CN216550579U - Cooling system for vacuum heat treatment - Google Patents

Abstract

The utility model relates to a cooling system for vacuum heat treatment belongs to thermal treatment technical field, and it is including the platform of placing that is located the vacuum heat treatment stove, the inside of placing the platform is provided with first cooling chamber and a plurality of second cooling chamber, and is a plurality of second cooling chamber is located the periphery in first cooling chamber, the lateral wall of placing the platform is provided with inlet tube and the outlet pipe that is linked together with first cooling chamber, all be provided with the solenoid valve on inlet tube and the outlet pipe, the other end intercommunication of inlet tube and outlet pipe has the water source, the upper surface of placing the platform is seted up and is corresponded the gas outlet of second cooling chamber intercommunication, second cooling intracavity intercommunication has the cold air source. The application has the effect that the workpiece can be uniformly subjected to heat treatment.

Description

Cooling system for vacuum heat treatment

Technical Field

The application belongs to the technical field of heat treatment, and particularly relates to a cooling system for vacuum heat treatment.

Background

Vacuum heat treatment is a novel heat treatment technology combining a vacuum technology and a heat treatment technology, wherein the vacuum environment of the vacuum heat treatment refers to an atmosphere environment lower than one atmosphere pressure, and comprises low vacuum, medium vacuum, high vacuum and ultrahigh vacuum, and the vacuum heat treatment actually belongs to atmosphere control heat treatment. The vacuum heat treatment is that the whole and part of the heat treatment process is carried out in a vacuum state, and the heat treatment quality is greatly improved. Compared with the conventional heat treatment, the vacuum heat treatment can realize no oxidation, no decarburization and no carburization, can remove phosphorus chips on the surface of a workpiece, and has the functions of degreasing, degassing and the like, thereby achieving the effect of bright purification of the surface.

After vacuum heat treatment is carried out on a workpiece, the workpiece needs to be cooled, and the prior art is to fill cold air into a vacuum heat treatment furnace to realize cooling. However, since the workpiece is placed in the vacuum heat treatment furnace, the contact surface cannot contact with the cold air because the workpiece and the vacuum heat treatment furnace have a certain contact area, and the heat treatment effect of the workpiece is not uniform.

SUMMERY OF THE UTILITY MODEL

In order to enable the workpiece to be uniformly subjected to heat treatment, the application provides a cooling system for vacuum heat treatment.

The cooling system for vacuum heat treatment adopts the following technical scheme:

the utility model provides a cooling system for vacuum heat treatment, is including being located the platform of placing of vacuum heat treatment stove, the inside of placing the platform is provided with first cooling chamber and a plurality of second cooling chamber, and is a plurality of second cooling chamber is located the periphery in first cooling chamber, the lateral wall of placing the platform is provided with inlet tube and the outlet pipe that is linked together with first cooling chamber, all be provided with the solenoid valve on inlet tube and the outlet pipe, the other end intercommunication of inlet tube and outlet pipe has the water source, the upper surface of placing the platform is seted up and is corresponded the gas outlet of second cooling chamber intercommunication, second cooling intracavity intercommunication has the cold air supply.

Through adopting above-mentioned technical scheme, place the upper surface of placing the platform with the work piece, accomplish the processing back at the work piece, the water source passes through the inlet tube and adds cold water into first cooling intracavity to make cold water and work piece carry out the heat exchange, reach the function that reduces the temperature, then the cold air source passes through the gas outlet with air conditioning and cools down other positions of work piece, thereby make the carrying out thermal treatment that the work piece surface can be even.

Optionally, a plurality of baffle plates are arranged in the first cooling cavity at intervals, a cooling channel is formed in the first cooling cavity by the baffle plates, one end of the cooling channel is communicated with the water inlet pipe, and the other end of the cooling channel is communicated with the water outlet pipe.

Through adopting above-mentioned technical scheme, the effect that can play the support to first cooling chamber is played in the setting of baffler to this avoids the work piece to place bench surface bending, and the baffler can improve the time that cold water stops in first cooling chamber simultaneously, guarantees with this that work piece and cold water can fully carry out the heat exchange, thereby reaches the effect that reduces the work piece temperature.

Optionally, the cooling channel is arranged in a wave shape.

Through adopting above-mentioned technical scheme, the cooling channel sets up and is the wave, can improve the dwell time of cold water in first cooling chamber, guarantees that cold water and work piece fully carry out the heat exchange to reach the purpose that reduces the work piece temperature.

Optionally, the water source includes the insulation box, be provided with in the box with the water pump that the inlet tube is linked together, the outlet pipe is linked together with the box, the lateral wall of insulation box is provided with a plurality of semiconductor refrigeration pieces, the cold side of semiconductor refrigeration piece is towards the inside wall of insulation box.

Through adopting above-mentioned technical scheme, the semiconductor refrigeration piece refrigerates to the water in the insulation can, and cold water is carried to the inlet tube under the drive of water pump to get into first cooling intracavity through the inlet tube, cold water carries out the heat exchange with the work piece of placing on placing the platform, guarantees that the work piece obtains effectual cooling with placing a contact surface.

Optionally, the hot side of the semiconductor cooling plate is provided with an auxiliary cooling fin.

Through adopting above-mentioned technical scheme, the radiating effect of semiconductor refrigeration piece hot side can be accelerated in the setting of auxiliary cooling fin to avoid the heat siltation near semiconductor refrigeration piece, prevent that semiconductor refrigeration piece high temperature.

Optionally, the periphery wall of the inlet pipe is sleeved with a heat-insulating layer.

Through adopting above-mentioned technical scheme, the setting of heat preservation can reduce inlet tube, outer water pipe and the external heat exchange that carries on to avoid the cold water temperature through in the inlet tube to rise, thereby guarantee the cooling effect of cold water to placing the bench work piece.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the workpiece is placed on the upper surface of the placing table, after the workpiece is machined, cold water is added into the first cooling cavity through the water inlet pipe by a water source, so that the cold water and the workpiece are subjected to heat exchange, the function of reducing the water temperature is achieved, and then the cold air source cools other positions of the workpiece through the air outlet, so that the surface of the workpiece can be subjected to uniform heat treatment;

2. the blocking plate can support the first cooling cavity, so that the upper surface of the placing table of the workpiece is prevented from being bent, meanwhile, the blocking plate can improve the time for cold water to stay in the first cooling cavity, and the workpiece and the cold water can be ensured to be subjected to heat exchange fully, so that the effect of reducing the temperature of the workpiece is achieved;

3. the semiconductor refrigeration piece refrigerates the water in the insulation can, and cold water is carried to the inlet tube under the drive of water pump to get into first cooling intracavity through the inlet tube, cold water carries out the heat exchange with the work piece of placing on placing the platform, guarantees that the work piece obtains effectual cooling with placing a contact surface.

Drawings

FIG. 1 is an overall schematic view of the present embodiment;

FIG. 2 is a schematic sectional view of the placement table in the present embodiment;

fig. 3 is a schematic structural view of the water source in this embodiment.

Reference numerals: 1. a placing table; 2. a first cooling chamber; 3. a water inlet pipe; 4. a water outlet pipe; 5. a water source; 51. a heat preservation box body; 52. a semiconductor refrigeration sheet; 53. an auxiliary heat sink; 6. an electromagnetic valve; 7. a second cooling chamber; 8. an air outlet; 9. a cold gas source; 10. a barrier plate; 11. a cooling channel.

Detailed Description

The present application is described in further detail below with reference to figures 1-3.

The embodiment of the application discloses a cooling system for vacuum heat treatment. Referring to fig. 1 and 2, the vacuum heat treatment furnace includes a mounting table 1, and the mounting table 1 is fixed to an inner bottom surface of the vacuum heat treatment furnace. Place 1 inside first cooling chamber 2 of having seted up of platform, the transversal rectangle setting of personally submitting of first cooling chamber 2. The side wall of the placing table 1 is provided with a water inlet pipe 3 and a water outlet pipe 4, the water inlet pipe 3 and the water outlet pipe 4 are both communicated with the first cooling cavity 2, and the other ends of the water inlet pipe 3 and the water outlet pipe 4 are both communicated with a water source 5 outside the vacuum heat treatment furnace. The water inlet pipe 3 and the water outlet pipe 4 are both provided with an electromagnetic valve 6. The peripheral wall of the water inlet pipe 3 is sleeved with a heat insulation layer. The heat insulating layer is made of glass wool.

In addition to the above embodiment, the second cooling chamber 7 is opened in the placing table 1 on both sides of the first cooling chamber 2. The upper surface of the placing table 1 is provided with an air outlet 8 communicated with the corresponding second cooling cavity 7. The second cooling chamber 7 is in communication with a source of cold air 9 located outside the standing board 1.

After the workpiece is machined, cold water in the water source 5 is cooled in the first cooling cavity 2 through the water inlet pipe 3, so that the position where the workpiece is abutted to the placing table 1 is cooled; the gas of the cold gas source 9 enters the second cooling cavity 7, so that the rest position of the workpiece is cooled, and the workpiece can be uniformly subjected to heat treatment.

Referring to fig. 2, barrier plates 10 are welded to opposite sidewalls of the first cooling chamber 2, the barrier plates 10 form a cooling channel 11 in the first cooling chamber 2, and the barrier plates 10 of the opposite sidewalls are spaced apart such that the cooling channel 11 is in a wave shape. The baffle plate 10 can serve as a support to prevent the first cooling chamber 2 from being crushed. Meanwhile, the cooling channel 11 is arranged in a wave shape, so that the retention time of cold water in the first cooling cavity 2 is prolonged, the cold water and the workpiece are ensured to fully exchange heat, and the purpose of reducing the temperature of the workpiece is achieved.

Referring to fig. 3, the water source 5 includes a thermal insulation case 51, and the thermal insulation case 51 contains water therein. The side wall of the heat preservation box body 51 is provided with a semiconductor refrigeration piece 52, the cold surface of the semiconductor refrigeration piece 52 faces the heat preservation box body 51, and the hot surface of the heat preservation box body 51 is provided with an auxiliary cooling fin 53. A water pump is arranged in the heat preservation box body 51 and is communicated with the water inlet pipe 3. The water outlet pipe 4 is communicated with the heat preservation box body 51.

When the work piece is cooled down, the water pump is started, the water pump conveys cold water in the heat insulation box body 51 to the first cooling cavity 2, the cold water is changed into warm water after heat exchange, and returns to the heat insulation box body 51 through the water outlet pipe 4, and under the action of the semiconductor refrigeration piece 52, the temperature of the warm water is reduced, ice water is provided to the first cooling cavity 2 from this, and the work piece is stably cooled down.

The implementation principle of the cooling system for vacuum heat treatment in the embodiment of the application is as follows: place the work piece at the upper surface of placing platform 1, accomplish processing back at the work piece, water source 5 adds cold water in the first cooling chamber 2 through inlet tube 3 to make cold water and work piece carry out the heat exchange, reach the function that reduces the temperature, then cold air source 9 passes through gas outlet 8 with air conditioning and cools down other positions of work piece, thereby makes the thermal treatment that carries on that the work piece surface can be even.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (6)

1. A cooling system for vacuum thermal processing, characterized by: including placing platform (1) that is located the vacuum heat treatment stove, the inside of placing platform (1) is provided with first cooling chamber (2) and a plurality of second cooling chamber (7), and is a plurality of second cooling chamber (7) are located the periphery of first cooling chamber (2), the lateral wall of placing platform (1) is provided with inlet tube (3) and outlet pipe (4) that are linked together with first cooling chamber (2), all be provided with solenoid valve (6) on inlet tube (3) and outlet pipe (4), the other end intercommunication of inlet tube (3) and outlet pipe (4) has water source (5), place the upper surface of platform (1) and set up gas outlet (8) with corresponding second cooling chamber (7) intercommunication, second cooling chamber (7) in-connection has cold air source (9).

2. A cooling system for vacuum thermal processing according to claim 1, characterized in that: a plurality of baffle plates (10) are arranged in the first cooling cavity (2) at intervals, a cooling channel (11) is formed in the first cooling cavity (2) by the baffle plates (10), one end of the cooling channel (11) is communicated with the water inlet pipe (3), and the other end of the cooling channel (11) is communicated with the water outlet pipe (4).

3. A cooling system for vacuum thermal processing according to claim 2, characterized in that: the cooling channel (11) is arranged in a wave shape.

4. A cooling system for vacuum thermal processing according to claim 1, characterized in that: the water source (5) includes insulation box (51), be provided with in the box with the water pump that inlet tube (3) are linked together, outlet pipe (4) are linked together with the box, the lateral wall of insulation box (51) is provided with a plurality of semiconductor refrigeration pieces (52), the cold side of semiconductor refrigeration piece (52) is towards the inside wall of insulation box (51).

5. A cooling system for vacuum thermal processing according to claim 4, characterized in that: and an auxiliary cooling fin (53) is arranged on the hot surface of the semiconductor refrigerating fin (52).

6. A cooling system for vacuum thermal processing according to claim 1, characterized in that: the periphery wall of inlet tube (3) all is equipped with the heat preservation.

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