positions of the lead wire carrier cavities correspond to tube seat models on the PCB; the lead baffle is attached to the upper surface or the lower surface of the lead filling box through an adsorption mechanism, and the lead baffle frame is attached to the other surface opposite to the lead baffle through the adsorption mechanism; the lead wire keeps off the frame and is equipped with a plurality of fretworks, and the fretwork position corresponds with lead wire carrier chamber position, confirms that it can't hinder PIN to discharge in the lead wire carrier chamber.

Further, the fixing mechanism is magnets embedded on the upper surface and the lower surface of the lead filling box, and the outer surfaces of the magnets are flush with the upper surface and the lower surface of the lead filling box.

Furthermore, the left boundary, the rear boundary and the right boundary of the upper surface and the lower surface of the lead filling box are respectively provided with a wrapping edge, namely a left wrapping edge, a rear wrapping edge and a right wrapping edge.

Furthermore, the left edge covering, the rear edge covering and the right edge covering protrude out of the upper surface or the lower surface of the lead filling box, and the height of the protrusion is the sum of the thicknesses of the PCB and the lead blocking frame.

Furthermore, the lead filling box is made of a cuboid aluminum material and has three groups of opposite surfaces, namely an upper group of opposite surfaces, a lower group of opposite surfaces, a front group of opposite surfaces, a rear group of opposite surfaces and a left group of opposite surfaces, wherein each group of opposite surfaces is of a symmetrical structure.

Furthermore, the lead baffle is a flat and deformation-free stainless iron sheet, and the lead baffle is tightly attached to the upper surface or the lower surface of the lead filling box through a magnet.

Furthermore, the lead wire keeps off the frame and is the stainless iron fretwork piece of leveling no deformation, and the lead wire keeps off the frame and closely laminates and grasps the PCB board through magnet and lead wire filling box's upper surface or lower surface, and the position of PCB board is fixed when guaranteeing that PIN needle fills into lead wire filling hole.

The utility model has the beneficial effects that: 1. compared with the original manual operation mode, on the premise of the same workload, the process of filling the PIN needle is not influenced by the direction of the PIN needle, so that the time for filling the PIN needle can be shortened to about one tenth of the original time by using the lead filling device, and the filling efficiency is greatly improved. 2. When the lead filling box is used, filling of the PIN needle can be realized only by gently shaking, the action is fine and stable, and the PIN needle and the lead filling hole are not damaged. 3. The lead filling device is low in cost, small and exquisite in appearance, light and convenient, can be operated by a single person and a single hand, and meets the actual requirements of small-batch production.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other structural arrangements similar to the following drawings can be obtained according to the structural arrangements in the following drawings without creative efforts for those skilled in the art.

Fig. 1 is a schematic top view of a lead cassette.

Fig. 2 is a front cross-sectional view of a lead cassette.

Fig. 3 is a schematic structural view of the lead baffle.

Fig. 4 is a schematic structural view of a lead frame.

Fig. 5 is a schematic structural diagram of a PCB board.

Fig. 6 is a schematic structural diagram of the PIN.

In the figure, 1, a lead filling box, 2, a left edge covering, 3, a rear edge covering, 4, a right edge covering, 5, a strong magnet, 6, a lead carrier cavity, 7, a lead baffle, 8, a lead baffle frame, 9, a lead filling hole, 10, an LED tube seat model, 11, a PCB (printed circuit board), 12, a PIN needle tail end, 13 and a PIN needle head end.

Detailed Description

Example 1

The embodiment discloses a lead filling device for inserting a PIN into a PCB (printed circuit board), which comprises a lead filling box 1, a left edge covering 2, a rear edge covering 3, a right edge covering 4, a strong magnet 5, a lead carrier cavity 6, a lead baffle 7 and a lead baffle frame 8, as shown in figures 1, 2, 3 and 4. In addition, as shown in fig. 5, the PCB 11 includes a lead wire filling hole 9 and an LED socket mold 10; the PIN shown in fig. 6 comprises a PIN tail end 12 and a PIN tip end 13. The lead filling box 1 is made of a cuboid aluminum material and has three groups of opposite surfaces, namely an upper group of opposite surfaces, a lower group of opposite surfaces, a front group of opposite surfaces, a rear group of opposite surfaces and a left group of opposite surfaces, wherein each group of opposite surfaces is of a symmetrical structure. A set of opposing surfaces on which a plurality of through holes are formed is now defined as an upper surface and a lower surface. The lead frame 8 is attached to the upper surface of the lead cassette 1. The lead baffle 7 is attached to the lower surface of the lead cassette 1.

As shown in fig. 1 and 2, among the four front, rear, left and right boundaries, there is a left boundary, a rear boundary, and a right boundary, which are a left edge 2, a rear edge 3, and a right edge 4. The front border is not covered. The left edge covering 2, the rear edge covering 3 and the right edge covering 4 are used for limiting the PCB 11, the lead baffle 7 and the lead baffle frame 8. Preferably, the left edge 2, the rear edge 3 and the right edge 4 protrude from the upper surface of the lead filling box 1, and the protruding height is the sum of the thicknesses of the PCB 11 and the lead blocking frame 8. Further, as shown in fig. 1 and 2, a plurality of lead carrier cavities 6 of the same size are uniformly and neatly arranged inside the lead cassette 1. The lead carrier cavities 6 axially penetrate through the upper and lower surfaces of the lead filling box 1, and the size, the number and the positions of the lead carrier cavities correspond to those of the LED tube seat model 10 in the figure 5, and are used for guiding the filling direction of the PIN needle. Further, as shown in fig. 1, strong magnets 5 are uniformly embedded in a plurality of blind holes on the upper and lower surfaces of the lead cassette 1. The strong magnet 5 is made of rare earth permanent magnet material with completely consistent shape and size, the end surface of the strong magnet is flush with the upper surface and the lower surface of the lead filling box 1, and the strong magnet is used for attracting the lead baffle 7 and the lead baffle frame 8. The structures of the lower surface and the upper surface of the lead loading box 1 are symmetrical to each other, and therefore, the description is omitted.

As shown in fig. 3, the lead baffle 7 is a flat non-deformed stainless steel sheet. When the lead blocking plate 7 is attached to the upper surface or the lower surface of the lead filling box 1 along the left and

rear covering edges

2, 3 and the right covering edge 4, the lead blocking plate 7 is attracted by the strong magnet 5 and closely attached to the upper surface or the lower surface of the lead filling box 1, thereby effectively preventing the PIN from leaking out of the lead carrier cavity 6.

As shown in fig. 4, the lead frame 8 is a flat and non-deformable hollow stainless steel sheet, and the hollow position corresponds to the lead carrier cavity 6, so as to ensure that the hollow position cannot obstruct the PIN from being discharged from the lead carrier cavity 6. When the lead wire blocking frame 8 is attached to the upper surface or the lower surface of the lead wire filling box 1 along the left edge covering 2, the rear edge covering 3 and the right edge covering 4, the lead wire blocking frame is attracted by the strong magnet 5 to clamp the PCB 11, and the position of the PCB 11 is fixed when the PIN needle is filled into the lead wire filling hole 9.

The PCB 11 is a circuit board including a plurality of LED socket models 10, and as shown in fig. 5, each LED socket model 10 has a plurality of lead wire filling holes 9. The lead wire filling hole 9 is used for inserting the PIN needle, and the size of the hole diameter is matched with the type of the PIN needle. Only when the PIN needle head end 13 is aligned with the lead wire filling hole 9, the PIN needle can be inserted into the lead wire filling hole to complete filling, and the direction is forward; otherwise, the PIN end 12 can not be inserted when aligned with the lead filling hole 9, and the direction is reverse.

The PIN is made of a T-shaped copper alloy material for conducting electricity, as shown in fig. 6, the end with the larger diameter is a PIN tail end 12, and the other end is a PIN head end 13.

In order to ensure that the process of filling the PIN is not affected by the PIN direction, the lead filling box 1 has an up-and-down symmetrical structure. When the lead baffle 7 is attached to the upper surface of the lead filling box 1, the lead baffle frame 8 is to be attached to the lower surface of the lead filling box 1; when the lead hole blocking plate 7 is attached to the lower surface of the lead filling box 1, the lead blocking frame 8 should be attached to the upper surface of the lead filling box 1. According to the design, after all PIN needles arranged in the forward direction in the lead carrier cavity 6 are filled, the lead filling box 1 is turned over up and down, the positions of the lead baffle 7, the lead baffle frame 8 and the PCB 11 are exchanged, and at the moment, the directions of the residual PIN needles in the lead carrier cavity 6 are changed from the reverse direction to the forward direction, so that the PIN needles in the lead filling box 1 can be continuously filled without being taken out.

The process of filling the lead by using the device comprises the following steps: (1) the lead baffle 7 is attached to the lower surface of the lead cassette 1. (2) An appropriate amount of PIN needle orientation is randomly placed into the lead carrier cavity 6. (3) A PCB board 11 to be loaded with PIN PINs is attached to the upper surface of the lead loading cassette 1 in a direction corresponding to the lead carrier cavity 6. (4) The lead frame 8 is attached to the outer side of the PCB 11, and the lead frame 8 is attracted by the strong magnet 5, so that the PCB 11 is firmly clamped. (5) The lead filling device is turned upside down so that the lead stopper 7 is positioned above and the PCB 11 is positioned below. (6) The lead loading device was manually picked up and gently shaken horizontally. (7) When all the lead filling holes 9 of the PCB 11 are filled with PIN needles by visual observation, the lead filling device is vertically turned over by 90 degrees, the lead carrier cavity 6 is made to be parallel, and the lead filling device is gently put down. (8) And (4) taking off the lead wire blocking frame 8, and then taking off the PCB 11 filled with the PIN PINs. (9) If the filling is needed to be continued, replacing the PCB 11 to be filled with the PIN PINs with a new PCB, and repeating the steps (3) to (8). (10) And (3) after the forward PIN needles are filled, continuously shaking the lead filling device to realize filling, putting down the lead filling device according to the steps (7) and (8), taking down the lead baffle frame 8 and the PCB 11, exchanging the positions of the PCB 11 and the lead baffle 7, and finally attaching the lead baffle frame 8 to the outer side of the PCB 11. At this time, the lead frame 8 and the PCB 11 are positioned on the lower surface of the lead cassette 1, the lead stopper 7 is positioned on the upper surface of the lead cassette 1, and the remaining PIN directions in the lead carrier chamber 6 are all changed from the reverse direction to the forward direction. And (5) continuously repeating the steps (3) to (8). (11) If the PIN in the lead carrier cavity 6 is insufficient, the PIN should be supplemented in time, but the PIN should not be filled fully at one time, otherwise the PIN in the lead carrier cavity 6 horizontally shakes in the step (6) to be hindered, and the filling effect is affected.

The device can be used for manually loading the leads and also can be used for automatically loading the leads mechanically. When the lead is manually loaded, the PIN is manually randomly placed in the direction of the lead carrier cavity 6, and after the lead baffle 7 and the lead baffle frame 8 are assembled, the lead loading box 1 is manually shaken to insert the PIN into the PCB. In mechanical operation, the PINs are randomly placed into the lead carrier cavity 6 by a conveyor belt or other means, and after the lead baffle 7 and the lead baffle frame 8 are assembled, the lead filling box 1 is driven by a vibrating device to vibrate, so that the PINs are inserted into the PCB.

The foregoing description is only for the purpose of illustrating the general principles and preferred embodiments of the present invention, and it is intended that modifications and substitutions by those skilled in the art be included within the scope of the present invention.

Claims

1. The utility model provides a PIN needle inserts lead wire filling device of PCB board which characterized in that: the lead wire loading box is provided with a plurality of lead wire carrier cavities, the lead wire carrier cavities axially penetrate through the upper surface and the lower surface of the lead wire loading box, and the size, the number and the position of the lead wire carrier cavities correspond to a tube seat model on a PCB (printed circuit board); the lead baffle is attached to the upper surface or the lower surface of the lead filling box through an adsorption mechanism, and the lead baffle frame is attached to the other surface opposite to the lead baffle through the adsorption mechanism; the lead wire keeps off the frame and is equipped with a plurality of fretworks, and the fretwork position corresponds with lead wire carrier chamber position, confirms that it can't hinder PIN and discharges from lead wire carrier chamber.

2. The PIN insertion PCB lead loading apparatus of claim 1, wherein: the adsorption mechanism is magnets embedded on the upper surface and the lower surface of the lead filling box, and the outer surfaces of the magnets are flush with the upper surface and the lower surface of the lead filling box.

3. The PIN insertion PCB lead loading apparatus of claim 1, wherein: the left boundary, the rear boundary and the right boundary of the upper surface and the lower surface of the lead filling box are respectively provided with a wrapping edge, namely a left wrapping edge, a rear wrapping edge and a right wrapping edge.

4. The PIN insertion PCB lead loading apparatus of claim 3, wherein: the left edge covering, the rear edge covering and the right edge covering protrude out of the upper surface or the lower surface of the lead filling box, and the height of the protrusion is the sum of the thicknesses of the PCB and the lead blocking frame.

5. The PIN insertion PCB lead loading apparatus of claim 1, wherein: the lead filling box is made of a cuboid aluminum material and has three groups of opposite surfaces, namely an upper group of opposite surfaces, a lower group of opposite surfaces, a front group of opposite surfaces, a rear group of opposite surfaces and a left group of opposite surfaces, wherein each group of opposite surfaces is of a symmetrical structure.

6. The PIN insertion PCB lead loading apparatus of claim 2, wherein: the lead baffle is a smooth and deformation-free stainless iron sheet, and the lead baffle is tightly attached to the upper surface or the lower surface of the lead filling box through a magnet.

7. The PIN insertion PCB lead loading apparatus of claim 2, wherein: the lead wire keeps off the frame and closely laminates and grasps the PCB board through magnet and the upper surface or the lower surface of lead wire filling box for leveling the nonrust iron fretwork piece that does not have the deformation, and the position of PCB board is fixed when guaranteeing that the PIN needle loads into lead wire filling hole.