CN216304009U

CN216304009U - Surface treatment device

Info

Publication number: CN216304009U
Application number: CN202122379010.9U
Authority: CN
Inventors: 何佳佳; 彭肖林; 屈伟伟; 王庆福; 郭晓岩; 冯宝鑫; 孙庆威
Original assignee: Lingbao Wason Copper Foil Co Ltd
Current assignee: Lingbao Wason Copper Foil Co Ltd
Priority date: 2021-09-29
Filing date: 2021-09-29
Publication date: 2022-04-15
Anticipated expiration: 2031-09-29

Abstract

The utility model discloses a surface treatment device, which comprises an upper guide roller, a submerged roller, a conductive roller, a submerged roller, a liquid return pipe and a spray pipe. The spray pipe is arranged at the upper part of the submerged roller. The length of the spray pipe is set to 1350-; two rows of spraying holes are arranged, and the included angle between the two rows of spraying holes is a right angle; the inner diameter of the spray pipe is phi 25-32mm, the aperture is phi 1.0-1.2mm, and the hole spacing is 2-3 cm. The spray pipe is preferably provided with two rows of spray holes, and the included angle between the two rows of spray holes is preferably a right angle. The quality problem caused by the defects of surface oxidation, stain, inclusion crystallization and the like of the copper foil is solved.

Description

Surface treatment device

Technical Field

The utility model relates to the technical field of electrolytic copper foil production, in particular to a surface treatment device.

Background

The circuit board foil is a main material for manufacturing the PCB, and the copper foil and the resin basal layer are generally laminated into a copper-clad plate under the heating and pressurizing conditions. In order to meet the requirement of users for producing the non-adhesive printed circuit board, the raw foil produced by the electrolytic copper foil needs to be subjected to surface treatment so as to ensure that the copper foil and the insulating base material have enough bonding strength under the condition of no adhesive. However, due to the electroplating reaction and the heat release of the conductive roller, the foil surface is easy to generate oxidation discoloration, stain and foil breakage abnormity, and the fluctuation of the solution is easy to cause uneven electroplating, so that the peeling strength of the copper foil is reduced; when the copper foil enters the next electrolytic tank after the electrolytic tank is electroplated, the copper foil is easy to carry with crystals due to the high linear speed, so that the abnormal crystallization of the copper foil clamp is caused.

SUMMERY OF THE UTILITY MODEL

In order to solve the defects, the utility model provides a surface treatment device, which solves the quality problem caused by the defects of surface oxidation, stain, inclusion crystallization and the like of the copper foil.

A surface treatment device comprises an upper guide roller, a submerged roller, a conductive roller, a submerged roller, a liquid return pipe and a spray pipe, wherein the spray pipe is arranged at the upper part of the submerged roller, and the length of the spray pipe is 1350-; the spray holes are arranged in two rows, the radial included angle of the two rows of spray holes is a right angle, the inner diameter phi of the spray pipe is 25-32mm, the hole diameter phi is 1.0-1.2mm, and the hole distance is 2-3 cm.

The utility model has the beneficial effects that:

1. the utility model adopts spraying and liquid feeding, thereby avoiding the defects of oxidation discoloration and stain caused by the fluctuation of the solution in the electrolytic bath; the copper foil is electroplated in a spraying mode, so that the electroplating uniformity is ensured, and the quality of the copper foil is stabilized.

2. The utility model adopts the spray pipe to avoid the problem of uneven electroplating caused by insufficient upper liquid flow. The shower is preferred to be provided with two rows of spraying holes, and two rows of spraying hole contained angles are preferred to be the right angle, and the corresponding parameter of shower is specific setting, obtains splendid technological effect in actual operation.

3. And the electrolyte is sprayed to the foil surface through one row of spraying holes. On one hand, the temperature of the copper foil is reduced, the foil breakage caused by subsequent electroplating (the current of the 3-conductive roller is larger during electroplating, and the temperature of the copper foil is higher due to heat release) is prevented, and on the other hand, the foil surface is washed, so that the defects of oxidation color difference, stain, clamp crystallization and the like of the foil surface are reduced. Solves the technical problem of difficulty faced in the technical field at present, has higher technical value and huge application and development potential.

4. As the electroplating conditions have certain parameter requirements on the electroplating solution, the electrolyte can crystallize on the spray pipe, aiming at the technical problem, in order to achieve better technical effect, the other row of spray holes are sprayed upwards to be sprayed on the spray pipe, so that the generation of crystallization at the aperture of the spray pipe is avoided, and good technical effect is achieved in practice.

Drawings

FIG. 1 is a schematic structural diagram of a surface treatment apparatus according to the present invention.

Fig. 2 is a schematic structural view of the shower pipe.

Fig. 3 is a schematic view of a shower.

Detailed Description

Examples

Referring to fig. 1-3, a surface treatment device comprises an upper guide roller 1, a submerged roller 2, a conductive roller 3, a submerged roller 4, a liquid return pipe 6 and a spray pipe 7. The spray pipe 7 is arranged at the upper part of the submerged roller 4. The length of the spray pipe is set to 1350-; two rows of spraying holes are arranged, and the included angle between the two rows of spraying holes is a right angle; the inner diameter of the spray pipe is phi 25-32mm, the aperture is phi 1.0-1.2mm, and the hole spacing is 2-3 cm.

This device is when using, and the copper foil gets into the left side electrolysis trough through the direction of last deflector roll 1, and this cell body solution high purity water carries out surface cleaning to the copper foil, and the conducting roller 3 is gone up in the direction through roller 2 under water, and the conducting roller provides the electric current, then leading-in right side electrolysis trough, and this cell body solution is the plating solution, and the copper foil carries out surface plating here.

Because the device is provided with radial vertical spraying holes, the electrolyte is sprayed to the foil surface through one row of the spraying holes. On one hand, the temperature of the copper foil is reduced, the foil breakage (large current and high temperature of the copper foil) in the subsequent electroplating is prevented, on the other hand, the foil surface is washed, and the defects of oxidation color difference, uneven plating amount, clamp crystallization and the like of the foil surface are reduced. Because the electroplating condition has certain parameter requirements on the electroplating solution, the electrolyte can generate crystallization on the spray pipe, and the other row of spray holes are sprayed upwards to be sprayed on the spray pipe, so that the generation of crystallization at the aperture of the spray pipe is avoided.

Claims

1. A surface treatment device characterized by: the device comprises an upper guide roller, a lower submerged roller, a conductive roller, a lower submerged roller, a liquid return pipe and a spray pipe, wherein the spray pipe is arranged at the upper part of the lower submerged roller, and the length of the spray pipe is 1350-; the spray holes are arranged in two rows, the radial included angle of the two rows of spray holes is a right angle, the inner diameter phi of the spray pipe is 25-32mm, the hole diameter phi is 1.0-1.2mm, and the hole distance is 2-3 cm.