CN215991319U - Circuit board - Google Patents
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- CN215991319U CN215991319U CN202121170963.8U CN202121170963U CN215991319U CN 215991319 U CN215991319 U CN 215991319U CN 202121170963 U CN202121170963 U CN 202121170963U CN 215991319 U CN215991319 U CN 215991319U
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Abstract
The utility model provides a circuit board which comprises a body, wherein the body comprises a first mixed pressboard, a third prepreg layer and a second mixed pressboard which are sequentially stacked from top to bottom; the body is provided with a first groove penetrating through the first mixed pressboard and the third prepreg layer, a second blind hole penetrating through the second mixed pressboard and communicated with the first groove, a second groove penetrating through the second mixed pressboard and the third prepreg layer, a first blind hole penetrating through the first mixed pressboard and communicated with the second groove, and a through hole penetrating through the body, wherein copper cylinders are filled in the first blind hole, the second blind hole and the through hole. The utility model can effectively solve the problems of insufficient glue filling of the circuit board, poor heat conduction and heat dissipation performance and the like.
Description
Technical Field
The utility model relates to the field of circuit boards, in particular to a circuit board.
Background
In recent years, along with the development of science and technology, higher and higher requirements are put forward on the heat conducting performance of the circuit board, particularly, the heat production quantity of communication element assemblies such as 5G and the like is large, the temperature of the assemblies and the whole circuit board is easily increased during application, and the situation of large local temperature difference occurs, so that the signal mutation instability of the assemblies is easily caused, and therefore, the heat conducting and radiating performance of the circuit board is improved, and the heat conducting and radiating performance of the circuit board is of great significance to popularization and application of the circuit board. At present, the circuit board is usually made of high-thermal-conductivity materials, and particularly, the high-thermal-conductivity materials are filled between copper substrates, however, the high-thermal-conductivity materials are often poor in flowability, the problems that glue filling between copper-clad substrates is not enough (namely, an area with insufficient filling amount of the high-thermal-conductivity materials or even without filling of the high-thermal-conductivity materials) and the like exist, and meanwhile, the heat conduction and the heat dissipation performance of the copper-clad substrates are also to be improved.
SUMMERY OF THE UTILITY MODEL
The utility model provides a mixed-voltage high-heat-conductivity circuit board, which at least solves the problems of insufficient glue filling between circuit board copper-clad substrates, poor heat conduction and heat dissipation performance and the like in the prior art.
The utility model provides a circuit board, which comprises a body, wherein the body comprises a first mixed pressboard, a third prepreg layer and a second mixed pressboard which are sequentially stacked from top to bottom, the first mixed pressboard comprises a first copper-clad substrate, a first prepreg layer and a second copper-clad substrate which are sequentially stacked from top to bottom, and the second mixed pressboard comprises a third copper-clad substrate, a second prepreg layer and a fourth copper-clad substrate which are sequentially stacked from top to bottom; wherein, be equipped with the first recess that runs through first mixed pressboard and third prepreg layer on the body, run through the second mixed pressboard and with the second blind hole of first recess intercommunication, run through the second mixed pressboard and the second recess of third prepreg layer, run through first mixed pressboard and with the first blind hole of second recess intercommunication and run through the through-hole of body, all pack in first blind hole, second blind hole, the through-hole and have the copper cylinder.
According to an embodiment of the present invention, the through hole is located between the first groove and the second groove.
According to an embodiment of the present invention, at least one of the following conditions is satisfied: the number of the through holes is more than or equal to 2; the number of the first blind holes is more than or equal to 2; the number of the second blind holes is more than or equal to 2.
According to an embodiment of the utility model, the body is further provided with a third blind hole which penetrates through the first mixed pressure plate and is not communicated with the second groove, and the third blind hole is filled with a copper cylinder; and/or the body is also provided with a fourth blind hole which penetrates through the second mixed pressboard and is not communicated with the first groove, and the fourth blind hole is filled with a copper cylinder.
According to an embodiment of the present invention, at least one of the following conditions is satisfied: a metal layer is formed on the inner wall of the first blind hole; a metal layer is formed on the inner wall of the second blind hole; a metal layer is formed on the inner wall of the through hole.
According to an embodiment of the present invention, at least one of the following conditions is satisfied: the resin content in the first semi-cured sheet layer is not lower than 65%; the resin content in the second prepreg layer is not less than 65%; the resin content in the third prepreg layer is not less than 65%.
According to an embodiment of the present invention, at least one of the following conditions is satisfied: the thickness of the first semi-cured sheet layer is more than or equal to 3 mil; the thickness of the second prepreg layer is more than or equal to 3 mil; the thickness of the third prepreg layer is not less than 4 mil.
According to an embodiment of the present invention, at least one of the following conditions is satisfied: the first copper-clad substrate comprises two first copper foil layers and a first insulating layer positioned between the two first copper foil layers, and the thickness of each first copper foil layer meets 2 OZ-8 OZ; the second copper-clad substrate comprises two second copper foil layers and a second insulating layer positioned between the two second copper foil layers, and the thickness of each second copper foil layer meets 2 OZ-8 OZ; the third copper-clad substrate comprises two third copper foil layers and a third insulating layer positioned between the two third copper foil layers, and the thickness of each third copper foil layer meets 2 OZ-8 OZ; the fourth copper-clad substrate comprises two fourth copper foil layers and a fourth insulating layer located between the two fourth copper foil layers, and the thickness of each fourth copper foil layer meets 2 OZ-8 OZ.
According to an embodiment of the present invention, at least one of the following conditions is satisfied: the first copper-clad substrate comprises two first copper foil layers and a first insulating layer positioned between the two first copper foil layers, and the thermal conductivity of the first insulating layer is 0.8W/(m.K) -2.5W/(m.K); the second copper-clad substrate comprises two second copper foil layers and a second insulating layer positioned between the two second copper foil layers, and the thermal conductivity of the second insulating layer is 0.8W/(m.K) -2.5W/(m.K); the third copper-clad substrate comprises two third copper foil layers and a third insulating layer positioned between the two third copper foil layers, and the thermal conductivity of the third insulating layer is 0.8W/(m.K) -2.5W/(m.K); the fourth copper-clad substrate comprises two fourth copper foil layers and a fourth insulating layer located between the two fourth copper foil layers, and the thermal conductivity of the fourth insulating layer is 0.8W/(m.K) -2.5W/(m.K).
According to an embodiment of the present invention, at least one of the following conditions is satisfied: the first semi-cured sheet layer comprises resin with a thermal conductivity coefficient of 0.2-0.7W/(m.K); the second prepreg layer contains resin with a thermal conductivity coefficient of 0.2-0.7W/(m.K); the third prepreg layer contains resin with a thermal conductivity of 0.2-0.7W/(m.K).
The circuit board is manufactured by using the prepreg, and the prepreg layers (the first prepreg layer, the second prepreg layer and the third prepreg layer) are formed between each copper-clad substrate and the mixed-compression daughter board, so that the problem of insufficient glue filling between copper layers can be effectively solved, and meanwhile, the copper cylinders in the first blind hole, the second blind hole and the through hole have good thermal conductivity, so that the heat conduction performance between the daughter boards is facilitated.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a copper-clad substrate according to an embodiment of the present invention;
FIG. 3 is a schematic view of a copper-clad substrate after an inner layer pattern is formed according to an embodiment of the present invention;
fig. 4 a is a schematic structural view of a first hybrid plate manufactured in an embodiment of the present invention, and fig. 4B is a schematic structural view of a second hybrid plate manufactured in an embodiment of the present invention;
fig. 5 a is a schematic structural view of the first hybrid board after forming a blind hole and forming a metal layer on the wall of the blind hole; fig. 5B is a schematic structural view after a blind hole is formed in the second mixed pressure plate and a metal layer is formed on the wall of the blind hole;
fig. 6 a is a schematic structural view after a copper cylinder is formed in a blind hole of the first hybrid board and used as an inner layer circuit; fig. 6B is a schematic structural view after a copper cylinder is formed in the blind hole of the second hybrid board and used as an inner layer circuit;
FIG. 7 is a schematic structural diagram of a circuit board precursor formed by laminating a first hybrid board, a third prepreg, and a second hybrid board;
FIG. 8 is a schematic diagram of the structure after forming a via hole in the wiring board precursor and a metal layer on the via hole wall;
FIG. 9 is a schematic diagram of a structure after forming copper pillars in the vias and making outer layer circuits;
fig. 10 is a schematic structural view after blind grooves are formed in the process of manufacturing the first groove and the second groove.
Description of reference numerals: 1. a first mixed pressboard; 2. a second mixed pressboard; 3. a third prepreg layer; 4. a through hole; 5. a metal layer; 6. a glue blocking gasket; 11. a first copper-clad substrate; 12. a first semi-cured ply layer; 13. a second copper-clad substrate; 14. a first blind hole; 15. a first groove; 16. a third blind hole; 21. a third copper-clad substrate; 22. a second prepreg layer; 23. a fourth copper-clad substrate; 24. a second blind hole; 25. a second groove; 26. a fourth blind hole; 111. a copper foil layer; 112. an insulating layer; h: a high heat dissipation area.
Detailed Description
In order that those skilled in the art will better understand the concept of the present invention, the following detailed description is given with reference to the accompanying drawings.
As shown in fig. 1, the circuit board provided by the utility model comprises a body, wherein the body comprises a first mixed pressboard 1, a third prepreg layer 3 and a second mixed pressboard 2 which are sequentially stacked from top to bottom, the first mixed pressboard 1 comprises a first copper-clad substrate 11, a first prepreg layer 12 and a second copper-clad substrate 13 which are sequentially stacked from top to bottom, and the second mixed pressboard 2 comprises a third copper-clad substrate 21, a second prepreg layer 22 and a fourth copper-clad substrate 23 which are sequentially stacked from top to bottom; wherein, be equipped with the first recess 15 that runs through first mixed pressboard 1 and third prepreg layer 3 on the body, run through the second mixed pressboard 2 and with the second blind hole 24 of first recess 15 intercommunication, run through the second mixed pressboard 2 and the second recess 25 of third prepreg layer 3, run through first mixed pressboard 1 and with the first blind hole 14 of second recess 25 intercommunication, and run through the through-hole 4 of body, all fill in first blind hole 14, second blind hole 24, the through-hole 4 has the copper cylinder.
The structural design of the blind holes (the first blind hole 14, the second blind hole 24, the third blind hole 16 and the fourth blind hole 26) and the through hole 4 is beneficial to conducting heat accumulated by each circuit copper circuit layer, and the heat dissipation path and the heat dissipation area of each circuit copper circuit layer are increased, under the structural system, the copper layer of the second copper-clad substrate corresponding to one end, close to the second groove 25, of the first blind hole 14 and the copper layer of the third copper-clad substrate corresponding to one end, close to the first groove 15, of the second blind hole 24 are high heat dissipation areas H, the high heat dissipation areas H at the two positions are respectively exposed through the second groove 25 and the first groove 15, and the overall heat conduction and dissipation performance of the circuit board can be effectively improved.
In some embodiments, the through hole 4 is located between the first groove 15 and the second groove 25, which is beneficial to further improve the heat conduction and dissipation performance of the circuit board.
In specific implementation, the number of the first grooves 15, the first blind holes 14, the second grooves 25, the second blind holes 24 and the through holes 4 can be designed according to the number of components to be mounted on a circuit board (or called a circuit board (PCB)), so that heat generated by the components can be dissipated. In some preferred embodiments, the number of through holes 4 may be 2 or more, the number of first blind holes 14 may be 2 or more, and the number of second blind holes 24 may be 2 or more.
In some embodiments, the body is further provided with a third blind hole 16 penetrating through the first hybrid board 1 and not communicated with the second groove 25, and the third blind hole 16 is filled with a copper cylinder, which is beneficial to further improving the heat conduction and heat dissipation performance of the circuit board. Alternatively, the third blind hole 16 may be disposed on a side of the first recess 15 away from the first blind hole 14.
Further, a fourth blind hole 26 which penetrates through the second mixed press plate 2 and is not communicated with the first groove 15 can be further formed in the body, and a copper cylinder is filled in the fourth blind hole 26. Alternatively, a fourth blind hole 26 may be provided on a side of the second recess 25 remote from the second blind hole 24.
To further optimize the overall performance of the circuit board, in some embodiments, at least one of the inner walls of the third blind hole 16, the fourth blind hole 26, the first blind hole 14, the second blind hole 24, and the through hole 4 is formed with a metal layer 5.
In some embodiments, the first prepreg layer comprises a resin having a thermal conductivity of 0.2-0.7W/(m.K), the second prepreg layer comprises a resin having a thermal conductivity of 0.2-0.7W/(m.K), and the third prepreg layer comprises a resin having a thermal conductivity of 0.2-0.7W/(m.K).
The prepreg layers (the first prepreg layer 12, the second prepreg layer 22, and the third prepreg layer 3) are formed by prepregs, and specifically, the prepregs, the copper-clad substrates, and the copper-clad substrates may be stacked in sequence and then laminated to form the daughter boards (the first mixed-voltage daughter board 1 and the second mixed-voltage daughter board 3), where the prepregs are subjected to a laminating process to form the prepreg layers. The prepreg (also called PP sheet) mainly comprises resin and reinforcing materials, and the resin can be conventional heat-conducting resin, such as resin with a heat conductivity coefficient of 0.2-0.7W/(m.K), which is beneficial to further avoiding the problem of insufficient filling.
In contrast, the use of a prepreg with a higher resin content (i.e., a high-gel prepreg) is beneficial to further improve the underfill problem, and in some preferred embodiments, at least one of the resin content in the first prepreg layer 12, the resin content in the second prepreg layer 22, and the resin content in the third prepreg layer 3 is not less than 65%, for example, a range consisting of 65%, 70%, 75%, 80%, 85%, 90%, 93%, or any value thereof.
In the utility model, the heat conduction and heat dissipation performance of the circuit board is satisfied, and the prepreg layers (the first prepreg layer 12, the second prepreg layer 22 and the third prepreg layer 3) have smaller thickness, so that the overall thickness of the circuit board is reduced, for example, in some embodiments, the thickness of the first prepreg layer 12 is not less than 3mil, the thickness of the second prepreg layer 22 is not less than 3mil, and the thickness of the third prepreg layer 3 is not less than 4 mil.
In the present invention, the copper-clad substrates (the first copper-clad substrate 11, the second copper-clad substrate 13, the third copper-clad substrate 21, and the fourth copper-clad substrate 23) generally include at least two copper foil layers (copper circuit layers) formed by metal copper and an insulating layer located between each two copper foil layers, and the insulating layer may be a high thermal conductive plate glue layer specifically, and is used to bond the two copper foil layers together. Taking the first copper clad substrate 11 as an example, the first copper clad substrate 11 includes two copper foil layers 111 and an insulating layer 112 located between the two copper foil layers 111.
In general, the insulating layers (e.g., the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer) include insulating resin glass cloth and a filler, which may be conventional materials in the art, and the present invention is not particularly limited thereto. The mass content of the insulating resin in the insulating layer may be generally 65% to 95%, for example, 65%, 70%, 75%, 80%, 85%, 90%, 95%, or any combination thereof.
Specifically, in some embodiments, the first copper-clad substrate comprises at least two first copper foil layers, and a first insulating layer positioned between each two first copper foil layers, wherein the thickness of each first copper foil layer satisfies 2 OZ-8 OZ; the second copper-clad substrate comprises at least two second copper foil layers and a second insulating layer positioned between every two second copper foil layers, and the thickness of each second copper foil layer meets 2 OZ-8 OZ; the third copper-clad substrate comprises at least two third copper foil layers and a third insulating layer positioned between every two third copper foil layers, and the thickness of each third copper foil layer meets 2 OZ-8 OZ; the fourth copper-clad substrate comprises at least two fourth copper foil layers and a fourth insulating layer positioned between every two fourth copper foil layers, and the thickness of each fourth copper foil layer meets 2 OZ-8 OZ. Wherein 1OZ is 35 μm.
Further, in some embodiments, the first insulating layer has a thermal conductivity of 0.8W/(m.k) -2.5W/(m.k), such as 1W/(m.k), 1.2W/(m.k), 1.5W/(m.k), 1.8W/(m.k), 2W/(m.k), 2.2W/(m.k), 2.5W/(m.k), or a range consisting of both any value therein; the second insulating layer has a thermal conductivity of 0.8W/(m.k) -2.5W/(m.k), such as 1W/(m.k), 1.2W/(m.k), 1.5W/(m.k), 1.8W/(m.k), 2W/(m.k), 2.2W/(m.k), 2.5W/(m.k), or a range consisting of any of both; the thermal conductivity of the third insulating layer is 0.8W/(m.k) -2.5W/(m.k), such as 1W/(m.k), 1.2W/(m.k), 1.5W/(m.k), 1.8W/(m.k), 2W/(m.k), 2.2W/(m.k), 2.5W/(m.k), or a range consisting of any of the two; the thermal conductivity of the fourth insulating layer is 0.8W/(m.k) -2.5W/(m.k), such as 1W/(m.k), 1.2W/(m.k), 1.5W/(m.k), 1.8W/(m.k), 2W/(m.k), 2.2W/(m.k), 2.5W/(m.k), or any combination thereof.
As shown in fig. 1 to 9, the method for manufacturing a circuit board provided by the present invention includes: (1) stacking a first copper-clad substrate, a first semi-cured sheet and a second copper-clad substrate in sequence, and then laminating to prepare a first mixed laminated board (shown as A in figure 5) with the first copper-clad substrate, the first semi-cured sheet and the second copper-clad substrate which are sequentially stacked; stacking the third copper-clad substrate, the second prepreg and the fourth copper-clad substrate in sequence, and then laminating to prepare a second mixed laminated board (shown as B in fig. 5) with the third copper-clad substrate, the second prepreg and the fourth copper-clad substrate which are stacked in sequence; (2) manufacturing a first blind hole penetrating through the first mixed-pressure plate on the first mixed-pressure plate, and injecting copper slurry into the first blind hole to form a copper cylinder (shown as A in figure 6); manufacturing a second blind hole penetrating through the second mixed-pressure plate on the second mixed-pressure plate, and injecting copper slurry into the second blind hole to form a copper cylinder (shown as B in figure 6); (3) respectively arranging a first through groove penetrating through the third prepreg and a second through groove penetrating through the third prepreg on the third prepreg, and respectively filling a glue blocking gasket 6 in the first through groove and the second through groove; stacking the first mixed pressboard, the third prepreg and the second mixed pressboard in sequence, and then laminating to obtain a circuit board precursor (shown in fig. 7) with the first mixed pressboard, the third prepreg and the second mixed pressboard which are stacked in sequence; the first blind hole is controlled to be communicated with the first through groove, and the second blind hole is controlled to be communicated with the second through groove; (4) performing the following steps (41) and (42) to obtain a wiring board: (41) manufacturing a through hole penetrating through the circuit board precursor on the circuit board precursor (as shown in FIG. 8), and injecting copper slurry into the through hole to form a copper cylinder (as shown in FIG. 9); (42) a first blind groove (shown in figure 10) which penetrates through the first mixed pressure plate and is communicated with the second through groove is formed in the circuit board precursor, the glue blocking gasket 6 in the second through groove is taken out, and a first groove which penetrates through the first mixed pressure plate and the third prepreg layer is formed; and (3) forming a second blind groove (shown in figure 10) which penetrates through the second mixed-pressure plate and is communicated with the first through groove on the circuit board precursor, taking out the glue blocking gasket 6 in the first through groove, and forming a second groove which penetrates through the second mixed-pressure plate and the third prepreg layer to obtain the circuit board (shown in figure 1).
Specifically, in the step (1), firstly, four high thermal conductive sheet thick copper-clad substrates (i.e., a first copper-clad substrate, a second copper-clad substrate, a third copper-clad substrate and a fourth copper-clad substrate, the structure of which is shown in fig. 2) and a first prepreg and a second prepreg are provided, inner layer patterns are respectively formed on the thick copper-clad substrates as required (as shown in fig. 3), and then the first copper-clad substrate, the first prepreg and the second copper-clad substrate are sequentially stacked and then pressed to form a first mixed pressboard (as shown in a of fig. 4); and stacking the third copper-clad substrate, the second prepreg and the fourth copper-clad substrate in sequence, and then laminating to obtain a second mixed pressboard (the structure is shown as B in fig. 4).
In some embodiments, the step (2) may further include fabricating a third blind hole penetrating through the first hybrid board, and in practical implementation, the first hybrid board may be drilled to form the first blind hole and the third blind hole, then the first blind hole and the third blind hole are respectively subjected to Plating Through Hole (PTH) and electroplating treatment to form a metal layer on inner walls of the first blind hole and the third blind hole, respectively (as shown in a of fig. 5), then a heat-conductive copper paddle is injected into the first blind hole and the third blind hole to form a copper cylinder, and then an internal circuit of the board is fabricated (as shown in a of fig. 6). The metal layer formed on the inner walls of the first blind via and the third blind via is, for example, a copper layer.
In some embodiments, the step (2) may further include fabricating a fourth blind hole penetrating through the second hybrid board on the second hybrid board, and in practical implementation, the second hybrid board may be drilled to form the second blind hole and the fourth blind hole, then the second blind hole and the fourth blind hole are respectively subjected to Plating Through Hole (PTH) and electroplating treatment to form a metal layer on inner walls of the second blind hole and the fourth blind hole, respectively (as shown in B of fig. 5), then a heat-conductive copper paddle is injected into the second blind hole and the fourth blind hole to form a copper cylinder, and then an internal circuit of the board is fabricated (as shown in B of fig. 6). The metal layer formed on the inner walls of the second blind via and the fourth blind via is, for example, a copper layer.
In step (3), an appropriate number of prepregs may be selected according to the thickness of the formed third prepreg layer, for example, two third prepregs are used to form the third prepreg layer (as shown in fig. 7 to 9).
In a specific implementation, step (41) may be performed first, and then step (42) may be performed, or step (42) may be performed first, and then step (41) may be performed, which is not particularly limited in the present invention.
In some embodiments, in step (41), a via hole is drilled in the wiring board precursor, and then a Plated Through Hole (PTH) and electroplating process is performed on the via hole to form a metal layer on the inner wall of the via hole (as shown in fig. 8). The metal layer formed on the inner wall of the through hole is, for example, a copper layer.
In the step (42), the adhesive blocking gasket 6 is taken out to form a first groove and a second groove, and a high heat dissipation area is exposed to improve the heat dissipation performance of the circuit board, and then residual media on the bottom surface and the side wall of the first groove, the second groove and the side wall can be treated and removed, and the whole circuit board precursor is subjected to surface cleaning and other treatments to obtain the circuit board. In the utility model, the processes of pressing, drilling, PTH, electroplating, surface treatment and the like can be conventional procedures in the field and are not described in detail.
The embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiment. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The circuit board is characterized by comprising a body, wherein the body comprises a first mixed pressboard, a third prepreg layer and a second mixed pressboard which are sequentially stacked from top to bottom, the first mixed pressboard comprises a first copper-clad substrate, a first prepreg layer and a second copper-clad substrate which are sequentially stacked from top to bottom, and the second mixed pressboard comprises a third copper-clad substrate, a second prepreg layer and a fourth copper-clad substrate which are sequentially stacked from top to bottom; wherein the content of the first and second substances,
the body is provided with a first groove penetrating through the first mixed pressboard and the third prepreg layer, a second blind hole penetrating through the second mixed pressboard and communicated with the first groove, a second groove penetrating through the second mixed pressboard and the third prepreg layer, a first blind hole penetrating through the first mixed pressboard and communicated with the second groove, and a through hole penetrating through the body, wherein copper cylinders are filled in the first blind hole, the second blind hole and the through hole.
2. The wiring board of claim 1, wherein the via is located between the first recess and the second recess.
3. The wiring board according to claim 1 or 2, wherein at least one of the following conditions is satisfied:
the number of the through holes is more than or equal to 2;
the number of the first blind holes is more than or equal to 2;
the number of the second blind holes is more than or equal to 2.
4. The wiring board of claim 1,
the body is also provided with a third blind hole which penetrates through the first mixed press plate and is not communicated with the second groove, and a copper cylinder is filled in the third blind hole;
and/or the presence of a gas in the gas,
the body is further provided with a fourth blind hole which penetrates through the second mixed press plate and is not communicated with the first groove, and a copper cylinder is filled in the fourth blind hole.
5. The wiring board of claim 1, wherein at least one of the following conditions is satisfied:
a metal layer is formed on the inner wall of the first blind hole;
a metal layer is formed on the inner wall of the second blind hole;
and a metal layer is formed on the inner wall of the through hole.
6. The wiring board of claim 1, wherein at least one of the following conditions is satisfied:
the resin content in the first semi-cured sheet layer is not lower than 65%;
the resin content in the second prepreg layer is not lower than 65%;
the resin content in the third prepreg layer is not less than 65%.
7. The wiring board according to claim 1 or 6, wherein at least one of the following conditions is satisfied:
the thickness of the first semi-cured sheet layer is more than or equal to 3 mil;
the thickness of the second prepreg layer is more than or equal to 3 mil;
the thickness of the third prepreg layer is not less than 4 mil.
8. The wiring board of claim 1, wherein at least one of the following conditions is satisfied:
the first copper-clad substrate comprises at least two first copper foil layers and a first insulating layer positioned between every two first copper foil layers, and the thickness of each first copper foil layer meets 2 OZ-8 OZ;
the second copper-clad substrate comprises at least two second copper foil layers and a second insulating layer positioned between every two second copper foil layers, and the thickness of each second copper foil layer meets 2 OZ-8 OZ;
the third copper-clad substrate comprises at least two third copper foil layers and a third insulating layer positioned between every two third copper foil layers, and the thickness of each third copper foil layer meets 2 OZ-8 OZ;
the fourth copper-clad substrate comprises at least two fourth copper foil layers and a fourth insulating layer positioned between every two fourth copper foil layers, and the thickness of each fourth copper foil layer meets 2 OZ-8 OZ.
9. The wiring board according to claim 1 or 8, wherein at least one of the following conditions is satisfied:
the first copper-clad substrate comprises two first copper foil layers and a first insulating layer located between the two first copper foil layers, and the thermal conductivity of the first insulating layer is 0.8W/(m.K) -2.5W/(m.K);
the second copper-clad substrate comprises two second copper foil layers and a second insulating layer located between the two second copper foil layers, and the thermal conductivity of the second insulating layer is 0.8W/(m.K) -2.5W/(m.K);
the third copper-clad substrate comprises two third copper foil layers and a third insulating layer located between the two third copper foil layers, and the thermal conductivity of the third insulating layer is 0.8W/(m.K) -2.5W/(m.K);
the fourth copper-clad substrate comprises two fourth copper foil layers and a fourth insulating layer located between the two fourth copper foil layers, and the thermal conductivity of the fourth insulating layer is 0.8W/(m.K) -2.5W/(m.K).
10. The wiring board of claim 1, wherein at least one of the following conditions is satisfied:
the first semi-cured sheet layer comprises resin with a heat conductivity coefficient of 0.2-0.7W/(m.K);
the second prepreg layer comprises resin with a thermal conductivity coefficient of 0.2-0.7W/(m.K);
the third prepreg layer contains resin with a thermal conductivity coefficient of 0.2-0.7W/(m.K).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121170963.8U CN215991319U (en) | 2021-05-28 | 2021-05-28 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121170963.8U CN215991319U (en) | 2021-05-28 | 2021-05-28 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215991319U true CN215991319U (en) | 2022-03-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202121170963.8U Active CN215991319U (en) | 2021-05-28 | 2021-05-28 | Circuit board |
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| Country | Link |
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| CN (1) | CN215991319U (en) |
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2021
- 2021-05-28 CN CN202121170963.8U patent/CN215991319U/en active Active
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Effective date of registration: 20230615 Address after: No. 107, Baishi Road, Qianshan, Xiangzhou District, Zhuhai, Guangdong 519070 Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee after: New founder holdings development Co.,Ltd. Address before: 519002 No. 107, Baishi Road, Qianshan, Xiangzhou District, Zhuhai City, Guangdong Province Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. |