CN216274200U - Plasmon optical enhancement chip system - Google Patents

Plasmon optical enhancement chip system Download PDF

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CN216274200U
CN216274200U CN202121903969.1U CN202121903969U CN216274200U CN 216274200 U CN216274200 U CN 216274200U CN 202121903969 U CN202121903969 U CN 202121903969U CN 216274200 U CN216274200 U CN 216274200U
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optical
chip
waveguide
microcavity
enhancement
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不公告发明人
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Shanghai Jinguan Technology Co ltd
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Shanghai Jinguan Technology Co ltd
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Abstract

The utility model provides a plasmon optical enhancement chip system which comprises a nanopore chip, an integrated optical chip and an image sensor chip, wherein at least one reaction unit is arranged in the nanopore chip, the reaction unit comprises a Bragg reflector and a microcavity, and a nanometer opening is formed in the bottom surface of the microcavity; the integrated optical chip comprises at least one optical unit, is used for irradiating the excitation light on the microcavity, collecting the excited optical signal at the opening of the nanometer, and outputting the collected optical signal after processing; the image sensor chip comprises at least one photoelectric conversion unit for receiving the optical signal output by the integrated optical chip and converting the optical signal into an electric signal. The plasmon optical enhancement chip system utilizes the amplification effect of a plasmon enhancement electric field to efficiently excite molecules at the opening of the microcavity nanometer, has ultrahigh sensitive detection capability, can realize ultrahigh sensitive optical detection of the lowest single molecule, and can be applied to the fields of single molecule detection and DNA/RNA sequencing.

Description

Plasmon optical enhancement chip system
Technical Field
The utility model belongs to the technical field of biochips, and relates to a plasmon optical enhancement chip system.
Background
The biochip has wide application, wide application in life science research and practice, medical research and clinic, drug design, environmental protection, agriculture, military and other fields, and wide economic, social and scientific research prospects. How to improve the detection sensitivity of the biochip becomes an important technical problem to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings of the prior art, the present invention aims to provide a plasmon optical enhancement chip system for solving the problem of low detection sensitivity of the biochip in the prior art.
To achieve the above and other related objects, the present invention provides a plasmon optical enhancement chip system, comprising:
the nanopore chip comprises a nanopore chip body and a metal film, wherein at least one reaction unit is arranged in the nanopore chip body and comprises a Bragg reflector and a microcavity, the microcavity is opened from the top surface of the nanopore chip body and extends to the bottom surface of the nanopore chip body to form a nanometer opening, the Bragg reflector is distributed on two sides of the microcavity and is spaced from the microcavity by a preset distance, and the metal film is positioned on the upper surface of the nanopore chip body and covers the surface of the Bragg reflector and the surface of the microcavity;
the integrated optical chip is positioned above the nanopore chip and comprises at least one optical unit which is used for irradiating excitation light on the microcavity, collecting the excited optical signal at the opening of the nanometer, processing the collected optical signal and outputting the processed optical signal;
and the image sensor chip is positioned above the integrated optical chip and comprises at least one photoelectric conversion unit which is used for receiving the optical signal output by the integrated optical chip and converting the optical signal into an electric signal.
Optionally, the open area of the microcavity is tapered from top to bottom.
Optionally, the shape of the nano-opening comprises one of a rectangle, a square, and a circle.
Optionally, the optical unit includes a single-mode waveguide, a focusing grating coupler, a collecting grating coupler, a planar waveguide, a multi-mode waveguide, and a static interferometer, the single-mode waveguide is configured to transmit excitation light to the focusing grating coupler, the focusing grating coupler is configured to focus and project the excitation light to the microcavity in a downward direction, the collecting grating coupler is configured to collect an optical signal excited at the nano opening and transmit the optical signal to the static interferometer through the planar waveguide and the multi-mode waveguide in sequence, and the static interferometer is configured to generate an interference signal and project the interference signal into the image sensor chip.
Optionally, the optical unit further includes a micro-ring resonator structure disposed beside the multimode waveguide to filter the excitation light.
Optionally, the micro-ring resonator structure includes a ring waveguide, a strip waveguide, and a metal block, where the ring waveguide is located between the multimode waveguide and the strip waveguide, and the metal block is connected to an output end of the strip waveguide.
Optionally, the plasmon optical enhancement chip system further comprises a laser and an optical fiber, and the integrated optical chip is connected to the laser through the optical fiber.
Optionally, the excitation light generated by the laser enters the integrated optical chip through the optical fiber in an end-face coupling manner or a grating coupling manner.
Optionally, the plasmon optical enhancement chip system includes a plurality of the reaction units, a plurality of the optical units, and a plurality of the photoelectric conversion units to form a plurality of detection units, and one of the detection units includes one of the reaction units, one of the optical units, and one of the photoelectric conversion units.
Optionally, the integrated optical chip further comprises a multi-stage multi-mode interference coupler for splitting the excitation light in the integrated optical chip into multiple beams to be input to different optical units.
As described above, the plasmon optical enhancement chip system has ultrahigh sensitive detection capability, and can realize ultrahigh sensitive optical detection of the lowest single molecule. The principle is that molecules in the optical enhancement antenna structure are efficiently excited by utilizing the amplification effect of a plasmon enhancement electric field, so that optical signals with single-molecule sensitivity are obtained, wherein the optical signals comprise spectral signals and/or fluorescence. The plasmon optical enhancement chip system can be applied to the fields of single molecule detection and DNA/RNA sequencing.
Drawings
FIG. 1 shows the structure and schematic diagram of a plasmon optical enhancement chip system according to the present invention.
FIG. 2 is a partial top view of the nanopore chip.
FIG. 3 is another partial top view of the nanopore chip.
Fig. 4 is a schematic diagram showing the operation of the nanopore chip.
Fig. 5 shows a schematic diagram of the end-coupling mode.
Fig. 6 shows a schematic diagram of the grating coupling method.
Fig. 7 shows a schematic diagram of a rectangular grating for the grating structure in the coupling grating.
Fig. 8 shows a schematic diagram of a sector grating selected for the grating structure in the coupling grating.
Fig. 9 is a schematic diagram of a sub-wavelength grating for use in a grating structure in a coupling grating.
Fig. 10 shows a schematic view of the collection grating coupler in a semi-elliptical shape.
Figure 11 shows a schematic view of the collection grating coupler in a semi-circular shape.
Fig. 12 shows a schematic diagram of a microring resonator structure.
FIG. 13 is a schematic diagram of a chip spectrometer formed by packaging a static interferometer and an image sensor chip.
FIG. 14 is a schematic diagram of a multi-array format of the plasmonic optical enhancement chip system.
FIG. 15 is a schematic diagram of a multimode interference coupler structure.
FIG. 16 is a schematic diagram of a multi-stage multi-mode interference coupler structure.
Fig. 17 shows a schematic structure of a second static interferometer.
Fig. 18 shows a schematic structure of a third static interferometer.
Fig. 19 is a schematic diagram of a fourth static interferometer.
Fig. 20 is a schematic structural diagram of a fifth type of static interferometer.
Description of the element reference numerals
1 nanopore chip
101 nanopore chip body
102 metal film
103 Bragg reflector
104 micro-cavity
105 nm opening
2 Integrated optical chip
201 substrate
202 optical waveguide
203 grating structure
204 waveguide
204a planar waveguide
204b single mode waveguide
205 single mode waveguide
206 focusing grating coupler
207 collection grating coupler
208 planar waveguide
209 multimode waveguide
210 static interferometer
210a multimode interference coupler structure
210b grating structure
210c multi-stage multi-mode interference coupler structure
210d interferometer unit structure
210e multimode waveguide
210f reflecting mirror
210g multimode interference coupler
210h loop waveguide
210i incident waveguide
210j input coupler
210k array waveguide
210l output coupler
210m exit waveguide
210n microlens array
211 micro-ring resonator structure
211a ring waveguide
211b strip waveguide
211c metal block
212 multistage multimode interference coupler
3 image sensor chip
4 laser
5 optical fiber
501 single mode optical fiber
6 chip type spectrometer
7 molecule
8 data processing device
M surface plasmon
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The utility model is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 20. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
The present invention provides a plasmon optical enhancement chip system, please refer to fig. 1, which shows the structure and schematic diagram of the plasmon optical enhancement chip system, comprising a nanopore chip 1, an integrated optical chip 2 and an image sensor chip 3, wherein the nanopore chip 1 comprises a nanopore chip body 101 and a metal film 102, at least one reaction unit is arranged in the nanopore chip body 101, the reaction unit comprises a Bragg reflector 103 and a microcavity 104, the microcavity 104 is opened from the top surface of the nanopore chip body 101, and extends to the bottom surface of the nanopore chip body 101 to form a nanometer opening 105, the bragg reflectors 103 are distributed on two sides of the microcavity 104 and spaced from the microcavity 104 by a preset distance, the metal film 102 is located on the upper surface of the nanopore chip body 101 and covers the surface of the bragg reflector 103 and the surface of the microcavity 104; the integrated optical chip 2 is located above the nanopore chip 1, and the integrated optical chip 2 includes at least one optical unit, and is configured to irradiate the excitation light onto the microcavity 104, collect an optical signal excited at the nano-opening 105, and output the collected optical signal after processing; the image sensor chip 3 is located above the integrated optical chip 2, and the image sensor chip 3 includes at least one photoelectric conversion unit for receiving an optical signal output by the integrated optical chip 2 and converting the optical signal into an electrical signal.
As an example, the image sensor chip 3 is connected to a data processing device 8.
As an example, the nanopore chip body 101 may be made of a rigid material, such as silicon, silicon nitride, silicon dioxide, aluminum nitride, hafnium oxide, glass, or other suitable material, or a flexible material, such as polymethyl methacrylate (PMMA), Polydimethylsiloxane (PDMS), or other suitable material. The metal film 102 includes at least one of a gold film, a silver film, a copper film, and a platinum film.
As an example, the opening area of the microcavity 104 is gradually reduced from top to bottom, and the size of the nano-opening 105 at the bottom of the microcavity 104 is on the order of nanometers (e.g., 0.1-1000nm) in at least one dimension.
As an example, the bragg reflector 103 includes a plurality of grating grooves formed in the nanopore chip body 101, and the grating grooves are opened from the top surface of the nanopore chip body 101, extend toward the bottom surface of the nanopore chip body 101, and do not penetrate through the bottom surface of the nanopore chip body 101.
For example, referring to fig. 2, a partial top view of the nanopore chip 1 is shown, wherein the nano-opening 105 is in the form of a nano-slit. Referring to fig. 3, another partial top view of the nanopore chip 1 is shown, wherein the nano-opening 105 is in a nanopore shape. It should be noted that the shape of the nano-opening 105 may be adjusted as needed, including but not limited to one of a rectangle, a square and a circle, and the arrangement rule of the plurality of grating grooves of the bragg reflector 103 may also be adjusted as needed, which is not limited to the configuration shown in fig. 2 and 3.
Referring to fig. 4, a schematic diagram of the operation of the nanopore chip 1 is shown, wherein an excitation light (shown by a plurality of parallel solid arrows in the figure) is irradiated onto the microcavity 104, and incident photons of the excitation light interact with free electrons on the surface of the metal film 102 to generate surface plasmonThe plasmon resonance (surface plasmon M is illustrated in the figure) and generates a surface plasmon enhancement electric field, which can propagate on the surface of the chip, when propagating to the position of the nano-opening 105 at the bottom of the microcavity 104, a stronger antenna enhancement effect can be generated, a highly localized plasmon enhancement electric field (a plurality of divergent dotted arrows in fig. 4 show the molecular optical signal excited by the plasmon electric field) appears, the enhancement electric field is localized at the position of the nano-opening 105, the fluorescence/raman/vibration/rotation/absorption/reflection spectrum of the molecule 7 in the nano-opening 105 can be excited, the enhancement effect with very high efficiency can be achieved, the sensitivity of single molecule detection can be realized (for example, 10 can be generated for the raman scattering effect)5-1020A multiple enhancement effect). The bragg reflectors 103 on the two sides of the microcavity 104 on the surface of the nanopore chip 1 play a role in reflection, and can partially reflect optical signals generated in the nano opening 105 back, so that the effects of reducing the propagation loss of signal photons on the surface and enhancing the intensity of the optical signals are achieved. The detected molecules 7 can be transported to the nano-opening 105 through the upper side of the nanopore chip 1, and can also be transported to the nano-opening 105 through the lower side of the nanopore chip 1.
For example, referring back to fig. 1, the plasmonic optical enhancement chip system further includes a laser 4 and an optical fiber 5, and the integrated optical chip 2 is connected to the laser 4 through the optical fiber 5. The laser 4 and the optical fiber 5 provide an optical excitation function in the chip as an indispensable optical component outside the chip architecture, the laser 4 outputs an excitation light source through the optical fiber 5, and excitation light is coupled into the integrated optical chip 2 through a grating coupling or end face coupling mode.
As an example, the optical fiber 5 may be a single mode optical fiber or a single mode fiber lens.
As an example, please refer to fig. 5, which is a schematic diagram of an end-face coupling manner, wherein excitation light is directly aligned in a short distance with an end face of an optical waveguide 202 on a substrate 201 of the integrated optical chip 2 through a single-mode optical fiber 501, and light emitted from the single-mode optical fiber 501 can be coupled into the optical waveguide 202 for further transmission.
As an example, please refer to fig. 6, which is a schematic diagram of a grating coupling manner, wherein excitation light is emitted out to the grating structure 203 on the substrate 201 of the integrated optical chip 2 through a single-mode fiber 501, and is coupled into the waveguide 204 by the grating structure 203 for continuous transmission. The central axis of the single mode fiber 501 is deviated from the normal by a preset angle theta.
As an example, please refer to fig. 7 to 9, which show top views of several common coupling gratings, wherein fig. 7 shows a schematic diagram that the grating structure 203 in the coupling grating is a rectangular grating, fig. 8 shows a schematic diagram that the grating structure 203 in the coupling grating is a sector grating, and fig. 9 shows a schematic diagram that the grating structure 203 in the coupling grating is a sub-wavelength grating. In this embodiment, the whole structure of the coupling grating includes the periodic grating structure 203, and a planar waveguide 204a and a single-mode waveguide 204b connected to the output end of the grating structure 203, and excitation light outside the integrated optical chip 2 is coupled into the grating and then continuously transmitted through the single-mode waveguide 204 b.
Referring back to fig. 1, in the integrated optical chip 2, the optical unit includes a single-mode waveguide 205, a focusing grating coupler 206, a collecting grating coupler 207, a planar waveguide 208, a multi-mode waveguide 209, and a static interferometer 210, the single-mode waveguide 205 is configured to transmit excitation light to the focusing grating coupler 206, the focusing grating coupler 206 is configured to focus and project the excitation light to the microcavity 104 in a downward direction, the collecting grating coupler 207 is configured to collect an optical signal excited at the nano-aperture 105 and transmit the optical signal to the static interferometer 210 through the planar waveguide 208 and the multi-mode waveguide 209 in sequence, and the static interferometer 210 is configured to generate an interference signal and project the interference signal into the image sensor chip 3.
Specifically, the focusing grating coupler 206 and the collecting grating coupler 207 realize the control of the propagation direction of the light beam by using the principle of diffraction grating, and realize the effect of optical focusing or optical collecting. In order to increase the excitation or collection efficiency, the overall size of the focusing grating coupler 206 and the collecting grating coupler 207 can be made larger, and the size can be controlled in the range of 50-5000 μm.
For example, please refer to fig. 10 and 11, which are schematic diagrams illustrating sequential connection of the collection grating coupler 207, the planar waveguide 208 and the multi-mode waveguide 209, wherein the collection grating coupler 207 may be a semi-elliptical shape as shown in fig. 10, or a semi-circular shape as shown in fig. 11. The shape of the focusing grating coupler 206 is similar and will not be described in detail here.
As an example, the optical unit further includes a micro-ring resonator structure 211, and the micro-ring resonator structure 211 is disposed beside the multimode waveguide 209 to filter the excitation light.
For example, please refer to fig. 12, which is a schematic diagram of the micro-ring resonator structure 211, wherein the micro-ring resonator structure 211 includes a ring waveguide 211a, a strip waveguide 211b, and a metal block 211c, the ring waveguide 211a is located between the multi-mode waveguide 209 and the strip waveguide 211b, and the metal block 211c is connected to an output end of the strip waveguide 211 b. By designing the size of the annular waveguide 211a, the effect of selecting a specific wavelength can be achieved, photons with the selected wavelength are coupled into the annular waveguide 211a through evanescent waves, interference enhancement is generated when the optical path of the photons propagating in the annular waveguide 211a is equal to integral multiple of the wavelength, a whispering gallery mode is formed and stays in the annular waveguide 211a for propagation, the photons in the annular waveguide 211a are coupled out through another shorter strip waveguide 211b, and the photons are absorbed through the metal block 211c, so that the effect of removing the photons with the wavelength from the original input photons is achieved, and the filtering of excitation light of a spectrum signal can be achieved.
For example, please refer to fig. 13, which is a schematic structural diagram of a chip spectrometer 6 formed by packaging the static interferometer 210 and the image sensor chip 3, wherein a coupling end of the static interferometer 210 is a multimode interference coupler structure 210a, a spectrum signal is propagated and coupled into the multimode interference coupler structure 210a through the multimode waveguide 209, and is divided into two parts by the multimode interference coupler structure 210a and then enters two parallel optical waveguides (made of silicon nitride) to continue to propagate forward. The widths of the two optical waveguides are specially designed to be different, so that photons transmitted in the two optical waveguides generate phase difference, and when two optical signals are transmitted in the waveguides, evanescent fields generated by total internal reflection are overlapped between the two parallel waveguides to generate interference signals. The periodic grating structure 210b is prepared in the area between the two waveguides, interference signals are diffracted upwards to the image sensor chip 3, the image sensor chip 3 can be a linear or rectangular CCD array and is used for receiving the interference signals to obtain interference patterns, and the interference patterns are subjected to Fourier transform processing to obtain spectral information.
For example, referring to fig. 14, a schematic diagram of a multi-array format of the plasmon optical enhancement chip system is shown, which includes a plurality of the reaction units, a plurality of the optical units, and a plurality of the photoelectric conversion units to form a plurality of detection units, where one of the detection units includes one of the reaction units, one of the optical units, and one of the photoelectric conversion units. The integrated optical chip 2 further comprises a multi-stage multi-mode interference coupler 212, wherein the multi-stage multi-mode interference coupler 212 is used for dividing excitation light input from an excitation light source to the integrated optical chip 2 into a plurality of beams to be input to different optical units. The image sensor chip 3 is connected to a data processing device 8.
For example, referring to fig. 15, a schematic diagram of a multimode interference coupler structure is shown, the multimode interference coupler structure is a micro-nano optical device commonly used in the field of integrated optics, in which light waves can propagate, and separates the light waves into two beams to propagate out in a controllable manner, and an ideal 1 × 2 multimode interference coupler structure is a 50/50 beam splitter, which separates the incoming light waves to emit out according to the proportion of 50% and 50%. Referring to fig. 16, a schematic diagram of a multi-stage multi-mode interference coupler structure is shown, according to a binary result, the multi-stage MMI structure can divide the light wave into a plurality of light beams with equal light intensity, and then the light wave continues to transmit in the waveguide.
The working principle of the plasmon optical enhancement chip system is as follows: the laser 4 outputs an excitation light source through the optical fiber 5, the excitation light is coupled and enters the multi-stage multi-mode interference coupler 212 in the integrated optical chip 2 in a grating coupling or end-face coupling manner, the multi-stage multi-mode interference coupler 212 equally divides the excitation light into multiple excitation lights with the same power, the multiple excitation lights are transmitted in the single-mode waveguide 205 (the output structure of the multi-stage multi-mode interference coupler 212 is connected to the single-mode waveguide 205), the multiple parallel excitation lights are transmitted forward in the single-mode waveguide 205 to the diffraction type focusing grating coupler 206, which is used as an excitation grating to focus and project the excitation light downward into the microcavity 104, and the optical signal of the molecule 7 at the nano opening 105 at the bottom of the microcavity 104 is excited. The excited optical signal is scattered upwards, collected by the collection grating coupler 207, and then converged into the multimode waveguide 209 through the planar waveguide 208, and transmitted into the static interferometer 210, and the excitation light can be filtered out by the micro-ring resonator structure 211 beside the multimode waveguide 209. The optical signal with the excitation light filtered out enters the static interferometer 210, photons with different wavelengths interfere in the static interferometer 210 and are projected upwards by the scattering grating in the static interferometer 210 to enter the image sensor chip 3 to form an interference pattern, and the interference pattern is subjected to fourier transform to obtain spectral information of the optical signal.
It is noted that the static interferometer 210 is not limited to the type shown in fig. 1, 13, 14, and may be, for example, the type shown in any one of fig. 17 to 20.
Specifically, the static interferometer shown in fig. 17 includes a multi-stage multi-mode interference coupler structure 210c and a plurality of interferometer unit structures 210d, where the interferometer unit structure 210d includes a fabry-perot interference cavity, the lengths of the fabry-perot interference cavities of the interferometer unit structures 210d are different, and the length difference is designed by a gradient, so that a plurality of groups of interference patterns with different fringe intervals and different peak intensities can be finally collected, and an accurate spectrum can be analyzed. In the chip structure, the larger the number of interferometer unit structures, the larger the spectral range that can be resolved.
Specifically, the static interferometer shown in fig. 18 includes a multimode waveguide 210e and a reflector 210f disposed at the end of the multimode waveguide 210e, a spectrum signal propagates forward in the multimode waveguide 210e to the reflector 210f and is reflected back, standing wave interference (indicated by a plurality of oblong shapes in the figure) occurs between an incident signal photon and a reflected signal photon at the center of the multimode waveguide 210e, an interference pattern can be captured by using a linear image sensor chip, and spectrum information is obtained after fourier transform.
Specifically, the static interferometer shown in fig. 19 includes a multimode interference coupler 210g and a loop waveguide 210h, a spectrum signal is transmitted to the multimode interference coupler 210g in the multimode waveguide, the multimode interference coupler 210g divides an incident signal photon into two beams, the two beams enter the loop waveguide 210h, and finally meet at the center of the loop waveguide 210h to generate standing wave interference (shown by a plurality of oblong shapes), an interference pattern can be shot by using a linear image sensor chip, and spectrum information is obtained after fourier transform.
Specifically, the static interferometer shown in fig. 20 employs an Arrayed Waveguide Grating (AWG), signal photons enter the input coupler 210j from the input Waveguide 210i, the input coupler 210j is configured as a planar Waveguide, the signal photons are diffracted at an interface between the input coupler 210j and the input Waveguide 210i, and the intensity enters the Arrayed Waveguide 210k in a gaussian distribution in a direction perpendicular to the propagation direction. The interface between the arrayed waveguide 210k and the input coupler 210j is a curved surface, which ensures that the diffracted light at each position reaches the end face of the arrayed waveguide 210k with the same phase. The arrayed waveguide 210k is composed of a series of similarly shaped strip waveguides, with adjacent waveguides having the same length difference, and the total length of each waveguide is increased/decreased in a gradient manner throughout the array. Due to the length difference, the light with different wavelengths propagates in the arrayed waveguide 210kHave the same phase difference. The signal photons enter the output coupler 210l from the arrayed waveguide 210k, and the output coupler 210l is also a planar waveguide structure, and both end faces of the output coupler are curved surfaces, and the two curved surfaces are on the same circumference. The other end of the output coupler 210l is connected to the exit waveguide 210 m. Due to the phase difference, signal photons of different wavelengths are diffracted out of the planar waveguide of the output coupler 210l and focused into different exit waveguides 210m, achieving the effect of wavelength separation (n wavelengths: λ are illustrated in the figure)1~λn). The exit waveguide 210m focuses the signal photons with the separated wavelengths on the linear image sensor chip 3 through the microlens array 210n to obtain interference patterns, and spectral information is obtained after inverse fourier transform.
Of course, in other embodiments, the static interferometer 210 may be of other suitable types, and the scope of the present invention should not be unduly limited herein.
The plasmon optical enhancement chip system can be applied to detecting optical signals of molecules and can realize ultra-high-sensitivity optical detection of the lowest single molecule. The optical signal includes at least one of a spectral signal and a fluorescent signal. Further, the plasmon optical enhanced chip system can be used for DNA sequencing or RNA sequencing.
It should be noted that the image sensor 3 may include array or linear Photo Multiplier Tubes (PMT), Single Photon Avalanche Diodes (SPAD), Charge Coupled Device (CCD), silicon photo multiplier tubes (SiPM), or may include individual PMT, SPAD, CCD, SiPM, or photodiode. In the case of a single PMT, SPAD, CCD, SiPM, or photodiode, the plasmonic optical enhancement chip system of the present invention can be used to detect the fluorescence signal intensity of a single molecule.
In conclusion, the plasmon optical enhancement chip system has ultrahigh sensitive detection capability, and can realize ultrahigh sensitive optical detection of the lowest single molecule. The principle is that molecules in the optical enhancement antenna structure are efficiently excited by utilizing the amplification effect of a plasmon enhancement electric field, so that optical signals with single-molecule sensitivity are obtained, wherein the optical signals comprise spectral signals and/or fluorescence. The plasmon optical enhancement chip system can be applied to the fields of single molecule detection and DNA/RNA sequencing. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. A plasmonic optical enhancement chip system, comprising:
the nanopore chip comprises a nanopore chip body and a metal film, wherein at least one reaction unit is arranged in the nanopore chip body and comprises a Bragg reflector and a microcavity, the microcavity is opened from the top surface of the nanopore chip body and extends to the bottom surface of the nanopore chip body to form a nanometer opening, the Bragg reflector is distributed on two sides of the microcavity and is spaced from the microcavity by a preset distance, and the metal film is positioned on the upper surface of the nanopore chip body and covers the surface of the Bragg reflector and the surface of the microcavity;
the integrated optical chip is positioned above the nanopore chip and comprises at least one optical unit which is used for irradiating excitation light on the microcavity, collecting the excited optical signal at the opening of the nanometer, processing the collected optical signal and outputting the processed optical signal;
and the image sensor chip is positioned above the integrated optical chip and comprises at least one photoelectric conversion unit which is used for receiving the optical signal output by the integrated optical chip and converting the optical signal into an electric signal.
2. The plasmonic optical enhancement chip system of claim 1, wherein: the opening area of the micro-cavity is gradually reduced from top to bottom.
3. The plasmonic optical enhancement chip system of claim 1, wherein: the shape of the nano opening comprises one of a rectangle, a square and a circle.
4. The plasmonic optical enhancement chip system of claim 1, wherein: the optical unit comprises a single-mode waveguide, a focusing grating coupler, a collecting grating coupler, a planar waveguide, a multi-mode waveguide and a static interferometer, the single-mode waveguide is used for transmitting exciting light to the focusing grating coupler, the focusing grating coupler is used for focusing and projecting the exciting light to the microcavity downwards, the collecting grating coupler is used for collecting optical signals excited at the opening of the nanometer and transmitting the optical signals to the static interferometer through the planar waveguide and the multi-mode waveguide in sequence, and the static interferometer is used for generating interference signals and projecting the interference signals into the image sensor chip.
5. The plasmonic optical enhancement chip system of claim 4, wherein: the optical unit further comprises a micro-ring resonator structure which is arranged beside the multimode waveguide to filter exciting light.
6. The plasmonic optical enhancement chip system of claim 5, wherein: the micro-ring resonator structure comprises a ring waveguide, a strip waveguide and a metal block, wherein the ring waveguide is positioned between the multimode waveguide and the strip waveguide, and the metal block is connected to the output end of the strip waveguide.
7. The plasmonic optical enhancement chip system of claim 1, wherein: the plasmon optical enhancement chip system further comprises a laser and an optical fiber, and the integrated optical chip is connected with the laser through the optical fiber.
8. The plasmonic optical enhancement chip system of claim 7, wherein: and excitation light generated by the laser enters the integrated optical chip through the optical fiber in an end-face coupling mode or a grating coupling mode.
9. The plasmonic optical enhancement chip system of claim 1, wherein: the plasmon optical enhancement chip system comprises a plurality of reaction units, a plurality of optical units and a plurality of photoelectric conversion units to form a plurality of detection units, wherein one detection unit comprises one reaction unit, one optical unit and one photoelectric conversion unit.
10. The plasmonic optical enhancement chip system of claim 9, wherein: the integrated optical chip further comprises a multi-stage multi-mode interference coupler for splitting the excitation light in the integrated optical chip into multiple beams to be input to different optical units.
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