CN216353717U

CN216353717U - Planar magnetic element and power module

Info

Publication number: CN216353717U
Application number: CN202121505181.5U
Authority: CN
Inventors: 高强; 张希俊; 姚军
Original assignee: Huawei Digital Power Technologies Co Ltd
Current assignee: Huawei Digital Power Technologies Co Ltd
Priority date: 2021-07-02
Filing date: 2021-07-02
Publication date: 2022-04-19
Anticipated expiration: 2031-07-02

Abstract

The application provides a planar magnetic element and a power supply module comprising the planar magnetic element. The planar magnetic element includes a first magnetic core, a second magnetic core, a magnetic post, a circuit board, and a support structure. The first magnetic core and the second magnetic core are arranged on two sides of the circuit board in a split mode, and the circuit board comprises a first plane close to the first magnetic core and a second plane close to the second magnetic core. The circuit board further comprises a through hole communicated between the first plane and the second plane. The magnetic column penetrates through the through hole and is respectively abutted against the first magnetic core and the second magnetic core. The supporting structure is located between the first magnetic core and the first plane, and the supporting structure is respectively abutted to the first magnetic core and the first plane, so that a first gap is formed between the first magnetic core and the first plane, and a second gap is formed between the second magnetic core and the second plane. The first gap and the second gap of the planar magnetic element increase the heat dissipation area, so that the thermal cascade effect is reduced, and the working reliability of the planar magnetic element can be improved.

Description

Planar magnetic element and power module

Technical Field

The present application relates to the field of electronic devices, and more particularly, to a planar magnetic element and a power module including the same.

Background

The planar magnetic technology has the advantages of small volume and light weight, and can remarkably improve the power density of the magnetic element, so that the planar magnetic technology is more and more widely applied to power modules. The magnetic core of the planar magnetic element is stacked with the circuit board, and the area of the outer surface of the magnetic core for heat dissipation is relatively small, so that the heat dissipation capability of the planar magnetic element is limited. Therefore, the planar magnetic element is easy to generate a thermal cascade phenomenon, and the normal work of the power supply module is influenced.

SUMMERY OF THE UTILITY MODEL

The application provides a planar magnetic element and a power module. The heat dissipation area of the planar magnetic element can be increased while the planar magnetic element is miniaturized. The application specifically comprises the following technical scheme:

in a first aspect, the present application provides a planar magnetic component comprising a first magnetic core, a second magnetic core, a magnetic pillar, a circuit board, and a support structure; the first magnetic core and the second magnetic core are arranged on two opposite sides of the circuit board, and the circuit board comprises a first plane close to the first magnetic core and a second plane close to the second magnetic core; the circuit board further comprises a through hole, the through hole is communicated between the first plane and the second plane, the magnetic column penetrates through the through hole, and the magnetic column is respectively abutted against the first magnetic core and the second magnetic core; the supporting structure is located between the first magnetic core and the first plane, and the supporting structure is respectively abutted to the first magnetic core and the first plane, so that a first gap is formed between the first magnetic core and the first plane, and a second gap is formed between the second magnetic core and the second plane.

This application plane magnetic element supports respectively through the magnetic column that passes the circuit board and holds first magnetic core and second magnetic core, has guaranteed the relative distance between first magnetic core and the second magnetic core. The height of the first gap, and thus indirectly to the second gap, is then controlled by the support structures abutting the first magnetic core and the first plane, respectively. And the formation of the first gap and the second gap also increases the heat dissipation area of the planar magnetic element and reduces the thermal cascade effect of the planar magnetic element. The working reliability of the plane magnetic element is correspondingly improved.

In one possible implementation, the first gap includes a first air duct, the first air duct penetrates between the first magnetic core and the first plane along a first direction, and the first direction is parallel to the first plane; the second gap comprises a second air passage, and the second air passage also penetrates between the second magnetic core and the second plane along the first direction.

In this implementation manner, when the first air duct penetrates through the space between the first magnetic core and the first plane along the first direction, the cooling air in the first gap can realize convection along the first direction, so as to ensure the heat dissipation effect at the position of the first gap; when the second ventilation channel penetrates through the second magnetic core and the second plane along the first direction, the convection of cooling air in the second gap can be ensured, and the heat dissipation effect of the second gap position is ensured.

In a possible implementation manner, the first gap includes at least two first ventilation channels, and in a second direction perpendicular to the first direction, at least one first ventilation channel is respectively arranged on two sides of the magnetic column; the second gap comprises at least two second air channels, and in the second direction, at least one second air channel is respectively arranged on two sides of the magnetic column.

In this implementation, because the magnetic pillar is connected between the first magnetic core and the second magnetic core, the magnetic pillar may obstruct the circulation of the cooling air. And all set up first ventiduct and second ventiduct in the relative both sides position of magnetism post, can make the respective radiating effect of first clearance and second clearance more balanced, avoid appearing the phenomenon that local temperature is too high.

In one possible implementation, the size of the first gap is greater than or equal to 1 mm; the second gap is also greater than or equal to 1mm in size.

In this implementation, the size of the first gap is set, i.e. the minimum distance of the first magnetic core to the first plane is controlled. This minimum distance ensures the cooperation between the first magnetic core and the circuit board, the magnetic pole, and at the same time provides sufficient space for the cooling air to flow. And the second gap is dimensioned to also ensure a minimum distance of the second magnetic core to the second plane.

In one possible implementation, the magnetic pillar and the first magnetic core are in an integrally formed structure.

In one possible implementation, the support structure is integrally formed with the first magnetic core.

In one possible embodiment, the support structure is designed as a spacer, which is bonded to the first magnetic core and to the first plane, respectively.

In a possible implementation manner, the circuit board includes two through holes, the two through holes are arranged at intervals, the number of the corresponding magnetic columns is also two, and the two magnetic columns are respectively abutted against the first magnetic core and the second magnetic core.

In this embodiment, the two magnetic columns are disposed at an interval, and a circulation path may be formed between the first magnetic core and the second magnetic core.

In one possible implementation, the two magnetic columns are arranged at intervals along the first direction.

In a possible implementation manner, the circuit board is further provided with a winding, and the winding surrounds the periphery of the through hole.

In this implementation, the winding surrounds the periphery of the through hole, that is, the winding surrounds the periphery of the magnetic pillar. The magnetic columns can increase the magnetic flux in the winding, and further increase the inductance of the planar magnetic element.

In a second aspect, the present application provides a power module comprising an air supply unit and at least one planar magnetic element provided in the first aspect of the present application. The air supply unit is used for supplying air towards the first gap and the second gap simultaneously so as to dissipate heat of the planar magnetic element. It can be understood that, in the power module provided in the second aspect of the present application, because the planar magnetic element provided in the first aspect of the present application is used, the heat dissipation effect is improved, and thus the operational reliability is improved.

Drawings

Fig. 1 is a schematic structural diagram of a power module provided in the present application;

FIG. 2 is a schematic structural diagram of a planar magnetic element in a power module provided herein;

FIG. 3 is an exploded side view of a planar magnetic element in a power module provided herein;

FIG. 4 is an exploded view of a planar magnetic element of a power module according to the present disclosure;

FIG. 5 is a side partial schematic view of a planar magnetic element in a power module provided herein;

fig. 6 is a schematic view of a cooling air path of a power module provided in the present application;

fig. 7 is a schematic view of a cooling air path of a power module in the prior art;

FIG. 8 is a schematic plan view of a first core of a planar magnetic component provided herein;

fig. 9 is a schematic structural diagram of a circuit board in a planar magnetic component provided in the present application;

FIG. 10 is an equivalent circuit diagram of a planar magnetic element provided herein;

FIG. 11 is another side schematic view of a planar magnetic element provided herein;

FIG. 12 is a schematic structural diagram of another embodiment of a first magnetic core in a planar magnetic component according to the present application;

FIGS. 13a, 13b and 13c are schematic cross-sectional views of different embodiments of a magnetic pillar in a planar magnetic component according to the present application;

FIG. 14 is a schematic structural diagram of another embodiment of a first magnetic core in a planar magnetic component according to the present application;

FIG. 15 is a schematic structural diagram of another embodiment of a first magnetic core in a planar magnetic component according to the present application;

fig. 16 is a side view of another embodiment of a first magnetic core in a planar magnetic component according to the present application.

Detailed Description

Technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Fig. 1 is a schematic structural diagram of a power module 200 provided in the present application.

The power module 200 includes an air supply unit 201 and the planar magnetic element 100 provided herein. The air supply unit 201 and the planar magnetic element 100 are arranged side by side along the first direction 001, and the air supply unit 201 may provide cooling air toward the planar magnetic element 100 along the first direction 001 to promote a heat dissipation effect of the planar magnetic element 100. And in the illustration of fig. 1, the planar magnetic element 100 has a plate shape, is arranged substantially parallel to the first direction 001, and is located at a middle position of the air blowing unit 201. Therefore, the cooling air sent by the air supply unit 201 can flow through the upper side and the lower side of the plate-shaped planar magnetic element 100 respectively, so that the action area of the cooling air on the planar magnetic element 100 is enlarged, and the heat dissipation effect of the cooling air is improved.

The planar magnetic element 100 of the present application can be used as a planar transformer or a planar inductor, and the power module 200 of the present application can be used as a switching power supply or a power converter. The application range of the Power module 200 may include an ac Power Supply, a dc Power Supply, a fast charging adapter, an On Board Charger (OBC), an Uninterruptible Power Supply (UPS), and the like. Because the volume of the planar magnetic element 100 of the present application is small, the volume of the power module 200 equipped with the planar magnetic element 100 is also controlled accordingly.

Fig. 2 is a structural schematic diagram of a planar magnetic element 100 provided in the present application.

The planar magnetic element 100 of the present application includes a first magnetic core 10, a second magnetic core 20, a magnetic pillar 30, a circuit board 40, and a support structure 50. The first magnetic core 10, the second magnetic core 20, and the circuit board 40 are substantially plate-shaped. The first magnetic core 10 and the second magnetic core 20 are arranged on two sides of the circuit board 40, that is, the first magnetic core 10, the circuit board 40 and the second magnetic core 20 are sequentially stacked. Referring to fig. 3, the circuit board 40 includes a first plane 401 and a second plane 402, which are opposite to each other, and the first plane 401 is located near the first magnetic core 10 and is disposed toward the first magnetic core 10. The second plane 402 is located close to the second magnetic core 20 and is disposed toward the second magnetic core 20.

Correspondingly, the first magnetic core 10 comprises a first inner surface 11, which first inner surface 11 is opposite to the first plane 401, i.e. the first magnetic core 10 comprises the first inner surface 11 close to and facing the circuit board 40. The second magnetic core 20 comprises a second inner surface 21, and the second inner surface 21 is opposite to the second plane 402, i.e. the second magnetic core 20 comprises the second inner surface 21 close to and facing the circuit board 40. It will be appreciated that the first inner surface 11 and the second inner surface 21 are also opposed to each other.

Referring to fig. 4, the circuit board 40 is provided with a through hole 41. The through hole 41 penetrates the circuit board 40, and the through hole 41 is connected between the first plane 401 and the second plane 402. In the embodiment of fig. 4, the number of the through holes 41 is two, and the two through holes 41 are arranged at intervals in the first direction 001. The first direction 001 is a direction parallel to the first plane 401 of the circuit board 40, and may also be understood as a longitudinal direction of the first core 10 and the second core 20 in the present embodiment. It is understood that in other embodiments, the number of the through holes 41 may be multiple, and the arrangement direction of the through holes 41 may be any direction parallel to the first plane 401.

The magnetic columns 30 pass through the through holes 41 and abut between the first magnetic core 10 and the second magnetic core 20, respectively. Specifically, the magnetic pillar 30 includes a first end 31 and a second end 32 opposite to each other, the first end 31 is located on a side of the first plane 401 away from the second plane 402, and the first end 31 contacts with the first inner surface 11 of the first magnetic core 10 and forms a mutual abutting structure; the second end 32 of the magnetic pillar 30 is located on the side of the second plane 402 away from the first plane 401, and the second end 32 contacts with the second inner surface 21 of the second magnetic core 20 to form a mutual abutting structure. Therefore, the distance between the first core 10 and the second core 20 is the distance between the first end 31 and the second end 32 of the pillar 30, i.e. the length of the pillar 30. In the planar magnetic member 100 of the present application, the length dimension of the magnetic pillar 30 is greater than the thickness dimension of the circuit board 40, and thus the minimum distance H1 between the first and second

magnetic cores

10 and 20 is also greater than the thickness dimension D of the circuit board 40 (see fig. 5).

The support structure 50 is located between the first magnetic core 10 and the circuit board 40. In the embodiment shown in fig. 3 and 4, the support structure 50 is realized in the form of a spacer 51. The spacer 51 and the first magnetic core 10 are independent components, the spacer 51 includes a first supporting surface 511 close to and facing the first inner surface 11, and the spacer 51 further includes a second supporting surface 512 close to and facing the first plane 401. The first supporting surface 511 contacts and abuts against the first inner surface 11, and the second supporting surface 512 contacts and abuts against the first plane 401. Thereby, a first gap 12 is formed between the first inner surface 11 and the first plane 401. The height h1 of the first gap 12 is the thickness of the spacer 51.

With continued reference to fig. 5, in the planar magnetic element 100 of the present application, the supporting function of the supporting structure 50 can control the relative distance between the first inner surface 11 of the first magnetic core 10 and the first plane 41 of the circuit board 40, that is, the thickness dimension of the first gap 12. As mentioned above, the relative distance H1 between the first inner surface 11 of the first core 10 and the second inner surface 21 of the second core 20 is limited by the length dimension of the pillar 30. Therefore, based on the calculation of the size chain, the distance h2 between the second inner surface 21 and the second plane 402 can be derived:

H2-H1-H1-D formula (1);

where D is the thickness of the circuit board 40. The distance H2 between the second inner surface 21 and the second plane 402 can be controlled by controlling the length dimension H1 of the magnetic pillar 30, matching the thickness dimension H1 of the spacer 51, and limiting the thickness dimension D of the circuit board 40. That is, the planar magnetic element 100 of the present application can form the second gap 22 (h 2 > 0) between the second magnetic core 20 and the circuit board 40 by controlling the dimension chain. Whereby a second gap 22 is formed between the second inner surface 22 and the second plane 402. The second gap 22 has an effect similar to that of the first gap 12, and may expose the first inner surface 11 of the first core 10, the second inner surface 21 of the second core 20, and the first plane 401 and the second plane 402 of the circuit board 40, respectively, for increasing the heat dissipation area of the planar magnetic element 100.

Further, please refer to fig. 6. While two paths for cooling air to flow are formed between the circuit board 40 and the first magnetic core 10 and between the circuit board 40 and the second magnetic core 20. For the power module 200 of the present application, when the air blowing unit 201 blows air towards the first gap 12 and the second gap 22, the cooling air can pass through the planar magnetic element 100 from the first gap 12 and the second gap 22, so as to promote the heat dissipation effect of the first inner surface 11, the second inner surface 21, and the first plane 401 and the second plane 402, thereby ensuring the working reliability of the planar magnetic element 100 of the present application.

Fig. 7 illustrates a structure of a power module 200a in the related art. In the prior art illustrated in fig. 7, the power supply module 200a also includes an air blowing unit 201a and a planar magnetic element 100 a. Wherein the prior art planar magnetic element 100a also includes a first magnetic core 10a, a second magnetic core 20a, a magnetic pillar (not shown), and a circuit board 40 a. The first and second

magnetic cores

10a and 20a are also arranged on both sides of the circuit board 40a, but the first and second

magnetic cores

10a and 20a are respectively attached to the plane of the circuit board 40 a. The magnetic columns are accommodated inside the circuit board 40a and abut against the first magnetic core 10a and the second magnetic core 20a, respectively.

Thus, when the air blowing unit 201a blows air toward the planar magnetic element 100a, the cooling air can flow only from the outer surface of the first magnetic core 10a on the side away from the circuit board 40a and the outer surface of the second magnetic core 20a on the side away from the circuit board 40 a. The heat dissipation area of the prior art planar magnetic element 100a is relatively small. In contrast, the structure of the planar magnetic element 100 shown in fig. 6 of the present application increases the structures of the first gap 12 and the second gap 22 compared to the planar magnetic element 100a of the prior art, so that the heat dissipation area thereof also increases the four planes of the first inner surface 11, the second inner surface 21, and the first plane 401 and the second plane 402, thereby obtaining a better heat dissipation effect. It can be understood that, for the power module 200 of the present application, even though the embodiment of the air supply unit 201 is not provided, the number of the heat dissipation surfaces of the individual planar magnetic elements 100 is still increased compared to the prior art, and thus a better heat dissipation effect can be obtained, and the operational reliability of the power module 200 is improved.

In one embodiment, the height dimension of the first gap 12, i.e., the distance h1 between the first inner surface 11 and the first plane 401, may be set to h1 ≧ 1 mm. Meanwhile, the height dimension of the second gap 22, i.e., the distance h2 between the second inner surface 21 and the second plane 402, can be set to h2 ≧ 1 mm. Experiments prove that when the height dimensions of the first gap 12 and the second gap 22 are controlled within a small range, the performance of the planar magnetic element 100 is relatively weakly influenced, but the heat dissipation effect is relatively remarkably improved.

On the other hand, the height dimensions of the first gap 12 and the second gap 22 are also related to the area dimensions of the first inner surface 11 and the second inner surface 21. It can be understood that, when the area of the first inner surface 11 and the second inner surface 21 is larger, the height dimension of the first gap 12 and the second gap 22 needs to be increased correspondingly to provide enough heat dissipation space for achieving better heat dissipation effect.

Referring to fig. 8, the first magnetic core 10 is a rectangular parallelepiped, and the first inner surface 11 is a rectangular structure. In the present embodiment, the first inner surface 11 has an area S, and a length dimension of the first inner surface 11 along the first direction 001 is a. At this time, when the condition is satisfied: s is less than or equal to 400mm²When A is less than or equal to 20mm, the height of the first gap 12 is preferably set to be less than or equal to 1mm and less than or equal to h1 and less than or equal to 1.5 mm; when the conditions are satisfied: 400mm²≤S≤1600mm²And when A is less than or equal to 40mm, the height of the first gap 12The degree is preferably set to be more than or equal to 1.5mm and less than or equal to h1 and less than or equal to 2 mm; when the conditions are satisfied: 1600mm²≤S≤3600mm²When A is less than or equal to 60mm, the height of the first gap 12 is preferably set to be less than or equal to 2mm and less than or equal to h1 and less than or equal to 3 mm; when the conditions are satisfied: 3600mm²When the height is less than or equal to S, the height of the first gap 12 is preferably set to be less than or equal to 3mm and less than or equal to h 1. Therefore, the height dimension of the first gap 12 is increased along with the increase of the area and length dimension of the first inner surface 11, and the heat dissipation effect of the planar magnetic element 100 can be ensured. The height dimension of the first gap 12 may also be increased with the length dimension of the first inner surface 11, and the heat dissipation effect of the planar magnetic element 100 may also be ensured. It will be appreciated that the height dimension of the second gap 22 may also be adjusted accordingly as the area and length dimensions of the second inner surface 21 are varied.

On the other hand, in the embodiment where the power module 200 is provided with the air supply unit 201, the flow rate of the cooling air supplied by the air supply unit 201 may also be used to match the height dimensions of the first gap 12 and the second gap 22. In one embodiment, the cooling air flow rate V provided by the air supply unit 201 satisfies the following condition: when V is less than or equal to 2m/s, the height of the first gap 12 is preferably set to be less than or equal to 3mm and less than or equal to h 1; when V is more than or equal to 2m/s and less than or equal to 4m/s, the height dimension of the first gap 12 is preferably more than or equal to 2mm and less than or equal to h1 and less than or equal to 3 mm; when V is more than or equal to 4m/s and less than or equal to 6m/s, the height dimension of the first gap 12 is preferably more than or equal to 1.5mm and less than or equal to h1 and less than or equal to 2 mm; when V is 6m/s, the height of the first gap 12 is preferably 1mm h1 1.5 mm. It can be seen that, in the present embodiment, the height dimension of the first gap 12 may be reduced accordingly as the cooling air flow rate of the air blowing unit 201 increases. That is, when the flow speed of the cooling air is faster, the height dimension of the first gap 12 can be reduced appropriately, and the heat dissipation requirement of the planar magnetic element 100 can also be satisfied. It is understood that the height dimension of the second gap 22 can be adjusted correspondingly with the change of the flow speed of the air supply unit 201.

One embodiment is shown in FIG. 9. For the circuit board 40 of the present application, at the position of the through hole 41, a winding wire 42 is further provided. The wire 42 is electrically conductive and may be made of copper wire. The winding 42 surrounds the periphery of the through hole 41, and when the magnetic pillar 30 passes through the through hole 41, the winding 42 surrounds the periphery of the magnetic pillar 30. Thus, the winding 42 is formed as a coil structure surrounding the periphery of the magnetic pillar, and the planar magnetic element 100 of the present application can be equivalent to the transformer structure shown in fig. 10: the first magnetic core 10, the second magnetic core 20 and the two magnetic columns 30 surround to form a magnetic circulation path. A winding 42 on the periphery of one of the magnetic columns 30 is formed into a primary coil of the transformer as an input end; a winding 42 on the periphery of the other leg 30 forms the secondary winding of the transformer as an output.

It should be noted that fig. 9 and 10 illustrate only one implementation of the planar magnetic element 100 of the present application as a transformer. In other embodiments, the planar magnetic element 100 may also be used as other components such as an inductor, and the structure thereof is similar to that of the transformer. On the other hand, in the illustration of fig. 9, the winding 42 surrounds the periphery of the through hole 41 along the first plane 401, and is helical with respect to the through hole 41. In other embodiments, the winding 42 may also extend along the thickness direction of the circuit board 40 and also spirally surround the periphery of the through hole 41.

Referring to fig. 11, in a second direction 002 perpendicular to the first direction 001, the first gap 12 includes a first air passage 121, and the second gap 22 includes a second air passage 221. Specifically, the first air duct 121 penetrates between the first magnetic core 10 and the circuit board 40 along the first direction 001, and the second air duct 221 penetrates between the second magnetic core 20 and the circuit board 40 along the first direction 001. When the air blowing unit 201 blows cooling air in the first direction 001, the cooling air may pass through the first air passage 121 and the second air passage 221, respectively, and may form a heat dissipation effect on the first inner surface 11 and the first plane 401, and the second inner surface 21 and the second plane 402, respectively.

In the embodiment of fig. 11, the number of the first air channels 121 is also two, and the two first air channels 121 are arranged on both sides of the magnetic pole 30 in the second direction 002. That is, the magnetic pillar 30 may be located at a middle position of the first magnetic core 10 in the second direction 002 such that one first air path 121 is formed at each of opposite sides of the magnetic pillar 30. Therefore, when the cooling air flows through the first air channels 121 on both sides of the magnetic pillar 30, the heat dissipation effect of the cooling air on the first inner surface 11 and the first plane 401 is relatively uniform. It will be appreciated that the magnetic pillar 30 is also located at a central position with respect to the second magnetic core 20, and that the second air passage channels 221 on both sides of the magnetic pillar 30 are also formed on both sides of the magnetic pillar 30. The second ventilation channels 221 on both sides can also make the heat dissipation effect of the second inner surface 21 and the second plane 402 relatively uniform.

In the embodiment of fig. 11, the position of the spacer 51 is set to correspond to the position of the magnetic pillar 30, i.e., the spacer 51 is also located at the middle portion with respect to the first magnetic core 10. Further, the projection of the pad 51 on the magnetic pillar 30 along the first direction 001 does not exceed the width of the magnetic pillar 30. Specifically, the magnetic pillar 30 has a first width dimension L1 along the second direction 002, and the spacer 51 has a second width dimension L2. L1 is set to be equal to or larger than L2, and the opposite ends of the shim 51 along the second direction 002 do not exceed the edge of the magnetic pillar 30. Therefore, the spacer 51 does not enter the area of the first air passage 121 while supporting the first magnetic core 10 and the circuit board 40, and further does not block the area of the first air passage 121, thereby increasing the flow rate of the cooling air passing through the first air passage 121 in the first direction 001. It should be noted that, when the number of the spacers 51 is plural, the projections of the plural spacers 51 on the magnetic pillar 30 along the first direction 001 need to be located in the area of the magnetic pillar 30, not exceeding the width range of the magnetic pillar 30, so as to ensure that the cross-sectional area of the first air channel 121 is maximized.

Referring to fig. 12, the first magnetic core 10 and the magnetic pillar 30 may be implemented by an integral structure. Specifically, the structure of the first magnetic core 10 integrated with the magnetic pillar 30 is directly formed through the control of the processing technology, so that the assembly of the first magnetic core 10 and the magnetic pillar 30 in the planar magnetic element 100 is completed after the magnetic pillar 30 is correspondingly inserted into the through hole 41 of the circuit board 40. The present embodiment provides a relative position between the first magnetic core 10 and the magnetic pillar 30 that is ensured and simplifies the assembly process of the planar magnetic core element 100.

Referring to fig. 13a, 13b and 13c, the cross-sectional shape of the magnetic pillar 30 of the present application may be any shape such as a rectangle, a circle or an ellipse. As long as the magnetic pillar 30 has a certain cross-sectional area, which can provide a magnetic flux satisfying a predetermined requirement, the function of the magnetic pillar 30 can be achieved. Correspondingly, the shape of the through hole 41 of the circuit board 40 can also match the cross-sectional shape of the magnetic pillar 30, so that the distance between the winding 42 and the magnetic pillar 30 is relatively close to form a more reliable coil structure.

Referring to fig. 14, by controlling the manufacturing process, a supporting structure 50 (schematically shown as a supporting block 52 in fig. 14) may also be fabricated on the first magnetic core 10, that is, the supporting structure 50 and the first magnetic core 10 are also integrally formed. In the present embodiment, the supporting block 52 is protruded on the first inner surface 11, and the first magnetic core 10 forms the first gap 11 between the first inner surface 11 and the first plane 401 due to the contact between the supporting block 52 and the first plane 401 of the circuit board 40.

In the illustrated construction, a support block 52 is also formed between the two magnetic columns 30. The two magnetic pillars 30 may also be integrally formed with the first magnetic core 10, whereby the first magnetic core 10 may be integrally formed with both the magnetic pillars 30 and the supporting blocks 52. The support block 52 is connected between the two magnetic columns 30, which can enhance the structural stability of the magnetic columns 30. And the relative position between the supporting block 52 itself and the first magnetic core 10 is also secured. Meanwhile, in the assembling process of the planar magnetic element 100, the first magnetic core 10, the magnetic pillar 30 and the supporting block 52 are assembled in the same step, which further simplifies the assembling process of the planar magnetic element 100.

One embodiment is shown in FIG. 15. In the present embodiment, the support structure 50 is realized in the form of a support strip 53. The support bar 53 is also constructed in an integrally formed manner with the first magnetic core 10. Further, the supporting bars 53 also extend in the first direction 001 to form at least two first air channels 121 in the first gap 12 (see fig. 16). Similar to the structure of the supporting block 52, the supporting bar 53 is also protruded on the first inner surface 11, and the first magnetic core 10 forms a first gap 11 between the first inner surface 11 and the first plane 401 due to the contact between the supporting bar 53 and the first plane 401 of the circuit board 40.

Meanwhile, the supporting bars 53 may also be distributed at two sides of the magnetic pillar 30, so as to form a plurality of first ventilation channels 121 at two sides of the magnetic pillar 30, respectively. In this embodiment, when the support bars 53 are distributed on both sides of the magnetic pole 30, the number of the first air path 121 is at least 4. As can be seen from fig. 16, since the supporting bars 53 are integrally formed with the first magnetic core 10, during the operation of the planar magnetic element 100, the heat generated by the first magnetic core 10 is synchronously transferred to the supporting bars 53. And since the supporting bars 53 are used to form the first air path 121, the side walls of the supporting bars 53 are also used to constitute the inner walls of the first air path 121. The cooling air contacts the side walls of the respective support bars 53 while flowing through the respective first air path 121, and carries heat of the support bars 53 away from the planar magnetic member 100. That is, the structure of the supporting bar 53 further increases the heat dissipation area of the first magnetic core 10, so that the planar magnetic element 100 of the present application obtains a better heat dissipation effect.

The above description is only for the specific embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions, such as the reduction or addition of structural elements, the change of shape of structural elements, etc., within the technical scope of the present application, and shall be covered by the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A planar magnetic element is characterized by comprising a first magnetic core, a second magnetic core, a magnetic column, a circuit board and a supporting structure;

the first and second magnetic cores are arranged on opposite sides of the circuit board, the circuit board including a first plane adjacent the first magnetic core and a second plane adjacent the second magnetic core;

the circuit board further comprises a through hole, the through hole is communicated between the first plane and the second plane, the magnetic column penetrates through the through hole, and the magnetic column is respectively abutted against the first magnetic core and the second magnetic core;

the supporting structure is located between the first magnetic core and the first plane, and the supporting structure is abutted to the first magnetic core and the first plane respectively, so that a first gap is formed between the first magnetic core and the first plane, and a second gap is formed between the second magnetic core and the second plane.

2. A planar magnetic component as claimed in claim 1, wherein the first gap comprises a first air duct extending in a first direction between the first core and the first plane, the first direction being parallel to the first plane;

the second gap includes a second air passage, and the second air passage also penetrates between the second magnetic core and the second plane along the first direction.

3. The planar magnetic component of claim 2, wherein the first gap comprises at least two first air channels, and at least one first air channel is disposed on each of two sides of the magnetic pillar in a second direction perpendicular to the first direction;

the second gap comprises at least two second air passages, and in the second direction, at least one second air passage is respectively arranged on two sides of the magnetic column.

4. A planar magnetic component as claimed in any of claims 1 to 3, wherein the size of the first gap is greater than or equal to 1 mm; the second gap is also greater than or equal to 1mm in size.

5. A planar magnetic component as claimed in any one of claims 1 to 3, wherein the magnetic post is of integral construction with the first magnetic core.

6. A planar magnetic component as claimed in any one of claims 1 to 3, wherein the support structure is of integral construction with the first magnetic core.

7. A planar magnetic component as claimed in any of claims 1 to 3, wherein the support structure is configured as a shim bonded to the first magnetic core and the first planar surface respectively.

8. A planar magnetic component as claimed in any one of claims 1 to 3, wherein the circuit board includes two through holes, the two through holes are spaced apart from each other, the number of the through holes is two corresponding to the number of the magnetic pillars, and the two magnetic pillars are respectively abutted against the first magnetic core and the second magnetic core.

9. A planar magnetic component as claimed in any one of claims 1 to 3, wherein the circuit board is further provided with a winding, the winding surrounding the periphery of the through hole.

10. A power supply module, characterized by comprising an air supply unit and at least one planar magnetic element according to any one of claims 1 to 9, wherein the air supply unit is used for supplying air towards the first gap and the second gap simultaneously so as to dissipate heat of the planar magnetic element.