CN110958787A - Welding method for multilayer interconnection FPC preset solder paste - Google Patents
Welding method for multilayer interconnection FPC preset solder paste Download PDFInfo
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- CN110958787A CN110958787A CN202010014962.8A CN202010014962A CN110958787A CN 110958787 A CN110958787 A CN 110958787A CN 202010014962 A CN202010014962 A CN 202010014962A CN 110958787 A CN110958787 A CN 110958787A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
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Abstract
The invention discloses a welding method of multilayer interconnected FPC preset solder paste, and aims to provide a welding method of multilayer interconnected FPC with simple process, good welding performance and capability of meeting the requirement that welding pads are distributed in a two-dimensional array. A welding method of multilayer interconnected FPC preset solder paste comprises the following steps: a. reinforcing the bottom of the main FPC; b. carrying out tin melting treatment on the main output bonding pad and the main input bonding pad, so that tin paste is arranged on the main output bonding pad and the main input bonding pad; c. a layer of double-sided adhesive tape is adhered to the bottom of the auxiliary FPC; d. aligning the main FPC and the auxiliary FPC, and attaching the auxiliary FPC to the main FPC after aligning; e. brushing solder paste above the solder conducting via hole of the auxiliary FPC; f. the auxiliary FPC and the main FPC which are brushed with the solder paste are subjected to reflow furnace welding or pressure welding, the solder paste flows into the solder guiding through hole after being melted, the solder paste is melted into the solder guiding through hole, the main input bonding pad and the auxiliary output bonding pad are communicated through the solder paste, and the main output bonding pad and the auxiliary input bonding pad are communicated through the solder paste. The invention is applied to the technical field of flexible circuit boards.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a method for welding preset solder paste of a multilayer interconnected flexible circuit board (FPC).
Background
Multilayer FPC boards have multiple wiring layers with an insulating layer between two adjacent wiring layers, and multilayer circuit boards generally have at least three conductive layers, two of which are on the outer surface and the remaining one incorporated in an insulating board, and the electrical connection between them is usually made by plated through holes in the cross section of the circuit board. For some multilayer FPC, the routing of a certain conductive layer is less, the material utilization rate is low, and great substrate material waste is caused. Therefore, a multilayer interconnection FPC consisting of a main FPC large board and a plurality of auxiliary FPC small boards is developed, and the quality of welding between the main FPC and the auxiliary FPC can directly influence the quality of a product. Because the area design of circuit board is limited, main FPC and assist the FPC pad size and received the restriction, so to guarantee to have good contact between main FPC and the assistance FPC, just must guarantee to have sufficient soldering tin volume between main FPC and the pad of assisting FPC two under limited pad area, but the problem of how to fuse sufficient soldering tin between main FPC and the pad of assisting FPC two obtains not fine solution in prior art. In addition, the space of the existing intelligent terminal such as a mobile phone is limited to devices such as an FPC, so that PADs (PADs) need to be distributed in a two-dimensional array under the condition of more PADs. The traditional welding mode cannot meet the welding between the FPC adopting the PAD and the FPC.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a welding method of a multilayer interconnected FPC, which has simple process and good welding performance and can meet the requirement that welding pads are distributed in a two-dimensional array.
The technical scheme adopted by the invention is as follows: a multilayer interconnection FPC presets the welding method of the tin cream, the multilayer interconnection FPC that this method applies includes main FPC and auxiliary FPC, there are main output areas and main input areas on the said main FPC, there are auxiliary output areas and auxiliary input areas on the said auxiliary FPC; a plurality of main output bonding pads connected with the main FPC circuit are arranged in the main output area, a plurality of main input bonding pads connected with the main FPC circuit are arranged in the main input area, a plurality of auxiliary output bonding pads which are connected with the auxiliary FPC circuit and correspond to the main input bonding pads one by one are arranged in the auxiliary output area, a plurality of auxiliary input bonding pads which are connected with the auxiliary FPC circuit and correspond to the main output bonding pads one by one are arranged in the auxiliary input area, the auxiliary output bonding pad and the auxiliary input bonding pad are both provided with tin-conducting through holes which conduct the upper and lower surfaces of the auxiliary FPC, a metal layer is plated in the tin-conducting through hole, the metal layer of the tin-conducting through hole on the auxiliary output bonding pad is connected with the auxiliary output bonding pad, and the metal layer of the tin-conducting through hole on the auxiliary input bonding pad is connected with the auxiliary input bonding pad; the method is characterized in that: the welding method of the multilayer interconnected FPC preset solder paste comprises the following steps:
a. reinforcing the bottom of the main FPC;
b. carrying out tin melting treatment on the main output bonding pad and the main input bonding pad, so that tin paste is arranged on the main output bonding pad and the main input bonding pad;
c. sticking a layer of double-sided adhesive tape at the bottom of the auxiliary FPC;
d. aligning the main FPC and the auxiliary FPC, and attaching the auxiliary FPC to the main FPC after aligning;
e. brushing solder paste above the solder conducting via hole of the auxiliary FPC;
f. the auxiliary FPC and the main FPC are subjected to reflow furnace welding or pressure welding after the solder paste is brushed, the solder paste flows into the solder guiding through hole after being melted, the solder paste is melted into the solder guiding through hole, the main input bonding pad and the auxiliary output bonding pad are communicated through the solder paste, and the main output bonding pad and the auxiliary input bonding pad are communicated through the solder paste.
Furthermore, the tin-conducting through holes are plated with tin or gold. The main FPC is a single-layer or multi-layer FPC, and the auxiliary FPC is a single-layer or multi-layer FPC; and a double-sided adhesive tape is arranged between the main FPC and the auxiliary FPC.
Furthermore, a plurality of main output test pads are uniformly arranged at the edge of the main output area, and auxiliary input test pads corresponding to the main output test pads one to one are uniformly arranged at the edge of the auxiliary input area; the main FPC is provided with a plurality of main output test circuits which are respectively connected with a plurality of main output test pads, the auxiliary FPC is provided with a plurality of auxiliary input test circuits which are respectively connected with a plurality of auxiliary input test pads, the main output test circuit is not connected with the main FPC circuit, the auxiliary input test circuit is not connected with the auxiliary FPC circuit, and the main output test pads and the auxiliary input test pads are also provided with the tin conducting through holes; in the step b, carrying out tin melting treatment on the main output test bonding pad to enable the main output test bonding pad to have tin paste; in step f, the main output test pad and the auxiliary input test pad are soldered together by solder paste.
Furthermore, a plurality of main input test pads are uniformly arranged at the edge of the main input area, and auxiliary output test pads corresponding to the main input test pads one to one are uniformly arranged at the edge of the auxiliary output area; the main FPC is provided with a plurality of main input test circuits which are respectively connected with a plurality of main input test pads, the auxiliary FPC is provided with a plurality of auxiliary output test circuits which are respectively connected with a plurality of auxiliary output test pads, the main input test circuit is not connected with the main FPC circuit, the auxiliary output test circuit is not connected with the auxiliary FPC circuit, and the main input test pads and the auxiliary output test pads are also provided with the tin conducting through holes; in the step b, carrying out tin melting treatment on the main input test bonding pad to enable the main input test bonding pad to have tin paste; in step f, the main input test pad and the auxiliary output test pad are soldered together by solder paste.
Further, in step b, after the main output bonding pad and the main input bonding pad are subjected to tin melting treatment, the height of the tin paste on the main output bonding pad and the main input bonding pad is 20um-100 um.
Further, the main output test bonding pad is subjected to tin melting treatment, so that the height of tin paste on the main output test bonding pad is 20-100 um.
Further, the main input test bonding pad is subjected to tin melting treatment, so that the height of tin paste on the main input test bonding pad is 20-100 um.
Further, at least one vent hole is formed in both the main output area and the main input area, and the vent holes) are communicated with the upper surface and the lower surface of the main FPC. The exhaust hole is formed in the eccentric position of the main output bonding pad and the main input bonding pad.
Furthermore, at least one exhaust hole is formed in the auxiliary output area and the auxiliary input area, and the exhaust holes are communicated with the upper surface and the lower surface of the auxiliary FPC.
The invention has the beneficial effects that: the welding method of the multilayer interconnected FPC preset solder paste comprises the following steps: a. reinforcing the bottom of the main FPC; b. Carrying out tin melting treatment on the main output bonding pad and the main input bonding pad, so that tin paste is arranged on the main output bonding pad and the main input bonding pad; c. sticking a layer of double-sided adhesive tape at the bottom of the auxiliary FPC; d. aligning the main FPC and the auxiliary FPC, and attaching the auxiliary FPC to the main FPC after aligning; e. brushing solder paste above the solder conducting via hole of the auxiliary FPC; f. and performing reflow furnace welding or pressure welding on the auxiliary FPC and the main FPC after the solder paste is brushed, wherein the solder paste flows into the solder guiding through hole after being melted, the solder paste is melted into the solder guiding through hole, the main input pad is communicated with the auxiliary output pad through the solder paste, and the main output pad is communicated with the auxiliary input pad through the solder paste.
Drawings
Fig. 1 is a schematic structural view of the main FPC;
fig. 2 is a schematic view of the structure of the auxiliary FPC;
FIG. 3 is an enlarged view at A of FIG. 2;
fig. 4 is a schematic structural view of a multilayer interconnected FPC of the present invention;
fig. 5 is a schematic structural view of the tin-plating process for the main output pad 7 and the main input pad 8;
fig. 6 is a schematic structural view of the main FPC1 and the auxiliary FPC2 when they are not yet soldered;
fig. 7 is a schematic structural view after the solder paste 17 is brushed on the solder via 11;
fig. 8 is a schematic view of the structure when the main FPC1 and the auxiliary FPC2 have been soldered.
Detailed Description
As shown in fig. 1 to 8, in the present embodiment, a method for soldering predetermined solder paste to a multi-layer interconnection FPC is used, the method uses a multi-layer interconnection FPC including a main FPC1 and an auxiliary FPC2, the main FPC1 is provided with a main output region 3 and a main input region 4, and the auxiliary FPC2 is provided with an auxiliary output region 5 and an auxiliary input region 6; a plurality of main output pads 7 electrically connected with the main FPC1 are provided in the main output area 3, a plurality of main input pads 8 electrically connected with the main FPC1 are provided in the main input area 4, a plurality of auxiliary output pads 9 which are electrically connected with the auxiliary FPC2 and correspond to the main input pads 8 one by one are arranged in the auxiliary output area 5, a plurality of auxiliary input pads 10 which are electrically connected with the auxiliary FPC2 and correspond to the main output pads 7 one to one are arranged in the auxiliary input area 6, the auxiliary output pad 9 and the auxiliary input pad 10 are both provided with tin-conducting through holes 11, the tin-conducting through holes 11 conduct the upper and lower surfaces of the auxiliary FPC2, a metal layer 16 is plated in the tin-conducting through hole 11, the metal layer 16 of the tin-conducting through hole 11 on the auxiliary output bonding pad 9 is connected with the auxiliary output bonding pad 9, the metal layer 16 of the tin conducting through hole 11 on the auxiliary input pad 10 is connected with the auxiliary input pad 10; the method is characterized in that: the welding method of the multilayer interconnected FPC preset solder paste comprises the following steps:
a. reinforcing the bottom of the main FPC 1;
b. carrying out tin melting treatment on the main output bonding pad 7 and the main input bonding pad 8, so that tin paste 17 is arranged on the main output bonding pad 7 and the main input bonding pad 8;
c. a layer of double-sided adhesive tape 18 is adhered to the bottom of the auxiliary FPC 2;
d. the main FPC1 and the auxiliary FPC2 are aligned, and the auxiliary FPC2 is attached to the upper surface of the main FPC1 after the alignment;
e. the solder paste 17 is brushed above the solder conducting through hole 11 of the auxiliary FPC 2;
f. the auxiliary FPC2 and the main FPC1 are subjected to reflow furnace welding or pressure welding after being brushed with the solder paste 17, the solder paste flows into the solder guiding through hole 11 after being melted, the solder paste 17 is melted into the solder guiding through hole 11, the main input pad 8 and the auxiliary output pad 9 are communicated through the solder paste 17, and the main output pad 7 and the auxiliary input pad 10 are communicated through the solder paste 17.
Through lead tin via hole 11 and weld and predetermine the design of tin cream, enable assist output pad 9 with between the main input pad 8 and assist input pad 10 with weld more fast between the main output pad 7, more firm, the contact is more abundant, can not produce phenomenons such as contact failure.
In this embodiment, the tin-conductive via 11 is plated with tin or gold. The main FPC1 is a single-layer or multi-layer FPC, and the auxiliary FPC2 is a single-layer or multi-layer FPC; a double-sided adhesive tape 18 is arranged between the main FPC1 and the auxiliary FPC 2.
In this embodiment, a plurality of main output test pads 12 are uniformly arranged at the edge of the main output area 3, and auxiliary input test pads 13 corresponding to the main output test pads 12 one to one are uniformly arranged at the edge of the auxiliary input area 6; a plurality of main output test circuits connected with a plurality of main output test pads 12 are arranged on the main FPC1, a plurality of auxiliary input test circuits connected with a plurality of auxiliary input test pads 13 are arranged on the auxiliary FPC2, the main output test circuit is not connected with the main FPC1 circuit, the auxiliary input test circuit is not connected with the auxiliary FPC2 circuit, and the main output test pads 12 and the auxiliary input test pads 13 are also provided with the tin-conducting through holes 11; in step b, performing tin melting treatment on the main output test pad 12 to enable the main output test pad 12 to have the tin paste 17; in step f, the main output test pad 12 and the auxiliary input test pad 13 are soldered together by solder paste 17.
In this embodiment, a plurality of main input test pads 14 are uniformly arranged at the edge of the main input area 4, and auxiliary output test pads 15 corresponding to the main input test pads 14 one to one are uniformly arranged at the edge of the auxiliary output area 5; a plurality of main input test circuits connected with a plurality of main input test pads 14 are arranged on the main FPC1, a plurality of auxiliary output test circuits connected with a plurality of auxiliary output test pads 15 are arranged on the auxiliary FPC2, the main input test circuit is not connected with the main FPC1 circuit, the auxiliary output test circuit is not connected with the auxiliary FPC2 circuit, and the main input test pads 14 and the auxiliary output test pads 15 are also provided with the tin-conducting through holes 11; in step b, the primary input test pad 14 is subjected to a tin melting process so that the primary input test pad 14 has a tin paste 17 thereon, and in step f, the primary input test pad 14 and the secondary output test pad 15 are soldered together by the tin paste 17.
In this embodiment, in step b, after the main output pad 7 and the main input pad 8 are subjected to the tin melting treatment, the height of the solder paste 17 on the main output pad 7 and the main input pad 8 is 60 um.
In this embodiment, the main output test pad 12 is subjected to the tin melting process so that the height of the solder paste 17 on the main output test pad 12 is 60 um.
In this embodiment, the main input test pad 14 is subjected to a tin melting process so that the height of the solder paste 17 on the main input test pad 14 is 60 um.
In this embodiment, at least one vent hole 19 is formed in each of the main output area 3 and the main input area 4, and the vent hole 19 conducts the upper and lower surfaces of the main FPC 1. The vent hole 19 is provided at an eccentric position of the main output pad 7 and the main input pad 8. In this embodiment, at least one air vent hole 19 is formed in each of the auxiliary output area 5 and the auxiliary input area 6, and the air vent hole 19 conducts the upper and lower surfaces of the auxiliary FPC 2. The invention adopts a reflow soldering mode, wherein the reflow soldering is to melt tin from the surface to the inside by hot air, the air in the melted surface is exhausted through the exhaust hole 19, so that the insufficient soldering cannot be generated, and the design size of the aperture of the exhaust hole 19 is 0.05-0.2mm, and the optimal 0.1 mm. The invention has simple structure, avoids the use of the material of the whole surface by a simple circuit, has high material utilization ratio compared with the traditional multilayer FPC, can discharge air through the vent hole during welding, effectively prevents false soldering, can accelerate the inflow speed of soldering tin, and has sufficient soldering tin amount.
As shown in fig. 5 to 8, in the present embodiment, both the main FPC1 and the auxiliary FPC2 are double-layer FPCs. Be provided with double faced adhesive tape 18 between main FPC1 and the supplementary FPC2, double faced adhesive tape 18 is used for main FPC1 with supplementary FPC2 is fixed in advance, ensures that follow-up welding has higher precision, guarantees the yields. In this embodiment, the main FPC1 and the auxiliary FPC2 each include a base material PI, copper foils are disposed on both surfaces of the base material PI, a coverlay film or green oil is disposed on the surfaces of the copper foils, and the two copper foils of the auxiliary FPC2 are electrically connected by plating gold in the tin conductive vias 11. The main output pad 7 and the main input pad 8 are both connected with the upper copper foil of the main FPC 1. The main FPC1 and the auxiliary FPC2 can achieve the same function as a four-layer FPC board after welding, and a local four-layer FPC structure is formed. Compared with the traditional multilayer FPC, the material utilization rate is high, and the performance is more stable.
The invention is applied to the technical field of flexible circuit boards.
While the embodiments of the present invention have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the present invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.
Claims (9)
1. A method for welding multilayer interconnection FPC preset solder paste is characterized in that the multilayer interconnection FPC applied by the method comprises a main FPC (1) and an auxiliary FPC (2), wherein the main FPC (1) is provided with a main output area (3) and a main input area (4), and the auxiliary FPC (2) is provided with an auxiliary output area (5) and an auxiliary input area (6); a plurality of main output bonding pads (7) which are in circuit connection with the main FPC (1) are arranged in the main output area (3), a plurality of main input bonding pads (8) which are in circuit connection with the main FPC (1) are arranged in the main input area (4), a plurality of auxiliary output bonding pads (9) which are in circuit connection with the auxiliary FPC (2) and are in one-to-one correspondence with the main input bonding pads (8) are arranged in the auxiliary output area (5), a plurality of auxiliary input bonding pads (10) which are in circuit connection with the auxiliary FPC (2) and are in one-to-one correspondence with the main output bonding pads (7) are arranged in the auxiliary input area (6), tin conducting through holes (11) are arranged on the auxiliary output bonding pads (9) and the auxiliary input bonding pads (10), the tin conducting through holes (11) are communicated with the upper surface and the lower surface of the auxiliary FPC (2), and metal layers (16) are plated in the tin conducting through holes (11), the metal layer (16) of the tin conducting through hole (11) on the auxiliary output bonding pad (9) is connected with the auxiliary output bonding pad (9), and the metal layer (16) of the tin conducting through hole (11) on the auxiliary input bonding pad (10) is connected with the auxiliary input bonding pad (10); the method is characterized in that: the welding method of the multilayer interconnected FPC preset solder paste comprises the following steps:
a. reinforcing the bottom of the main FPC (1);
b. carrying out tin melting treatment on the main output bonding pad (7) and the main input bonding pad (8) to enable the main output bonding pad (7) and the main input bonding pad (8) to have tin paste (17);
c. a layer of double-sided adhesive tape (18) is adhered to the bottom of the auxiliary FPC (2);
d. the main FPC (1) and the auxiliary FPC (2) are aligned, and the auxiliary FPC (2) is attached to the main FPC (1) after the alignment;
e. a solder paste (17) is brushed above the solder conducting through hole (11) of the auxiliary FPC (2);
f. will brush behind tin cream (17) assist FPC (2) with main FPC (1) carries out reflow oven welding or pressure welding, flows into after the tin cream melts lead tin via hole (11), melt into tin cream (17) in leading tin via hole (11), main input pad (8) with assist output pad (9) and pass through tin cream (17) intercommunication, main output pad (7) with assist input pad (10) and pass through tin cream (17) intercommunication.
2. The method for soldering the multilayer interconnected FPC preset solder paste as recited in claim 1, wherein: and tin or gold is plated in the tin conducting through holes (11).
3. The method for soldering the multilayer interconnected FPC preset solder paste as recited in claim 1, wherein: a plurality of main output test pads (12) are uniformly arranged at the edge of the main output area (3), and auxiliary input test pads (13) which are in one-to-one correspondence with the main output test pads (12) are uniformly arranged at the edge of the auxiliary input area (6); a plurality of main output test circuits connected with a plurality of main output test pads (12) respectively are arranged on the main FPC (1), a plurality of auxiliary input test circuits connected with a plurality of auxiliary input test pads (13) respectively are arranged on the auxiliary FPC (2), the main output test circuits are not connected with the main FPC (1) circuit, the auxiliary input test circuits are not connected with the auxiliary FPC (2) circuit, and the main output test pads (12) and the auxiliary input test pads (13) are also provided with the tin-conducting through holes (11); in the step b, the tin melting treatment is carried out on the main output test pad (12) so that the tin paste (17) is arranged on the main output test pad (12); in step f, the primary output test pad (12) and the secondary input test pad (13) are soldered together by solder paste (17).
4. The method for soldering the multilayer interconnected FPC preset solder paste as recited in claim 1, wherein: a plurality of main input test pads (14) are uniformly arranged at the edge of the main input area (4), and auxiliary output test pads (15) which are in one-to-one correspondence with the main input test pads (14) are uniformly arranged at the edge of the auxiliary output area (5); the main FPC (1) is provided with a plurality of main input test circuits respectively connected with a plurality of main input test pads (14), the auxiliary FPC (2) is provided with a plurality of auxiliary output test circuits respectively connected with a plurality of auxiliary output test pads (15), the main input test circuit is not connected with the main FPC (1) circuit, the auxiliary output test circuit is not connected with the auxiliary FPC (2) circuit, and the main input test pads (14) and the auxiliary output test pads (15) are also provided with the tin-conducting through holes (11); in the step b, carrying out tin melting treatment on the main input test pad (14) to enable the main input test pad (14) to have tin paste (17); in step f, the primary input test pad (14) and the secondary output test pad (15) are soldered together by solder paste (17).
5. The method for soldering the multilayer interconnected FPC preset solder paste as recited in claim 1, wherein: in step b, after the main output bonding pad (7) and the main input bonding pad (8) are subjected to tin melting treatment, the height of the tin paste (17) on the main output bonding pad (7) and the main input bonding pad (8) is 20um-100 um.
6. The method for soldering the multilayer interconnected FPC preset solder paste as recited in claim 3, wherein: and the main output test pad (12) is subjected to tin melting treatment, so that the height of the tin paste (17) on the main output test pad (12) is 20-100 um.
7. The method for soldering the multilayer interconnected FPC preset solder paste as recited in claim 4, wherein: and the main input test pad (14) is subjected to tin melting treatment, so that the height of the tin paste (17) on the main input test pad (14) is 20-100 um.
8. The method for soldering the multilayer interconnected FPC preset solder paste as recited in claim 1, wherein: at least one exhaust hole (19) is formed in the main output area (3) and the main input area (4), and the exhaust holes (19) are communicated with the upper surface and the lower surface of the main FPC (1). The exhaust hole (19) is arranged at the eccentric position of the main output bonding pad (7) and the main input bonding pad (8).
9. The method for soldering the multilayer interconnected FPC preset solder paste as recited in claim 1, wherein: at least one exhaust hole (19) is formed in the auxiliary output area (5) and the auxiliary input area (6), and the exhaust holes (19) are communicated with the upper surface and the lower surface of the auxiliary FPC (2).
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| CN111629511A (en) * | 2020-06-03 | 2020-09-04 | 成都羿发向荣芯能量材料科技有限公司 | Interconnected FPC board bubble bulge processing method, interconnected FPC board and electronic equipment |
| CN112040641A (en) * | 2020-09-17 | 2020-12-04 | 成都羿发向荣芯能量材料科技有限公司 | Multilayer interconnection electronic circuit board |
| CN112135439A (en) * | 2020-09-17 | 2020-12-25 | 成都羿发向荣芯能量材料科技有限公司 | Magnetic jig and multilayer FPC welding method |
| CN113179597A (en) * | 2021-04-22 | 2021-07-27 | 深圳市格瑞弘电子有限公司 | Rigid-flexible circuit board and manufacturing method thereof |
| CN113747685A (en) * | 2020-05-27 | 2021-12-03 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board assembly and manufacturing method thereof |
| CN114286512A (en) * | 2021-12-30 | 2022-04-05 | 京东方科技集团股份有限公司 | Circuit board assembly, manufacturing method thereof and display device |
| CN116709669A (en) * | 2022-12-30 | 2023-09-05 | 福莱盈电子股份有限公司 | Manufacturing method of circuit board external connection bridging stacking structure |
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