CN216626182U - Embedded intelligent multi-path voltage-stabilized power supply circuit board - Google Patents
Embedded intelligent multi-path voltage-stabilized power supply circuit board Download PDFInfo
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- CN216626182U CN216626182U CN202123222739.1U CN202123222739U CN216626182U CN 216626182 U CN216626182 U CN 216626182U CN 202123222739 U CN202123222739 U CN 202123222739U CN 216626182 U CN216626182 U CN 216626182U
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Abstract
The utility model relates to an embedded intelligent multi-path voltage-stabilized power supply circuit board which comprises a circuit board body, wherein element components are arranged on the surface of the circuit board body, heat dissipation components are arranged on the upper side and the lower side of the circuit board body, the element components comprise voltage stabilizing circuit components fixedly installed on the top of the circuit board body, and an intelligent chip is fixedly installed on the top of the circuit board body. This embedded intelligent multichannel constant voltage power supply circuit board, be used for installing loading board and lower loading board through both sides difference erection bracing post about the circuit board body, and at the surface mounting samming board of last loading board and lower loading board, form through the samming board is come to dispel the heat to the circuit board body, compare traditional forced air cooling form, not only can save a large amount of spaces, can not produce the noise at radiating in-process simultaneously, through adding the heat conduction silk screen that is equipped with superfine copper wire and makes in two relative one sides of samming board, can accelerate the samming board and absorb thermal speed, further promote the radiating effect.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to an embedded intelligent multi-path stabilized voltage supply circuit board.
Background
The circuit board is named as a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB (printed circuit board), an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB (printed circuit board), an ultrathin circuit board, a printed (copper etching technology) circuit board and the like, enables the circuit to be miniaturized and visualized, plays an important role in batch production of fixed circuits and optimization of electrical appliance layout, and can be called as a printed circuit board or a printed circuit board.
Along with the development of circuit board industry, the intelligent requirement on a circuit board is higher and higher, but along with the higher and higher requirement, the integration of the circuit board is higher and higher, the elements on the surface of the circuit board are more and more, so that the heat productivity of the circuit board after operation is larger and larger, and the traditional heat dissipation mode is mostly in an air cooling mode, and the mode not only needs a large amount of space for installing a fan, but also has larger noise in the heat dissipation process, so that the embedded intelligent multi-path stabilized voltage power supply circuit board is provided.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the utility model provides an embedded intelligent multi-path voltage-stabilized power supply circuit board which has the advantages of space saving, low noise and the like, and solves the problem that air-cooling heat dissipation not only needs a large amount of space for installing a fan, but also has larger noise in the heat dissipation process.
In order to achieve the purposes of space saving and low noise, the utility model provides the following technical scheme: the utility model provides an embedded intelligent multichannel constant voltage power supply circuit board, includes the circuit board body, the surface of circuit board body is provided with the component subassembly, the upper and lower both sides of circuit board body are provided with radiator unit, the component subassembly includes the voltage stabilizing circuit spare of fixed mounting at circuit board body top, the top fixed mounting of circuit board body has intelligent chip, the top fixed mounting of circuit board body has auxiliary component, radiator unit includes both sides support column all around about fixed mounting is about the circuit board body, both sides the surface of support column fixed mounting respectively has last loading board and lower loading board, go up the equal fixed mounting in one side that loading board and lower loading board carried on the back mutually has the samming board, it has the heat conduction silk screen to go up the relative one side fixed mounting of loading board and lower loading board.
Further, the circuit board body is the rectangle, and four angles of circuit board body are all seted up for the chamfer, and the avris fixed mounting of circuit board body has the anticollision frame.
Furthermore, the voltage stabilizing circuit part is fixedly connected with the intelligent chip through a wire, and the intelligent chip is fixedly connected with the auxiliary element through a wire.
Further, the top of circuit board body is seted up with intelligent chip and auxiliary component looks adaptation's resettlement groove, the both sides of the affiliated resettlement groove of auxiliary component all fixed mounting have metal pin.
Further, the support column is a plastic cylinder, a buffer air bag is fixedly mounted in the middle of the support column, and the height of the support column is smaller than that of the top at the bottom.
Further, go up loading board and lower loading board and be the copper and the size equals, the equal fixed mounting in surface of going up loading board and lower loading board has insulating coating, goes up the lower dive groove of all offering with the samming looks adaptation in one side that loading board and lower loading board carried on the back mutually, and heat conduction silk screen and samming board fixed connection, heat conduction silk screen are superfine copper silk screen.
Compared with the prior art, the utility model provides an embedded intelligent multi-path voltage-stabilized power supply circuit board which has the following beneficial effects:
this embedded intelligent multichannel constant voltage power supply circuit board, through both sides difference erection bracing post about the circuit board body is used for installing loading board and loading board down, and at the surface mounting samming board of loading board and loading board down, come to dispel the heat to the circuit board body through the form of samming board, compare traditional forced air cooling form, not only can save a large amount of spaces, can not produce the noise at radiating in-process simultaneously, furthermore, through the heat conduction silk screen that is equipped with superfine copper wire and makes additional one side in two samming boards are relative, can accelerate the speed that the samming board absorbs the heat effectively, and then further promote the radiating effect, in addition, install the buffering gasbag additional at the middle part of support column, can let loading board and loading board down all have good buffering effect.
Drawings
FIG. 1 is a schematic top view of a circuit board body according to the present invention;
FIG. 2 is a side view of the present invention.
In the figure: the circuit board comprises a circuit board body 1, a voltage stabilizing circuit component 2, an intelligent chip 3, an auxiliary element 4, a support column 5, a buffering air bag 6, an upper bearing plate 7, a lower bearing plate 8, a lower submerged groove 9, a temperature-equalizing plate 10, a heat-conducting wire mesh 11 and an anti-collision frame 12.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, an embedded intelligent multi-path voltage-stabilized power supply circuit board comprises a circuit board body 1, wherein the circuit board body 1 is rectangular, four corners of the circuit board body 1 are provided with chamfers, an anti-collision frame 12 is fixedly mounted on the side of the circuit board body 1, and the anti-collision frame 12 is made of elastic sponge.
The surface of the circuit board body 1 is provided with element components, and the upper side and the lower side of the circuit board body 1 are provided with heat dissipation components.
The component assembly comprises a voltage stabilizing circuit component 2 fixedly mounted on the top of the circuit board body 1, and can effectively stabilize the voltage of the multi-path accessed current, so that other components are prevented from being damaged due to voltage change, and the service lives of other components are guaranteed.
Secondly, the top of the circuit board body 1 is fixedly provided with two intelligent chips 3, and the top of the circuit board body 1 is fixedly provided with an auxiliary element 4.
Wherein, one in two intelligent chip 3 is as another annex as of main part, and two intelligent chip 3 alternate operation, and intelligent chip 3 is when moving, and only one intelligent chip 3 is working, when 3 high temperatures of intelligent chip, then can another intelligent chip 3 of automatic start to intelligent chip 3 with original operation closes, is in peak state at this 3 moments of effectual assurance intelligent chip, can promote intelligent chip 3's life.
Secondly, voltage stabilizing circuit part 2 passes through wire silk fixed connection with intelligent chip 3, and intelligent chip 3 passes through wire silk fixed connection with auxiliary component 4, and the resettlement groove with intelligent chip 3 and auxiliary component 4 looks adaptation is seted up at the top of circuit board body 1, and the equal fixed mounting in both sides of the resettlement groove of auxiliary component 4 belonged has metal pin 41.
The heat dissipation assembly comprises support columns 5 which are fixedly mounted on the upper side and the lower side of the circuit board body 1 on the periphery, the surfaces of the support columns 5 on the two sides are respectively fixedly provided with an upper bearing plate 7 and a lower bearing plate 8, the upper bearing plate 7 and the lower bearing plate 8 are copper plates and equal in size, an insulating coating is fixedly mounted on the surfaces of the upper bearing plate 7 and the lower bearing plate 8 and used for insulation, and a lower submerged groove 9 is formed in one side, back to back, of the upper bearing plate 7 and the lower bearing plate 8.
Wherein, support column 5 is the plastic cylinder, and the middle part fixed mounting of support column 5 has buffering gasbag 6 to, the height that highly is less than the support column 5 at top of support column 5 at the bottom can absorb outside vibrations effectively through buffering gasbag 6, and then reduces the vibrations to circuit board body 1.
In addition, a uniform temperature plate 10 is fixedly installed in the submerged groove 9 on the opposite side of the upper bearing plate 7 and the lower bearing plate 8, a heat conducting wire mesh 11 fixedly connected with the uniform temperature plate 10 is fixedly installed on the opposite side of the upper bearing plate 7 and the lower bearing plate 8, and the heat conducting wire mesh 11 is an ultrafine copper wire mesh.
This embodiment is when using, install loading board 7 and loading board 8 down through the support column 5 of both sides about the circuit board body 1, and at the surface mounting temperature-uniforming plate 10 of loading board 7 and loading board 8 down, come to dispel the heat to circuit board body 1 through the form of temperature-uniforming plate 10, save a large amount of spaces with this, avoid producing the noise simultaneously, in addition, can accelerate the speed that temperature-uniforming plate 10 absorbs the heat through heat conduction silk screen 11, in addition, through the buffering gasbag 5 at support column 5 middle part, can let loading board 7 and loading board 8 down all have good buffering effect.
The electrical components shown herein are electrically connected to a main controller and a power supply, the main controller can be a conventional known device controlled by a computer, and the conventional power connection technology disclosed in the prior art is not described in detail herein.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an embedded intelligent multichannel constant voltage power supply circuit board, includes circuit board body (1), its characterized in that: the surface of the circuit board body (1) is provided with element components, and the upper side and the lower side of the circuit board body (1) are provided with heat dissipation components;
the component assembly comprises a voltage stabilizing circuit component (2) fixedly mounted at the top of the circuit board body (1), an intelligent chip (3) is fixedly mounted at the top of the circuit board body (1), and an auxiliary component (4) is fixedly mounted at the top of the circuit board body (1);
the heat dissipation assembly comprises support columns (5) fixedly mounted on the periphery of the upper side and the lower side of a circuit board body (1) and two sides, wherein the surfaces of the support columns (5) are respectively fixedly mounted with an upper bearing plate (7) and a lower bearing plate (8), a uniform temperature plate (10) is fixedly mounted on one side of the upper bearing plate (7) opposite to the one side of the lower bearing plate (8), and a heat conduction wire mesh (11) is fixedly mounted on the opposite side of the upper bearing plate (7) and the lower bearing plate (8).
2. The embedded intelligent multi-path voltage-stabilized power supply circuit board according to claim 1, characterized in that: the circuit board is characterized in that the circuit board body (1) is rectangular, four corners of the circuit board body (1) are all provided with chamfers, and an anti-collision frame (12) is fixedly mounted on the side of the circuit board body (1).
3. The embedded intelligent multi-path voltage-stabilized power supply circuit board according to claim 1, characterized in that: the voltage stabilizing circuit part (2) is fixedly connected with the intelligent chip (3) through a wire, and the intelligent chip (3) is fixedly connected with the auxiliary element (4) through a wire.
4. The embedded intelligent multi-path voltage-stabilized power supply circuit board according to claim 1, characterized in that: the top of the circuit board body (1) is provided with a placement groove matched with the intelligent chip (3) and the auxiliary element (4), and metal pins (41) are fixedly mounted on two sides of the placement groove to which the auxiliary element (4) belongs.
5. The embedded intelligent multi-path voltage-stabilized power supply circuit board according to claim 1, characterized in that: the support column (5) is a plastic cylinder, the middle of the support column (5) is fixedly provided with a buffering air bag (6), and the bottom of the support column (5) is smaller than the top of the support column (5).
6. The embedded intelligent multi-path voltage-stabilized power supply circuit board according to claim 1, characterized in that: go up loading board (7) and loading board (8) down and be the copper and the size equals, the equal fixed mounting in surface of going up loading board (7) and loading board (8) down has insulating coating, goes up loading board (7) and one side that loading board (8) carried on the back mutually all sets up dive groove (9) with temperature-uniforming plate (10) looks adaptation down, heat conduction silk screen (11) and temperature-uniforming plate (10) fixed connection, and heat conduction silk screen (11) are superfine copper silk screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123222739.1U CN216626182U (en) | 2021-12-21 | 2021-12-21 | Embedded intelligent multi-path voltage-stabilized power supply circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123222739.1U CN216626182U (en) | 2021-12-21 | 2021-12-21 | Embedded intelligent multi-path voltage-stabilized power supply circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216626182U true CN216626182U (en) | 2022-05-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123222739.1U Active CN216626182U (en) | 2021-12-21 | 2021-12-21 | Embedded intelligent multi-path voltage-stabilized power supply circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216626182U (en) |
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2021
- 2021-12-21 CN CN202123222739.1U patent/CN216626182U/en active Active
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