CN216542675U - Polishing pad and polishing device - Google Patents

Abstract

The utility model discloses a polishing pad and a polishing device, which are used for polishing a groove line at the bending position of ultrathin flexible glass. This polishing pad is when polishing the recess lines of the position department of buckling to ultra-thin flexible glass, because the bottom surface of stereoplasm polishing dish is formed with flexible polishing layer, flexible polishing layer compression deformation can improve the defect of the local roughness imbalance of polishing pad, promotes polishing pad and product face contact homogeneity, improves polishing homogeneity and reduces the risk that ultra-thin flexible glass crushes by pressure.

Description

Polishing pad and polishing device

Technical Field

The utility model relates to the technical field of ultrathin glass processing, in particular to a polishing pad and a polishing device.

Background

UTG glass, also called ultra-thin flexible glass, the bending position is generally accomplished by etching, because the etching at the bending position causes that the position has a certain thickness difference compared with the non-etching position of the ultra-thin flexible glass, and then the line feeling of the groove generated at the bending position is very obvious, which affects the beauty and the use effect.

Generally, the method for removing the lines mainly adopts the polishing treatment of the groove lines at the bending position, and the current polishing method is as follows: UTG glass was attached directly to the suction pad and the position of the wire was polished using a conventional polyurethane polishing pad.

However, since the product thickness is too thin, and the conventional polyurethane polishing pad is not elastic to polish, the polishing process is prone to chipping.

In summary, how to solve the problem that the ultrathin flexible glass is easily broken in the polishing process of the groove line at the bending position becomes a problem to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a polishing pad and a polishing device to solve the problem that ultrathin flexible glass is easy to be broken in the process of polishing the groove line at the bending position.

In order to achieve the purpose, the utility model provides the following technical scheme:

the polishing pad is used for polishing groove lines at the bending positions of ultrathin flexible glass and comprises a polishing pad body, wherein the polishing pad body comprises a hard polishing disk and a flexible polishing layer, and the flexible polishing layer is formed on the bottom surface of the hard polishing disk.

Preferably, the rigid polishing disk is a polyurethane polishing pad.

Preferably, the flexible polishing layer is a foamed sponge layer.

Preferably, the flexible polishing layer is bonded to the bottom surface of the rigid polishing disk by a fixing adhesive.

Compared with the introduction content of the background technology, the polishing pad is used for polishing the groove lines at the bending positions of the ultrathin flexible glass and comprises a polishing pad body, wherein the polishing pad body comprises a hard polishing disk and a flexible polishing layer, and the flexible polishing layer is formed on the bottom surface of the hard polishing disk. This polishing pad is when polishing the recess lines of the position department of buckling to ultra-thin flexible glass, because the bottom surface of stereoplasm polishing dish is formed with flexible polishing layer, flexible polishing layer compression deformation can improve the defect of the local roughness imbalance of polishing pad, promotes polishing pad and product face contact homogeneity, improves polishing homogeneity and reduces the risk that ultra-thin flexible glass crushes by pressure.

In addition, the utility model also provides a polishing device, which comprises an adsorption pad for adsorbing and fixing the ultrathin flexible glass, a polishing shaft arranged on a polishing head and a polishing pad arranged on the polishing shaft, wherein the polishing pad is the polishing pad described in any scheme. Since the above-mentioned polishing pad has the above-mentioned technical effects, the polishing apparatus having the polishing pad should also have the corresponding technical effects, which are not described herein again.

Preferably, this burnishing device still includes ultra-thin support filler strip, ultra-thin support filler strip be used for place in the adsorption pad with between the ultra-thin flexible glass, ultra-thin support filler strip with the recess lines of ultra-thin flexible glass's the position department of buckling is just right, just the both ends of ultra-thin support filler strip all surpass the tip of recess lines.

Preferably, the ultra-thin support backing strip is an adhesive tape.

Preferably, both ends of the ultrathin supporting filler strip exceed the preset length of the end part of the groove line, and the preset length is 1cm +/-0.5 cm.

Preferably, when the ultra-thin flexible glass is placed in the adsorption pad, the groove lines are arranged along the width direction of the adsorption pad, and the adsorption pad is wider than the groove lines in the width direction by a preset width.

Preferably, the preset width is 15cm-20 cm.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of the overall structure of a polishing pad according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of a polishing pad according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an adsorption pad for fixing the ultra-thin flexible glass to a polishing device according to an embodiment of the present invention.

Wherein, in fig. 1-3:

the polishing device comprises ultrathin flexible glass 1, a polishing pad body 2, a hard polishing disk 21, a flexible polishing layer 22, an adsorption pad 3 and an ultrathin support filler strip 4.

Detailed Description

The core of the utility model is to provide a polishing pad and a polishing device, which are used for solving the problem that ultrathin flexible glass is easy to fragment in the process of polishing the groove lines at the bent positions.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 3, an embodiment of the utility model provides a polishing pad for polishing a groove line at a bending position of an ultra-thin flexible glass 1, including a polishing pad body 2, the polishing pad body 2 includes a hard polishing disk 21 and a flexible polishing layer 22, and the flexible polishing layer 22 is formed on a bottom surface of the hard polishing disk 21.

This polishing pad is when polishing the recess lines of the position department of buckling to ultra-thin flexible glass, because the bottom surface of stereoplasm polishing dish is formed with flexible polishing layer, flexible polishing layer compression deformation can improve the defect of the local roughness imbalance of polishing pad, promotes polishing pad and product face contact homogeneity, improves polishing homogeneity and reduces the risk that ultra-thin flexible glass crushes by pressure.

In a further embodiment, the hard polishing disk 21 is preferably a polyurethane polishing pad, but it is understood that in practical applications, a hard polishing disk of other material may be selected, and is not limited to this.

In some embodiments, the flexible polishing layer 22 may be a foam sponge layer, but other flexible materials known to those skilled in the art may be used, as long as they can deform under pressure to improve the local unevenness of the polishing pad.

In a further embodiment, the flexible polishing layer 22 may be specifically adhered to the bottom surface of the hard polishing disk 21 by a fixing adhesive, and may of course be formed on the bottom surface of the hard polishing disk 21 by other methods commonly used by those skilled in the art, and during the actual application process, the flexible polishing layer may be selected according to the actual needs, which is not limited in more detail herein.

In addition, the utility model also provides a polishing device, which comprises an adsorption pad 3 for adsorbing and fixing the ultrathin flexible glass 1, a polishing shaft arranged on a polishing head and a polishing pad arranged on the polishing shaft, wherein the polishing pad is the polishing pad described in any scheme. Since the above-mentioned polishing pad has the above-mentioned technical effects, the polishing apparatus having the polishing pad should also have the corresponding technical effects, which are not described herein again.

It should be noted that, as will be understood by those skilled in the art, the ultra-thin flexible glass is generally thin, and is usually less than 0.1mm thick, and when the ultra-thin flexible glass is fixed to an adsorption pad for polishing operation in the actual operation process, the problem of undesirable removal of the groove lines due to the slight deformation of the adsorption pad is easily caused.

In view of this, the polishing device may further include an ultra-thin supporting filler strip 4, where the ultra-thin supporting filler strip 4 is disposed between the adsorption pad 3 and the ultra-thin flexible glass 1, the ultra-thin supporting filler strip 4 is opposite to the groove line at the bending position of the ultra-thin flexible glass 1, and both ends of the ultra-thin supporting filler strip 4 exceed the end portions of the groove line. The groove lines at the bending positions of the ultrathin flexible glass 1 form local support through the ultrathin support filler strips 4, then the groove lines can be locally raised to improve the local grinding rate, the line throwing effect is improved, and the problem that the lines are difficult to remove due to the fact that the product is too thin is effectively avoided.

It should be noted that the ultra-thin supporting pad strip 4 may be an adhesive tape, because the adhesive tape satisfies the ultra-thin characteristic, and is very convenient and cheap to use. It is understood that the manner of using the adhesive tape for the ultra-thin support strip is merely a preferred example of the embodiment of the present invention, and other ultra-thin materials commonly used by those skilled in the art may be used in the practical application process, which is not limited herein.

In a further embodiment, in order to ensure the stability supported by the ultra-thin supporting filler strip 4, generally, both ends of the ultra-thin supporting filler strip 4 exceed the end portions of the groove lines by a preset length, and the preset length may be specifically 1cm ± 0.5 cm.

In some more specific embodiments, when the ultrathin flexible glass 1 is placed on the adsorption pad 3, specifically, the groove line may be arranged along the width direction of the adsorption pad 3, and a single side of the adsorption pad 3 in the width direction is wider than the groove line by a preset width, and the preset width may be specifically 15cm to 20 cm. Arrange through the width direction with the recess lines along adsorption pad 3 for a plurality of ultra-thin flexible glass can be placed simultaneously to the adsorption pad on length direction, can realize that a plurality of products operate on same adsorption pad, help improving production efficiency and saving cost.

The polishing pad and the polishing apparatus provided by the present invention have been described in detail above. It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.

It should be understood that "system", "apparatus", "unit" and/or "module" as used herein is a method for distinguishing different components, elements, parts or assemblies at different levels. However, other words may be substituted by other expressions if they accomplish the same purpose.

As used in this application and the appended claims, the terms "a," "an," "the," and/or "the" are not intended to be inclusive in the singular, but rather are intended to be inclusive in the plural unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that steps and elements are included which are explicitly identified, that the steps and elements do not form an exclusive list, and that a method or apparatus may include other steps or elements. An element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element.

In the description of the embodiments herein, "/" means "or" unless otherwise specified, for example, a/B may mean a or B; "and/or" herein is merely an association describing an associated object, and means that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of the present application, "a plurality" means two or more than two.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

If used in this application, the flowcharts are intended to illustrate operations performed by the system according to embodiments of the present application. It should be understood that the preceding or following operations are not necessarily performed in the exact order in which they are performed. Rather, the various steps may be processed in reverse order or simultaneously. Meanwhile, other operations may be added to the processes, or a certain step or several steps of operations may be removed from the processes.

It is also noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.

The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the core concepts of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims (10)

1. A polishing pad is used for polishing groove lines at the bending positions of ultrathin flexible glass (1) and comprises a polishing pad body (2), wherein the polishing pad body (2) comprises a hard polishing disk (21) and a flexible polishing layer (22), and the flexible polishing layer (22) is formed on the bottom surface of the hard polishing disk (21).

2. The polishing pad of claim 1, wherein the rigid polishing disk (21) is a polyurethane polishing pad.

3. The polishing pad of claim 1, wherein the flexible polishing layer (22) is a foam sponge layer.

4. The polishing pad according to claim 1, wherein the flexible polishing layer (22) is bonded to the bottom surface of the hard polishing disk (21) by a fixing adhesive.

5. A polishing device comprising an adsorption pad (3) for adsorbing and fixing an ultra-thin flexible glass (1), a polishing spindle mounted to a polishing head, and a polishing pad mounted to the polishing spindle, wherein the polishing pad is the polishing pad according to any one of claims 1 to 4.

6. The polishing device according to claim 5, further comprising an ultra-thin support filler strip (4), wherein the ultra-thin support filler strip (4) is used for being placed between the adsorption pad (3) and the ultra-thin flexible glass (1), the ultra-thin support filler strip (4) is opposite to the groove line at the bending position of the ultra-thin flexible glass (1), and two ends of the ultra-thin support filler strip (4) exceed the end of the groove line.

7. A polishing device according to claim 6, characterized in that the ultra-thin supporting strips (4) are adhesive tapes.

8. A polishing device as claimed in claim 6, characterized in that both ends of the ultra-thin support bead (4) exceed the ends of the groove line by a predetermined length, which is 1cm ± 0.5 cm.

9. The polishing apparatus according to claim 6, wherein when the ultra-thin flexible glass (1) is placed on the adsorption pad (3), the groove line is arranged in a width direction of the adsorption pad (3), and the adsorption pad (3) is wider than the groove line by a predetermined width on one side in the width direction.

10. The polishing apparatus as recited in claim 9, wherein the predetermined width is 15cm to 20 cm.

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