CN216527049U - Computer CPU radiator - Google Patents

Computer CPU radiator Download PDF

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Publication number
CN216527049U
CN216527049U CN202122235579.8U CN202122235579U CN216527049U CN 216527049 U CN216527049 U CN 216527049U CN 202122235579 U CN202122235579 U CN 202122235579U CN 216527049 U CN216527049 U CN 216527049U
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China
Prior art keywords
heat dissipation
fin
computer cpu
heat
mounting bracket
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Active
Application number
CN202122235579.8U
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Chinese (zh)
Inventor
吴绍顺
彭博
高敏
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Qiqihar Qisan Machine Tool Co Ltd
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Qiqihar Qisan Machine Tool Co Ltd
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Priority to CN202122235579.8U priority Critical patent/CN216527049U/en
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Publication of CN216527049U publication Critical patent/CN216527049U/en
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Abstract

The utility model relates to the technical field of computer heat dissipation, and discloses a computer CPU (central processing unit) radiator which comprises an underframe, wherein the upper surface of the underframe is fixedly connected with a mounting rack through a fixing bolt, a heat dissipation sheet is fixedly mounted at the bottom of the mounting rack, a heat dissipation plate is welded at the bottom of the heat dissipation sheet, a placing groove is formed in the middle of the mounting rack, a blowing fan is arranged in the placing groove, and a liquid storage tank is formed in the mounting rack. This computer CPU radiator sets up through the fin with the cooperation of blowing the fan, will blow the fan and connect universal power source during the use, make outside air get into fin interval department to the effectual heat that absorbs on the fin is taken away, through the setting of heating panel, has played and has siphoned away the produced heat of CPU and has transmitted the effect on the fin, and the heating panel heat conductivity of copper is stronger, when using reduce cost with the cooperation of aluminium system fin, the heat-sinking capability also obtains promoting.

Description

Computer CPU radiator
Technical Field
The utility model relates to the technical field of computer heat dissipation, in particular to a computer CPU (central processing unit) heat radiator.
Background
Computers are indispensable electronic products in daily life and work, wherein a CPU is one of main devices of electronic computers and is a core accessory in the computers. The computer has the functions of mainly interpreting computer instructions and processing data in computer software, and all operations in the computer are taken charge of a core component for reading instructions, decoding the instructions and executing the instructions by a CPU. However, in hot summer months, the temperature in the atmosphere is too high, which causes the computer to heat more quickly.
At present, most of common CPU radiators on the market radiate heat by one of air cooling or water cooling, the effect of a single radiating method is obviously reduced under a hot environment, the CPU is easy to be subjected to frequency reduction and even damaged, and the service life of the CPU is influenced, so that the utility model provides the CPU radiator for the computer.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Aiming at the defects of the prior art, the utility model provides a computer CPU radiator, which solves the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the utility model is realized by the following technical scheme: the utility model provides a computer CPU radiator, includes the chassis, the upper surface of chassis passes through fixing bolt fixedly connected with mounting bracket, the bottom fixed mounting of mounting bracket has the fin, the bottom welding of fin has the heating panel, the standing groove has been seted up at the middle part of mounting bracket, the inside of standing groove is equipped with the fan of blowing, the reservoir has been seted up to the inside of mounting bracket, the inside of reservoir is equipped with miniature pump, miniature pump's inside output fixed mounting has the cooling tube.
Optionally, the outer surface of the cooling pipe is attached to the heat dissipation plate, the other end of the cooling pipe is inserted into the liquid storage tank, and sealing gaskets are sleeved at the joints of the two ends of the cooling pipe and the liquid storage tank.
Optionally, heat dissipation grooves are formed in two sides of the bottom frame, and partition plates are fixedly mounted on the inner side walls of the heat dissipation grooves.
Optionally, a dust guard is fixedly mounted on one side of the heat dissipation groove.
Optionally, the top of the placing groove is fixedly provided with a dust screen, and a fixing plate is arranged at the bottom of the valley at the edge of the dust screen.
Optionally, the clamping grooves matched with the cooling pipes are formed in two opposite side faces of the mounting frame.
(III) advantageous effects
The utility model provides a computer CPU radiator, which has the following beneficial effects:
this computer CPU radiator, cooperation through the fin and the fan of blowing sets up, the fan that will blow during the use connects universal power supply, make outside air get into fin interval department, thereby effectually take away the heat that absorbs on the fin, setting through the heating panel, the produced heat of CPU has been played and has been siphoned away the effect of transmission to the fin on, and copper heating panel heat conductivity is stronger, when using reduce cost with aluminium system fin cooperation, the heat-sinking capability also obtains promoting, through the reservoir, micro-water pump and cooling tube's cooperation sets up, with micro-water pump switch-on during the use, it drives the coolant liquid and flows inside the cooling tube to make it, can absorb the heat on the heating panel, thereby further improve the radiating effect.
Drawings
FIG. 1 is a perspective view of the structure of the present invention;
FIG. 2 is a schematic view of the split structure of the present invention;
fig. 3 is a schematic cross-sectional view of the mounting bracket of the present invention.
In the figure: 1. a chassis; 2. fixing the bolt; 3. a mounting frame; 4. a heat sink; 5. a heat dissipation plate; 6. a placement groove; 7. a blower fan; 8. a liquid storage tank; 9. a micro water pump; 10. a cooling tube; 11. a gasket; 12. A partition plate; 13. a dust-proof plate; 14. a dust screen; 15. a fixing plate; 16. a clamping groove.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a technical solution: a computer CPU radiator comprises a chassis 1, wherein the upper surface of the chassis 1 is fixedly connected with a mounting rack 3 through a fixing bolt 2, the bottom of the mounting rack 3 is fixedly provided with a radiating fin 4, the bottom of the radiating fin 4 is welded with a radiating plate 5 which is arranged through the radiating plate 5 to play a role of absorbing and transmitting heat generated by a CPU to the radiating fin 4, the copper radiating plate 5 has stronger heat conductivity, the radiating capacity is improved when the copper radiating fin is matched with an aluminum radiating fin 4 for use, the cost is relatively reduced compared with the cost of a pure copper radiator, the effect is better compared with the effect of a pure aluminum radiator, the middle part of the mounting rack 3 is provided with a placing groove 6, a blowing fan 7 is arranged inside the placing groove 6, the blowing fan 7 is connected with a universal power supply during use through the matching arrangement of the radiating fin 4 and the blowing fan 7, so that external air enters into the interval of the radiating fin 4, and the heat absorbed by the radiating fin 4 is effectively taken away, the liquid storage tank 8 is arranged in the mounting frame 3, the micro water pump 9 is arranged in the liquid storage tank 8, the cooling pipe 10 is fixedly arranged at the inner output end of the micro water pump 9, the liquid storage tank 8 is arranged in a matching manner of the micro water pump 9 and the cooling pipe 10, when the cooling device is used, the micro water pump 9 is powered on, so that cooling liquid is driven to flow in the cooling pipe 10, heat on the heat dissipation plate 5 can be absorbed, the heat dissipation effect is further improved, the outer surface of the cooling pipe 10 is attached to the heat dissipation plate 5, the other end of the cooling pipe 10 is inserted in the liquid storage tank 8, the sealing gaskets 11 are respectively sleeved at the joints of the two ends of the cooling pipe 10 and the liquid storage tank 8, the arrangement of the sealing gaskets 11 is improved, the cooling liquid is prevented from leaking, the heat dissipation grooves are formed in the two sides of the chassis 1, the partition plates 12 are fixedly arranged on the inner side walls of the heat dissipation grooves, the dust-proof plates 13 are fixedly arranged on one sides of the heat dissipation grooves, inside having avoided the dust to enter into effectively, influenced the radiating effect, the top fixed mounting of standing groove 6 has dust screen 14, and fixed plate 15 is installed at the bottom of the edge millet of dust screen 14, and draw-in groove 16 with cooling tube 10 looks adaptation is all seted up to two relative sides of mounting bracket 3.
In the utility model, the working steps of the device are as follows:
1. through the matching arrangement of the radiating fins 4 and the blowing fans 7, when in use, the blowing fans 7 are connected with a universal power supply, so that external air enters the intervals of the radiating fins 4, and the heat absorbed by the radiating fins 4 is effectively taken away;
2. the heat dissipation plate 5 is arranged to absorb heat generated by the CPU and transfer the heat to the heat dissipation plate 4, and the copper heat dissipation plate 5 has higher heat conductivity, so that the heat dissipation capability is improved while the copper heat dissipation plate 5 is matched with the aluminum heat dissipation plate 4 for use, the cost is reduced;
3. through the cooperation setting of reservoir 8, micro-water pump 9 and cooling tube 10, switch on micro-water pump 9 during the use, make it drive the coolant liquid and flow in cooling tube 10 is inside, can absorb the heat on the heating panel 5 to further improve the radiating effect.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents. In the description of the present specification, the terms "connect", "mount", "fix", "set", etc. are understood broadly, for example, the term "connect" may be a fixed connection or an indirect connection through an intermediate component without affecting the relationship and technical effects of the components, or may be an integral connection or a partial connection, and as such, for a person skilled in the art, the specific meaning of the terms in the present invention or the utility model can be understood according to specific situations, wherein the used standard components can be purchased from the market, and can be customized according to the description of the specification and the drawings, the specific connection manner of each component adopts the conventional means of bolt, rivet, welding, etc. mature in the prior art, the machines, parts and devices adopt the conventional models in the prior art, and the components known by the person skilled in the art, the structure and principle are known to the skilled person through technical manuals or through routine experimentation.

Claims (6)

1. A computer CPU radiator comprises a chassis (1), and is characterized in that: the upper surface of chassis (1) passes through fixing bolt (2) fixedly connected with mounting bracket (3), the bottom fixed mounting of mounting bracket (3) has fin (4), the bottom welding of fin (4) has heating panel (5), standing groove (6) have been seted up at the middle part of mounting bracket (3), the inside of standing groove (6) is equipped with fan (7) of blowing, reservoir (8) have been seted up to the inside of mounting bracket (3), the inside of reservoir (8) is equipped with the coolant liquid, the inside of reservoir (8) is equipped with micro-water pump (9), the inside output fixed mounting of micro-water pump (9) has cooling tube (10).
2. The computer CPU heat sink of claim 1, wherein: the outer surface of the cooling pipe (10) is attached to the heat dissipation plate (5), the other end of the cooling pipe (10) is inserted into the liquid storage tank (8), and sealing gaskets (11) are sleeved at the connection positions of the two ends of the cooling pipe (10) and the liquid storage tank (8).
3. The computer CPU heat sink of claim 1, wherein: the heat dissipation device is characterized in that heat dissipation grooves are formed in two sides of the bottom frame (1), and partition plates (12) are fixedly mounted on the inner side walls of the heat dissipation grooves.
4. The computer CPU heat sink of claim 3, wherein: and a dustproof plate (13) is fixedly arranged on one side of the heat dissipation groove.
5. The computer CPU heat sink of claim 1, wherein: the top fixed mounting of standing groove (6) has dust screen (14), fixed plate (15) are installed to the edge millet bottom of dust screen (14).
6. The computer CPU heat sink of claim 1, wherein: draw-in groove (16) with cooling tube (10) looks adaptation are all seted up to two relative sides of mounting bracket (3), the material of fin (4) is aluminium, the material of heating panel (5) is copper.
CN202122235579.8U 2021-09-15 2021-09-15 Computer CPU radiator Active CN216527049U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122235579.8U CN216527049U (en) 2021-09-15 2021-09-15 Computer CPU radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122235579.8U CN216527049U (en) 2021-09-15 2021-09-15 Computer CPU radiator

Publications (1)

Publication Number Publication Date
CN216527049U true CN216527049U (en) 2022-05-13

Family

ID=81516905

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122235579.8U Active CN216527049U (en) 2021-09-15 2021-09-15 Computer CPU radiator

Country Status (1)

Country Link
CN (1) CN216527049U (en)

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