CN216146295U - Ceramic package crystal oscillator - Google Patents
Ceramic package crystal oscillator Download PDFInfo
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- CN216146295U CN216146295U CN202121824052.2U CN202121824052U CN216146295U CN 216146295 U CN216146295 U CN 216146295U CN 202121824052 U CN202121824052 U CN 202121824052U CN 216146295 U CN216146295 U CN 216146295U
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Abstract
The utility model discloses a ceramic packaging crystal oscillator, which comprises a ceramic substrate, a metal shell, a wafer and pins, wherein the ceramic substrate is provided with a mounting side and a patch side which are oppositely arranged, a mounting hole is arranged between the mounting side and the patch side in a penetrating manner, the patch side is at least partially provided with a first metal coating, the first metal coating is used for being welded with a circuit board patch, and the mounting side is at least partially provided with a second metal coating; the metal shell cover is arranged on the mounting side and forms a mounting cavity together with the mounting side in a surrounding manner; the wafer is arranged in the mounting cavity and is connected with the second metal coating; the pins penetrate through the mounting holes and are respectively connected with the first metal plating layer and the second metal plating layer. The ceramic packaging crystal oscillator provided by the scheme has the advantages of simple structure, convenience and quickness in installation, good air tightness in the installation cavity, low possibility of damage, long service life, simple packaging process and no need of complex equipment support.
Description
Technical Field
The utility model relates to the technical field of crystal oscillators, in particular to a ceramic packaging crystal oscillator.
Background
The packaging scheme of the existing tuning fork crystal oscillator comprises the following steps: the upper part is a metal shell, the middle part is a metal sheet, the lower part is a pin, the pin penetrates through the metal sheet in the middle part and is sealed and insulated by glass melting, but the packaging has an obvious defect, when the tuning fork type crystal oscillator is used, the pin needs to be inserted into a corresponding hole, so that the pin is inevitably bent or sheared, and the glass sealing part is easily damaged at the moment, so that the air tightness problem is caused, and the performance of the element is further influenced.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a ceramic-packaged crystal oscillator, aiming at solving the problem that the air tightness of the traditional crystal oscillator is easily damaged in the using process.
In order to achieve the above object, the present invention provides a ceramic package crystal oscillator, comprising:
the ceramic substrate is provided with a mounting side and a patch side which are oppositely arranged, a mounting hole penetrates between the mounting side and the patch side, a first metal plating layer is at least partially arranged on the patch side and used for being welded with a circuit board patch, and a second metal plating layer is at least partially arranged on the mounting side;
the metal shell is covered on the mounting side and forms a mounting cavity together with the mounting side in a surrounding manner;
the wafer is arranged in the mounting cavity and is connected with the second metal plating layer; and the number of the first and second groups,
and the pins penetrate through the mounting holes and are respectively connected with the first metal plating layer and the second metal plating layer.
Optionally, the mounting hole is filled with a metal material to form the pin.
Optionally, the lead and the first and second metal plating layers are made of the same material.
Optionally, the material of the first metal plating layer is at least partially copper.
Optionally, a third metal plating layer is further disposed on the mounting side, the third metal plating layer is annularly disposed corresponding to the open end of the metal shell, and the third metal plating layer is welded to the open end of the metal shell.
Optionally, the third metal plating layer is made of copper, and the metal shell is made of copper.
Optionally, the third metal plating layer is made of copper, and the metal shell is made of aluminum.
Optionally, the pins are spaced apart at a first predetermined pitch to generate a predetermined frequency for the wafer.
Optionally, the wafer is provided with a plurality of pins, and the pins are correspondingly provided with a plurality of pins.
Optionally, each of the wafers corresponds to two of the pins.
In the technical scheme of the utility model, the ceramic packaging crystal oscillator can be fixed by welding the first metal coating and the corresponding position patch on the circuit board, the ceramic packaging crystal oscillator is simple in structure, convenient and quick to install, the problem of air tightness in the installation cavity caused by bending or shearing of the pins can be avoided in the using process, the ceramic packaging crystal oscillator is not easy to damage and longer in service life, and the packaging process of the scheme is simple without complex equipment support.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a front view of one embodiment of a ceramic packaged crystal oscillator according to the present invention;
FIG. 2 is a top view of the ceramic packaged crystal oscillator (without the metal case) of FIG. 1;
fig. 3 is a bottom view of the ceramic packaged crystal oscillator (without the metal case) of fig. 1.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indication is involved in the embodiment of the present invention, the directional indication is only used for explaining the relative positional relationship, the motion situation, and the like between the components in a certain posture, and if the certain posture is changed, the directional indication is changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The packaging scheme of the existing tuning fork crystal oscillator comprises the following steps: the upper part is a metal shell, the middle part is a metal sheet, the lower part is a pin, the pin penetrates through the metal sheet in the middle part and is sealed and insulated by glass melting, but the packaging has an obvious defect, when the tuning fork type crystal oscillator is used, the pin needs to be inserted into a corresponding hole, so that the pin is inevitably bent or sheared, and the glass sealing part is easily damaged at the moment, so that the pin is in an airtight problem, and the performance of an element is further influenced.
In view of the above, the present invention provides a ceramic package crystal oscillator. Fig. 1 to fig. 3 show an embodiment of a ceramic package crystal oscillator according to the present invention.
Referring to fig. 1 to 3, the ceramic package crystal oscillator 100 includes a ceramic substrate 1, a metal housing 2, a wafer (not shown in the figure) and pins 3, the ceramic substrate 1 has a mounting side 11 and a die side 12 opposite to each other, a mounting hole 13 is formed between the mounting side 11 and the die side 12, the die side 12 is at least partially provided with a first metal plating layer 121, the first metal plating layer 121 is used for die bonding with a circuit board, and the mounting side 11 is at least partially provided with a second metal plating layer 111; the metal shell 2 is covered on the mounting side 11 and forms a mounting cavity together with the mounting side 11 in an enclosing manner; the wafer is arranged in the mounting cavity and is connected with the second metal plating layer 111; the pins 3 are inserted into the mounting holes 13, and the pins 3 are respectively connected to the first metal plating layer 121 and the second metal plating layer 111.
In the technical scheme of the utility model, the ceramic package crystal oscillator 100 can be fixed by welding the first metal plating layer 121 with the corresponding position patch on the circuit board, the structure is simple, the installation is convenient and rapid, the air tightness problem in the installation cavity caused by bending or shearing of the pins 3 is avoided in the use process, the ceramic package crystal oscillator is not easy to damage, the service life is longer, the package process of the scheme is simple, and the support of complex equipment is not needed.
In order to ensure the air tightness in the mounting cavity, the mounting hole 13 is filled with a metal material to form the pin 3, the pin 3 is used as a conductor, the air tightness between the first metal plating layer 121 and the second metal plating layer 111 can be ensured, the performance of the ceramic package crystal oscillator 100 is prevented from being affected due to poor air tightness, and thus, the product yield can be improved.
Specifically, the lead 3 and the first metal plating layer 121 are made of the same material, so that metal materials of the same material are easily combined, and the airtightness is better.
In an embodiment of the utility model, the material of the first metal plating layer 121 is at least partially copper, and the material of the corresponding pin 3 is also copper, so that the conductivity is good.
For the guarantee gas tightness in the installation cavity, metal casing 2 with ceramic substrate 1's junction should also seal treatment, consequently, in this scheme, still be equipped with third metallic coating 112 on installation side 11, third metallic coating 112 corresponds metal casing 2's open end is the annular setting, third metallic coating 112 with metal casing 2's open end welding, metal casing 2 with ceramic substrate 1's packaging method is simple, and production efficiency is high, the gas tightness in the installation cavity is better, and the life of product is longer.
In an embodiment of the utility model, the third metal plating layer 112 is made of copper, and the metal shell 2 is made of copper, so that the same material is more convenient and more reliable to weld.
It should be noted that the material of the metal shell 2 may also be different from the material of the third metal plating layer 112, and the material of the metal shell 2 is not limited thereto, for example, the material of the third metal plating layer 112 is copper, and the material of the metal shell 2 is aluminum, so that a designer may design the metal shell according to actual requirements.
It should be noted that, the present invention is not limited to the welding method, and how to weld belongs to the common knowledge in the art, for example, the welding method may be brazing, which is not described herein.
In the utility model, the pins 3 are arranged at intervals at a first preset interval to enable the wafer to generate stable frequency, and the first preset interval can be adjusted according to actual requirements, so long as the oscillation frequency of the wafer is not affected, which is within the protection scope of the utility model.
In an embodiment provided by the present invention, referring to fig. 2 to 3, the wafer is provided with a plurality of wafers, and the pins 3 are also provided with a plurality of pins, it should be emphasized that the present invention does not limit the number of the wafers, and the wafers may be one wafer or integrated by a plurality of wafers, so as to implement multi-oscillator packaging, and the wafers may be specifically provided according to actual requirements.
Specifically, each wafer corresponds to two pins 3, which respectively correspond to the positive and negative electrodes of the circuit board.
It should be emphasized that, in the present invention, the shape of the ceramic substrate 1 is not limited, and may be designed according to the actual installation space so as to meet the requirements of different patch welding shapes.
In addition, the utility model also provides a packaging process method of the ceramic packaged crystal oscillator 10, which is used for simplifying the packaging process of the crystal oscillator and reducing the production cost, and the packaging process method comprises the following steps: plating copper on the mounting side 11 and the die side 12, and performing through hole manufacturing at the corresponding position where the wafer is required to be mounted to form the mounting hole 13; performing copper filling operation on the mounting hole 13 to form a pin 3 for connecting the first metal plating layer 121 and the second metal plating layer 111; welding the wafer to the second metal plating layer 111; and welding the metal shell 2 and the third metal plating layer 112 on the ceramic substrate 1 under vacuum conditions to complete vacuum packaging.
From the above process method, the ceramic package crystal oscillator 100 provided by the utility model has a simple structure, and the whole package process flow is simpler without complex equipment support under the condition of meeting the product quality requirement, so that the cost is saved.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A ceramic packaged crystal oscillator, comprising:
the ceramic substrate is provided with a mounting side and a patch side which are oppositely arranged, a mounting hole penetrates between the mounting side and the patch side, a first metal plating layer is at least partially arranged on the patch side and used for being welded with a circuit board patch, and a second metal plating layer is at least partially arranged on the mounting side;
the metal shell is covered on the mounting side and forms a mounting cavity together with the mounting side in a surrounding manner;
the wafer is arranged in the mounting cavity and is connected with the second metal plating layer; and the number of the first and second groups,
and the pins penetrate through the mounting holes and are respectively connected with the first metal plating layer and the second metal plating layer.
2. The ceramic package crystal oscillator of claim 1, wherein the mounting holes are filled with a metallic material to form the leads.
3. The ceramic package crystal oscillator of claim 2, wherein the leads are the same material as the first metallization and the second metallization.
4. The ceramic packaged crystal oscillator of claim 1, wherein the first metallization is at least partially copper.
5. The ceramic packaged crystal oscillator of claim 1, wherein a third metal plating is further disposed on the mounting side, the third metal plating being annularly disposed corresponding to the open end of the metal housing, the third metal plating being welded to the open end of the metal housing.
6. The ceramic packaged crystal oscillator of claim 5, wherein the third metal plating is copper and the metal housing is copper.
7. The ceramic packaged crystal oscillator of claim 5, wherein the third metal plating is copper and the metal housing is aluminum.
8. The ceramic package crystal oscillator of claim 1, wherein the leads are spaced apart at a first predetermined pitch to produce a stable frequency for the die.
9. The ceramic package crystal oscillator of claim 1, wherein the die is provided in plurality and the pins are correspondingly provided in plurality.
10. The ceramic package crystal oscillator of claim 8, wherein there are two of the pins for each of the dies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121824052.2U CN216146295U (en) | 2021-08-05 | 2021-08-05 | Ceramic package crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121824052.2U CN216146295U (en) | 2021-08-05 | 2021-08-05 | Ceramic package crystal oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216146295U true CN216146295U (en) | 2022-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121824052.2U Active CN216146295U (en) | 2021-08-05 | 2021-08-05 | Ceramic package crystal oscillator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216146295U (en) |
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2021
- 2021-08-05 CN CN202121824052.2U patent/CN216146295U/en active Active
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