CN216480313U - LED lamp panel comprising multilayer flat wires - Google Patents
LED lamp panel comprising multilayer flat wires Download PDFInfo
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- CN216480313U CN216480313U CN202123158204.2U CN202123158204U CN216480313U CN 216480313 U CN216480313 U CN 216480313U CN 202123158204 U CN202123158204 U CN 202123158204U CN 216480313 U CN216480313 U CN 216480313U
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Abstract
The utility model discloses a LED lamp plate including flat wire of multilayer, including the circuit board main part, the lower extreme of circuit board main part is provided with the insulating layer, the lower extreme of insulating layer is provided with flat wire layer, the lower extreme on flat wire layer is provided with the heat-conducting layer, the lower extreme of heat-conducting layer is provided with the radiating part, the through-hole has all been seted up in the upper end four corners of circuit board main part, the through-hole extends to the lower extreme of heat-conducting layer, the upper end middle part electric connection of circuit board main part has a plurality of to be the LED lamp that linear array distributes. A LED lamp plate including the flat wire of multilayer, can absorb the heat that the flat wire layer produced fast and in time give off through setting up the common cooperation of heat-conducting layer and radiating part, reduced the temperature on flat wire layer, correspondingly reduced resistance, guaranteed the luminance of LED lamp, can reflect the bright light that the LED lamp produced through setting up the reflector layer, increased luminance indirectly.
Description
Technical Field
The utility model relates to a LED lamp plate field, in particular to LED lamp plate including flat wire of multilayer.
Background
The LED lamp has the advantages of low-voltage power supply, low energy consumption, strong applicability, high stability, short response time, no pollution to the environment, multicolor luminescence and the like, and although the price is more expensive than that of the existing lighting fixture, the LED lamp is still considered to be inevitably used for replacing the existing lighting device.
The existing LED lamp panel has the following disadvantages: 1. when an existing LED lamp panel works, current is generally transmitted by means of a wire, the temperature of the wire rises along with the lapse of time, if heat is not timely exhausted, the resistance is increased, the corresponding current is reduced, and the brightness of the LED lamp is reduced; 2. when the brightness of an existing LED lamp panel needs to be improved, the power of an LED lamp is generally improved, after the power is improved, the temperature of a chip inside a corresponding LED can be rapidly improved, if an LED bulb is in a high-temperature state for a long time, the service life of the LED lamp can be shortened, and meanwhile, the electric power is increased.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a LED lamp plate including the flat wire of multilayer, can effectively solve the problem among the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a LED lamp plate including flat wire of multilayer, includes the circuit board main part, the lower extreme of circuit board main part is provided with the insulating layer, the lower extreme of insulating layer is provided with flat wire layer, the lower extreme on flat wire layer is provided with the heat-conducting layer, the lower extreme of heat-conducting layer is provided with the radiating part, the through-hole has all been seted up in the upper end four corners of circuit board main part, the through-hole extends to the lower extreme of heat-conducting layer, the upper end middle part electric connection of circuit board main part has a plurality of to be the LED lamp that linear array distributes, the upper end of circuit board main part is provided with the reflector layer.
Preferably, the heat dissipation part comprises a heat dissipation base, a plurality of heat dissipation fins distributed in a linear array are mounted at the lower end of the heat dissipation base, and nanometer black body enhanced heat dissipation coatings are coated on the outer surfaces of the heat dissipation base and the heat dissipation fins.
Preferably, the heat conducting layer comprises a heat conducting mud layer, the heat conducting mud layer is arranged at the lower end of the flat wire layer, and a heat conducting insulating sheet layer is arranged at the lower end of the heat conducting mud layer.
Preferably, the reflective layer includes a reflective thermal film layer, the reflective thermal film layer is arranged at the upper end of the circuit board main body, and the upper end of the reflective thermal film layer is coated with a nano high diffuse reflection reflective coating.
Preferably, the heat dissipation base is arranged at the lower end of the heat conduction insulating sheet layer.
Preferably, the circuit board main body is electrically connected with the flat conductor layer.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model relates to a LED lamp plate including multilayer flat wire, can absorb the heat that flat wire layer produced fast and in time distribute through setting up the common cooperation of heat-conducting layer and radiating part, in operation, flat wire layer produces higher heat, heat conduction mud layer absorbs these heats in time, heat conduction mud layer has advantages such as coefficient of heat conductivity is high and the thermal resistance is low, heat conduction mud layer transmits the heat to heat conduction insulation lamella, heat conduction insulation lamella has good coefficient of heat conductivity, low thermal resistance, heat conduction insulation lamella transmits the heat again to heat dissipation base and fin and distributes away the heat, and nanometer black body reinforcing heat dissipation coating can promote the radiance on heat dissipation base and fin surface, further strengthen the radiating efficiency, the temperature of flat wire layer is reduced, correspondingly reduced the resistance, the luminance of LED lamp has been guaranteed;
2. the utility model relates to a LED lamp plate including flat wire of multilayer, can reflect the light that the LED lamp produced through setting up the reflector layer, brightness has been increased indirectly, the hot rete of reflection of light is made by the spheroid regression reflection principle that high refractive index glass pearl formed, can be with the light that the LED lamp produced of reflection, excellent reflection of light effect has, and the high diffuse reflection of light reflection coating of nanometer has further improved the total reflectivity and the diffuse reflectance ratio of the hot rete of reflection of light, make light wide angle reflection, provide wider irradiation range and more even reflection effect, need not to increase the operating power of LED lamp, the life of LED lamp has been guaranteed, electric power has been saved.
Drawings
Fig. 1 is a schematic view of an overall structure of an LED lamp panel including a plurality of layers of flat wires according to the present invention;
fig. 2 is a schematic view of an overall structure of a heat dissipation component of an LED lamp panel including a plurality of layers of flat wires according to the present invention;
fig. 3 is a schematic view of an overall structure of a heat conduction layer of an LED lamp panel including a plurality of layers of flat wires according to the present invention;
fig. 4 is the utility model relates to a whole structure schematic diagram of the reflector layer of the LED lamp plate including the flat wire of multilayer.
In the figure: 1. a circuit board main body; 2. an LED lamp; 3. an insulating layer; 4. a flat wire layer; 5. a heat conductive layer; 6. a heat dissipating member; 7. a light-reflecting layer; 8. a through hole; 51. a heat-conducting mud layer; 52. a thermally conductive insulating sheet layer; 61. a heat dissipation base; 62. a heat sink; 63. a nano blackbody enhanced heat dissipation coating; 71. a reflective heat-sealable film layer; 72. and (3) a nano high diffuse reflection reflective coating.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1-4, an LED lamp panel including multilayer flat wires, including circuit board main body 1, the lower extreme of circuit board main body 1 is provided with insulating layer 3, the lower extreme of insulating layer 3 is provided with flat wire layer 4, the lower extreme of flat wire layer 4 is provided with heat-conducting layer 5, the lower extreme of heat-conducting layer 5 is provided with radiating part 6, through-hole 8 has all been seted up in the upper end four corners of circuit board main body 1, through-hole 8 extends to the lower extreme of heat-conducting layer 5, the upper end middle part electric connection of circuit board main body 1 has a plurality of LED lamp 2 that are linear array and distribute, the upper end of circuit board main body 1 is provided with reflector layer 7, the inside a plurality of wires that are provided with of flat wire layer 4.
The heat dissipation part 6 comprises a heat dissipation base 61, the heat dissipation fins 62 that a plurality of is linear array and distributes are installed to the lower extreme of heat dissipation base 61, the surface of heat dissipation base 61 and heat dissipation fins 62 all coats and has nanometer black body reinforcing heat dissipation coating 63, heat-conducting layer 5 includes heat conduction mud layer 51, heat conduction mud layer 51 sets up the lower extreme at flat wire layer 4, the lower extreme of heat conduction mud layer 51 is provided with heat conduction insulating lamella 52, heat-conducting layer 5 and heat dissipation part 6 cooperate jointly to be used for absorbing the heat that flat wire layer 4 produced fast and give off in time.
The reflective layer 7 includes a reflective heat-sealing film layer 71, the reflective heat-sealing film layer 71 is disposed on the upper end of the circuit board main body 1, the upper end of the reflective heat-sealing film layer 71 is coated with a nano high diffuse reflection reflective coating 72, and the reflective layer 7 is used for reflecting the light generated by the LED lamp 2, thereby indirectly increasing the brightness.
The heat dissipation base 61 is disposed at the lower end of the heat conductive insulating sheet layer 52, and the circuit board body 1 is electrically connected to the flat wire layer 4.
It should be noted that, the utility model relates to a LED lamp panel including multilayer flat wire, when using, can install circuit board main part 1 at the assigned position, screw into through-hole 8 with the screw and fix, in operation, flat wire layer 4 produces higher heat, heat conduction mud layer 51 absorbs these heats in time, heat conduction mud layer 51 has advantages such as coefficient of heat conductivity is high and thermal resistance is low, heat conduction mud layer 51 transmits heat to heat conduction insulation lamella 52, heat conduction insulation lamella 52 has good coefficient of heat conductivity, low thermal resistance, heat conduction insulation lamella 52 transmits heat to heat dissipation base 61 and fin 62 again and distributes out the heat, and nanometer black body reinforcing heat dissipation coating 63 can promote the radiance on heat dissipation base 61 and fin 62 surface, further strengthen the radiating efficiency, can reflect the light that LED lamp 2 produced through setting up reflector layer 7, indirect increase luminance brightness, the reflective heat-adhered film layer 71 is made by the sphere regression reflection principle formed by high-refractive-index glass beads, can reflect light generated by the LED lamp 2, has excellent reflective effect, and the nanometer high-diffuse-reflection reflective coating 72 further improves the total reflectivity and the diffuse reflectivity of the reflective heat-adhered film layer 71, so that the light is reflected in a wide angle, the light output rate can be improved by 20-50%, and the light distribution range is wider, more uniform and softer.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a LED lamp plate including flat wire of multilayer, includes circuit board main part (1), its characterized in that: the LED lamp circuit is characterized in that an insulating layer (3) is arranged at the lower end of the circuit board main body (1), a flat wire layer (4) is arranged at the lower end of the insulating layer (3), a heat conducting layer (5) is arranged at the lower end of the flat wire layer (4), heat radiating parts (6) are arranged at the lower end of the heat conducting layer (5), through holes (8) are formed in four corners of the upper end of the circuit board main body (1), the through holes (8) extend to the lower end of the heat conducting layer (5), a plurality of LED lamps (2) distributed in a linear array are electrically connected to the middle of the upper end of the circuit board main body (1), and a reflecting layer (7) is arranged at the upper end of the circuit board main body (1).
2. An LED lamp panel comprising multilayer flat wires according to claim 1, characterized in that: the heat dissipation part (6) comprises a heat dissipation base (61), a plurality of heat dissipation fins (62) distributed in a linear array are installed at the lower end of the heat dissipation base (61), and the outer surfaces of the heat dissipation base (61) and the heat dissipation fins (62) are coated with nano black body reinforcing heat dissipation coatings (63).
3. The LED lamp panel comprising the multilayer flat wires as claimed in claim 2, wherein: the heat conducting layer (5) comprises a heat conducting mud layer (51), the heat conducting mud layer (51) is arranged at the lower end of the flat wire layer (4), and a heat conducting insulating sheet layer (52) is arranged at the lower end of the heat conducting mud layer (51).
4. The LED lamp panel comprising the multilayer flat wires as claimed in claim 3, wherein: the reflecting layer (7) comprises a reflecting hot-film layer (71), the reflecting hot-film layer (71) is arranged at the upper end of the circuit board main body (1), and the upper end of the reflecting hot-film layer (71) is coated with a nanometer high diffuse reflection reflecting coating (72).
5. The LED lamp panel comprising the multilayer flat wires as claimed in claim 4, wherein: the heat dissipation base (61) is arranged at the lower end of the heat conduction insulating sheet layer (52).
6. The LED lamp panel comprising the multilayer flat wires as claimed in claim 5, wherein: the circuit board main body (1) is electrically connected with the flat conductor layer (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202123158204.2U CN216480313U (en) | 2021-12-15 | 2021-12-15 | LED lamp panel comprising multilayer flat wires |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202123158204.2U CN216480313U (en) | 2021-12-15 | 2021-12-15 | LED lamp panel comprising multilayer flat wires |
Publications (1)
Publication Number | Publication Date |
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CN216480313U true CN216480313U (en) | 2022-05-10 |
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Family Applications (1)
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CN202123158204.2U Active CN216480313U (en) | 2021-12-15 | 2021-12-15 | LED lamp panel comprising multilayer flat wires |
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CN (1) | CN216480313U (en) |
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2021
- 2021-12-15 CN CN202123158204.2U patent/CN216480313U/en active Active
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