CN216313501U - Circuit board assembly and lighting equipment - Google Patents

Abstract

The utility model relates to a circuit board assembly and lighting equipment.A top circuit board and a bottom circuit board of the circuit board assembly are arranged in an up-and-down superposition manner, so that the transverse size of the circuit board assembly is reduced as much as possible under the condition of the same circuit board area, the circuit board assembly and the bottom circuit board can be conveniently integrated and arranged in a limited space of a shell under the condition of reducing the transverse size of the shell as much as possible, a manufactured down lamp and a manufactured spot lamp can be consistent with the sizes of the existing down lamp and the existing spot lamp as much as possible, and the universality of the manufactured down lamp and the spot lamp is improved; in addition, through set up electrically conductive hole and lead electrical pillar respectively on upper and lower circuit board, realize the electricity through electrically conductive hole and the cooperation of leading electrical pillar and connect the electric connection, need not weld, can save material, promote assembly efficiency, simultaneously, still can form the location to upper and lower superimposed circuit board, reduce the assembly degree of difficulty and promote the assembly precision.

Description

Circuit board assembly and lighting equipment

Technical Field

The utility model relates to the field of illumination, in particular to a circuit board assembly and an illumination device.

Background

An LED (Light Emitting Diode) Light engine is a module that includes an LED package device or an LED chip array, a power supply circuit, a driving circuit, and a control circuit, and can be directly connected to a branch circuit through a connector that is matched with an LED lamp to provide illumination in the lamp. In the LED photo engine, when setting up supply circuit, drive circuit and control circuit on a PCB board, lead to the size of PCB board great, when especially being applied to down lamp or shot-light, need set up the shell of great internal diameter, lead to the shot-light or the down lamp that make to be inconsistent with the size of current shot-light or down lamp, the commonality is poor.

SUMMERY OF THE UTILITY MODEL

In view of the deficiencies of the prior art, an object of the present application is to provide a circuit board assembly and a lighting device, which solve the problem of poor universality of a down lamp or a spot lamp manufactured by using an existing circuit board.

In order to solve the above technical problem, an embodiment of the present invention provides a circuit board assembly, where the circuit board assembly is applied to a down lamp or a spot lamp, and includes:

the circuit board comprises an upper circuit board and a lower circuit board which are arranged in an up-and-down overlapping mode, wherein one of the upper circuit board and the lower circuit board is provided with a first circuit and a conductive hole, the inner wall of the conductive hole is provided with a conductive layer electrically connected with the first circuit, and the opening of the conductive hole faces to the other circuit board;

a second circuit and a conductive column communicated with the second circuit are arranged on the other circuit board, and the conductive column faces to the opening of the conductive hole;

when the upper circuit board and the lower circuit board are stacked up and down, the conductive column penetrates into the conductive hole through the opening, is clamped in the conductive hole and is tightly attached to the conductive layer.

Optionally, the upper circuit board is located on the lower circuit board, the first circuit and the conductive hole are arranged on the upper circuit board, and the second circuit and the conductive column are arranged on the lower circuit board.

Optionally, the first circuit comprises a control circuit and the second circuit comprises a power supply circuit for electrically connecting with the light emitting unit;

the upper circuit board is provided with a hollow area, and the area for arranging the light-emitting unit on the lower circuit board is positioned below the hollow area, so that light emitted by the light-emitting unit is emitted through the hollow area.

Optionally, the first circuit comprises a power supply circuit for electrically connecting with the light emitting unit, and the second circuit comprises a control circuit.

Optionally, the upper circuit board is located on the lower circuit board, the lower circuit board is provided with the first circuit and the conductive hole, and the upper circuit board is provided with the second circuit and the conductive post.

Optionally, the first circuit comprises a control circuit and the second circuit comprises a power supply circuit for electrically connecting with the light emitting unit.

Optionally, the first circuit comprises a power supply circuit for electrically connecting with the light emitting unit, and the second circuit comprises a control circuit.

The upper circuit board is provided with a hollow area, and the area for arranging the light-emitting unit on the lower circuit board is positioned below the hollow area, so that light emitted by the light-emitting unit is emitted through the hollow area.

Optionally, the conductive hole is a through hole penetrating through the circuit board, and the conductive layer is disposed on a sidewall of the through hole.

Optionally, the conductive via is a blind via that does not penetrate through the circuit board, and the wire layer is disposed on at least one of a sidewall and a bottom wall of the blind via.

Based on the same inventive concept, the utility model also provides a lighting device which is a down lamp or a spot lamp and comprises the circuit board assembly.

In the circuit board assembly and the lighting device provided by the embodiment, the upper circuit board and the lower circuit board of the circuit board assembly are arranged in an up-and-down superposed manner, wherein one of the upper circuit board and the lower circuit board is provided with a first circuit and a conductive hole, the inner wall of the conductive hole is provided with a conductive layer electrically connected with the first circuit, and the opening of the conductive hole faces to the other circuit board; the other circuit board is provided with a second circuit and a conductive column communicated with the second circuit, and the conductive column faces the opening of the conductive hole, so that when the upper circuit board and the lower circuit board are stacked up and down, the conductive column penetrates into the conductive hole through the opening, is clamped in the conductive hole and is tightly attached to the conductive layer, and the first circuit is electrically connected with the second circuit; the upper circuit board and the lower circuit board of the circuit board assembly are arranged in an upper-lower overlapping mode, so that the transverse size of the circuit board assembly is reduced as much as possible under the condition of the same circuit board area, the upper circuit board and the lower circuit board can be conveniently integrated and arranged in a limited space of the shell under the condition that the transverse size of the shell is reduced as much as possible, the manufactured down lamp and the manufactured spot lamp can be consistent with the sizes of the existing down lamp and the existing spot lamp as much as possible, and the universality of the manufactured down lamp and the existing spot lamp is improved;

in addition, through set up electrically conductive hole and lead electrical pillar respectively on upper and lower circuit board, realize the electricity through electrically conductive hole and the cooperation of leading electrical pillar and connect the electric connection, need not weld, can save material, promote assembly efficiency, simultaneously, still can form the location to upper and lower superimposed circuit board, reduce the assembly degree of difficulty and promote the assembly precision.

Drawings

Fig. 1 is a first schematic structural diagram of an upper circuit board according to an embodiment of the present invention;

fig. 2 is a first schematic diagram of a lower circuit board structure according to an embodiment of the present invention;

FIG. 3 is a schematic assembly diagram of an upper circuit board and a lower circuit board according to an embodiment of the present invention;

FIG. 4 is a first schematic diagram illustrating the superposition of an upper circuit board and a lower circuit board according to an embodiment of the present invention;

FIG. 5 is a second schematic structural diagram of an upper circuit board according to an embodiment of the present invention;

fig. 6 is a second schematic diagram of a lower circuit board structure according to an embodiment of the present invention;

fig. 7 is a schematic diagram of a second stacked upper circuit board and a lower circuit board according to an embodiment of the present invention;

fig. 8 is a third schematic structural diagram of an upper circuit board according to an embodiment of the present invention;

fig. 9 is a third schematic diagram of a lower circuit board structure according to an embodiment of the present invention;

fig. 10 is a schematic diagram of stacking an upper circuit board and a lower circuit board according to an embodiment of the present invention;

fig. 11 is a fourth schematic structural diagram of an upper circuit board according to an embodiment of the present invention;

fig. 12 is a fourth schematic diagram of a lower circuit board structure according to an embodiment of the present invention;

fig. 13 is a fourth schematic view of an upper circuit board and a lower circuit board stacked according to an embodiment of the present invention;

fig. 14 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

The circuit board assembly provided by the embodiment is applied to lighting equipment, and is particularly suitable for, but not limited to, down lamps or spot lamps. Wherein should be with circuit board assembly's last circuit board and circuit board upper and lower stack setting down to the realization reduces circuit board assembly's horizontal size as far as under the condition of the same circuit board area, be convenient for can set up the two integratedly in the finite space of shell under the condition of reducing the horizontal size of shell as far as possible, make down lamp and shot-light that make can be as far as with the size unanimity of current down lamp and shot-light, promote the commonality of the down lamp and the shot-light that make.

In addition, in the upper circuit board and the lower circuit board in this embodiment, one of the circuit boards is provided with a first circuit and a conductive hole, a conductive layer electrically connected with the first circuit is provided on an inner wall of the conductive hole, and an opening of the conductive hole faces the other circuit board; the other circuit board is provided with a second circuit and a conductive column communicated with the second circuit, and the conductive column faces the opening of the conductive hole, so that when the upper circuit board and the lower circuit board are stacked up and down, the conductive column penetrates into the conductive hole through the opening, is clamped in the conductive hole and is tightly attached to the conductive layer, and the first circuit is electrically connected with the second circuit; the connecting structure is simple and reliable, and the assembling efficiency and the assembling precision can be improved.

In some examples of the present embodiment, the conductive hole disposed on the circuit board may be a through hole penetrating through the circuit board, and the conductive layer may be disposed on a sidewall of the through hole; and it should be understood that the conductive layer in this example may cover the sidewalls of the vias completely or only a portion thereof.

In other examples of the present embodiment, the conductive hole provided on the circuit board may be a blind hole that does not penetrate through the circuit board, and the conductive layer may be provided on at least one of a side wall and a bottom wall of the blind hole. For example, in some examples, the conductive layer may be disposed on a bottom wall of the blind via, and the conductive layer may not be disposed on a sidewall of the blind via; in still other examples, the conductive layer may be disposed on a sidewall of the blind via, and the conductive layer may not be disposed on a bottom wall of the blind via; in other examples, the conductive layer may be disposed on the sidewall and the bottom wall of the blind hole, and may be flexibly disposed according to application requirements, which is not repeated herein.

In addition, it should be understood that the conductive holes in the present embodiment may be disposed on the upper circuit board or the lower circuit board according to the application requirements. For ease of understanding, several exemplary arrangements are described below.

In one example, the upper circuit board is located above the lower circuit board, the upper circuit board is provided with a first circuit and a conductive hole, and the lower circuit board is provided with a second circuit and a conductive column.

For example, an application example is shown in fig. 1 to 4, in which:

fig. 1 shows a lower circuit board 11, a light emitting unit 12 is disposed on the lower circuit board 11, and a second circuit (not shown) on the lower circuit board 11 includes a power circuit electrically connected to the light emitting unit 12 for supplying power thereto; the lower circuit board 11 is provided with a conductive column 13 electrically connected to the power circuit.

Fig. 2 shows an upper circuit board 21, and a first circuit on the upper circuit board 21 includes a control circuit, which can drive and/or control the light emitting unit. The upper circuit board 21 is provided with a conductive hole 22, the conductive hole 22 is a through hole, a conductive layer 23 is provided on the sidewall of the through hole, and the conductive layer 23 is electrically connected with the control circuit.

In this example, referring to fig. 2, a hollow area a is further provided on the upper circuit board 21, and an area for disposing the light emitting unit 12 on the lower circuit board 11 is located below the hollow area a, so that light emitted from the light emitting unit 12 is emitted through the hollow area.

Referring to fig. 3, when the upper circuit board 21 and the lower circuit board 21 shown in fig. 1 and 2 are stacked up and down, the conductive holes 22 on the upper circuit board 21 correspond to the corresponding conductive posts 13 on the lower circuit board 11 one by one, and the conductive posts 13 are inserted into the corresponding conductive holes 22 and are in close contact with the conductive layers 23 on the side walls of the conductive holes 22 to form electrical connection, as shown in fig. 4. And it should be understood that the upper ends of the conductive posts 13 may be flush with the upper circuit board 21, or higher than the upper circuit board 21, or slightly lower than the upper circuit board 21 after being inserted into the conductive holes 22.

For another example, see fig. 5-7, where: fig. 5 shows the upper circuit board 21, and the second circuit on the upper circuit board 21 includes a control circuit, which can drive and/or control the light emitting unit. The upper circuit board 21 is provided with a conductive hole 22, the conductive hole 22 is a blind hole, conductive layers 23 are arranged on the side wall and the bottom wall of the blind hole, and the conductive layers 23 are electrically connected with the control circuit. It should be understood that the conductive layer may also be provided on only one of the side walls and the bottom wall of the blind hole.

Fig. 6 is a schematic view illustrating an assembly of the lower circuit board 11 and the upper circuit board 21, wherein the lower circuit board 11 is provided with a light emitting unit 12, and a first circuit on the lower circuit board 11 includes a power circuit electrically connected to the light emitting unit 12 for supplying power thereto; the lower circuit board 11 is provided with a conductive column 13 electrically connected to the power circuit. Referring to fig. 7, when the upper circuit board 21 and the lower circuit board 21 are stacked up and down, the blind holes on the upper circuit board 21 correspond to the corresponding conductive posts 13 on the lower circuit board 11 one by one, and the conductive posts 13 are inserted into the corresponding blind holes and are in close contact with the conductive layers 23 on the side walls and the bottom walls of the blind holes to form electrical connection. And it should be understood that the upper end of the conductive post 13 can abut against the bottom wall of the blind hole after being inserted into the conductive hole 22.

Another application example of the present embodiment is shown in fig. 8 to 10, in which:

fig. 8 shows the upper circuit board 31, and a first circuit on the upper circuit board 31 includes a power circuit electrically connected to the light emitting unit 32 for supplying power thereto; the upper circuit board 31 is provided with a conductive hole 34, the conductive hole 34 is a through hole, a conductive layer 35 is provided on the sidewall of the through hole, and the conductive layer 35 is electrically connected to the power circuit.

Fig. 9 shows a lower circuit board 41, a second circuit (not shown) on the lower circuit board 11 includes a control circuit, which can drive and/or control the light emitting unit 32, and a conductive column 42 electrically connected to the control circuit is disposed on the lower circuit board 41. The cross-sectional shape of the conductive post 42 in this example may be, but is not limited to, circular, rectangular, oval, etc., and the side surface of the conductive post 42 may be a smooth surface, and may also be a threaded surface, a concave-convex surface, etc. When the side surface of the conductive post 42 is a threaded surface or a concave-convex surface, the side surface of the conductive hole 34 is set as a corresponding threaded surface or a concave-convex surface.

Fig. 10 shows that when the upper circuit board 31 and the lower circuit board 41 shown in fig. 8 and 9 are stacked up and down, the through holes on the upper circuit board 31 correspond to the corresponding conductive posts 42 on the lower circuit board 41 one by one, and the conductive posts 42 are inserted into the corresponding through holes and are in close contact with the conductive layer 35 on the side walls of the through holes to form electrical connection, and it should be understood that after the conductive posts 42 are inserted into the through holes, the upper ends thereof may be flush with the upper circuit board 31, or higher than the upper circuit board 31, or slightly lower than the upper circuit board 31.

Still another application example of the present embodiment is shown in fig. 11 to 13, in which:

fig. 11 shows the upper circuit board 31, and a first circuit on the upper circuit board 31 includes a power circuit electrically connected to the light emitting unit 32 for supplying power thereto; the upper circuit board 31 is provided with a conductive hole 34, the conductive hole 34 is a blind hole, the side wall and the bottom wall of the blind hole are provided with conductive layers 35, and the conductive layers 35 are electrically connected with the power circuit.

Fig. 12 shows a lower circuit board 41, a second circuit (not shown) on the lower circuit board 11 includes a control circuit, which can drive and/or control the light emitting unit 32, and a conductive column 42 electrically connected to the control circuit is disposed on the lower circuit board 41. Fig. 13 shows that when the upper circuit board 31 and the lower circuit board 41 shown in fig. 11 and 12 are stacked up and down, the blind holes on the upper circuit board 31 correspond to the corresponding conductive posts 42 on the lower circuit board 41 one by one, and the conductive posts 42 are inserted into the corresponding blind holes and are in close contact with the conductive layers 35 on the sidewalls and the bottom walls of the blind holes to form electrical connection.

In the two examples shown in fig. 8 to 13, in order to improve the heat dissipation efficiency, the heat dissipation area B may be disposed on the lower circuit board 41, and the heat dissipation area B penetrates through the front surface and the back surface of the lower circuit board 41, and the shape and the size of the heat dissipation area B are not strictly limited in this example, as long as the light emitting unit 32 on the upper circuit board 31 corresponds to the heat dissipation area B in position after the upper circuit board 31 and the lower circuit board 41 are stacked up and down. For example, as shown in fig. 8 to 13, the lower circuit board 41 in this example has a heat dissipation area B with a rectangular cross section, and of course, the cross section of the heat dissipation area B is not limited to a rectangle, and may be set to be a regular shape such as a circle, an ellipse, a triangle, a diamond, a hexagon, or an irregular shape as required, which is not described again. In an application scenario, after the lower circuit board 41 and the upper circuit board 31 are stacked up and down, at least a part of the light emitting unit 32 on the upper circuit board 31 overlaps the heat dissipation area B, so that heat generated by the light emitting unit 32 during operation is directly dissipated through the heat dissipation area B through the back surface of the upper circuit board 31, and the heat dissipation efficiency is improved.

In the above examples, the conductive holes are disposed on the upper circuit board and the conductive posts are disposed on the lower circuit board, but it should be understood that in the present embodiment, the conductive posts may be disposed on the upper circuit board and the conductive holes may be disposed on the lower circuit board.

For example, in some application scenarios of this embodiment, the upper circuit board may still be disposed on the lower circuit board, the lower circuit board is provided with the first circuit and the conductive hole, and the upper circuit board is provided with the second circuit and the conductive pillar. The first circuit comprises a control circuit, and the second circuit comprises a power supply circuit electrically connected with the light-emitting unit; or, the first circuit comprises a power supply circuit used for being electrically connected with the light-emitting unit, the second circuit comprises a control circuit, the upper circuit board is provided with a hollow area, and the area used for arranging the light-emitting unit on the lower circuit board is positioned below the hollow area, so that light emitted by the light-emitting unit is emitted through the hollow area. Compared with the examples shown in fig. 1 to 13, the example shown in this application scenario differs mainly in that the first circuit and the conductive hole are disposed on the lower circuit board, and the second circuit and the conductive post are disposed on the upper circuit board.

It should be understood that, in this embodiment, a part of the conductive holes and the conductive pillars may be disposed on the upper circuit board, and another part of the conductive holes and the conductive pillars may be disposed on the lower circuit board, which is an equivalent alternative to the above examples, and therefore, the details are not repeated herein.

It should be understood that at least one of the upper circuit board and the lower circuit board in the present embodiment may be a flexible circuit board, and may also be a rigid circuit board. The upper circuit board can also be a substrate base plate and a first circuit arranged on the substrate base plate, wherein the substrate base plate adopts but is not limited to a conductive metal base plate; for example, but not limited to, at least one of an aluminum substrate, a copper substrate, a silver substrate, a conductive alloy substrate, or the like may be used. It should be understood that, in the present embodiment, the substrate base plate may be replaced by a non-metal base plate; for example, in some examples, a substrate body having an insulating body and a composite substrate having respective conductor lines provided within the substrate body may be employed as the upper circuit board. The substrate body may be made of a rigid material, such as but not limited to a phenolic paper laminated board, an epoxy paper laminated board, a polyester glass mat laminated board, an epoxy glass cloth laminated board, a BT resin board, or a glass board; the substrate body may also be made of a flexible material, such as but not limited to a polyester film, a polyimide film, or a fluorinated ethylene propylene film. The lower circuit board may also be arranged in the manner referred to, but not limited to, the upper circuit board.

It should be understood that the materials of the upper circuit board and the lower circuit board in the embodiment may be the same, or may be different according to the requirement. And both can set up to be flexible, or rigidity, or one of them sets up to be flexible, and another sets up to be rigid, also can set up in a flexible way according to the application demand specifically, need not be repeated here one by one.

It should be understood that the light emitting unit in the present embodiment may include, but is not limited to, at least one of an LED lamp bead and an LED chip; when the LED lamp beads are included, the LED lamp beads can adopt but are not limited to bracket type packaged lamp beads, and also can adopt but are not limited to bracket-free LED lamp beads; when included, the LED Chip may be disposed On the circuit Board by, but not limited to, a COB (Chip On Board) process. The LED chips are divided according to the pin distribution mode of the LED chips, and the LED chips in the present embodiment can comprise at least one of a forward-mounted LED chip, a flip-chip LED chip and a vertical LED chip; from the chip size division, the LED chips in this example may include, but are not limited to, a Micro-scale LED chip (e.g., at least one of a Mini LED chip and a Micro LED chip) and an LED chip larger than the Micro-scale. Moreover, it should be understood that the number of the light emitting units arranged on the circuit board in this embodiment, and the number, the light emitting intensity, the light emitting color, and the like of the LED lamp beads and/or the LED chips included in each light emitting unit may be flexibly set according to application requirements, and are not described herein again.

It should be understood that the conductive layer in the present embodiment may be a conductive adhesive or a conductive metal layer filled in the conductive hole. When the conductive adhesive is used, the conductive adhesive has the characteristics of conductivity and adhesion, and when the conductive adhesive is classified according to conductive materials, the conductive adhesive used can include, but is not limited to, conductive silver adhesive, copper powder conductive adhesive, nickel-carbon conductive adhesive, silver-copper conductive adhesive, and the like. When the conductive metal layer is used, it can be implemented by, but not limited to, a gold layer, a silver layer, a copper layer, an aluminum layer, etc., or by, but not limited to, various deposition processes.

It should be understood that the upper circuit board in this embodiment may be rectangular, circular, or elongated, and may also be in an irregular shape, and specifically, may be flexibly configured according to application requirements. The conductive holes and the conductive posts disposed on the upper circuit board and the lower circuit board are in one-to-one correspondence, and it should be understood that the number of the conductive holes may be two, corresponding to the positive and negative terminals of the first circuit, respectively, or three, corresponding to the positive, negative and ground terminals of the first circuit, respectively. Of course, more than three can be set according to the requirement, and the description is not repeated here. In this embodiment, when the number of the conductive holes includes more than two, each conductive hole may be disposed on the same side of the light emitting unit, or may be disposed on different sides of the light emitting unit.

It should be understood that, in this embodiment, the shape of the lower circuit board may also be flexibly set according to application requirements, and may be set to be a rectangle, and certainly, may also be set to be a regular shape such as a circle, an ellipse, a long strip, and the like, and may also be set to be an irregular shape according to requirements, which is not described herein again. And the shape of the upper circuit board and the shape of the lower circuit board can be the same or different.

In some examples of this embodiment, in order to further improve the heat dissipation effect, an area of the light emitting unit projected on the lower circuit board may be located in the heat dissipation area B, that is, an area of the light emitting unit projected on the lower circuit board is smaller than an area of the heat dissipation area, and a position of the light emitting unit corresponds to a position of the heat dissipation area B, so as to ensure that heat generated by the light emitting unit is dissipated from the heat dissipation area B as much as possible.

In other examples of the embodiment, to further enhance the heat dissipation effect, the lighting device further includes a heat dissipation assembly disposed below the lower circuit board, and the heat dissipation assembly may be disposed in contact with at least one of the back surface of the lower circuit board and the back surface area of the upper circuit board. For example, as shown in fig. 14, the upper end of the heat sink may be disposed to contact the back surface area of the upper circuit board 31 and the back surface of the lower circuit board 41, respectively, so that the heat generated by the upper circuit board 31 and the lower circuit board 41 is directly conducted to the heat sink, thereby improving the heat dissipation efficiency. Of course, in other application scenarios of the present example, it may also be possible to arrange that the upper end of the heat dissipation assembly is not in contact with at least one of the upper circuit board and the lower circuit board, but a heat conduction layer is arranged between the upper end of the heat dissipation assembly and the lower end of the upper circuit board and the lower end of the lower circuit board, the heat conduction layer guides heat generated by the upper circuit board and/or the lower circuit board into the heat dissipation assembly, and the heat conduction layer can also perform the thermoelectric separation function. In some application scenarios of the present example, in order to further improve the heat dissipation efficiency, the lower end (the end opposite to the upper end of the heat dissipation assembly) of the heat dissipation assembly may be provided with heat dissipation fins, by which the heat dissipation efficiency can be further improved. It should be understood that the heat dissipation assembly in this example may be made of various materials with good thermal conductivity, such as ceramic, metal, graphene, etc.

The lighting device that this embodiment provided is through going up circuit board and circuit board stack setting from top to bottom down to make it can assemble in the finite space of shell, for current lighting device need locate the circuit board down the outer way of shell, the lighting device that this embodiment provided has the integrated level height, and is integrative good, assembles convenient and cost advantage lower. In addition, the upper circuit board 11 and the lower circuit board 21 stacked up and down in the embodiment are electrically connected through the conductive posts and the conductive holes, so that compared with a traditional connection mode in which two ends of a wire are welded, the wire material can be saved, the welding times can be reduced, the manufacturing efficiency can be improved, and the cost and the product integrity can be further reduced.

It is to be understood that the utility model is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the utility model as defined by the appended claims.

Claims (10)

1. The utility model provides a circuit board assembly, its characterized in that, circuit board assembly is applied to down lamp or shot-light, and it includes:

the circuit board comprises an upper circuit board and a lower circuit board which are arranged in an up-and-down overlapping mode, wherein one of the upper circuit board and the lower circuit board is provided with a first circuit and a conductive hole, the inner wall of the conductive hole is provided with a conductive layer electrically connected with the first circuit, and the opening of the conductive hole faces to the other circuit board;

a second circuit and a conductive column communicated with the second circuit are arranged on the other circuit board, and the conductive column faces to the opening of the conductive hole;

when the upper circuit board and the lower circuit board are stacked up and down, the conductive column penetrates into the conductive hole through the opening, is clamped in the conductive hole and is tightly attached to the conductive layer.

2. The circuit board assembly of claim 1, wherein said upper circuit board is positioned above said lower circuit board, said first circuit and said conductive vias being disposed on said upper circuit board, said second circuit and said conductive posts being disposed on said lower circuit board.

3. The circuit board assembly of claim 2, wherein the first circuit comprises a control circuit, and the second circuit comprises a power supply circuit for electrically connecting with a light emitting unit;

the upper circuit board is provided with a hollow area, and the area for arranging the light-emitting unit on the lower circuit board is positioned below the hollow area, so that light emitted by the light-emitting unit is emitted through the hollow area.

4. The circuit board assembly of claim 2, wherein the first circuit comprises a power supply circuit for electrically connecting with a light emitting unit and the second circuit comprises a control circuit.

5. The circuit board assembly of claim 1, wherein said upper circuit board is positioned above said lower circuit board, said first circuit and said conductive vias being disposed on said lower circuit board, said second circuit and said conductive posts being disposed on said upper circuit board.

6. The circuit board assembly of claim 5, wherein the first circuit comprises a control circuit and the second circuit comprises a power supply circuit for electrically connecting to a light emitting unit.

7. The circuit board assembly of claim 5, wherein the first circuit comprises a power supply circuit for electrically connecting with a light emitting unit, the second circuit comprises a control circuit,

the upper circuit board is provided with a hollow area, and the area for arranging the light-emitting unit on the lower circuit board is positioned below the hollow area, so that light emitted by the light-emitting unit is emitted through the hollow area.

8. The circuit board assembly of any one of claims 1-7, wherein the conductive via is a through hole extending through the circuit board, the conductive layer being disposed on a sidewall of the through hole.

9. The circuit board assembly of any one of claims 1-7, wherein the conductive via is a blind via that does not extend through the circuit board, and wherein the conductive layer is disposed on at least one of a sidewall and a bottom wall of the blind via.

10. A lighting device which is a downlight or a downlight comprising the circuit board assembly according to any one of claims 1 to 9.

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