CN216288345U - Wafer box disassembling tool - Google Patents

Abstract

The utility model discloses a wafer box disassembling tool which comprises a base, a top block, a push block, a driving assembly and a limiting structure, wherein the top block can be arranged on the base in a relative sliding mode along the front-back direction, the push block can be arranged on the base in a relative sliding mode along the front-back direction, the driving assembly is used for driving the push block to move along the front-back direction, and the limiting structure is arranged between the top block and the push block. Wherein, the front part of the ejector block is provided with an ejection inclined plane which gradually inclines upwards from front to back, and the ejector block is positioned above the ejector block. This assembly and disassembly tools of wafer box can realize the seesaw of kicking block and ejector pad through drive assembly, and the top through the kicking block pushes away the inclined plane and can make the locking structure between wafer box main part and the wafer box base remove the locking, can be through limit structure behind the locking structure unblock, and the ejector pad can continue to promote the wafer box base to make it break away from the cooperation with wafer box main part, easy operation, and can not lead to the fact the damage to wafer box surface.

Description

Wafer box disassembling tool

Technical Field

The utility model relates to a wafer box disassembling tool, in particular to a FOSB disassembling tool.

Background

Fosb (front Opening Shipping box), a front Opening wafer pod, is widely used in the semiconductor manufacturing field as a container for storing and transporting wafers. As shown in fig. 11, a FOSB generally comprises a wafer cassette body 61 and a wafer cassette base 62, and the wafer cassette base 62 is required to be frequently detached therefrom during use. At present, in a conventional disassembling manner, as shown in fig. 13, an operator needs to press the elastic sheet 76 below the wafer cassette base 62 with a hand from below, so that the elastic sheet 76 is separated from the wafer cassette main body 61, and then uses a tool such as a hammer and a pad to strike the wafer cassette base 62 to the left, at this time, the second protruding rib 72 on the wafer cassette main body 61 is elastically deformed, the wafer cassette base 62 moves to the upper left, and then is separated from the wafer cassette main body 61, so as to disassemble the wafer cassette base 62. This traditional mode of operation not only demolishs inefficiency, and is higher to operating personnel's experience requirement, causes the industrial accident easily, and at the in-process of dismantling moreover, instrument such as hammer may knock down wafer box 6, causes the fish tail or the damage on wafer box 6 surface.

Disclosure of Invention

The utility model aims to provide a wafer box disassembling tool to solve one or more problems in the prior art.

In order to achieve the purpose, the utility model adopts the technical scheme that:

a wafer cassette disassembly tool, the disassembly tool comprising:

a base;

the jacking block can be arranged on the base in a relative sliding manner along the front-back direction, and the front part of the jacking block is provided with a jacking inclined plane which gradually inclines upwards from front to back;

the pushing block is arranged on the base in a manner of relatively sliding along the front-back direction and is positioned above the ejecting block;

the driving assembly is used for driving the push block to move along the front and back directions;

the limiting structure is arranged between the ejector block and the push block and has a limiting state and a limiting releasing state, and when the limiting structure is in the limiting state, the ejector block and the push block are relatively fixed and can synchronously move back and forth; when the limiting structure is in a limiting releasing state, the push block and the ejector block are separated from each other, the push block is driven by the driving assembly to move independently, and the base is further provided with a limiting releasing structure which is used for enabling the limiting structure to be converted from the limiting state to the limiting releasing state in the process that the push block moves forwards.

Preferably, the limiting structure comprises a first limiting groove arranged at the bottom of the push block, a second limiting groove arranged at the top of the ejector block, and a limiting block which can be arranged in the first limiting groove and/or the second limiting groove in a vertically moving manner, and when the limiting structure is in a limiting state, one part of the limiting block is positioned in the first limiting groove and the other part of the limiting block is positioned in the second limiting groove; when the limiting structure is in a limiting releasing state, the limiting block is separated from the second limiting groove and synchronously moves back and forth with the push block.

Preferably, the unlocking limiting structure comprises an unlocking inclined plane arranged on the base, the unlocking inclined plane extends obliquely upwards from back to front, and the unlocking inclined plane is located in front of the second limiting groove.

Preferably, the upper portion of the ejector block is provided with a sliding groove extending in the front-rear direction, the rear portion of the push block is provided with a protrusion protruding downwards, and the protrusion is arranged in the sliding groove in a sliding fit manner.

Preferably, the front end surface of the pushing block is located behind the pushing inclined surface.

Preferably, the base is provided with a containing groove for containing the push block, the push block is arranged in the containing groove in a sliding fit manner, guide pins are arranged on the left side and the right side of the push block, guide grooves are arranged on the left side and the right side of the containing groove on the base, and the guide pins are arranged in the guide grooves in a sliding fit manner.

Preferably, a stopper extending in the front-rear direction is provided on one or both side portions in the left-right direction of the base, and at least a front end portion of the stopper is higher than the top block.

Preferably, the driving assembly comprises an operating handle, a push rod extending in the front-back direction and movably arranged on the base in the front-back direction, and a linkage rod arranged between the operating handle and the push rod, wherein the push rod and the push block are fixedly arranged, or the push rod is detachably arranged behind the push block.

Furthermore, one end of the operating handle is rotatably connected to the base, one end of the linkage rod is rotatably connected to the push rod, and the other end of the linkage rod is rotatably connected to the operating handle.

Furthermore, the upper part of the base is also fixedly provided with a handle for holding.

Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages: the wafer box assembling and disassembling tool comprises a base, a top block, a push block, a driving assembly and a limiting structure, wherein the driving assembly can realize the forward and backward movement of the top block and the push block, the locking structure between a wafer box main body and the wafer box base can be unlocked through the pushing inclined plane of the top block, the push block can continuously push the wafer box base after the locking structure is unlocked through the limiting structure, and therefore the wafer box base is separated from the wafer box main body, the operation is simple, and the surface of a wafer box cannot be damaged.

Drawings

Fig. 1 is a schematic perspective view of a wafer cassette mounting and dismounting tool according to the present invention, wherein a limiting structure is in a limiting state;

fig. 2 is a schematic perspective view of the wafer cassette mounting and dismounting tool of fig. 1 at another viewing angle;

FIG. 3 is a top view of the wafer pod removal tool of FIG. 1;

FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;

FIG. 5 is a cross-sectional view taken along line B-B of FIG. 3;

fig. 6 is a schematic perspective view of the wafer cassette mounting and dismounting tool of the present invention, wherein the limiting structure is in a state of limiting;

fig. 7 is a perspective and schematic structural view of the wafer pod attaching and detaching tool of fig. 6 from another viewing angle;

FIG. 8 is a top view of the pod removal tool of FIG. 6;

FIG. 9 is a cross-sectional view taken along line C-C of FIG. 8;

FIG. 10 is a cross-sectional view taken along line D-D of FIG. 8;

fig. 11 is a schematic perspective view of the wafer cassette of this embodiment;

fig. 12 is a cross-sectional view of the wafer cassette of fig. 11;

FIG. 13 is an enlarged fragmentary view at E in FIG. 12;

fig. 14 is a schematic perspective view of the wafer cassette mounting/dismounting tool of the present invention in cooperation with a wafer cassette;

FIG. 15 is a schematic perspective view of the wafer cassette loading/unloading tool of the present invention in cooperation with a wafer cassette;

FIG. 16 is an enlarged fragmentary view at F of FIG. 15;

wherein:

1. a base; 11. a containing groove; 12. a guide groove; 13. a stopper; 14. carrying a handle; 15. unlocking the inclined plane;

2. a top block; 21. pushing the inclined plane; 22. a chute;

3. a push block; 31. a protrusion; 32. a guide pin;

4. a drive assembly; 41. a handle; 42. a push rod; 43. a linkage rod;

5. a limiting structure; 51. a first limit groove; 52. a second limit groove; 53. a limiting block;

6. a wafer cassette; 61. a wafer cassette main body; 611. a flange; 62. a base body; 621. a sliding part;

71. a first rib; 72. a second rib; 73. a third rib; 74. a fourth rib; 75. a card slot; 76. a spring plate; 761. and a limiting bulge.

Detailed Description

The technical solution of the present invention is further explained with reference to the drawings and the specific embodiments.

Referring to the figures, the wafer cassette dismounting tool comprises a base 1, a top block 2 arranged on the base 1 in a relative sliding manner along the front-back direction, a push block 3 arranged on the base 1 in a relative sliding manner along the front-back direction, a driving assembly for driving the push block 3 to move along the front-back direction, and a limiting structure 5 arranged between the top block 2 and the push block 3. The upper part of the base 1 is fixedly provided with a handle 14 for holding, the front part of the ejector block 2 is provided with an ejection inclined plane 21 which gradually inclines upwards from front to back, the ejector block 3 is positioned above the ejector block 2, the front end surface of the ejector block 3 is positioned behind the ejection inclined plane 21, the limiting structure 5 is provided with a limiting state and a limiting releasing state, and when the limiting structure 5 is in the limiting state, the ejector block 2 and the ejector block 3 are relatively fixed and can synchronously move forwards and backwards; when limit structure 5 is in the spacing state of separating, ejector pad 3 breaks away from each other with ejector pad 2, and ejector pad 3 is driven by drive assembly 4 and independent motion, wherein, still be equipped with on the base 1 and be used for making limit structure 5 convert the spacing structure of separating of spacing state into by spacing state in the in-process of ejector pad 3 forward motion.

Referring to fig. 11 to 13, the wafer cassette 6 includes a cassette main body 61 and a cassette base 62 detachably provided on the cassette main body 61. Specifically, two sets of sliding grooves (not shown in the figure) extending in the front-rear direction are provided on the wafer cassette main body 61, the left and right side edge portions of the wafer cassette base 62 each have a sliding portion 621 capable of sliding along the sliding groove, and each set of sliding portions 621 is inserted into the sliding groove accordingly. In this embodiment, one end portion of the wafer cassette main body 61 in the front-rear direction is an open end provided with an opening, the open end of the wafer cassette main body 61 has a flange 611, and a space capable of accommodating the base 1 is provided between the flange 611 and the wafer cassette base 62.

Still be provided with the locking mechanical system that can lock the two relatively between wafer cassette main part 61 and the wafer cassette base 62, locking mechanical system is including setting up in wafer cassette main part 61 and along the first protruding muscle 71 of fore-and-aft direction interval arrangement in proper order, second protruding muscle 72 and third protruding muscle 73, and set up on wafer cassette base 62 and along the fourth protruding muscle 74 of fore-and-aft direction interval arrangement, draw-in groove 75 and shell fragment 76, wherein, first protruding muscle 71, second protruding muscle 72, third protruding muscle 73 and fourth protruding muscle 74 all extend along vertical direction, shell fragment 76 extends along fore-and-aft direction, have the spacing arch 761 that extends along vertical direction on the shell fragment 76, fourth protruding muscle 74 can block and establish the lateral surface at first protruding muscle 71, the lateral surface at third protruding muscle 73 is established to spacing arch 761 card, second protruding muscle 72 card is established in draw-in groove 75. In this embodiment, the groove wall of the engaging groove 75 and the elastic piece 76 have certain elasticity, so as to facilitate the detachment of the wafer cassette base 62, and meanwhile, a gap is provided between the end of the elastic piece 76 and the wafer cassette main body 61.

Referring to fig. 4 and 9, the limiting structure 5 includes a first limiting groove 51 disposed at the bottom of the pushing block 3, a second limiting groove 52 disposed at the top of the pushing block 2, and a limiting block 53 disposed in the first limiting groove 51 or the second limiting groove 52 and capable of moving in the up-down direction, when the limiting structure 5 is in a limiting state, a part of the limiting block 53 is located in the first limiting groove 51 and the other part is located in the second limiting groove 52, the pushing block 3 can push the pushing block 2 to move forward, and at this time, the pushing block 3 and the pushing block 2 move synchronously; when the limiting structure 5 is in the limiting releasing state, the limiting block 53 is separated from the second limiting groove 52 and moves back and forth synchronously with the pushing block 3, and the pushing block 2 is static at the moment.

Referring to fig. 5 and 10, the unlocking structure includes an unlocking inclined surface 15 provided on the base 1, the unlocking inclined surface 15 extends obliquely upward from rear to front, and the unlocking inclined surface 15 is located in front of the second stopper groove 52. When the limiting block 53 moves obliquely upward along the unlocking inclined plane 15, the limiting block 53 moves upward along the first limiting groove 51 and the second limiting groove 52 until the limiting block 53 is disengaged from the first limiting groove 51; when the limiting block 53 moves obliquely downward along the unlocking inclined plane 15, the limiting block 53 moves downward along the first limiting groove 51 and the second limiting groove 52, and the limiting block 53 pushes the top block 2 to move backward.

Referring to fig. 4 and 9, the top of the top block 2 is provided with a slide groove 22 extending in the front-rear direction, and the rear of the push block 3 is provided with a protrusion 31 protruding downward, and the protrusion 31 is slidably fitted in the slide groove 22. When the limiting structure 5 is in the limiting state, the protrusion 31 is still relative to the sliding groove 22; when the stop structure 5 is in the stop state, the protrusion 31 can slide relative to the slide groove 22 in the backward direction.

Referring to fig. 1 to 3 and 6 to 8, a containing groove 11 for containing the push block 3 is provided on the base 1, the push block 3 is disposed in the containing groove 11 in a sliding fit manner, guide pins 32 are disposed on both left and right sides of the push block 3, guide grooves 12 are disposed on both left and right sides of the containing groove 11 on the base 1, the guide grooves 12 extend in the front-rear direction, the guide pins 32 are disposed in the guide grooves 12 in a sliding fit manner, and the distance that the guide pins 32 can slide along the guide grooves 12 is the stroke of the push block 3. In this embodiment, the guide pins 32 have two sets arranged in the front-rear direction, and the diameter of the guide pins 32 is equal to the width of the guide grooves 12, so that the push block 3 can be limited from moving in the vertical direction, and the smooth movement of the push block 3 is ensured.

Referring to fig. 14 and 15, a stopper 13 extending in the front-rear direction is provided on one or both side portions in the left-right direction of the base 1, and at least a front end portion of the stopper 13 is higher than the top block 2. When the wafer cassette dismounting tool of the embodiment is used, the stopper 13 can be clamped at the side of the wafer cassette base 62, and has certain limiting and guiding functions.

Referring to fig. 1 to 4 and 6 to 9, the driving assembly 4 includes an operating handle 41, a push rod 42 extending in a front-back direction and movably disposed on the base 1 in the front-back direction, and a linkage rod 43 disposed between the operating handle 41 and the push rod 42, wherein the push rod 42 is fixedly disposed with the push block 3, or the push rod 42 is detachably disposed behind the push block 3. One end of the operating handle 41 is rotatably connected to the base 1, one end of the linkage rod 43 is rotatably connected to the push rod 42, and the other end of the linkage rod 43 is rotatably connected to the operating handle 41. When the operating handle 41 rotates forwards, the linkage rod 43 pushes the push rod 42 to move forwards, and the push rod 42 drives the push block 3 to move forwards; when the operating handle 41 rotates backwards, the linkage rod 43 pulls the push rod 42 to move backwards, thereby driving the push block 3 to move backwards.

The working principle of the wafer cassette attaching and detaching tool of the present embodiment is specifically described below:

referring to fig. 14 and 15, the operation handle 41 is rotated to a maximum angle relative to the push rod 42, at this time, the limit structure 5 is in a limit state, the wafer cassette disassembling tool is placed between the flange 611 and the base 1, the stopper 13 is leaned against the side of the wafer cassette base 62, the base 1 is leaned against the flange 611, the operation handle 41 is rotated forward, the top block 2 and the push block 3 move forward, the end of the spring piece 76 is leaned against the push inclined surface 21 of the top block 2, the push inclined surface 21 drives the spring piece 76 to bend upward, the limit protrusion 761 and the third rib 73 are disengaged, the second rib 72 and the slot 75 are disengaged, and at the same time, the push block 3 pushes the wafer cassette base 62 to move forward until the wafer cassette base 62 and the wafer cassette main body 61 are disengaged, and at this time, the limit structure 5 is in a limit-disengaged state.

In summary, the wafer cassette dismounting tool of the embodiment includes the base 1, the ejector block 2, the ejector block 3, the driving assembly 4, and the limiting structure 5, the front-back motion of the ejector block 2 and the ejector block 3 can be realized through the driving assembly 4, the locking structure 7 between the wafer cassette main body 61 and the wafer cassette base 62 can be unlocked through the ejector inclined plane 21 of the ejector block 2, the ejector block 3 can continue to push the wafer cassette base 62 after the locking structure 7 is unlocked through the limiting structure 5, so that the wafer cassette base 62 is disengaged from the wafer cassette main body 61, the operation is simple, and the surface of the wafer cassette 6 is not damaged.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (10)

1. A wafer cassette assembly and disassembly tools which characterized in that: the disassembly and assembly tool comprises:

a base;

the jacking block can be arranged on the base in a relative sliding manner along the front-back direction, and the front part of the jacking block is provided with a jacking inclined plane which gradually inclines upwards from front to back;

the pushing block is arranged on the base in a manner of relatively sliding along the front-back direction and is positioned above the ejecting block;

the driving assembly is used for driving the push block to move along the front and back directions;

the limiting structure is arranged between the ejector block and the push block and has a limiting state and a limiting releasing state, and when the limiting structure is in the limiting state, the ejector block and the push block are relatively fixed and can synchronously move back and forth; when the limiting structure is in a limiting releasing state, the push block and the ejector block are separated from each other, the push block is driven by the driving assembly to move independently, and the base is further provided with a limiting releasing structure which is used for enabling the limiting structure to be converted from the limiting state to the limiting releasing state in the process that the push block moves forwards.

2. The wafer cassette handling tool of claim 1, wherein: the limiting structure comprises a first limiting groove arranged at the bottom of the push block, a second limiting groove arranged at the top of the ejector block and a limiting block which can be arranged in the first limiting groove and/or the second limiting groove in a vertically moving mode, and when the limiting structure is in a limiting state, one part of the limiting block is positioned in the first limiting groove and the other part of the limiting block is positioned in the second limiting groove; when the limiting structure is in a limiting releasing state, the limiting block is separated from the second limiting groove and synchronously moves back and forth with the push block.

3. The wafer cassette handling tool of claim 2, wherein: the unlocking limiting structure comprises an unlocking inclined plane arranged on the base, the unlocking inclined plane extends obliquely upwards from back to front, and the unlocking inclined plane is located in front of the second limiting groove.

4. The wafer cassette handling tool of claim 1, wherein: the upper portion of kicking block is provided with the spout that extends along the fore-and-aft direction, the rear portion of ejector pad has the arch of downward bulge, protruding sliding fit ground set up in the spout.

5. The wafer cassette handling tool of claim 1, wherein: the front end face of the pushing block is located behind the pushing inclined plane.

6. The wafer cassette handling tool of claim 1, wherein: the base is provided with a containing groove for containing the push block, the push block is arranged in the containing groove in a sliding fit mode, guide pins are arranged on the left side and the right side of the push block respectively, guide grooves are arranged on the left side and the right side of the containing groove on the base respectively, and the guide pins are arranged in the guide grooves in a sliding fit mode.

7. The wafer cassette handling tool of claim 1, wherein: one or two side parts of the base in the left and right directions are provided with stop blocks extending in the front and back directions, and at least the front end parts of the stop blocks are higher than the top blocks.

8. The wafer cassette handling tool of claim 1, wherein: the driving assembly comprises an operating handle, a push rod and a linkage rod, the push rod extends in the front-back direction and can be movably arranged in the front-back direction on the base, the linkage rod is arranged between the operating handle and the push rod, the push rod is fixedly arranged with the push block, or the push rod is detachably arranged at the rear of the push block.

9. The wafer cassette mounter according to claim 8, wherein: one end of the operating handle is rotatably connected to the base, one end of the linkage rod is rotatably connected to the push rod, and the other end of the linkage rod is rotatably connected to the operating handle.

10. The wafer cassette handling tool of claim 1, wherein: the upper part of the base is also fixedly provided with a handle for holding.

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