CN105468115A - Quick heat dissipation device for CPU (central processing unit) of computer - Google Patents
Quick heat dissipation device for CPU (central processing unit) of computer Download PDFInfo
- Publication number
- CN105468115A CN105468115A CN201510832695.4A CN201510832695A CN105468115A CN 105468115 A CN105468115 A CN 105468115A CN 201510832695 A CN201510832695 A CN 201510832695A CN 105468115 A CN105468115 A CN 105468115A
- Authority
- CN
- China
- Prior art keywords
- heat
- cpu
- heat dissipation
- computer
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a quick heat dissipation device for a CPU of a computer. The quick heat dissipation device comprises a base board, a heat dissipation sheet, a CPU main board, a second heat dissipation cabin, heat conduction silicone, a first heat dissipation cabin and bases. A CPU chip is fixedly connected to the middle part of the upper part of the CPU main board; the heat dissipation sheet is fixedly connected with the CPU chip through the heat conduction silicone; the base board is fixedly arranged at the bottom of the heat dissipation sheet; fixing posts are arranged at the left side and the right side of the upper end of the base board (2); heat dissipation fins are arranged between the two fixing posts; the second heat dissipation cabin is fixedly connected with the bottom end of the CPU main board; a heat dissipation fan is arranged in the first heat dissipation cabin; the top end of the second dissipation cabin is fixedly connected with the bottom end of the first dissipation cabin; a heat dissipation grid is arranged in the second dissipation cabin; and the two bases are respectively arranged at the left side and the right side of the bottom end of the second dissipation cabin. The quick heat dissipation device for a CPU of a computer is simple in structure, convenient in use and low in cost.
Description
Technical field
The present invention relates to heat abstractor technical field, be specially a kind of computer CPU rapid heat radiation device.
Background technology
Computing machine (computer) is commonly called as computer, is a kind of robot calculator device for supercomputing, can carries out numerical evaluation, can carry out logical calculated again, also have store-memory function.Can run according to program, automatically, the modernization intelligent electronic device of high speed processing mass data.Being made up of hardware system and software systems, the computing machine not installing any software is called bare machine.Can be divided into supercomputer, industrial control computer, network computer, personal computer, embedded computer five class, more advanced computing machine has biocomputer, photonic computer, quantum computer etc.Invention on computer person John von Neumann.Computing machine is one of 20th century state-of-the-art science and technology invention, creates extremely important impact to the activity in production of the mankind and social activities, and with powerful vitality develop rapidly.Its application is from initial military research application extension to the every field of society, define huge computer industry, drive the technical progress of global range, cause deep social change thus, computing machine is throughout general school, enterprises and institutions, enter common people house, become requisite instrument in information society.Computer application is more and more general in China, after reform and opening-up, China meter central processing unit (CPU, CentralProcessingUnit) being one piece of ultra-large integrated circuit, is arithmetic core (Core) and the control core (ControlUnit) of a computing machine.Its function data mainly in interpretive machine instruction and process computer software.Central processing unit mainly comprises arithmetical unit (arithmetic logical unit, ALU, ArithmeticLogicUnit) and cache memory (Cache) and realizing contact between them data (Data), control and the bus (Bus) of state.It and internal storage (Memory) and I/O (I/O) equipment are collectively referred to as the large core component of robot calculator three.CPU comprises arithmetic and logic unit, register block and control assembly etc.In recent years, along with the transfer capability of power circuit constantly increases, power consumption increases thereupon, therefore various electronic component also creates very huge heat, bring heat dissipation problem, create heat abstractor thereupon, with regard to current CPU element, the raising of its integrated level and frequency of operation, also will improve the requirement of heat radiator.In prior art, normally cpu chip is directly fixed on a heat sink, but nowadays CPU processing procedure enters into the 18um epoch, its core fragility especially, traditional fixed form and easily this cpu chip of damage.The CPU of computing machine is the main heat-generating units of computer equipment, needs to carry out effective heat radiation auxiliary, to ensure the runnability of computing machine.Existing cpu heat radiating effect is not good, not easily smooth laminating between its heat conduction original paper and CPU module, and heat-conducting silicone grease not easily spreads out in CPU module, and then affects heat conduction rate, and make the heat of CPU not easily conduct to heat conduction original paper fast, radiating efficiency is not high.So we need a novel computer CPU rapid heat radiation device to solve the problems referred to above, meet the demand of people.
Summary of the invention
The object of the present invention is to provide a kind of computer CPU rapid heat radiation device, to solve the problem proposed in above-mentioned background technology.
For achieving the above object, the invention provides following solution: a kind of computer CPU rapid heat radiation device, comprise base plate, heat radiator, cpu motherboard, heat-dissipating storehouse two, heat conductive silica gel, heat-dissipating storehouse one, base, the middle part on described cpu motherboard top is fixedly connected with cpu chip, described heat radiator is fixedly connected with cpu chip by heat conductive silica gel, described base plate is fixedly installed on the bottom of heat radiator, on the left of the upper end of described base plate (2) and right side is equipped with fixed leg, radiating fin is provided with between 2 described fixed legs, described heat-dissipating storehouse two is fixedly connected with the bottom of cpu motherboard, the inside of described heat-dissipating storehouse one is provided with heat emission fan, the top of described heat-dissipating storehouse two is fixedly connected with the bottom of heat-dissipating storehouse one, the inside of described heat-dissipating storehouse two is provided with heat radiation grid, 2 described bases are separately positioned on left side and the right side of heat-dissipating storehouse two bottom.
Preferably, left side and the right side of described heat radiator are equipped with bolt hole, and heat radiator is fixedly connected with cpu motherboard by bolt.
Preferably, described heat emission fan is provided with 2.
Compared with prior art, the invention has the beneficial effects as follows: this computer CPU rapid heat radiation device structure is simple, easy to use, and cost is low; The setting of heat conductive silica gel by the heat in cpu chip to passing to removing, can be conducive to the heat transfer of cpu chip like this; The heat that cpu chip can conduct out by the setting of heat radiator is to distributing; Heat can both be carried out distributing of money Soviet Union by heat emission fan, radiating fin, heat radiation grid, provides multi-ensuring to the heat radiation of this computer CPU rapid heat radiation device.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
In figure: 1, fixed leg, 2, base plate, 3, heat radiator, 4, cpu motherboard, 5, heat emission fan, 6, heat-dissipating storehouse two, 7, radiating fin, 8, heat conductive silica gel, 9, cpu chip, 10, heat-dissipating storehouse two, 11, heat radiation grid, 12, base.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the invention provides a kind of technical scheme: a kind of computer CPU rapid heat radiation device, comprise base plate 2, heat radiator 3, cpu motherboard 4, heat-dissipating storehouse 26, heat conductive silica gel 8, heat-dissipating storehouse 1, base 12, the middle part on described cpu motherboard 4 top is fixedly connected with cpu chip 9, described heat radiator 3 is fixedly connected with cpu chip 9 by heat conductive silica gel 8, left side and the right side of described heat radiator 3 are equipped with bolt hole, and heat radiator 3 is fixedly connected with cpu motherboard 4 by bolt, described base plate 2 is fixedly installed on the bottom of heat radiator 3, on the left of the upper end of described base plate 2 and right side is equipped with fixed leg 1, radiating fin 7 is provided with between 2 described fixed legs 1, described heat-dissipating storehouse 2 10 is fixedly connected with the bottom of cpu motherboard 4, the inside of described heat-dissipating storehouse 1 is provided with heat emission fan 5, described heat emission fan 5 is provided with 2, the top of described heat-dissipating storehouse 26 is fixedly connected with the bottom of heat-dissipating storehouse 1, the inside of described heat-dissipating storehouse 26 is provided with heat radiation grid 11, 2 described bases 12 are separately positioned on left side and the right side of heat-dissipating storehouse 26 bottom.
Principle of work: when this computer CPU rapid heat radiation device uses, first the heat part that cpu motherboard 4 produces passes to heat radiator 3 by heat conductive silica gel 8, then heat is shed by radiating fin 7 by heat radiator 3, another part heat is discharged in heat-dissipating storehouse 26 by the heat emission fan 5 in heat-dissipating storehouse 1, and then passed by heat radiation grid 11, thus reach the effect of heat radiation.
Although illustrate and describe embodiments of the invention, for the ordinary skill in the art, be appreciated that and can carry out multiple change, amendment, replacement and modification to these embodiments without departing from the principles and spirit of the present invention, scope of the present invention is by claims and equivalents thereof.
Claims (3)
1. a computer CPU rapid heat radiation device, comprise base plate (2), heat radiator (3), cpu motherboard (4), heat-dissipating storehouse two (6), heat conductive silica gel (8), heat-dissipating storehouse one (10), base (12), it is characterized in that: the middle part on described cpu motherboard (4) top is fixedly connected with cpu chip (9), described heat radiator (3) is fixedly connected with cpu chip (9) by heat conductive silica gel (8), described base plate (2) is fixedly installed on the bottom of heat radiator (3), on the left of the upper end of described base plate (2) and right side is equipped with fixed leg (1), radiating fin (7) is provided with between 2 described fixed legs (1), described heat-dissipating storehouse two (10) is fixedly connected with the bottom of cpu motherboard (4), the inside of described heat-dissipating storehouse one (10) is provided with heat emission fan (5), the top of described heat-dissipating storehouse two (6) is fixedly connected with the bottom of heat-dissipating storehouse one (10), the inside of described heat-dissipating storehouse two (6) is provided with heat radiation grid (11), 2 described bases (12) are separately positioned on left side and the right side of heat-dissipating storehouse two (6) bottom.
2. a kind of computer CPU rapid heat radiation device according to claim 1, is characterized in that: left side and the right side of described heat radiator (3) are equipped with bolt hole, and heat radiator (3) is fixedly connected with cpu motherboard (4) by bolt.
3. a kind of computer CPU rapid heat radiation device according to claim 1, is characterized in that: described heat emission fan (5) is provided with 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510832695.4A CN105468115A (en) | 2015-11-26 | 2015-11-26 | Quick heat dissipation device for CPU (central processing unit) of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510832695.4A CN105468115A (en) | 2015-11-26 | 2015-11-26 | Quick heat dissipation device for CPU (central processing unit) of computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105468115A true CN105468115A (en) | 2016-04-06 |
Family
ID=55605905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510832695.4A Pending CN105468115A (en) | 2015-11-26 | 2015-11-26 | Quick heat dissipation device for CPU (central processing unit) of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105468115A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106713151A (en) * | 2016-11-25 | 2017-05-24 | 东莞大联社电子散热材料有限公司 | Novel router heat dissipation module |
| CN111280576A (en) * | 2018-12-29 | 2020-06-16 | 深圳光启超材料技术有限公司 | Heat radiator for intelligence helmet |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040063746A1 (en) * | 2002-07-25 | 2004-04-01 | Alicia Regueiro-Ren | Indole, azaindole and related heterocyclic ureido and thioureido piperazine derivatives |
| CN2615733Y (en) * | 2003-03-26 | 2004-05-12 | 晟铭电子科技股份有限公司 | Central processor radiating module |
| CN1512292A (en) * | 2002-12-27 | 2004-07-14 | 庄儒桂 | Mounting seat for head radiation fan in portable computer |
| US20120057300A1 (en) * | 2010-09-07 | 2012-03-08 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation apparatus |
| CN202887087U (en) * | 2012-09-29 | 2013-04-17 | 四川奥格科技有限公司 | Semiconductor central processing unit (CPU) radiator having heat insulation protection |
| CN205353908U (en) * | 2015-11-26 | 2016-06-29 | 重庆市泓言科技工程有限公司 | Quick heat abstractor of computer CPU |
-
2015
- 2015-11-26 CN CN201510832695.4A patent/CN105468115A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040063746A1 (en) * | 2002-07-25 | 2004-04-01 | Alicia Regueiro-Ren | Indole, azaindole and related heterocyclic ureido and thioureido piperazine derivatives |
| CN1512292A (en) * | 2002-12-27 | 2004-07-14 | 庄儒桂 | Mounting seat for head radiation fan in portable computer |
| CN2615733Y (en) * | 2003-03-26 | 2004-05-12 | 晟铭电子科技股份有限公司 | Central processor radiating module |
| US20120057300A1 (en) * | 2010-09-07 | 2012-03-08 | Hon Hai Precision Industry Co., Ltd. | Heat dissipation apparatus |
| CN202887087U (en) * | 2012-09-29 | 2013-04-17 | 四川奥格科技有限公司 | Semiconductor central processing unit (CPU) radiator having heat insulation protection |
| CN205353908U (en) * | 2015-11-26 | 2016-06-29 | 重庆市泓言科技工程有限公司 | Quick heat abstractor of computer CPU |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106713151A (en) * | 2016-11-25 | 2017-05-24 | 东莞大联社电子散热材料有限公司 | Novel router heat dissipation module |
| CN111280576A (en) * | 2018-12-29 | 2020-06-16 | 深圳光启超材料技术有限公司 | Heat radiator for intelligence helmet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205353908U (en) | Quick heat abstractor of computer CPU | |
| CN105468115A (en) | Quick heat dissipation device for CPU (central processing unit) of computer | |
| CN203689288U (en) | Complete equipment cabinet and node server of complete equipment cabinet | |
| CN104571398B (en) | Servomechanism and its radiating subassembly | |
| CN203239605U (en) | Fan board with controllable rotation speed based on single four-path system | |
| CN206209478U (en) | A kind of server master board that externally can be interconnected at a high speed | |
| CN205103739U (en) | Computer hardware mounting structure with heat abstractor | |
| CN105120631A (en) | CPU cooling device with graphene thermal silicone grease cooling layer | |
| CN213302973U (en) | Novel lead cold heat dissipation type master control board for industrial control machine | |
| Wang et al. | Near threshold cloud processors for dark silicon mitigation: the impact on emerging scale-out workloads | |
| CN206162358U (en) | Novel overlay type CPU radiator | |
| CN204790682U (en) | Portable computer | |
| CN216527065U (en) | High heat dissipation memory for computer | |
| CN204595747U (en) | A kind of notebook radiator | |
| CN207601699U (en) | A kind of computer CPU heat sink | |
| CN204347739U (en) | A kind of fan for computer heat radiation | |
| CN217360730U (en) | High-performance CPU + MXM display card integrated radiator structure | |
| CN204883576U (en) | Computer radiator | |
| CN206684653U (en) | A kind of heat abstractor of central processing unit (CPU) | |
| CN203455767U (en) | Environmental-friendly and energy-saving computer host | |
| CN212032100U (en) | Tower type radiator for computer | |
| CN202904761U (en) | Host machine of cash register | |
| CN106484058A (en) | A kind of computer radiator | |
| CN201938020U (en) | Efficient U-shaped base plate sectional material heat-radiator | |
| CN216249099U (en) | Industrial personal computer for edge calculation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160406 |