CN216290638U - Power management module with good heat dissipation performance - Google Patents
Power management module with good heat dissipation performance Download PDFInfo
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- CN216290638U CN216290638U CN202122418452.XU CN202122418452U CN216290638U CN 216290638 U CN216290638 U CN 216290638U CN 202122418452 U CN202122418452 U CN 202122418452U CN 216290638 U CN216290638 U CN 216290638U
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Abstract
The utility model relates to a power management module with good heat dissipation performance, which comprises: the power supply management module comprises a power supply management module body, a voltage division unit, a chip and a heat dissipation unit, wherein the voltage division unit is arranged on one surface of the power supply management module body and is used for dividing voltage of a power supply; the chip is arranged on one surface of the power management module body and is positioned on the side edge of the voltage division unit; the heat dissipation unit comprises a heat dissipation block, a cooling box and a first cooling fan, wherein the heat dissipation block is arranged on the other surface of the power management module body, the heat dissipation block is provided with a containing cavity, the cooling box is arranged in the containing cavity, cooling liquid used for accelerating heat dissipation is arranged in the cooling box, the heat dissipation block is far away from the surface of the power management module body, and the first cooling fan is embedded in the opening. According to the utility model, the rapid heat dissipation of the power management module is realized, and the damage to the power module caused by overhigh temperature of the circuit board is avoided.
Description
Technical Field
The utility model relates to the technical field of power management modules, in particular to a power management module with good heat dissipation performance.
Background
The power supply module is a power supply device which can be directly attached to a printed circuit board, and is characterized by that it can provide power supply for special-purpose integrated circuit, digital signal processor, microprocessor, memory, field programmable gate array and other digital or analog loads.
The module power has the isolation effect, the interference killing feature is strong, from taking protect function, be convenient for integrate, along with semiconductor technology, a large amount of uses of packaging technology and high frequency soft switch, module power density is bigger and bigger, conversion efficiency is higher and higher, it is also simpler and simpler to use, power management module also belongs to power module, power module can produce the heat in the course of the work, the circuit board during operation also can produce the heat, the radiating effect and the barrier propterty of current low-loss partial pressure formula power management module self are not good enough, can damage the circuit board when the high spark of power management module temperature, can damage power module when the circuit board temperature is too high.
SUMMERY OF THE UTILITY MODEL
In order to solve the above technical problem or at least partially solve the above technical problem, the present application provides a power management module with good heat dissipation performance, which aims to solve the problem of poor heat dissipation performance of the existing power management module.
The application provides a power management module that heat dispersion is good includes: a power management module body, a voltage division unit, a chip and a heat dissipation unit,
the voltage division unit is arranged on one surface of the power management module body and is used for dividing voltage of a power supply;
the chip is arranged on one surface of the power management module body and is positioned on the side edge of the voltage division unit;
the heat dissipation unit comprises a heat dissipation block, a cooling box and a first cooling fan, wherein the heat dissipation block is arranged on the other surface of the power management module body, the heat dissipation block is provided with a containing cavity, the cooling box is arranged in the containing cavity, cooling liquid used for accelerating heat dissipation is arranged in the cooling box, the heat dissipation block is far away from the surface of the power management module body, and the first cooling fan is embedded in the opening.
Preferably, the heat dissipation unit further comprises a heat dissipation column, one end of the heat dissipation column is connected with the bottom of the cooling box, and the other end of the heat dissipation column vertically extends towards the hole opening direction.
Preferably, the four side surfaces of the voltage dividing unit are uniformly distributed with radiating fins, and a gap is formed between every two adjacent radiating fins.
Preferably, the heat dissipation fins and the heat dissipation column are made of aluminum.
Preferably, power module that heat dispersion is good still includes heat dissipation casing and second radiator fan, the heat dissipation casing is located the top of partial pressure unit, just the heat dissipation casing with be formed with the cavity between the partial pressure unit, the upper surface of heat dissipation casing seted up with the round hole of cavity intercommunication, second radiator fan inlays in the round hole.
Preferably, the side edge of the power management module body is connected with a mounting seat for surface connection with a circuit board, and a mounting hole is formed in the surface of the mounting seat.
Preferably, the mounting seat comprises a connecting section and a mounting section, one side of the connecting section is fixedly connected with the side edge of the power management module body, the other side of the connecting section is connected with the mounting section, a ladder shape is formed between the mounting section and the connecting section, and the mounting hole is formed in the mounting section.
Preferably, the surfaces of the power management module body, the heat dissipation block, the heat dissipation shell and the mounting seat are coated with fireproof coatings.
Preferably, the cooling liquid comprises cold water.
Preferably, the radiating block comprises a top plate, a bottom plate, a left side plate and a right side plate, the top plate, the bottom plate, the left side plate and the right side plate are sequentially connected to form the accommodating cavity, and the cooling box is fixed to the inner surface of the top plate.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
(1) when the power management module works, heat generated by the voltage division module is transferred to the radiating block, then the heat on the radiating block is absorbed by cooling liquid in the cooling box, and then the cooling liquid in the cooling box is cooled by starting the first cooling fan, so that the cooling liquid in the cooling box is always in a low-temperature state, the heat on the radiating block can be continuously absorbed, the rapid heat dissipation of the power management module is realized, and the power management module is prevented from being damaged due to overhigh temperature of a circuit board;
(2) set up the heat dissipation casing through the top at the partial pressure unit to accelerate the heat flow in the cavity through starting second radiator fan, thereby realize dispelling the heat fast to the heat that the partial pressure unit produced, further accelerate power management module's radiating rate, avoid the circuit board high temperature and damage power module.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
In the drawings:
FIG. 1 is a schematic diagram of a power management module with good heat dissipation performance according to the present invention;
FIG. 2 is a schematic diagram of a power management module with good heat dissipation performance from another perspective;
FIG. 3 is an internal schematic view of a power management module with good heat dissipation performance according to the present invention;
reference numerals: 1. a power management module body; 2. a voltage division module; 3. a heat dissipating housing; 4. A second heat dissipation fan; 5. heat dissipation fins; 6. a chip; 7. a mounting seat; 8. fixing the bolt; 9. a first heat dissipation fan; 10. a heat dissipating block; 11. a cooling tank; 12. a heat-dissipating stud.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it is to be understood that the orientations and positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "lateral", "vertical", "horizontal", "top", "bottom", "inner", "outer", "leading", "trailing", and the like are configured and operated in specific orientations based on the orientations and positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate that the device or element referred to must have a specific orientation, and thus, are not to be construed as limiting the present invention.
It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are only for convenience in describing the present technical solution, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the utility model. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
As shown in fig. 1 to 3, in the embodiment of the power management module with good heat dissipation performance of the present invention, the power management module includes: the power supply management module comprises a power supply management module body 1, a voltage division unit, a chip 6 and a heat dissipation unit, wherein the voltage division unit is arranged on one surface of the power supply management module body and is used for dividing voltage of a power supply; the chip 6 is arranged on one surface of the power management module body and is positioned on the side edge of the voltage division unit;
wherein, the radiating unit includes radiating block 10, cooler bin 11 and first radiator fan 9, and radiating block 10 sets up on another surface of power management module body, and radiating block 10 is equipped with and holds the chamber, and cooler bin 11 is installed and is being held the intracavity, and is equipped with in the cooler bin 11 and is used for accelerating radiating coolant liquid, and radiating block 10 keeps away from the power management module body be equipped with the trompil on the surface, and first radiator fan 9 inlays in the trompil.
It can be known to combine the structure of above-mentioned description, this power management module is installed and is used on the circuit board surface, when power management module carries out work, the heat transfer that voltage division module 2 produced is to radiating block 10, heat on the radiating block 10 is absorbed by the coolant liquid in cooler bin 11 afterwards, then cool down the coolant liquid in cooler bin 11 through starting first radiator fan 9, make the coolant liquid in cooler bin 11 be in the low temperature state always, can continuously absorb the heat on radiating block 10, the quick heat dissipation to power management module has been realized, avoid the circuit board high temperature and damage power module. It should be noted that the present embodiment uses cooling liquid level cold water.
In one embodiment, the heat dissipating unit further includes a heat dissipating pillar 12, and one end of the heat dissipating pillar 12 is connected to the bottom of the cooling box 11 and the other end extends vertically toward the opening. It should be noted that, the heat dissipation column 12 is disposed at the bottom of the cooling box 11, so that the heat of the cooling liquid in the cooling box 11 can be quickly dissipated, the heat transferred to the heat dissipation block 10 can be continuously absorbed by the cooling liquid, and the heat dissipation performance is improved.
In one embodiment, the radiating fins 5 are uniformly distributed on the four side surfaces of the voltage dividing unit, and gaps are formed between the adjacent radiating fins 5. The heat dissipation fins 5 are uniformly arranged on the surfaces of the four sides of the voltage division unit, so that the heat of the paging unit is transferred to the surfaces of the heat dissipation fins 5 and is further dissipated to the outside, and the power management module is effectively protected.
In one embodiment, the heat sink fins 5 and the heat sink posts 12 are made of aluminum. It should be noted that, because the aluminum material has a good heat transfer speed, the heat dissipation can be accelerated.
In an embodiment, the power module with good heat dissipation performance further includes a heat dissipation housing 3 and a second heat dissipation fan 4, the heat dissipation housing 3 is disposed above the voltage dividing unit, a cavity is formed between the heat dissipation housing 3 and the voltage dividing unit, a circular hole communicated with the cavity is formed in an upper surface of the heat dissipation housing 3, and the second heat dissipation fan 4 is embedded in the circular hole.
It should be noted that, set up heat dissipation casing 3 in the top of partial pressure unit, and be formed with the cavity between heat dissipation casing 3 and the partial pressure unit, inlay second radiator fan 4 and lie in the round hole of cavity intercommunication, when power management module is carrying out the during operation, start second radiator fan 4 and accelerate the heat circulation to the cavity, thereby the realization dispels the heat fast to the heat that the partial pressure unit produced, further accelerate power management module's radiating rate, avoid the circuit board high temperature and damage power module.
In one embodiment, the side of the power management module body 1 is connected to a mounting seat 7 for connecting with a surface of a circuit board, and a mounting hole is formed on the surface of the mounting seat 7. It should be noted that, the mounting base 7 is connected to the side of the power management module body 1, and then the power management module is mounted on the surface of the circuit board by passing through the mounting hole through the bolt, so that the structure is simple, and the mounting or dismounting is convenient.
Specifically, mount pad 7 includes linkage segment and installation section, one side and the side fixed connection of power management module body 1 of linkage segment, and the another side and the installation section of linkage segment are connected, and form the echelonment between installation section and the linkage segment, and the mounting hole is seted up on the installation section.
In one embodiment, the surfaces of the power management module body, the heat slug 10, the heat sink housing 3 and the mounting base 7 are coated with a fire retardant coating. It should be noted that, when the surface temperature of the power management module body 1 or the circuit board is too high, fire easily occurs, and the fireproof coating can reduce the fire, reduce the loss, and improve the fireproof performance.
In one embodiment, the heat dissipation block 10 includes a top plate, a bottom plate, a left side plate and a right side plate, which are connected in sequence to form a receiving cavity, and the cooling box 11 is fixed on an inner surface of the top plate.
It is to be understood that the foregoing examples, while indicating the preferred embodiments of the utility model, are given by way of illustration and description, and are not to be construed as limiting the scope of the utility model; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.
Claims (9)
1. The utility model provides a power management module that heat dispersion is good which characterized in that includes: a power management module body, a voltage division unit, a chip and a heat dissipation unit,
the voltage division unit is arranged on one surface of the power management module body and is used for dividing voltage of a power supply;
the chip is arranged on one surface of the power management module body and is positioned on the side edge of the voltage division unit;
the heat dissipation unit comprises a heat dissipation block, a cooling box and a first cooling fan, wherein the heat dissipation block is arranged on the other surface of the power management module body, the heat dissipation block is provided with a containing cavity, the cooling box is arranged in the containing cavity, cooling liquid used for accelerating heat dissipation is arranged in the cooling box, the heat dissipation block is far away from the surface of the power management module body, and the first cooling fan is embedded in the opening.
2. The power management module with good heat dissipation performance according to claim 1, wherein the heat dissipation unit further comprises a heat dissipation column, one end of the heat dissipation column is connected with the bottom of the cooling box, and the other end of the heat dissipation column vertically extends towards the opening.
3. The power management module with good heat dissipation performance of claim 2, wherein heat dissipation fins are uniformly distributed on four side surfaces of the voltage division unit, and a gap is formed between adjacent heat dissipation fins.
4. The power management module with good heat dissipation performance of claim 3, wherein the heat dissipation fins and the heat dissipation columns are made of aluminum.
5. The power management module with good heat dissipation performance according to claim 1, wherein the power management module with good heat dissipation performance further comprises a heat dissipation casing and a second heat dissipation fan, the heat dissipation casing is disposed above the voltage dividing unit, a cavity is formed between the heat dissipation casing and the voltage dividing unit, a circular hole communicated with the cavity is formed in an upper surface of the heat dissipation casing, and the second heat dissipation fan is embedded in the circular hole.
6. The power management module with good heat dissipation performance of claim 1, wherein a mounting seat for surface connection with a circuit board is connected to a side edge of the power management module body, and a mounting hole is formed in a surface of the mounting seat.
7. The power management module with good heat dissipation performance as recited in claim 6, wherein the mounting base includes a connection section and a mounting section, one side of the connection section is fixedly connected to a side of the power management module body, the other side of the connection section is connected to the mounting section, a step shape is formed between the mounting section and the connection section, and the mounting hole is formed in the mounting section.
8. The power management module with good heat dissipation performance of claim 1, wherein the cooling liquid comprises cold water.
9. The power management module with good heat dissipation performance of claim 1, wherein the heat dissipation block comprises a top plate, a bottom plate, a left side plate and a right side plate, the top plate, the bottom plate, the left side plate and the right side plate are sequentially connected to form the accommodating cavity, and the cooling box is fixed on the inner surface of the top plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122418452.XU CN216290638U (en) | 2021-10-08 | 2021-10-08 | Power management module with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122418452.XU CN216290638U (en) | 2021-10-08 | 2021-10-08 | Power management module with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216290638U true CN216290638U (en) | 2022-04-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122418452.XU Active CN216290638U (en) | 2021-10-08 | 2021-10-08 | Power management module with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216290638U (en) |
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2021
- 2021-10-08 CN CN202122418452.XU patent/CN216290638U/en active Active
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