CN216527065U

CN216527065U - High heat dissipation memory for computer

Info

Publication number: CN216527065U
Application number: CN202123013683.9U
Authority: CN
Inventors: 杜慧明
Original assignee: Shenzhen Maishi Technology Co Ltd
Current assignee: Shenzhen Maishi Technology Co Ltd
Priority date: 2021-12-02
Filing date: 2021-12-02
Publication date: 2022-05-13
Anticipated expiration: 2031-12-02

Abstract

The utility model discloses a high-heat-dissipation memory for a computer, which comprises memory bars and a fixed plate, wherein fixing frames are arranged on two sides of the top of the fixed plate, two memory bars are fixed between the fixing frames on the two sides, an air guide hole is formed in the center of the fixed plate, a plurality of heat dissipation fins are arranged between the two memory bars on the top of the fixed plate, a fixed cover is arranged at the bottom of the fixed plate, three heat dissipation fans are arranged in the fixed cover and are arranged at the bottom of a mounting frame arranged in the fixed cover, and two sides of the mounting frame are fixed in the fixed cover through first fixing screws. When the high-heat-dissipation memory for the computer works, the three heat dissipation fans in the fixing cover perform continuous air extraction operation, and during the operation, cold air at the top is continuously extracted from the air guide holes, so that heat of the plurality of heat dissipation fins is taken out, and the heat dissipation fins are arranged between the two memory strips, so that the heat can be quickly absorbed, and the heat dissipation is more convenient.

Description

High heat dissipation memory for computer

Technical Field

The utility model relates to the field of computer accessories, in particular to a high-heat-dissipation memory for a computer.

Background

The computer is commonly called computer, and is a modern electronic computing machine for high-speed computation, which can perform numerical computation, logic computation and memory function. The intelligent electronic device can run according to a program and automatically process mass data at a high speed. A computer consisting of a hardware system and a software system without any software installed is called a bare metal. The computer can be divided into a super computer, an industrial control computer, a network computer, a personal computer and an embedded computer, and more advanced computers comprise a biological computer, a photon computer, a quantum computer and the like. The computer inventor john von neumann. The computer is one of the most advanced scientific and technical inventions in the 20 th century, has extremely important influence on the production activities and social activities of human beings, and develops rapidly with strong vitality. The application field of the computer system is expanded from the initial military scientific research application to various fields of society, a huge-scale computer industry is formed, and the technology progress in the global range is driven, so that the profound social change is caused, the computer is spread throughout general schools, enterprises and public institutions, enters common people and becomes an essential tool in the information society, and a Memory (Memory) is one of important parts of the computer, is also called an internal Memory and a main Memory, is used for temporarily storing operation data in a CPU (central processing unit) and is used for data exchanged with external memories such as a hard disk and the like. The computer is a bridge for communicating an external memory with a CPU, all programs in the computer are operated in the internal memory, and the level of the overall performance of the computer is influenced by the strength of the internal memory. As long as the computer starts to run, the operating system transfers the data to be operated to the CPU from the memory for operation, and when the operation is finished, the CPU transmits the result.

The traditional computer memory mechanism has poor heat dissipation performance, and the situation that a memory bank is overheated occurs in the long-time use process.

Based on this, the utility model designs a high heat dissipation memory for a computer to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a high heat dissipation memory for a computer, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme:

the utility model provides a high heat dissipation memory for computer, includes DRAM and fixed plate, its characterized in that, the both sides at fixed plate top all are provided with the mount, both sides be fixed with two DRAM between the mount, the fixed plate center is provided with the air guide hole, the mount top is two be provided with a plurality of radiating fin between the DRAM, the bottom of fixed plate is provided with fixed cover, the inside three heat dissipation fan that is provided with of fixed cover.

As a further aspect of the present invention, the three heat dissipation fans are mounted at the bottom of a mounting frame provided inside the fixing cover.

As a further aspect of the present invention, both sides of the mounting bracket are fixed inside the fixing cover by a first fixing screw.

As a further scheme of the utility model, a sealing gasket is arranged between the top of the fixed cover and the bottom of the fixed plate.

As a further aspect of the present invention, both sides of the fixing cover are fixed to the fixing plate by a second fixing screw.

As a further scheme of the utility model, a plurality of the radiating fins are arranged at equal intervals.

As a further scheme of the utility model, the sealing gasket is made of a silica gel material.

As a further aspect of the present invention, the air holes are located right below the plurality of heat dissipation fins.

Compared with the prior art, the utility model has the beneficial effects that:

(1) when the heat dissipation device works, the three heat dissipation fans in the fixing cover perform continuous air extraction operation, and cold air at the top is continuously extracted from the air guide holes during the operation, so that heat of the plurality of heat dissipation fins is taken out, and the heat dissipation fins are arranged between the two memory bars, can quickly absorb heat, and are more convenient to dissipate heat.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

In the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Fig. 1 is a schematic side sectional view of a high heat dissipation memory for a computer according to the present invention;

fig. 2 is a schematic structural view of a high heat dissipation memory for a computer according to the present invention;

fig. 3 is a partially enlarged schematic view at a in fig. 1.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a memory bank; 2. a fixing plate; 3. a fixed mount; 4. a heat dissipating fin; 5. an air vent; 6. a fixed cover; 7. a heat dissipation fan; 8. a mounting frame; 9. a first fixing screw; 10. a gasket; 11. and a second fixing screw.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1-3, the utility model provides a high-heat-dissipation memory for a computer, which comprises memory banks 1 and a fixing plate 2, and is characterized in that fixing frames 3 are arranged on both sides of the top of the fixing plate 2, two memory banks 1 are fixed between the fixing frames 3 on both sides, an air guide hole 5 is arranged in the center of the fixing plate 2, a plurality of heat dissipation fins 4 are arranged between the two memory banks 1 on the top of the fixing frame 3, a fixing cover 6 is arranged at the bottom of the fixing plate 2, and three heat dissipation fans 7 are arranged inside the fixing cover 6.

Through the scheme of the utility model, the three heat dissipation fans 7 are arranged at the bottom of the mounting frame 8 arranged in the fixed cover 6.

Through the scheme of the utility model, two sides of the mounting rack 8 are fixed inside the fixing cover 6 through the arranged first fixing screws 9.

Through the scheme of the utility model, a sealing gasket 10 is arranged between the top of the fixed cover 6 and the bottom of the fixed plate 2.

Through the scheme of the utility model, two sides of the fixing cover 6 are fixed with the fixing plate 2 through the second fixing screws 11.

Through the scheme of the utility model, a plurality of radiating fins 4 are arranged at equal intervals.

According to the scheme of the utility model, the sealing gasket 10 is made of a silica gel material.

With the above arrangement of the present invention, the air holes 5 are located right below the plurality of heat dissipation fins 4.

In practical application, during operation, fixed 6 inside three heat dissipation fans 7 of cover continuously bleed the operation, and the cold air at top is continuously taken out in air guide hole 5 department during the period, and then takes out a plurality of radiating fin 4's heat, and radiating fin 4 sets up can the rapid absorption heat between two DRAM 1, the heat dissipation of being convenient for more.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a high heat dissipation memory for computer, includes DRAM (1) and fixed plate (2), its characterized in that, the both sides at fixed plate (2) top all are provided with mount (3), both sides be fixed with two DRAM (1) between mount (3), fixed plate (2) center is provided with air guide hole (5), mount (3) top is in two be provided with a plurality of radiating fin (4) between DRAM (1), the bottom of fixed plate (2) is provided with fixed cover (6), fixed cover (6) inside is provided with three heat dissipation fan (7).

2. The memory with high heat dissipation for computers according to claim 1, wherein three heat dissipation fans (7) are installed at the bottom of a mounting frame (8) provided inside the fixed cover (6).

3. The high heat dissipation memory for the computer according to claim 2, wherein two sides of the mounting rack (8) are fixed inside the fixing cover (6) through a first fixing screw (9).

4. The high heat dissipation memory for computers according to claim 1, wherein a sealing gasket (10) is provided between the top of the fixing cover (6) and the bottom of the fixing plate (2).

5. The high heat dissipation memory for the computer according to claim 1, wherein both sides of the fixing cover (6) are fixed to the fixing plate (2) by a second fixing screw (11).

6. The high heat dissipation memory for computers according to claim 1, wherein a plurality of said heat dissipation fins (4) are arranged equidistantly.

7. The high heat dissipation memory for computers according to claim 4, wherein said sealing gasket (10) is made of silicone.

8. The high heat dissipation memory for computers according to claim 1, wherein the air holes (5) are located directly below the plurality of heat dissipation fins (4).