CN215573123U - Temperature vibration composite sensor based on mems acceleration chip - Google Patents
Temperature vibration composite sensor based on mems acceleration chip Download PDFInfo
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- CN215573123U CN215573123U CN202122392042.2U CN202122392042U CN215573123U CN 215573123 U CN215573123 U CN 215573123U CN 202122392042 U CN202122392042 U CN 202122392042U CN 215573123 U CN215573123 U CN 215573123U
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Abstract
The application discloses temperature vibration composite sensor based on mems acceleration chip relates to signal detection technical field. The vibration signal and the temperature signal of the object to be detected can be detected simultaneously, and the device has the advantages of simple and compact structure and easiness in assembly and debugging. The temperature vibration composite sensor comprises a sensor shell, a temperature sensor probe, a mems acceleration chip and a signal processing chip; a sensor mounting cavity which is communicated from left to right is arranged in the sensor shell, a sensor mounting base is arranged in the mounting cavity, the sensor mounting base is connected to the opening at the left end of the sensor shell, and a sensor cover plate is arranged at the opening at the right end of the sensor shell; the temperature sensor probe is connected to the left end of the sensor mounting base, the signal processing chip is arranged at the right end of the sensor mounting base, and the mems acceleration chip is arranged on the signal processing chip; the bottom of the mounting cavity is provided with a wire outlet, and the wire outlet is connected with a wire outlet connector. The application is used for improving the performance of the temperature vibration composite sensor.
Description
Technical Field
The application relates to the technical field of signal detection, in particular to a temperature vibration composite sensor based on a mems acceleration chip.
Background
The existing temperature vibration composite sensor mainly detects temperature and is accompanied with axial vibration detection, and most of the existing temperature vibration composite sensors adopt a method of installing a mass block to detect pressure or shear force generated during vibration to measure acceleration. The method has the defects of complex structure, complex processing, small vibration detection range and low sensitivity, and each sensor needs to be calibrated independently due to the existence of processing errors, so the method is not suitable for high-precision multi-axial signal detection.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a temperature vibration composite sensor based on mems acceleration chip, not only can detect the vibration signal and the temperature signal of the object that awaits measuring simultaneously, has simple structure compactness, easily the advantage of equipment debugging moreover.
In order to achieve the above object, an embodiment of the present application provides a temperature vibration composite sensor based on a mems acceleration chip, which includes a sensor housing, a temperature sensor probe, a mems acceleration chip, and a signal processing chip; a sensor mounting base is arranged in the mounting cavity, the sensor mounting base is connected to the opening at the left end of the sensor shell, and a sensor cover plate is arranged at the opening at the right end of the sensor shell; the temperature sensor probe is connected to the left end of the sensor mounting base, the signal processing chip is arranged at the right end of the sensor mounting base, and the mems acceleration chip is arranged on the signal processing chip; and a wire outlet is arranged at the bottom of the mounting cavity and connected with a wire outlet connector.
Furthermore, an included angle is formed between the central line of the wire outlet and the bottom surface of the mounting cavity.
Further, the installation cavity is I-shaped, and the left side wall and the right side wall of the installation cavity are both provided with left and right through connection holes.
Further, the sensor mounting base comprises a first mounting part and a second mounting part arranged at the right end of the first mounting part; the section of the first mounting part is I-shaped, the first mounting part is welded at an opening at the left end of the sensor shell, a mounting hole extending along the left-right direction is formed in the first mounting part, and one end of the temperature sensor probe is fixed in the mounting hole; the second installation department is the rectangular plate, the signal processing chip passes through first bolted connection and is in on the second installation department, just the signal processing chip is located the middle part of installation cavity.
Further, the mems acceleration chip is welded on the signal processing chip.
Further, the temperature sensor probe is welded to the sensor mounting base.
Furthermore, the mems acceleration chip can acquire an acceleration value of the to-be-detected object, convert the acceleration value into an electric signal and output the electric signal to the signal processing chip; the signal processing chip can reduce noise and amplify the electric signals.
Further, the mems acceleration chips are multiple.
Further, the mems acceleration chip can measure vibration signals in a single direction in a high-frequency state, the single-axis measuring range of the mems acceleration chip is +/-100 g, and the sampling frequency is 21 kHz.
Further, the mems acceleration chip can simultaneously measure acceleration values in three directions in a low-frequency state.
Compared with the prior art, the application has the following beneficial effects:
1. the temperature vibration composite sensor of the embodiment of the application is provided with the temperature sensor probe on the sensor shell, and the mems acceleration chip and the signal processing chip are arranged in the sensor shell, so that compared with the technical scheme that the mass block is installed in the prior art, the temperature vibration composite sensor not only can simultaneously detect the vibration signal and the temperature signal of an object to be detected, but also has the advantages of simple and compact structure and easiness in assembly and debugging.
2. The temperature vibration composite sensor can select single-axis or multi-axis signal acquisition according to actual needs, and has the advantages of high signal precision and large measuring range.
3. The mems acceleration chip in the temperature vibration composite sensor of the embodiment of the application has stable output signals and does not need complex signal calibration operation.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a cross-sectional view of a temperature vibration composite sensor based on a mems acceleration chip according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a view angle of the temperature vibration composite sensor based on the mems acceleration chip according to the embodiment of the present application (the sensor cover is removed);
FIG. 3 is a schematic structural diagram of another view angle of the temperature vibration composite sensor based on the mems acceleration chip according to the embodiment of the present application (the sensor cover is removed);
fig. 4 is a schematic structural diagram of a sensor mounting base in the temperature vibration composite sensor based on the mems acceleration chip according to the embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; the specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
Referring to fig. 1, an embodiment of the present application provides a mems acceleration chip-based temperature vibration composite sensor, which includes a sensor housing 1, a temperature sensor probe 2, a signal processing chip 3, and a mems acceleration chip 4.
Referring to fig. 1 to 3, a left-right through mounting cavity 11 is formed in a sensor housing 1, for convenience of mounting a chip and wiring, the mounting cavity 11 is i-shaped, and left and right side walls of the mounting cavity 11 are provided with left and right through connecting holes 13. The second bolt 9 passes through the connecting hole 13 and then is connected with the piece to be tested. Be equipped with sensor mounting base 5 in the installation cavity 11, and sensor mounting base 5 connects at the left end opening part of sensor housing 1, and sensor cover plate 6 is welded to the right-hand member opening part of sensor housing 1. The temperature sensor probe 2 is connected to the left end of the sensor mounting base 5, the signal processing chip 3 is arranged at the right end of the sensor mounting base 5, and the mems acceleration chip 4 is arranged on the signal processing chip 3. An outlet 12 is arranged at the bottom of the mounting cavity 11, and the outlet 12 is connected with the outlet connector 7.
In order to facilitate wiring and installation of the outlet connector 7, an included angle is formed between the central line of the outlet 12 and the bottom surface of the installation cavity 11. Specifically, the included angle may be 45 degrees, 90 degrees or other angles, which is not limited herein.
Referring to fig. 1 and 4, the sensor mounting base 5 includes a first mounting portion 51 and a second mounting portion 52 provided at a right end of the first mounting portion 51. The first mounting portion 51 has an i-shaped cross section, and the first mounting portion 51 is welded to the left end opening of the sensor housing 1. The first mounting portion 51 is provided with a positioning mounting hole 511 extending in the left-right direction, and one end of the temperature sensor probe 2 is fixed in the positioning mounting hole 511.
The second mounting portion 52 is a rectangular plate vertically disposed on the circular right end surface of the first mounting portion 51, and a surface surrounded by a length of the rectangular plate in the width direction and a length of the rectangular plate in the thickness direction is fixedly connected to the circular right end surface of the first mounting portion 51. Be equipped with four screw holes 521 that extend along thickness direction on this rectangular plate, signal processing chip 3 passes through first bolt 8 to be connected on second installation department 52, and signal processing chip 3 is vertical to be set up in the middle part of installation cavity 11. For more reliable connection and ease of processing, the mems acceleration chip 4 is soldered on the signal processing chip 3.
In some embodiments, one end of the temperature sensor probe 2 is welded at the positioning and mounting hole 511 of the sensor mounting base 5, and the other end thereof is inserted into the inside of the to-be-detected piece for temperature detection.
The mems acceleration chip 4 can collect the vibration signal of the detected object and convert the vibration signal into an electric signal for output, specifically, the vibration signal can be directly converted into an electric signal when acting on the mems acceleration chip 4, and the electric signal is output after noise reduction and amplification through the signal processing chip. Therefore, piezoelectric or pressure-sensitive structures such as mass blocks do not need to be additionally arranged, the structure is simple, the space is saved, and the assembly is convenient.
In some embodiments, the mems acceleration chip 4 can measure vibration signals in multiple directions simultaneously in a low-frequency state, and has the advantages of large measuring range and high sensitivity.
In other embodiments, the mems acceleration chip 4 can measure vibration signals in a single direction at a high frequency. Specifically, the uniaxial measuring range of the mems acceleration chip 4 is ± 100g, and the sampling frequency is 21 kHz. In addition, a plurality of mems acceleration chips 4 may be arranged to obtain a three-axis vibration signal in a high-frequency state, and it should be noted that the three axes refer to X, Y and a Z axis.
The above is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A temperature vibration composite sensor based on a mems acceleration chip is characterized by comprising a sensor shell, a temperature sensor probe, a mems acceleration chip and a signal processing chip;
a sensor mounting base is arranged in the mounting cavity, the sensor mounting base is connected to the opening at the left end of the sensor shell, and a sensor cover plate is arranged at the opening at the right end of the sensor shell;
the temperature sensor probe is connected to the left end of the sensor mounting base, the signal processing chip is arranged at the right end of the sensor mounting base, and the mems acceleration chip is arranged on the signal processing chip;
and a wire outlet is arranged at the bottom of the mounting cavity and connected with a wire outlet connector.
2. The mems acceleration chip based temperature vibration composite sensor according to claim 1, wherein the center line of the outlet has an angle with the bottom surface of the mounting cavity.
3. The mems acceleration chip-based temperature and vibration composite sensor according to claim 1, wherein the mounting cavity is i-shaped, and left and right side walls of the mounting cavity are provided with left and right through connection holes.
4. The mems acceleration chip based temperature vibration composite sensor according to claim 3,
the sensor mounting base comprises a first mounting part and a second mounting part arranged at the right end of the first mounting part;
the section of the first mounting part is I-shaped, the first mounting part is welded at an opening at the left end of the sensor shell, a mounting hole extending along the left-right direction is formed in the first mounting part, and one end of the temperature sensor probe is fixed in the mounting hole;
the second installation department is the rectangular plate, the signal processing chip passes through first bolted connection and is in on the second installation department, just the signal processing chip is located the middle part of installation cavity.
5. The mems acceleration chip based temperature vibration composite sensor according to claim 1, wherein the mems acceleration chip is soldered on the signal processing chip.
6. The mems acceleration chip based temperature vibration composite sensor of claim 1, wherein the temperature sensor probe is soldered on the sensor mounting base.
7. The temperature vibration composite sensor based on the mems acceleration chip as claimed in any one of claims 1 to 6, wherein the mems acceleration chip can collect acceleration values of a detected object, convert the acceleration values into electric signals and output the electric signals to the signal processing chip; the signal processing chip can reduce noise and amplify the electric signals.
8. The mems acceleration chip based temperature vibration composite sensor according to claim 1, wherein the mems acceleration chip is plural.
9. The mems acceleration chip-based temperature vibration composite sensor according to claim 1, wherein the mems acceleration chip can measure vibration signals in a single direction in a high frequency state, and the single-axis measuring range of the mems acceleration chip is ± 100g, and the sampling frequency is 21 kHz.
10. The mems acceleration chip based temperature vibration composite sensor according to claim 1, wherein the mems acceleration chip can simultaneously measure acceleration values in three directions in a low frequency state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122392042.2U CN215573123U (en) | 2021-09-30 | 2021-09-30 | Temperature vibration composite sensor based on mems acceleration chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122392042.2U CN215573123U (en) | 2021-09-30 | 2021-09-30 | Temperature vibration composite sensor based on mems acceleration chip |
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| CN215573123U true CN215573123U (en) | 2022-01-18 |
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| CN202122392042.2U Active CN215573123U (en) | 2021-09-30 | 2021-09-30 | Temperature vibration composite sensor based on mems acceleration chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4296250A1 (en) | 2022-06-23 | 2023-12-27 | Yara International ASA | Process or storage tank with dual measurement means and method of operating thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4296250A1 (en) | 2022-06-23 | 2023-12-27 | Yara International ASA | Process or storage tank with dual measurement means and method of operating thereof |
| WO2023247749A1 (en) | 2022-06-23 | 2023-12-28 | Yara International Asa | Process or storage tank with dual measurement means and method of operating thereof |
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