CN216361455U

CN216361455U - Semiconductor refrigerating device

Info

Publication number: CN216361455U
Application number: CN202123132671.8U
Authority: CN
Inventors: 周林
Original assignee: Guangdong Fuxin Electronic Technology Co ltd
Current assignee: Guangdong Fuxin Electronic Technology Co ltd
Priority date: 2021-12-14
Filing date: 2021-12-14
Publication date: 2022-04-22
Anticipated expiration: 2031-12-14

Abstract

The utility model discloses a semiconductor refrigerating device which comprises a box body, an inner barrel, a semiconductor refrigerating device and a radiating assembly, wherein the inner barrel is positioned inside the box body; the bucket wall of interior bucket is for laminating portion and lead cold portion, and the bucket wall thickness of laminating portion is greater than the bucket wall thickness of leading cold portion, and the lateral wall of laminating portion is provided with the binding face, and semiconductor refrigeration device's cold junction face and binding face laminate each other, and semiconductor refrigeration device's hot terminal surface and radiator unit laminate each other. According to the semiconductor refrigerating device provided by the technical scheme, on the premise that the cold guide effect of the inner barrel is guaranteed, the installation difficulty of a semiconductor refrigerating device in the assembling process of the refrigerating device is reduced, and the technical problem that the cold guide effect and the installation convenience are difficultly taken into consideration in the installation of the semiconductor refrigerating device in the conventional semiconductor refrigerating device is solved.

Description

Semiconductor refrigerating device

Technical Field

The utility model relates to the field of semiconductor refrigeration equipment, in particular to a semiconductor refrigeration device.

Background

The semiconductor refrigeration technology has the characteristics of small volume, compact structure, no vibration, environmental protection, silence, accurate temperature control, convenient installation and the like. With the recognition of semiconductor refrigeration technology by more and more people, the application of semiconductor refrigeration devices in terminal products is more and more extensive, and at present, semiconductor terminal application products mainly comprise refrigerators, cold storage boxes, ice cream machines, refrigeration cups and the like.

The existing semiconductor refrigerating device is generally composed of an inner barrel, a box body, a semiconductor refrigerating device and a heat dissipation assembly; the cold end surface of the semiconductor refrigerating device is close to one surface of the inner barrel, so that cold energy can be conveniently conveyed to the inner barrel, and the temperature of the inner barrel is reduced; the hot end face of the semiconductor refrigerating device is close to the heat dissipation assembly, so that heat generated by the semiconductor refrigerating device is discharged outwards along with the heat dissipation assembly, and the constant temperature of the inner barrel is kept.

Further, with respect to the conventional semiconductor refrigeration apparatus, the mounting position of the semiconductor refrigeration device inside the apparatus is generally the following two cases:

1. directly mounting the semiconductor refrigeration device at the bottom of the inner barrel, and fixedly connecting the semiconductor refrigeration device with the heat dissipation assembly through fasteners such as screws and the like; the above arrangement causes an increase in the overall height of the semiconductor refrigeration device product, and is obviously unsuitable if a refrigeration device product with a strictly defined height needs to be produced. And when the bottom of the inner barrel is used for fastening and connecting the semiconductor refrigeration device and the heat dissipation assembly, the screw head for fixing is easily embedded into the barrel body, so that the inside of the barrel body is polluted, and the requirement of food-grade products cannot be met.

2. The semiconductor refrigerating device is directly arranged on the side surface of the inner barrel, although the whole height of the semiconductor refrigerating device product is reduced by the equipment mode, in the arrangement mode, if the inner barrel with larger wall thickness is adopted, the cold conducting effect of the inner barrel is reduced; if adopt interior bucket that the wall thickness is less, can increase semiconductor refrigeration device's the installation degree of difficulty, and when utilizing fasteners such as screw to be fixed in interior bucket for the interior bucket of fixed screwhead imbeds easily in the thin wall, can cause barrel body internal contamination equally, can not satisfy the requirement of food level product.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor refrigerating device, which reduces the installation difficulty of a semiconductor refrigerating device in the assembling process of the refrigerating device on the premise of ensuring the cold conduction effect of an inner barrel, solves the technical problem that the installation of the semiconductor refrigerating device in the conventional semiconductor refrigerating device cannot give consideration to both the cold conduction effect and the convenient installation, has simple and reasonable structure, is convenient and quick to install and overcomes the defects in the prior art.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a semiconductor refrigerating device comprises a box body, an inner barrel, a semiconductor refrigerating device and a heat dissipation assembly, wherein the inner barrel is positioned inside the box body, a first avoiding opening is formed in the side wall of the box body, and the first avoiding opening is used for avoiding the inner barrel and the semiconductor refrigerating device so as to enable the inner barrel to be tightly attached to the semiconductor refrigerating device;

the barrel wall of interior bucket divide into laminating portion and leads cold portion, just laminating portion with lead cold portion and enclose jointly the chamber that holds of interior bucket, the barrel wall thickness of laminating portion is greater than lead the barrel wall thickness of cold portion, just the lateral wall of laminating portion is provided with the binding face, semiconductor refrigeration device's cold terminal surface with the binding face laminates each other, semiconductor refrigeration device's hot junction face with radiator unit laminates each other.

Preferably, the outer side wall of the fitting part is inwards sunken to be provided with a fitting position, and the bottom surface of the fitting position is the fitting surface.

Preferably, the laminating portion includes bucket wall district and laminating district, laminating district outstanding set up in the outside in bucket wall district, just the lateral wall in laminating district is provided with the binding face.

Preferably, the heat dissipation assembly is provided with a first mounting hole, the attachment portion is provided with a second mounting hole corresponding to the first mounting hole, and a fastener sequentially penetrates through the first mounting hole and the second mounting hole to enable the semiconductor refrigeration device to be mounted between the inner barrel and the heat dissipation assembly.

Preferably, a second avoiding port is formed in the top of the box body and is used for avoiding a barrel opening of the inner barrel;

the heat preservation device is characterized by further comprising a heat preservation strip, wherein the heat preservation strip is arranged on the outer side of the barrel opening of the inner barrel in a surrounding mode, and the heat preservation strip is abutted between the box body and the inner barrel.

Preferably, the heat dissipation assembly comprises a heat dissipation block and a heat dissipation fan, and the semiconductor refrigeration device, the heat dissipation block and the heat dissipation fan are sequentially connected;

the radiating block comprises a radiating plate and radiating fins, wherein the radiating fins are provided with a plurality of blocks and arranged on the outer plate surface of the radiating plate at intervals, and the extending direction of the radiating fins faces towards the radiating fan.

Preferably, the heat dissipation assembly further comprises an installation cover, the installation cover is arranged between the heat dissipation block and the heat dissipation fan, and the installation cover is used for installing the heat dissipation fan.

Preferably, the mounting cover comprises a first support plate, a ventilation plate and a second support plate which are connected in sequence, the mounting cover is erected on the outer plate surface of the heat dissipation plate through the first support plate and the second support plate, and the first support plate, the ventilation plate and the second support plate enclose a mounting space for accommodating the heat dissipation fins; the ventilation hole has been seted up to the face of ventilating plate, the ventilation hole is used for the heat to discharge semiconductor refrigerating plant.

Preferably, the heat dissipation assembly further comprises a protective net, and the protective net is arranged outside the heat dissipation fan.

Preferably, the heat dissipation plate is provided with a first assembly hole, the side wall of the box body is provided with a second assembly hole corresponding to the first assembly hole, and a fastener sequentially penetrates through the first assembly hole and the second assembly hole to enable the heat dissipation plate to be connected with the box body.

The technical scheme provided by the embodiment of the application can have the following beneficial effects:

1. the side wall of the box body is provided with a first avoiding opening, the first avoiding opening is used for avoiding the inner barrel and the semiconductor refrigerating device, the inner barrel and the semiconductor refrigerating device are tightly attached to each other, cold energy can be directly and effectively conveyed to the inner barrel conveniently, and therefore the cold guiding effect of the inner barrel is improved.

2. Through improving internal bucket ladle body structure, make it have the thick laminating portion of bucket wall and the thinner cold portion that leads of bucket wall simultaneously, wherein, laminating portion is used for installing semiconductor refrigeration device, and laminating portion is equipped with the binding face that is used for laminating each other with semiconductor refrigeration device's cold junction face, the semiconductor refrigeration device of being convenient for is at the installation of interior bucket lateral wall. In addition, if fasteners such as screws are needed to fix the semiconductor refrigeration device in the inner barrel, the screw head can be prevented from being embedded into the inner barrel to a certain extent due to the thick barrel wall of the attaching part, so that the inside of the barrel body of the inner barrel is prevented from being polluted, and the refrigeration device meets the food-grade requirement. Because the joint part of the inner barrel is used for installing the semiconductor refrigerating device, the cold conducting part of the inner barrel can be made into a thin-wall barrel body, thereby reducing the overall thermal resistance of the inner barrel and ensuring the cold conducting effect of the inner barrel.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor refrigeration device according to the present invention.

Fig. 2 is a partial structural schematic diagram of a semiconductor refrigeration device of the utility model.

Fig. 3 is an exploded view of a semiconductor refrigeration unit of the present invention.

Fig. 4 is a schematic structural diagram of an inner barrel of a semiconductor refrigeration device according to a first embodiment of the present invention.

Fig. 5 is a schematic structural view of a second embodiment of an inner barrel in a semiconductor refrigeration device according to the present invention.

Fig. 6 is a schematic structural view of a third embodiment of an inner barrel in the semiconductor refrigeration device according to the present invention.

Wherein: the semiconductor refrigeration device comprises a box body 1, a first avoidance port 101, a second avoidance port 102, a second assembly hole 103, an inner barrel 2, a joint portion 21, a barrel wall region 211, a joint surface 2111, a joint region 212, a cold guide portion 22, a containing cavity 201, a joint position 202, a second mounting hole 203, a semiconductor refrigeration device 3, a heat dissipation assembly 4, a heat dissipation block 41, a heat dissipation plate 411, a heat dissipation fin 412, a heat dissipation fan 42, a mounting cover 43, a first supporting plate 431, a ventilation plate 432, a second supporting plate 433, a protective net 44, a first mounting hole 401, a first assembly hole 402 and a heat preservation strip 5.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and simplicity in description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.

In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The technical scheme provides a semiconductor refrigerating device which comprises a box body 1, an inner barrel 2, a semiconductor refrigerating device 3 and a heat dissipation assembly 4, wherein the inner barrel 2 is positioned inside the box body 1, a first avoiding opening 101 is formed in the side wall of the box body 1, and the first avoiding opening 101 is used for avoiding the inner barrel 2 and the semiconductor refrigerating device 3 so that the inner barrel 2 is tightly attached to the semiconductor refrigerating device 3;

the bucket wall of interior bucket 2 is laminating portion 21 and leads cold portion 22, just laminating portion 21 with lead cold portion 22 and enclose jointly interior bucket 2 hold chamber 201, the bucket wall thickness of laminating portion 21 is greater than lead cold portion 22's bucket wall thickness, just the lateral wall of laminating portion 21 is provided with binding face 2111, the cold terminal surface of semiconductor refrigeration device 3 with binding face 2111 laminates each other, the hot terminal surface of semiconductor refrigeration device 3 with radiator unit 4 laminates each other.

In order to solve the problem of mounting the semiconductor refrigeration device in the inner barrel, some manufacturers of semiconductor refrigeration devices try to mount the semiconductor refrigeration device on the side surface of the inner barrel, but if the inner barrel with larger wall thickness is adopted, the cold conduction effect of the inner barrel is reduced; if adopt interior bucket that the wall thickness is less, can increase semiconductor refrigeration device's the installation degree of difficulty, and when utilizing fasteners such as screw to be fixed in interior bucket for the interior bucket of fixed screwhead imbeds easily in the thin wall, then can cause the inside pollution of ladle body, can not satisfy the requirement of food level product.

Therefore, in order to solve the technical problem that the installation of a semiconductor refrigerating device in the conventional semiconductor refrigerating device is difficult to take the cold guide effect and the installation convenience into consideration, the technical scheme provides the semiconductor refrigerating device, the installation difficulty of the semiconductor refrigerating device in the assembling process of the refrigerating device is reduced on the premise of ensuring the cold guide effect of the inner barrel, the structure is simple and reasonable, and the installation is convenient and quick, so that the defects in the prior art are overcome.

Specifically, the semiconductor refrigeration device provided by the technical scheme comprises a box body 1, an inner barrel 2, a semiconductor refrigeration device 3 and a heat dissipation assembly 4, wherein the inner barrel 2 is positioned inside the box body 1, so that a foaming space of the refrigeration device is formed between the inner barrel 2 and the box body 1, and the heat preservation effect of the refrigeration device is convenient to ensure; the side wall of the box body 1 is provided with a first avoiding opening 101, the first avoiding opening 101 is used for avoiding the inner barrel 2 and the semiconductor refrigerating device 3, the inner barrel 2 and the semiconductor refrigerating device 3 are mutually attached, and cold energy can be directly and effectively conveyed to the inner barrel 2 conveniently, so that the cold guiding effect of the inner barrel 2 is improved.

In the technical scheme, the semiconductor refrigerating device 3 is provided with a hot end and a cold end, the semiconductor refrigerating device 52 is manufactured by using the Peltier effect, and the Peltier effect refers to the phenomenon that when direct current passes through a couple formed by two semiconductor materials, one end of the couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigerating device 3 is made of two semiconductor materials to form a hot end and a cold end, and the cold end continuously absorbs heat to realize refrigeration; the hot junction lasts exothermic, and this technical scheme makes interior bucket 2 interior microthermal storage environment of formation with the semiconductor refrigeration mode, can effectively simplify refrigerating plant's structure and compression refrigerating plant's whole volume, is convenient for realize the silence refrigeration, and safe and reliable, convenient and practical, low in manufacturing cost, application scope is wide.

More specifically, the barrel wall of the inner barrel 2 in the technical scheme is divided into the attaching portion 21 and the cold conducting portion 22, the attaching portion 21 and the cold conducting portion 22 jointly enclose the accommodating cavity 201 of the inner barrel 2, the barrel wall thickness of the attaching portion 21 is larger than that of the cold conducting portion 22, the outer side wall of the attaching portion 21 is provided with an attaching surface 2111, the cold end surface of the semiconductor refrigeration device 3 is attached to the attaching surface 2111, and the hot end surface of the semiconductor refrigeration device 3 is attached to the heat dissipation assembly 4.

This scheme is through improving interior bucket 2 ladle body structure, makes it have the thick laminating portion 21 of bucket wall and the thinner cold portion 22 of leading of bucket wall simultaneously, and wherein, laminating portion 21 is used for installing semiconductor refrigeration device 3, and laminating portion 21 is equipped with the binding face that is used for laminating each other with semiconductor refrigeration device 3's cold junction face, the semiconductor refrigeration device 3 of being convenient for in the installation of interior bucket 2 lateral wall. In addition, if fasteners such as screws are needed to fix the semiconductor refrigeration device 3 in the inner barrel 2, the thick barrel wall of the joint part 21 can prevent the screw head from being embedded into the inner barrel to a certain extent, so that the inside of the barrel body of the inner barrel 2 is prevented from being polluted, and the refrigeration device meets the requirement of food grade. Since the attaching portion 21 of the inner barrel 2 is already used for mounting the semiconductor refrigeration device 3, the cold conducting portion 22 of the inner barrel 2 can be made into a thin barrel body, thereby reducing the overall thermal resistance of the inner barrel 2 and ensuring the cold conducting effect of the inner barrel 2.

Preferably, the attaching portion 21 and the cold conducting portion 22 are integrally formed, which is beneficial to preventing the inner barrel 2 from leaking cold. It should be noted that, in the present solution, the thickness of the barrel wall of the attaching portion 21 may be equal everywhere or unequal; the barrel wall thickness of the cold conducting part 22 can be equal everywhere or unequal; the barrel wall thickness of the attaching portion 21 is greater than that of the cold conducting portion 22, which means that the barrel wall thickness at any position of the attaching portion 21 is greater than that of the cold conducting portion 22.

More specifically, the outer side wall of the attaching portion 21 is recessed inward to form an attaching position 202, and the bottom surface of the attaching position 202 is the attaching surface 2111.

In a preferred embodiment of the present invention, the outer sidewall of the fitting portion 21 is recessed inward to form a fitting position 202, as shown in fig. 4, a bottom surface of the fitting position 202 is a fitting surface 2111, and the recessed fitting position 202 provides a mounting position for the semiconductor refrigeration device 3, so as to facilitate quick mounting of the semiconductor refrigeration device 3 in the inner barrel 2.

Further, the attaching portion 21 includes a barrel wall 211 and an attaching area 212, the attaching area 212 is protrudingly disposed on an outer side of the barrel wall 211, and an outer side wall of the attaching area 212 is provided with the attaching surface 2111.

In another preferred embodiment of the present technical solution, the attaching portion 21 includes a barrel wall region 211 and an attaching region 212, the attaching region 212 is protrudingly disposed on the outer side of the barrel wall region 211, and the outer side wall of the attaching region 212 is provided with an attaching surface 2111, as shown in fig. 5 and 6, the disposition of the attaching region 212 provides the attaching surface 2111 for the installation of the semiconductor refrigeration device 3, thereby facilitating the direct transmission of the cold generated by the semiconductor refrigeration device 3 to the inner barrel 2.

In actual production, the barrel wall region 211 and the fitting region 212 can be integrally formed, so that the heat preservation effect of the inner barrel 2 is ensured; a structural member having an abutment surface 2111 may also be mounted on the existing barrel structure to form the abutment region 212 of the inner barrel 2, thereby facilitating the production and assembly of the inner barrel 2. In this embodiment, the bonding region 212 in the inner barrel 2 may be a structural member having a cooling effect, such as a metal block.

Preferably, the semiconductor refrigeration device of the present embodiment further includes a processor (not shown in the drawings) and a temperature controller (not shown in the drawings), wherein the temperature controller is embedded in the protruding bonding region 212; the processor is respectively and electrically connected with the semiconductor refrigerating device 3 and the temperature controller; the temperature controller is used for collecting the temperature change condition of the inner barrel 2 in real time and transmitting the collected temperature information to the processor, and the processor is used for controlling the on-off and/or power and other related parameters of the semiconductor refrigerating device according to the temperature information transmitted by the temperature controller, thereby being beneficial to improving the automation degree of the semiconductor refrigerating device.

More specifically, the heat dissipating module 4 is provided with a first mounting hole 401, the attaching portion 21 is provided with a second mounting hole 203 corresponding to the first mounting hole 401, and a fastener sequentially passes through the first mounting hole 401 and the second mounting hole 203, so that the semiconductor refrigeration device 3 is mounted between the inner tub 2 and the heat dissipating module 4.

In an embodiment of the present disclosure, the heat sink 4 has a first mounting hole 401, the attaching portion 21 has a second mounting hole 203 corresponding to the first mounting hole 401, and a fastening member (not shown) sequentially passes through the first mounting hole 401 and the second mounting hole 203, so that the semiconductor refrigeration device 3 is mounted between the inner barrel 2 and the heat sink 4. In addition, because the second mounting hole 203 in this scheme is seted up in the thick laminating portion 21 of bucket wall, consequently, can avoid the screwhead to imbed to interior bucket to a certain extent, prevent that the inside of interior bucket 2 ladle body from causing the pollution, make refrigerating plant not conform to and satisfy the requirement of food level.

It should be noted that the fastening member may be a screw, a bolt, or other structural members for fixing and installing.

Further, a second avoidance port 102 is formed at the top of the box body 1, and the second avoidance port 102 is used for avoiding a bung hole of the inner tub 2;

the heat preservation device is characterized by further comprising a heat preservation strip 5, wherein the heat preservation strip 5 is arranged on the outer side of the barrel opening of the inner barrel 2 in a surrounding mode, and the heat preservation strip 5 is abutted between the box body 1 and the inner barrel 2.

Further, a second avoidance port 102 is formed in the top of the box body 1, and the second avoidance port 102 is used for avoiding a barrel opening of the inner barrel 2, so that normal implementation of taking and placing of the refrigerating device articles is guaranteed; specifically, the semiconductor refrigerating device further comprises a heat preservation strip 5, the heat preservation strip 5 is arranged on the outer side of the barrel opening of the inner barrel 2 in a surrounding mode, the heat preservation strip 5 is abutted between the box body 1 and the inner barrel 2, and the arrangement of the heat preservation strip 5 is beneficial to preventing cold energy from flowing away from a gap between the barrel opening of the inner barrel 2 and the second avoiding opening 102, so that the heat preservation effect of the refrigerating device is ensured.

Furthermore, the semiconductor refrigeration device in the present embodiment further includes a cover (not shown) installed on the top of the box body 1, and the cover is used to open and close the second avoiding opening 102, so that the dissipation of cold energy can be reduced by closing the cover, and the temperature of the inner barrel 2 can be kept constant.

It should be noted that, the heat insulating strip 5 in the present technical solution may be a material piece with a heat insulating effect, such as a sponge strip.

Further, the heat dissipation assembly 4 includes a heat dissipation block 41 and a heat dissipation fan 42, and the semiconductor refrigeration device 3, the heat dissipation block 41 and the heat dissipation fan 42 are connected in sequence;

the heat dissipation block 41 includes a heat dissipation plate 411 and heat dissipation fins 412, the heat dissipation fins 412 are provided with a plurality of blocks, the heat dissipation fins 412 are arranged on the outer plate surface of the heat dissipation plate 411 at intervals, and the extension direction of the heat dissipation fins 412 faces the heat dissipation fan 42.

The heat dissipation assembly 4 in the present technical solution includes a heat dissipation block 41 and a heat dissipation fan 42, and the semiconductor refrigeration device 3, the heat dissipation block 41 and the heat dissipation fan 42 are connected in sequence; the heat dissipation fan 42 is beneficial to accelerating the gas flow, thereby improving the heat dissipation effect of the semiconductor refrigeration device.

Specifically, the heat dissipation block 41 includes a heat dissipation plate 411 and heat dissipation fins 412, the heat dissipation fins 412 are multiple, the multiple heat dissipation fins 412 are arranged on the outer plate surface of the heat dissipation plate 411 at intervals, the extending direction of the heat dissipation fins 412 faces the heat dissipation fan 42, and through flow channels are formed among the multiple heat dissipation fins 412 to guide air, which is beneficial to further improving the heat dissipation effect of the semiconductor refrigeration device.

More specifically, the heat dissipation assembly 4 further includes a mounting cover 43, the mounting cover 43 is disposed between the heat dissipation block 41 and the heat dissipation fan 42, and the mounting cover 43 is used for mounting the heat dissipation fan 42.

Further, the heat dissipation assembly 4 further includes an installation cover 43 for installing the heat dissipation fan 42, and the installation cover 43 is disposed between the heat dissipation block 41 and the heat dissipation fan 42, so as to conveniently dissipate heat generated by the semiconductor refrigeration device 3 in time, and further facilitate improvement of the structural compactness of the semiconductor refrigeration device.

More specifically, the mounting cover 43 includes a first support plate 431, a ventilation plate 432 and a second support plate 433 which are connected in sequence, the mounting cover 43 is erected on the outer plate surface of the heat dissipation plate 411 through the first support plate 431 and the second support plate 433, and the first support plate 431, the ventilation plate 432 and the second support plate 433 enclose a mounting space for accommodating the heat dissipation fins 412; the ventilation hole is opened to ventilation board 432's face, the ventilation hole is used for the heat to discharge semiconductor refrigerating plant.

Furthermore, the mounting cover 43 includes a first support plate 431, a ventilation plate 432 and a second support plate 433 which are connected in sequence, the mounting cover 43 is erected on the outer plate surface of the heat dissipation plate 411 through the first support plate 431 and the second support plate 433, and the first support plate 431, the ventilation plate 432 and the second support plate 433 enclose a mounting space for accommodating the heat dissipation fins 412, the first support plate 431 and the second support plate 433 support the mounting space for the arrangement and mounting of the heat dissipation fins 412, the structure is simple, the performance is reliable, and the stable mounting of the heat dissipation fan 42 is facilitated; the ventilation hole is opened to ventilation board 432's face, and the ventilation hole is used for heat discharge semiconductor refrigerating plant, the thermal normal circulation of being convenient for.

More specifically, the heat dissipation assembly 4 further includes a protection net 44, and the protection net 44 is covered outside the heat dissipation fan 42.

In an embodiment of the present disclosure, the heat dissipation assembly 4 further includes a protection net 44, and the protection net 44 is covered outside the heat dissipation fan 42 to protect the heat dissipation fan 42, so as to ensure the normal operation of the heat dissipation fan 42.

More specifically, the heat dissipation plate 411 is formed with a first assembly hole 402, the sidewall of the case 1 is formed with a second assembly hole 103 corresponding to the first assembly hole 402, and a fastener sequentially passes through the first assembly hole 402 and the second assembly hole 103 to connect the heat dissipation plate 411 to the case 1.

In a preferred embodiment of the present invention, the heat dissipating plate 411 has a first assembling hole 402, the sidewall of the box 1 has a second assembling hole 103 corresponding to the first assembling hole 402, and a fastening member (not shown) sequentially passes through the first assembling hole 402 and the second assembling hole 103, so that the heat dissipating plate 411 is connected to the box 1, which is simple in structure and stable in installation, and ensures stable installation of the heat dissipating assembly 4 and the box 1. In addition, because the second assembling hole 103 is located on the side wall of the box body 1, the secondary opening of the side wall of the inner barrel 2 is avoided, the heat preservation effect of the inner barrel 2 is ensured to a certain extent, and the inner barrel 2 is further prevented from being polluted.

The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the utility model and should not be construed in any way as limiting the scope of the utility model. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.

Claims

1. A semiconductor refrigeration device, characterized by: the refrigerator comprises a box body, an inner barrel, a semiconductor refrigerating device and a heat dissipation assembly, wherein the inner barrel is positioned inside the box body, a first avoidance port is formed in the side wall of the box body, and the first avoidance port is used for avoiding the inner barrel and the semiconductor refrigerating device so as to enable the inner barrel to be tightly attached to the semiconductor refrigerating device;

2. A semiconductor refrigeration unit as recited in claim 1, further comprising: the lateral wall of laminating portion is inwards sunken to be provided with the laminating position, the bottom surface of laminating position is the binding face.

3. A semiconductor refrigeration unit as recited in claim 2, wherein: the laminating portion includes barrel wall district and laminating district, laminating district outstanding set up in the outside in barrel wall district, just the lateral wall in laminating district is provided with the binding face.

4. A semiconductor refrigeration unit as recited in claim 1, further comprising: the heat dissipation assembly is provided with a first mounting hole, the attaching portion is provided with a second mounting hole corresponding to the first mounting hole, and a fastener sequentially penetrates through the first mounting hole and the second mounting hole to enable the semiconductor refrigeration device to be mounted between the inner barrel and the heat dissipation assembly.

5. A semiconductor refrigeration unit as recited in claim 1, further comprising: a second avoidance port is formed in the top of the box body and used for avoiding a barrel opening of the inner barrel;

6. A semiconductor refrigeration unit as recited in claim 1, further comprising: the heat dissipation assembly comprises a heat dissipation block and a heat dissipation fan, and the semiconductor refrigeration device, the heat dissipation block and the heat dissipation fan are sequentially connected;

7. A semiconductor refrigeration unit as recited in claim 6, further comprising: the heat dissipation assembly further comprises an installation cover, the installation cover is arranged between the heat dissipation block and the heat dissipation fan, and the installation cover is used for installing the heat dissipation fan.

8. A semiconductor refrigeration unit according to claim 7, wherein: the mounting cover comprises a first supporting plate, a ventilating plate and a second supporting plate which are sequentially connected, the mounting cover is erected on the outer plate surface of the radiating plate through the first supporting plate and the second supporting plate, and the first supporting plate, the ventilating plate and the second supporting plate enclose a mounting space for accommodating the radiating fins; the ventilation hole has been seted up to the face of ventilating plate, the ventilation hole is used for the heat to discharge semiconductor refrigerating plant.

9. A semiconductor refrigeration unit as recited in claim 6, further comprising: the heat radiation assembly further comprises a protective net, and the protective net is arranged outside the heat radiation fan.

10. A semiconductor refrigeration unit as recited in claim 6, further comprising: first pilot hole has been seted up to the heating panel, the lateral wall of box seted up with the second pilot hole that first pilot hole corresponds, the fastener passes in proper order first pilot hole with the second pilot hole makes the heating panel with the box links to each other.