CN115418689A - Smart card carrier band film-coating palladium-plating process - Google Patents
Smart card carrier band film-coating palladium-plating process Download PDFInfo
- Publication number
- CN115418689A CN115418689A CN202211372997.4A CN202211372997A CN115418689A CN 115418689 A CN115418689 A CN 115418689A CN 202211372997 A CN202211372997 A CN 202211372997A CN 115418689 A CN115418689 A CN 115418689A
- Authority
- CN
- China
- Prior art keywords
- plating
- palladium
- film
- product
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
- C25D7/0678—Selective plating using masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention belongs to the technical field of chemical electroplating, and particularly relates to a film-coating palladium plating process for a smart card carrier tape. The method comprises the following procedures of deoiling, activating, nickel plating, pre-gold plating, film coating, palladium plating on a contact surface, film tearing and drying. Firstly, sodium hydroxide and sulfuric acid are used for carrying out deoiling and activating treatment on the product, and the surface of the product is cleaned. Then, nickel plating and pre-gold plating are carried out on the product, nickel plating is carried out on the contact surface and the pressure welding surface of the product at the same time, flash gold plating is carried out on the contact surface, and soft gold plating is carried out on the pressure welding surface; then, laminating a film on the press welding surface of the product, shielding the soft gold plating layer, and plating palladium on the contact surface; and finally, tearing off the adhesive film coated on the pressure welding surface by using an on-line film tearing machine, cleaning by using deionized water, and drying to finish the palladium plating process. The process can separate the gold plating tank from the palladium plating tank, completely avoids the problem that the liquid medicine of the soft gold tank is polluted by palladium ions, has pure color of products produced by the film-covered palladium plating process and small process difficulty, reduces the thickness of a plating layer, and realizes the mass production of palladium plating products.
Description
Technical Field
The invention belongs to the technical field of chemical electroplating, and particularly relates to a film-coating palladium plating process for a smart card carrier tape.
Background
In the prior art, a palladium plating product generally adopts a palladium plating process, namely palladium plating is firstly carried out and then soft gold plating is carried out. In the operation process of the one-time palladium plating process, palladium ions enter the soft gold groove along with the product to pollute the soft gold liquid medicine, the palladium ions are accumulated in the soft gold liquid medicine groove along with the increase of the product yield to cause the concentration of the palladium ions in the soft gold groove to exceed the standard, the concentration of the palladium ions in the soft gold liquid medicine groove reaches the control upper limit of 0.3g/L, the palladium plating product can not be produced any more, and no effective method is used for removing the palladium ions.
The palladium plating process requires a thicker palladium plating layer, the palladium plating layer needs more than 0.03 mu m to meet the appearance requirement of the product, and the palladium salt used for electroplating is a noble metal, so the cost is higher. And the product produced by the process has gold precipitation, so that the color of the product is yellow, the product is shielded by a mould and colloidal particles, the process difficulty is high and unstable, and the problems of palladium leakage and the like are easy to occur in the production process of the product.
Chinese patent CN201210289688.0, the disclosure time is 2015.3.15. The invention discloses a lead frame ultrathin palladium plating and gold plating process, which comprises the following steps: electrolytic degreasing, lead frame matrix activation treatment, electrodeposition nickel plating layer, nickel layer activation treatment, electrodeposition palladium plating thin layer and high-frequency pulse electrodeposition gold plating thin layer: and (3) putting the lead frame substrate plated with palladium into a gold plating solution for electrodeposition for 10-20s, then washing with gold recovered water, blow-drying and carrying out gold protection. However, the palladium plating layer is thick, and the problem that the gold bath liquid medicine is polluted by palladium ions cannot be avoided.
In conclusion, the prior art can realize the process of plating palladium first and then plating gold, but the process can not solve the problems that the liquid medicine of the soft gold tank is polluted by palladium ions, and the problems that the palladium plating layer is thick and the production cost is high.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a film-coating palladium plating process for a carrier tape of an intelligent card, which adopts the film-coating palladium plating process, firstly pre-plating gold to plate flash gold on a contact surface and plating soft gold on a press welding surface, then coating the press welding surface and plating palladium on the contact surface, so that a gold-plating tank and a palladium-plating tank are separated, and the problem that the liquid medicine of the soft gold tank is polluted by palladium ions is completely avoided. The mass production of palladium plating products is realized. And the product produced by the film-coating palladium plating process has pure color, simple process, small difficulty and easy operation. The film-covered palladium plating process can reduce the thickness of a plating layer, the plating layer reaches 0.015 mu m and can meet the appearance requirement of a product, and the cost can be greatly reduced by adopting the film-covered palladium plating process.
The technical scheme adopted by the invention is as follows:
the process for coating the film and plating the palladium on the intelligent card carrier band is characterized by comprising the following working procedures of oil removal, activation, nickel plating, pre-gold plating, film coating, palladium plating on a contact surface, film tearing and drying; the method specifically comprises the steps of carrying out deoiling and activating treatment on a product, and cleaning the surface of the product to remove an oxidation film possibly existing on the surface; then, carrying out nickel plating and pre-gold plating treatment on the product, simultaneously plating nickel on the contact surface and the pressure welding surface of the product, plating flash gold on the contact surface, and plating soft gold on the pressure welding surface; then, laminating a film on the press welding surface of the product, shielding the soft gold plating layer, and plating palladium on the contact surface; and finally, tearing off the adhesive film coated on the pressure welding surface by using an on-line film tearing machine, cleaning by using deionized water, and drying to finish the palladium plating process.
In the oil removing process, sodium hydroxide or potassium hydroxide is used as an electrolytic degreasing agent to clean the surface of the product, a sodium hydroxide solution with the concentration of 110-130g/L is preferred, the oil removing temperature is 50-70 ℃, and the carrier band is cleaned by ultrasonic waves and a cathode oil removing mode.
In the activation procedure, sulfuric acid is used for pickling the surface of the product, preferably a sulfuric acid solution with the concentration range of 190-230mL/L, and the activation temperature is 20-30 ℃ so as to remove an oxidation film possibly existing on the surface.
In the nickel plating process, the nickel plating solution is one of nickel sulfamate, nickel sulfate, nickel acetate, nickel chloride and nickel hypophosphite, preferably nickel sulfamate plating solution with the concentration of 110-140g/L, so that a product is connected with a direct-current power supply cathode, nickel metal is added into a titanium basket to be used as an anode to carry out nickel electroplating on the product, the nickel plating temperature is 50-70 ℃, the current density is 3-6ASD, and the electroplating time is 1-3min.
In the pre-gold plating process, firstly, gold flash plating is carried out on the contact surface of the product, then soft gold plating is carried out on the press-welding surface of the product, the gold flash plating and gold plating liquid medicine is one of gold potassium cyanide and gold potassium citrate gold plating liquid, preferably, the gold potassium cyanide gold plating liquid has the concentration of 1-3g/L, the temperature of 40-50 ℃, the current density of 0.1-0.3ASD and the electroplating time of 3-8S. And plating soft gold on the pressure welding surface, wherein the gold plating liquid is one of gold potassium cyanide and gold potassium citrate, the gold potassium cyanide plating liquid is preferably selected, the concentration is 11-15g/L, the electroplating temperature is 60-70 ℃, the current density is 2-7ASD, and the electroplating time is 8-15S.
In the film laminating process, the adhesive film is an acid and alkali resistant adhesive film with self viscosity, the adhesive film is made of one of PVC (polyvinyl chloride), PET (polyethylene terephthalate) and PI (polyimide), the adhesive strength of the adhesive film is 100-160Kg/25mm, the film laminating temperature range is 20-40 ℃, the film laminating pressure range is 0.5-2MPa, and a laminating machine is used for laminating the press-welded surface of the product.
In the working procedure of palladium plating on the contact surface, the palladium plating liquid is one of tetraammine palladium chloride and ethylenediamine ammonium sulfate palladium plating liquid, preferably ethylenediamine ammonium sulfate palladium with the concentration of 10-16g/L, the palladium plating temperature of 40-50 ℃, the current density of 5-10ASD and the plating time of 10-20S, so that the product is connected with a direct current power supply cathode, and a platinum titanium net is used as an anode to carry out palladium metal plating on the contact surface of the product.
In the film tearing process, an on-line film tearing machine is used for tearing the film.
In the drying procedure, deionized water is used for washing the product, and an oven is used for drying the product, wherein the drying temperature is 75-85 ℃, and the drying time is 8-15S.
Compared with the prior art, the invention has the following beneficial effects:
(1) The film-coating palladium plating process comprises the steps of plating flash gold on the contact surface of a product, plating soft gold on the press-welding surface of the product, coating a film on the press-welding surface, plating palladium on the contact surface, and separating a gold plating tank from a palladium plating tank, so that the problem that the liquid medicine in the soft gold tank is polluted by palladium ions is completely avoided, and the mass production of palladium-plated products is realized;
(2) The cost can be greatly reduced by adopting the film-covered palladium plating process, the thickness of the palladium plating layer is required to be thicker by one-time palladium plating process, the appearance requirement of the product can be met only by the palladium plating layer of more than 0.03 mu m, the cost is higher because the palladium salt used for electroplating is a noble metal, the thickness of the plating layer can be reduced by the film-covered palladium plating process, and the appearance requirement of the product can be met when the plating layer reaches 0.015 mu m;
(3) The film-covered palladium plating process does not need a mould and colloidal particles to shield the product during palladium plating, has small process difficulty, is easy to operate, has stable production line operation, and does not have the problems of palladium leakage and the like in the production process of the product;
(4) The film-coating palladium plating process can solve the problem that the color of the contact surface of the one-time palladium plating process is yellow, and the product produced by the film-coating palladium plating process is purer in color.
Drawings
FIG. 1 is a flow chart of the process for coating a film on a smart card carrier tape with palladium according to the present invention.
FIG. 2 shows the palladium metal ion concentration in the soft gold bath in each example and comparative example measured by an atomic absorption spectrophotometer at a yield of 3000 ten thousand pieces.
Detailed Description
The present invention is further illustrated by the following examples, which are not intended to limit the practice of the invention.
The production process adopted in the embodiment comprises the following steps of oil removal, activation, nickel plating, pre-gold plating, film coating, palladium plating on a contact surface, film tearing and drying.
Example 1
A normal intelligent card carrier tape 100 meters is used as a test substrate, and the use process flow of the electroplating line is as follows:
oil removal: preparing sodium hydroxide with the concentration of 120g/L as an oil removing liquid medicine, heating the liquid medicine to 60 ℃, and cleaning the carrier band by using ultrasonic waves and a cathode electrolysis oil removing mode;
and (3) activation: in a 25 ℃ state, using a sulfuric acid solution with the concentration of 200mL/L as an activating solution to carry out acid cleaning on the surface of a product, and carrying out acid oxidation removal treatment on the product to remove an oxidation film possibly existing on the surface;
nickel plating: the nickel plating solution is composed of nickel sulfamate, the concentration is 120g/L, the temperature is heated to 60 ℃, the product is connected with a direct current power supply cathode, nickel metal is added into a titanium basket as an anode to carry out nickel electroplating on the product, and 5ASD current density electroplating is used for 2 minutes;
pre-gold plating: plating gold flash on the contact surface of the product, wherein the gold plating liquid is gold potassium cyanide plating solution with the concentration of 2g/L, heating to 45 ℃, and electroplating for 5S by using 0.15ASD current density; carrying out soft gold electroplating on the pressure welding surface, wherein the main component of a gold plating liquid medicine is potassium aurous cyanide, the concentration is 13g/L, the product is connected with a direct current power supply cathode, a platinum titanium net is used as an anode to carry out electroplating on the pressure welding surface of the product, the temperature is heated to 65 ℃, and 5ASD current density electroplating is used for 12S;
film covering: laminating the product press-welded surface by adopting a PVC (polyvinyl chloride) adhesive film with self viscosity, wherein the adhesive strength of the adhesive film is 130Kg/25mm, laminating the product press-welded surface by using a laminating machine, wherein the laminating temperature is 25 ℃, and the laminating pressure is 1MPa;
plating palladium on the contact surface: carrying out palladium metal electroplating on the contact surface, wherein the main component of the plating solution is ethylenediamine palladium ammonium sulfate plating solution with the concentration of 12g/L, heating to 45 ℃, and electroplating for 15S by using 8ASD current density to finish palladium plating;
and (3) film tearing: tearing off the PVC material adhesive film by using an on-line film tearing machine;
and washing the product by using deionized water, and drying at the drying temperature of 80 ℃ for 12S.
Example 2
A normal intelligent card carrier belt is used as a test substrate for 100 meters, and the use process flow in a continuous high-speed electroplating line is as follows:
oil removal: preparing sodium hydroxide with the concentration of 110g/L as an oil removing liquid medicine, heating to 70 ℃, and cleaning the carrier band by using ultrasonic waves and a cathode electrolysis oil removing mode;
and (3) activation: pickling the surface of the product by using a sulfuric acid solution with the concentration of 190mL/L as an activating solution at the temperature of 30 ℃, and carrying out acid oxidation removal treatment on the product to remove an oxide film possibly existing on the surface;
nickel plating: the nickel plating solution comprises the components of sulfamic acid nickel plating solution, the concentration is 110g/L, the temperature is heated to 70 ℃, the product is connected with the cathode of a direct current power supply, nickel metal is added into a titanium basket as the anode to carry out nickel electroplating on the product, and 6ASD current density is used for electroplating for 3 minutes;
pre-gold plating: plating gold flash on the contact surface of the product, wherein the gold plating liquid is gold potassium cyanide plating solution with the concentration of 1g/L, heating to 50 ℃, and electroplating for 8S by using 0.3ASD current density; soft gold electroplating is carried out on the pressure welding surface, the main component of a gold plating liquid is aurous potassium cyanide, the concentration is 11g/L, the product is connected with a direct current power supply cathode, a platinum titanium net is used as an anode to electroplate the pressure welding surface of the product, the temperature is heated to 70 ℃, and 7ASD current density electroplating is carried out for 15S;
film covering: laminating the product press-welded surface by adopting a PI adhesive film with viscosity, wherein the adhesive strength of the adhesive film is 100Kg/25mm, laminating the product press-welded surface by using a laminating machine, the laminating temperature is 20 ℃, and the laminating pressure is 2MPa;
plating palladium on a contact surface: carrying out palladium metal electroplating on the contact surface, wherein the main component of the plating solution is ethylenediamine ammonium sulfate palladium plating solution, the concentration is 10g/L, the temperature is heated to 50 ℃, and 10ASD current density is used for electroplating for 20S to finish palladium plating;
and (3) film tearing: tearing off the PI glue film by using an on-line film tearing machine;
and washing the product by using deionized water, and drying at 75 ℃ for 15S.
Example 3
The normal intelligent card carrier tape 100 meters is used as a test substrate, and the process flow used in a continuous high-speed electroplating line is as follows:
oil removal: preparing 130g/L sodium hydroxide as an oil removing liquid medicine, heating to 50 ℃, and cleaning the carrier band by using ultrasonic waves and a cathode electrolysis oil removing mode;
and (3) activation: in the state of 20 ℃, using a sulfuric acid solution with the concentration of 230mL/L as an activating solution to carry out acid washing on the surface of the product, and carrying out acid oxidation treatment on the product to remove an oxide film possibly existing on the surface;
nickel plating: the nickel plating solution comprises the components of nickel sulfamate nickel plating solution, the concentration is 140g/L, the temperature is heated to 50 ℃, the product is connected with a direct-current power supply cathode, nickel metal is added into a titanium basket to be used as an anode to carry out nickel electroplating on the product, and 3ASD current density electroplating is used for 1 minute;
pre-gold plating: plating gold flash on the contact surface of the product, wherein the gold plating liquid is gold potassium cyanide plating solution with the concentration of 3g/L, heating to 40 ℃, and electroplating for 3S by using 0.1ASD current density; soft gold electroplating is carried out on the pressure welding surface, the main component of a gold plating liquid is aurous potassium cyanide, the concentration is 15g/L, the product is connected with a direct current power supply cathode, a platinum titanium net is used as an anode to electroplate the pressure welding surface of the product, the temperature is heated to 50 ℃, and 2ASD current density electroplating is carried out for 8S;
film covering: laminating the product press-welded surface by using a PET (polyethylene terephthalate) adhesive film with viscosity, wherein the adhesive strength of the adhesive film is 160Kg/25mm, laminating the product press-welded surface by using a laminating machine, and the laminating temperature is 40 ℃ and the laminating pressure is 0.5MPa;
plating palladium on the contact surface: carrying out palladium metal electroplating on the contact surface, wherein the main component of the plating solution is ethylenediamine palladium ammonium sulfate plating solution with the concentration of 16g/L, heating to 40 ℃, and electroplating for 10S by using 5ASD current density to finish palladium plating;
and (3) film tearing: tearing off the PET material adhesive film by using an on-line film tearing machine;
and washing the product with deionized water, and drying at 85 ℃ for 8S.
Comparative example 1
The electroplating process flow comprises the following steps: degreasing, activating, nickel plating, pre-gold plating of a contact surface, palladium plating of the contact surface, soft gold plating of a press welding surface and drying.
The normal intelligent card carrier tape 100 meters is used as a test substrate, and the process flow used in a continuous high-speed electroplating line is as follows:
oil removal: preparing sodium hydroxide with the concentration of 120g/L as an oil removing liquid medicine, heating to 60 ℃, and cleaning the carrier band by using ultrasonic waves and a cathode electrolysis oil removing mode;
and (3) activation: in a 25 ℃ state, using a sulfuric acid solution with the concentration of 200mL/L as an activating solution to carry out acid cleaning on the surface of a product, and carrying out acid oxidation removal treatment on the product to remove an oxidation film possibly existing on the surface;
nickel plating: the nickel plating solution comprises nickel sulfamate with the concentration of 120g/L, the temperature is heated to 60 ℃, the product is connected with the cathode of a direct current power supply, nickel metal is added into a titanium basket to be used as the anode to carry out nickel electroplating on the product, and 5ASD current density electroplating is used for 2 minutes;
pre-plating gold on the contact surface: plating flash gold on the contact surface of the product, heating the plating solution to 50 ℃ by using gold potassium cyanide plating solution, and electroplating for 5 seconds by using 0.15ASD current density;
plating palladium on the contact surface: carrying out palladium metal electroplating on the contact surface, wherein the liquid medicine of the plating solution is ethylenediamine palladium ammonium sulfate plating solution, the concentration is 15g/L, the temperature is heated to 45 ℃, and 15ASD current density electroplating is carried out for 20S;
plating soft gold on the press welding surface: soft gold electroplating is carried out on the pressure welding surface, the main component of a gold plating liquid medicine is aurous potassium cyanide, the concentration is 13g/L, the product is connected with a direct current power supply cathode, a platinum titanium net is used as an anode to electroplate the pressure welding surface of the product, the temperature is heated to 65 ℃, and 5ASD current density electroplating is carried out for 12S;
and washing the product by using deionized water, and drying at the drying temperature of 80 ℃ for 12S.
The test method comprises the following steps:
when the yield reached 3000 ten thousand pieces, the palladium metal ion concentration in the soft gold bath in each example and comparative example was measured by an atomic absorption spectrophotometer, and the test results are shown in fig. 2.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (9)
1. A smart card carrier band film-coating palladium plating process is characterized by comprising the following working procedures of oil removal, activation, nickel plating, pre-gold plating, film coating, palladium plating on a contact surface, film tearing and drying; the method specifically comprises the steps of carrying out oil removal activation treatment on a product, and cleaning the surface of the product; then, carrying out nickel plating and pre-gold plating treatment on the product, simultaneously plating nickel on the contact surface and the pressure welding surface of the product, plating flash gold on the contact surface, and plating soft gold on the pressure welding surface; then, laminating a film on the press welding surface of the product, shielding the soft gold plating layer, and plating palladium on the contact surface; and finally, tearing off the adhesive film coated on the press-welding surface by using an on-line film tearing machine, cleaning by using deionized water, and drying to finish the palladium plating process.
2. The smart card carrier tape film-coating palladium-plating process according to claim 1, wherein in the degreasing process, sodium hydroxide and potassium hydroxide are used as electrolytic degreasing agents, and the carrier tape is cleaned by ultrasonic waves and a cathode degreasing mode, wherein the degreasing temperature is 50-70 ℃.
3. The process for coating the smart card carrier tape with palladium according to claim 1, wherein in the activation step, sulfuric acid is used for pickling the surface of the product to remove the oxide film possibly existing on the surface, and the activation temperature is 20-30 ℃.
4. The smart card carrier tape film-coating palladium plating process according to claim 1, wherein in the nickel plating process, the nickel plating solution comprises one of nickel sulfamate, nickel sulfate, nickel acetate, nickel chloride and nickel hypophosphite, the nickel plating temperature is 50-70 ℃, the current density range is 3-6ASD, and the electroplating time range is 1-3min.
5. The process for coating the film and plating the palladium on the smart card carrier tape according to claim 1, wherein in the pre-gold plating step, the flash gold plating is performed on the contact surface of the product, and then the soft gold plating is performed on the bonding surface of the product, the flash gold plating solution is one of gold potassium cyanide plating solution and gold potassium citrate plating solution, the temperature is 40-50 ℃, the current density is 0.1-0.3ASD, the plating time is 3-8S, the soft gold plating solution for plating the bonding surface is one of gold potassium cyanide plating solution and gold potassium citrate plating solution, the temperature is 60-70 ℃, the current density is 2-7ASD, and the plating time is 8-15S.
6. The process of claim 1, wherein the adhesive film is an acid and alkali resistant adhesive film with self-adhesive properties, the adhesive film is one of PVC, PET, and PI, the adhesive strength of the adhesive film is 100-160Kg/25mm, the coating temperature is 20-40 ℃, and the coating pressure is 0.5-2MPa.
7. The smart card carrier tape film-coating palladium plating process according to claim 1, wherein in the contact surface palladium plating process, palladium plating liquid is one of tetraamminepalladium chloride and ethylenediamine palladium ammonium sulfate plating liquid, the palladium plating temperature is 40-50 ℃, the current density is 5-10ASD, and the electroplating time is 10-20S.
8. The smart card carrier tape film-coating palladium-plating process according to claim 1, wherein in the film tearing process, an on-line film tearing machine is used for film tearing.
9. The smart card carrier tape film-coating palladium-plating process according to claim 1, wherein in the drying procedure, deionized water is used for washing the product, and an oven is used for drying the product, wherein the drying temperature is 75-85 ℃, and the drying time is 8-15S.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211372997.4A CN115418689B (en) | 2022-11-04 | 2022-11-04 | Film-covering palladium plating process for smart card carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211372997.4A CN115418689B (en) | 2022-11-04 | 2022-11-04 | Film-covering palladium plating process for smart card carrier tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115418689A true CN115418689A (en) | 2022-12-02 |
| CN115418689B CN115418689B (en) | 2023-04-07 |
Family
ID=84208189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211372997.4A Active CN115418689B (en) | 2022-11-04 | 2022-11-04 | Film-covering palladium plating process for smart card carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115418689B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117976551A (en) * | 2024-04-02 | 2024-05-03 | 新恒汇电子股份有限公司 | Smart card capable of recycling carrier tape and preparation method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5882955A (en) * | 1997-04-09 | 1999-03-16 | Sitron Precision Co., Ltd. | Leadframe for integrated circuit package and method of manufacturing the same |
| US20020070434A1 (en) * | 1999-12-10 | 2002-06-13 | Abbott Donald C. | Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| US20030011048A1 (en) * | 1999-03-19 | 2003-01-16 | Abbott Donald C. | Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered |
| JP2006086201A (en) * | 2004-09-14 | 2006-03-30 | Shinei Hitec:Kk | Flexible wiring board and surface treating method therefor |
| US20100078785A1 (en) * | 2008-09-29 | 2010-04-01 | Sumitomo Metal Mining Co., Ltd. | Lead frame and method of manufacturing the same |
| US20100089613A1 (en) * | 2008-03-19 | 2010-04-15 | Matsuda Sangyo Co., Ltd. | Electronic component and method for manufacturing the same |
| JP2011236509A (en) * | 2011-09-02 | 2011-11-24 | Sumitomo Metal Mining Co Ltd | Method of manufacturing lead frame |
| CN102817055A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Ultrathin palladium plating and gold plating process for lead wire frame |
| CN104485317A (en) * | 2014-12-24 | 2015-04-01 | 恒汇电子科技有限公司 | IC (integrated circuit) packaged carrier tape and preparation method thereof |
| CN111785701A (en) * | 2020-07-24 | 2020-10-16 | 宁波康强电子股份有限公司 | Pre-electroplated nickel-palladium-gold lead frame and preparation method thereof |
| CN113279031A (en) * | 2021-04-14 | 2021-08-20 | 赛肯电子(徐州)有限公司 | Plating process of lead frame |
-
2022
- 2022-11-04 CN CN202211372997.4A patent/CN115418689B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5882955A (en) * | 1997-04-09 | 1999-03-16 | Sitron Precision Co., Ltd. | Leadframe for integrated circuit package and method of manufacturing the same |
| US20030011048A1 (en) * | 1999-03-19 | 2003-01-16 | Abbott Donald C. | Semiconductor circuit assembly having a plated leadframe including gold selectively covering areas to be soldered |
| US20020070434A1 (en) * | 1999-12-10 | 2002-06-13 | Abbott Donald C. | Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication |
| JP2006086201A (en) * | 2004-09-14 | 2006-03-30 | Shinei Hitec:Kk | Flexible wiring board and surface treating method therefor |
| US20100089613A1 (en) * | 2008-03-19 | 2010-04-15 | Matsuda Sangyo Co., Ltd. | Electronic component and method for manufacturing the same |
| US20100078785A1 (en) * | 2008-09-29 | 2010-04-01 | Sumitomo Metal Mining Co., Ltd. | Lead frame and method of manufacturing the same |
| JP2011236509A (en) * | 2011-09-02 | 2011-11-24 | Sumitomo Metal Mining Co Ltd | Method of manufacturing lead frame |
| CN102817055A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Ultrathin palladium plating and gold plating process for lead wire frame |
| CN104485317A (en) * | 2014-12-24 | 2015-04-01 | 恒汇电子科技有限公司 | IC (integrated circuit) packaged carrier tape and preparation method thereof |
| CN111785701A (en) * | 2020-07-24 | 2020-10-16 | 宁波康强电子股份有限公司 | Pre-electroplated nickel-palladium-gold lead frame and preparation method thereof |
| CN113279031A (en) * | 2021-04-14 | 2021-08-20 | 赛肯电子(徐州)有限公司 | Plating process of lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117976551A (en) * | 2024-04-02 | 2024-05-03 | 新恒汇电子股份有限公司 | Smart card capable of recycling carrier tape and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115418689B (en) | 2023-04-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4576685A (en) | Process and apparatus for plating onto articles | |
| CN115418689B (en) | Film-covering palladium plating process for smart card carrier tape | |
| CN1693576A (en) | Preparation method of conductive dacron fabric for electromagnetic wave shielding | |
| CN105483795B (en) | A kind of method that compound copper nano-wire is prepared using underpotential deposition technology | |
| CN109023495A (en) | A kind of continuous glass electroplating assembly line of annular vertical | |
| US20180202048A1 (en) | Process for metallizing plastic surfaces | |
| CN106400070A (en) | Electroplating method for partial silver-plating for iron substrate lead frame | |
| CN209210961U (en) | A kind of continuous glass electroplating assembly line of annular vertical | |
| CN114059120A (en) | Laser pump source chip base and new process for plating and silver plating on tube shell | |
| CN109487088A (en) | A kind of waste and old plating piece gradient recycling metal process of copper-based nickel plating-Gold plated Layer | |
| CN105648485B (en) | A kind of cyanogen-free silver-plating solution | |
| CN213977941U (en) | Auxiliary groove for preventing copper plating of conductive roller on upper side of coating film | |
| US4552627A (en) | Preparation for improving the adhesion properties of metal foils | |
| CN111826695A (en) | Electroplating process for LED lead frame | |
| US2966448A (en) | Methods of electroplating aluminum and alloys thereof | |
| CN103806063A (en) | Method for electroplating silver on molybdenum foil surface | |
| CN113355672A (en) | Electroplating process of aluminum alloy pier pressing part | |
| JPS6056073A (en) | Method for coating ceramic substrate with partially thick gold film | |
| CN109267115A (en) | A kind of copper components nickel plating process | |
| CN216304009U (en) | Surface treatment device | |
| JPS586999A (en) | Method and device for automatic continuous electroplating | |
| CN110484900A (en) | A kind of Novel horizontal electroless copper plating ionic palladium activating solution | |
| JP2005146330A (en) | Surface treatment method for non-conductor material | |
| CN106242314A (en) | A kind of glass copper-plating technique | |
| CN115747907B (en) | Multifunctional composite electroplated layer of optocoupler lead frame and preparation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |