CN214314124U - Air cooler based on semiconductor refrigeration - Google Patents
Air cooler based on semiconductor refrigeration Download PDFInfo
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- CN214314124U CN214314124U CN202022471377.9U CN202022471377U CN214314124U CN 214314124 U CN214314124 U CN 214314124U CN 202022471377 U CN202022471377 U CN 202022471377U CN 214314124 U CN214314124 U CN 214314124U
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Abstract
The utility model relates to a semiconductor refrigeration technology field, concretely relates to air-cooler based on semiconductor refrigeration, the air-cooler includes: the cooling system comprises a hot end outer cover, a cold end outer cover, a hot end cooling fan, a hot end cooling block, a cold end cold guide fan, a power control switch and a cold guide refrigeration structure. The utility model discloses an air-cooler utilizes the difference in temperature transmission that the semiconductor refrigeration piece produced to the cooling piece, then carries cold wind through the cold junction fan to the switch board inside, carries out the convection current with the inside air of switch board, realizes the cooling effect to switch board electronic components, improves the life of switch board, and it has simple structure compactness, and the mounting means is convenient, can replace axial fan and directly install on the switch board cabinet body; the refrigeration effect is excellent, no refrigerant is required to be added, and the environment is protected and reliable; simple operation, high operation reliability and long service life.
Description
Technical Field
The utility model relates to a semiconductor refrigeration technology field, concretely relates to air-cooler based on semiconductor refrigeration.
Background
At present, although the increase of electrical equipment's use, and also increase with the supporting switch board quantity that uses of electrical equipment, the switch board is at the during operation, and inside electronic components can produce a large amount of heats, if untimely cooling can bring the potential safety hazard, the long-term life that also can reduce the switch board of operation under high temperature, at present though some cooling equipment, its installation is inconvenient, need regularly add refrigerant and special messenger to maintain, has not friendly to the environment, the operational reliability is low, and life is short.
Disclosure of Invention
The utility model discloses an air-cooler based on semiconductor refrigeration to solve any problem in the above-mentioned and other potential problems of prior art.
In order to solve the technical problem, the technical scheme of the utility model is that: an air-cooler based on semiconductor refrigeration, the air-cooler includes: the cooling system comprises a hot end outer cover, a cold end outer cover, a hot end cooling fan, a hot end cooling block, a cold end cold guide fan, a power control switch and a cold guide refrigeration structure;
wherein one end of the hot end outer cover is fixedly connected with one end of the cold end outer cover, the hot end radiating block and the cold end cooling block are respectively arranged in the hot end outer cover and the cold end outer cover,
the hot end heat radiation fan is arranged on the end face of the other end of the hot end outer cover, and the cold end cold guide fan is arranged on the end face of the other end of the cold end outer cover;
the cold guide refrigeration structure is arranged between the hot end radiating block and the cold end cooling block, and is in close contact with the end faces of the hot end radiating block and the cold end cooling block;
and the power supply control switch is respectively in control connection with the hot-end heat radiation fan, the cold-end cold guide fan and the cold guide refrigeration structure.
Furthermore, the air cooler also comprises a heat insulation block, the heat insulation block is arranged between the hot end heat dissipation block and the cold end cooling block, and a plurality of rectangular through holes for installing the cold guide refrigeration structure are formed in the heat insulation block.
Further, the heat insulation block is heat insulation cotton.
Furthermore, the radiating block is of a radiating fin structure, and a gap not smaller than 13mm is arranged between the fin structure and the inner wall of the hot end outer cover and serves as a radiating air duct.
Further, the cold junction cooling block is the cooling fin structure, just the fin structure with be equipped with between the cold junction dustcoat inner wall and be not less than 6mm space, as the wind channel of convection current.
Further, the radiating fin structure is made of aluminum or copper.
Further, the cold-end fin structure is made of aluminum or copper.
Further, the cold guide refrigeration structure comprises a cold guide block and a semiconductor refrigeration piece;
one end face of the cold guide block is tightly attached to one end face of the hot-end radiating block, the other end face of the cold guide block is tightly attached to one end face of the semiconductor refrigerating piece, the other end face of the semiconductor refrigerating piece is tightly attached to one end face of the cold-end cooling block, and the semiconductor refrigerating piece is in control connection with the power control switch.
Further, the cold guide block is an aluminum block or a copper block.
Furthermore, the end faces, closely attached to each other, of the hot-end heat dissipation block, the cold guide block, the semiconductor refrigeration sheet and the cold-end cooling block are coated with silica gel.
The utility model has the advantages that: by adopting the technical scheme, the air cooler of the utility model utilizes the temperature difference generated by the semiconductor refrigeration sheet to transfer to the cooling block, then conveys cold air to the inside of the power distribution cabinet through the cold end fan, and carries out convection with the air in the power distribution cabinet, thereby realizing the cooling effect on electronic components of the power distribution cabinet, improving the service life of the power distribution cabinet, having simple and compact structure and convenient installation mode, and being capable of replacing an axial flow fan to be directly installed on the cabinet body of the power distribution cabinet; the refrigeration effect is excellent, no refrigerant is required to be added, and the environment is protected and reliable; simple operation, high operation reliability and long service life.
Drawings
Fig. 1 is the utility model relates to a structural schematic of air-cooler based on semiconductor refrigeration.
Fig. 2 is the utility model relates to a lead cold refrigeration structure's based on semiconductor refrigeration structure's schematic structure diagram.
Fig. 3 is a structural diagram of the heat insulation cotton of the present invention.
Fig. 4 is a structural diagram of the hot end outer cover of the present invention.
In the figure:
the cooling system comprises a hot end cooling fan 1, a hot end outer cover 2, a hot end cooling block 3, heat insulation cotton 4, a cold end cooling block 5, a cold end outer cover 6, a cold end cold guide fan 7, a power supply control switch 8, a cold guide block 9, a semiconductor refrigeration piece 10, an air outlet 11 and a rectangular through hole 12.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings.
As shown in fig. 1, the utility model relates to an air-cooler based on semiconductor refrigeration, the air-cooler includes: the device comprises a hot end outer cover 2, a cold end outer cover 6, a hot end heat radiation fan 1, a hot end heat radiation block 3, a cold end cooling block 5, a cold end cold guide fan 7, a power control switch 8 and a cold guide refrigeration structure;
wherein, one end of the hot end outer cover 2 is fixedly connected with one end of the cold end outer cover 6, the hot end radiating block 3 and the cold end cooling block 5 are respectively arranged inside the hot end outer cover 2 and the cold end outer cover 6,
the hot end heat radiation fan 1 is arranged on the end face of the other end of the hot end outer cover 2, and the cold end cold guide fan 7 is arranged on the end face of the other end of the cold end outer cover 6;
the cold guide refrigeration structure is arranged between the hot end heat dissipation block 3 and the cold end cooling block 5, and is in close contact with the end faces of the hot end heat dissipation block 3 and the cold end cooling block 5;
and the power supply control switch 8 is respectively in control connection with the hot-end heat radiation fan 1, the cold-end cold guide fan 7 and the semiconductor refrigeration sheet 10.
Further, the air cooler still includes heat insulating block 4, heat insulating block 4 sets up between hot junction radiating block 3 and the cold junction cooling block 5, just be equipped with a plurality of rectangle through-holes 12 that are used for installing on heat insulating block 4 lead cold mass and semiconductor refrigeration piece.
Further, the heat insulation block 4 is heat insulation cotton.
Further, the radiating block 3 is a radiating fin structure, and a gap not smaller than 13mm is arranged between the fin structure and the inner wall of the hot end outer cover 2 and serves as a radiating air duct.
Further, cold junction cooling block 5 is the cooling fin structure, just the fin structure with be equipped with between 6 inner walls of cold junction dustcoat and be not less than 6mm gaps, as the wind channel of convection current.
Further, the radiating fin structure is made of aluminum or copper.
Further, the cold-end fin structure is made of aluminum or copper.
Further, the cold guide refrigeration structure comprises a cold guide block 9 and a semiconductor refrigeration piece 10;
one end face of the cold guide block 9 is tightly attached to one end face of the hot-end radiating block 3, the other end face of the cold guide block 9 is tightly attached to one end face of the semiconductor chilling plate 10, and the other end face of the semiconductor chilling plate 10 is tightly attached to one end face of the cold-end cooling block 5.
The cold guide block 9 is an aluminum block or a copper block.
And silica gel is coated on the tightly attached end faces of the hot end radiating block 3, the cold guide block 9, the semiconductor refrigerating sheet 10 and the cold end cooling block 5.
Example (b):
the utility model relates to an air-cooler based on semiconductor refrigeration, the air-cooler includes hot junction radiator fan 1, hot junction dustcoat 2, hot junction radiating block 3, heat insulating block 4, cold junction cooling block 5, 6 cold junction dustcoat, cold junction cold-conducting fan 7, power control switch 8, cold-conducting block 9, semiconductor refrigeration piece 10;
wherein, the hot end outer cover 2 is provided with a hot end heat radiation fan mounting hole and a power supply control switch mounting hole, and the hot end heat radiation fan 1 and the power supply control switch 8 are fixed on the hot end outer cover by adopting threaded connection. The hot end radiating block 3, the hot end of the semiconductor refrigerating piece 10, the cold guide block 9 and the cooling block 5 are placed in a mode of being sequentially attached, the air outlet 11 of the hot end radiating fan 1 is attached to the surface of the hot end outer cover 2, and the air suction opening of the cold end cold guide fan 7 is attached to the surface of the cold end outer cover 6. When the utility model discloses the device passes through DC power supply, P-N in the semiconductor refrigeration piece knot forms the thermocouple pair, produces the peltier effect, forms the hot junction and the cold junction of semiconductor refrigeration piece 10. Make the hot junction of semiconductor refrigeration piece 10 constantly carry out the heat exchange heat dissipation and keep certain temperature with the outside air through hot junction radiating block 3 and hot junction radiator fan 1, transmit the cold volume that the cold junction of semiconductor refrigeration piece 10 produced in cold junction cooling block 5 through leading cold block 9, cold air transmission around the cold junction cooling block is internal to carry out the convection current with the air with the switch board cabinet to cold junction cold fan inlet scoop.
Referring to fig. 3, the heat insulation block 4 is provided with eight square through holes 12 for placing the cooling block and the semiconductor refrigeration piece, and the semiconductor refrigeration piece 10 and the cold conduction piece 9 are uniformly distributed according to the reserved installation size of the cabinet body of the power distribution cabinet.
Referring to fig. 4, a hot-end heat dissipation fan 1 mounting hole and a power control switch 8 mounting hole are formed in the hot-end outer cover 2, and the hot-end heat dissipation fan 1 and the power control switch 8 are fixed to the hot-end outer cover 2 by adopting threaded connection. Six mounting holes matched with the power distribution cabinet body are formed in the turned-over edge of the hot end outer cover 2, and the air cooler device is fixed with the power distribution cabinet body through bolts between the six mounting holes.
The hot end radiating block 3 is of a fin structure, the distance between the radiating block and the inner wall of the hot end outer cover is 13mm, and a reasonable air channel is formed when the hot end radiating fan air outlet 11 radiates the heat, so that the radiating effect is improved.
Cold junction cooling block 5 is the fin structure, and cold junction cooling block is 6mm apart from hot junction cold junction dustcoat inner wall distance, and the cold fan inlet scoop of being convenient for cold junction is led and is absorbed cold air.
The air outlet of the hot end heat dissipation fan is attached to the surface of the hot end outer cover, and the hot end heat dissipation block is cooled through blowing of the hot end heat dissipation fan.
Cold fan inlet scoop and cold junction dustcoat surface laminating are led to the cold junction, and cold fan inlet scoop is led to the cold junction and is transmitted the cold air around the cold junction cooling block to the switch board cabinet internal with the air convection current.
The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the invention, but all modifications and changes made by the contents of the present invention or directly used in other fields without departing from the spirit and scope of the present invention are encompassed in the claims of the present invention.
Claims (10)
1. The utility model provides an air-cooler based on semiconductor refrigeration, its characterized in that, the air-cooler includes: the cooling system comprises a hot end outer cover, a cold end outer cover, a hot end cooling fan, a hot end cooling block, a cold end cold guide fan, a power control switch and a cold guide refrigeration structure;
wherein one end of the hot end outer cover is fixedly connected with one end of the cold end outer cover, the hot end radiating block and the cold end cooling block are respectively arranged in the hot end outer cover and the cold end outer cover,
the hot end heat radiation fan is arranged on the end face of the other end of the hot end outer cover, and the cold end cold guide fan is arranged on the end face of the other end of the cold end outer cover;
the cold guide refrigeration structure is arranged between the hot end radiating block and the cold end cooling block, and is in close contact with the end faces of the hot end radiating block and the cold end cooling block;
and the power supply control switch is respectively in control connection with the hot-end heat radiation fan, the cold-end cold guide fan and the cold guide refrigeration structure.
2. The air cooler based on semiconductor refrigeration of claim 1, further comprising a heat insulation block, wherein the heat insulation block is arranged between the hot end heat dissipation block and the cold end cooling block, and a plurality of rectangular through holes for mounting the cold guide refrigeration structure are formed in the heat insulation block.
3. The semiconductor refrigeration based air cooler of claim 2, wherein the heat insulating block is heat insulating cotton.
4. The air cooler based on semiconductor refrigeration as claimed in claim 1, wherein the heat dissipation block is a heat dissipation fin structure, and a gap not smaller than 13mm is provided between the fin structure and the inner wall of the hot end outer cover as a heat dissipation air duct.
5. The air cooler based on semiconductor refrigeration as claimed in claim 1, wherein the cooling block at the cold end is of a cooling fin structure, and a gap not smaller than 6mm is provided between the fin structure and the inner wall of the outer cover at the cold end as a convection air duct.
6. The air cooler based on semiconductor refrigeration of claim 4, characterized in that the heat dissipation fin structure is made of aluminum or copper.
7. The semiconductor refrigeration based air cooler of claim 5, wherein the cold side fin structure is made of aluminum or copper.
8. The semiconductor refrigeration based air cooler according to claim 1, wherein the cold conduction refrigeration structure comprises a cold conduction block and a semiconductor refrigeration sheet;
one end face of the cold guide block is tightly attached to one end face of the hot-end radiating block, the other end face of the cold guide block is tightly attached to one end face of the semiconductor refrigerating piece, the other end face of the semiconductor refrigerating piece is tightly attached to one end face of the cold-end cooling block, and the semiconductor refrigerating piece is in control connection with the power control switch.
9. The semiconductor refrigeration based air cooler according to claim 8, wherein the cold-conducting block is an aluminum block or a copper block.
10. The semiconductor refrigeration-based air cooler according to claim 8, wherein each of the closely attached end faces of the hot-end heat-dissipating block, the cold-conducting block, the semiconductor refrigeration sheet and the cold-end cooling block is coated with silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022471377.9U CN214314124U (en) | 2020-10-30 | 2020-10-30 | Air cooler based on semiconductor refrigeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022471377.9U CN214314124U (en) | 2020-10-30 | 2020-10-30 | Air cooler based on semiconductor refrigeration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214314124U true CN214314124U (en) | 2021-09-28 |
Family
ID=77840355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022471377.9U Active CN214314124U (en) | 2020-10-30 | 2020-10-30 | Air cooler based on semiconductor refrigeration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214314124U (en) |
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2020
- 2020-10-30 CN CN202022471377.9U patent/CN214314124U/en active Active
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