CN215525502U - Calibration mechanism and equipment suitable for wafer appearance detection - Google Patents
Calibration mechanism and equipment suitable for wafer appearance detection Download PDFInfo
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- CN215525502U CN215525502U CN202121993679.0U CN202121993679U CN215525502U CN 215525502 U CN215525502 U CN 215525502U CN 202121993679 U CN202121993679 U CN 202121993679U CN 215525502 U CN215525502 U CN 215525502U
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Abstract
The utility model discloses a calibration mechanism and equipment suitable for wafer appearance detection, which belong to the technical field of wafer detection. The calibrating mechanism suitable for wafer appearance detection is simple in structure and simple and convenient to set, can accurately and quickly realize direction calibration after different wafers to be detected are taken and before detection, ensures that the wafers to be detected for wafer detection can be consistent in detection direction, reduces the setting of a rotary correcting mechanism at a detection station, simplifies the structural design of wafer appearance detection equipment, improves the efficiency and the precision of wafer appearance detection, and has good practical value and application prospect.
Description
Technical Field
The utility model belongs to the technical field of wafer detection, and particularly relates to a calibration mechanism and equipment suitable for wafer appearance detection.
Background
With the rapid development of electronic products, the demand of the electronic market for wafers is increasing day by day, and higher requirements are put forward on the product quality, the product specification, the preparation process and the like of the wafers.
In the production process of the wafer, the detection process of the wafer is indispensable, which often relates to the reliability and accuracy of the subsequent use of the wafer, and when the detection process of the wafer is carried out, the direction of the wafer product often needs to be identified, so as to ensure that the product faces the same direction after each wafer to be detected enters the detection visual field of AOI (optical automatic detection), which is beneficial to reducing the rotation adjustment of the product carrying platform, avoiding the design of a rotation correction mechanism, reducing the volume of AOI equipment and simplifying the control process of the AOI equipment.
At present, in order to realize the direction recognition of a wafer before detection, a small notch or a flat opening is usually formed at the edge of a wafer product so as to be matched with a sensor for detection, and then the direction of the wafer to be detected is judged. The above method can meet the detection requirement of the traditional wafer to a certain extent, however, along with the continuous expansion of the wafer market application, more and more wafer product forms begin to appear, wherein the wafer product forms include products which cannot be provided with notches, such as CV wafer products (a combination product of glass sheets and wafers).
SUMMERY OF THE UTILITY MODEL
Aiming at one or more of the defects or the improvement requirements in the prior art, the utility model provides a calibration mechanism and equipment suitable for wafer appearance detection, which can accurately realize the calibration of a wafer to be detected before AOI detection, accurately realize the identification of the product direction of the wafer, and improve the efficiency and the accuracy of the wafer appearance detection.
In order to achieve the above object, according to an aspect of the present invention, a calibration mechanism for inspecting the appearance of a wafer includes a calibration module and a detection module;
the calibration module comprises a sucker and a calibrator; the sucking disc is used for adsorbing and supporting a wafer to be tested, is connected with the calibrator in a matching way, and can drive the wafer to be tested to translate and/or rotate under the driving of the calibrator;
the detection module is arranged on one side of the calibration module and used for identifying the positioning identification on the wafer to be tested and completing positioning calibration of the wafer to be tested by matching with the calibrator.
As a further improvement of the present invention, the positioning mark is at least one of a positioning notch, a positioning code and a characteristic stripe;
the positioning notch is formed in the periphery of the wafer to be detected, and the positioning code and the characteristic stripes are formed on the top surface of the wafer to be detected respectively.
As a further improvement of the utility model, the positioning notch comprises a flat cutting notch and an arc notch.
As a further improvement of the present invention, the detection module comprises a camera; the camera is supported by the supporting frame and arranged on one side of the calibration module and used for identifying the positioning mark.
As a further improvement of the utility model, the detection module further comprises a coaxial light source for providing illumination for the detection of the camera.
As a further improvement of the present invention, the detection module further includes a backlight source for providing illumination to the bottom surface of the wafer to be detected, so that one side of the wafer to be detected on the suction cup extends between the coaxial light source and the backlight source.
As a further improvement of the present invention, an adjusting unit is disposed on the supporting frame corresponding to the camera and/or the coaxial light source, and is configured to adjust a relative position of the camera and/or the coaxial light source.
As a further improvement of the present invention, the adjustment manner of the adjustment unit includes a lifting adjustment, a translation adjustment and/or a rotation adjustment.
As a further improvement of the utility model, a lens is arranged between the coaxial light source and the camera.
The equipment suitable for the wafer appearance detection comprises the calibration mechanism suitable for the wafer appearance detection, and can perform direction calibration on a wafer to be detected after the wafer is taken and before the wafer is detected.
The above-described improved technical features may be combined with each other as long as they do not conflict with each other.
Generally, compared with the prior art, the technical scheme conceived by the utility model has the following beneficial effects:
(1) according to the calibration mechanism suitable for wafer appearance detection, the detection module and the calibration module are correspondingly arranged, so that reliable adsorption support of a wafer to be detected can be realized, the positioning mark on the wafer to be detected can be quickly and accurately identified on the basis, direction detection and calibration of the wafer to be detected are realized, the wafers subjected to appearance detection at a detection station can be ensured to keep consistent directions, position adjustment of the wafer at the detection station is reduced, arrangement of wafer appearance detection equipment is simplified, and efficiency and precision of wafer appearance detection are improved.
(2) According to the calibrating mechanism suitable for wafer appearance detection, the detection module consisting of the camera, the lens, the coaxial light source, the backlight source and the like is arranged to replace the traditional sensor detection module, so that the calibrating detection of the wafer with the positioning marks such as the positioning gap and the positioning code can be realized, the calibrating detection of the wafer which cannot be provided with the positioning marks can also be realized, the application range of the calibrating mechanism is expanded, the compatibility of the calibrating mechanism is improved, the wafer appearance detection equipment can perform appearance detection of different types of wafers, and the setting cost of the wafer appearance detection equipment is indirectly reduced.
(3) According to the calibrating mechanism suitable for wafer appearance detection, the adjusting unit is arranged on the supporting frame corresponding to the camera of the detection module, so that the detection position of the camera can be adjusted according to actual needs, the detection requirements of different parts of a wafer are met, and the positioning and calibration of different types of wafers are possible.
(4) The calibrating mechanism suitable for wafer appearance detection is simple in structure and simple and convenient to set, can accurately and quickly realize direction calibration after different wafers to be detected are taken and before detection, ensures that the wafers to be detected for wafer detection can be consistent in detection direction, reduces the setting of a rotary correcting mechanism at a detection station, simplifies the structural design of wafer appearance detection equipment, improves the efficiency and the precision of wafer appearance detection, and has good practical value and application prospect.
Drawings
FIG. 1 is a schematic diagram of an alignment mechanism suitable for wafer appearance inspection according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a wafer to be tested being mounted on a calibration mechanism in a matching manner according to an embodiment of the utility model;
FIGS. 3-5 are schematic structural diagrams of different types of wafers under test according to embodiments of the present invention;
in all the figures, the same reference numerals denote the same features, in particular:
1. a base plate; 2. calibrating the module; 3. a detection module; 4. a wafer to be tested;
201. a calibrator; 202. a suction cup; 301. a camera; 302. a lens; 303. a support frame; 304. a camera adjustment unit; 305. a coaxial light source; 306. a backlight source; 307. a light source adjusting unit; 401. positioning the notch; 402. positioning codes; 403. characteristic stripes.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Example (b):
referring to fig. 1 and 2, the calibration mechanism suitable for wafer appearance inspection in the preferred embodiment of the present invention includes a calibration module 2 and a detection module 3, the two modules are preferably simultaneously disposed on a bottom plate 1, and the bottom plate 1 is connected to corresponding stations on an AOI device, so that the calibration mechanism can be disposed on the AOI device. Under the general condition, the calibration station provided with the calibration mechanism in the AOI equipment is arranged between the material taking station and the detection station or arranged on one side of the material taking station, so that the wafer 4 to be detected can be aligned and calibrated after material taking and before detection, and the accuracy of subsequent detection is ensured.
Specifically, the calibration module 2 in the preferred embodiment is shown in fig. 1, and includes a box-shaped calibrator 201, and a suction cup 202 is disposed corresponding to the calibrator 201. In the preferred embodiment, the chuck 202 is a disk-shaped structure that protrudes vertically from the top surface of the aligner case for carrying and adsorbing the wafer 4 to be tested. Meanwhile, in the calibrator 201 in the preferred embodiment, a displacement assembly is disposed corresponding to the suction cup 202, and the suction cup 202 can be driven to perform displacement adjustment in the XY axis orthogonal direction and rotation adjustment in the circumferential direction.
In more detail, in actual configuration, the displacement assembly configured for the suction cup 202 may include a plurality of servo motors, and the servo motors are driven to realize the translation and/or the rotation around the axis of the suction cup 202. Accordingly, corresponding to the translation of the suction cup 202, a sliding guide rail may be correspondingly provided for realizing the translation, which is not described herein again.
Further, the detecting module 3 in the preferred embodiment is disposed at one side of the calibrating module 2, and is used for identifying and detecting the wafer 4 to be tested fixed on the chuck 202, and further completing the direction calibration of the wafer 4 to be tested by cooperating with the calibrator 201.
In a preferred embodiment, the detection module 3 is configured to identify a positioning identifier on the wafer 4 to be detected, and the determination of the setting direction of the wafer 4 to be detected is achieved through the identification of the positioning identifier. In practical application, the shape of the wafer 4 to be tested includes three shapes as shown in fig. 3 to fig. 5, and at this time, the positioning mark on the wafer 4 to be tested includes a positioning notch 401, a positioning code 402 and a characteristic stripe 403.
The positioning notch 401 is opened on the outer periphery of one side of the wafer 4 to be tested, and in a preferred embodiment, there are at least two types of flat cutting notches 401a as shown in fig. 3 and arc/semicircular notches 401b as shown in fig. 4. The positioning code 402 is arranged on the top surface of the wafer 4 to be detected and can be directly identified by the detection module 3; in actual setting, the positioning code 402 may be a character code for storing product information of the wafer, so that when the detection module 3 is used for detection, the product information of the wafer may be correspondingly read, and the detection result corresponds to the product. In addition, when the top surface of the wafer 4 to be tested cannot be provided with the positioning code 402 and the periphery cannot be provided with the positioning notch 401, the detection module 3 can identify the characteristic stripe 403 on the wafer to realize positioning calibration, for example, the direction of the wafer 4 to be tested is judged by judging whether the horizontal and vertical cross grains of the well are presented.
More specifically, the inspection module 3 in the preferred embodiment includes a camera 301, and more preferably a CCD camera, which is disposed on a support 303 whose bottom is connected to the bottom plate 1, and is provided with a lens 302 corresponding thereto, and a coaxial light source 305 is coaxially disposed below the lens 302 for illuminating the top surface of the wafer 4 to be inspected, so as to provide illumination for the operation of the camera 301. Specifically, the coaxial light source 305 is located above the wafer 4 to be tested on the chuck 202; correspondingly, a backlight source 306 is further disposed on the supporting frame 303 for illuminating the bottom surface of the wafer 4 to be tested, so that after the wafer 4 to be tested is correspondingly disposed on the chuck 202, one side of the matching detection module 3 is sandwiched between the coaxial light source 305 and the backlight source 306, as shown in fig. 2.
Further, a camera adjusting unit 304 is further disposed on the supporting frame 303 corresponding to the camera 301, and is configured to adjust the position of the camera 301 aligning to the wafer 4 to be detected, so as to implement switching detection of different positioning identifiers by the camera 301, and meet detection requirements of different wafers 4 to be detected. The adjustment content of the camera adjustment unit 304 in the preferred embodiment includes, but is not limited to, vertical adjustment, translational adjustment, and rotational adjustment. Correspondingly, the corresponding coaxial light source 305 is further provided with a light source adjusting unit 307 for realizing synchronous corresponding adjustment between the coaxial light source 305 and the camera 301. Of course, in actual setup, the camera 301 and the coaxial light source 305 may preferably share a set of adjustment units, so that both may be adjusted together.
In an embodiment of the present invention, the calibration mechanism is disposed on the detection station, so that the wafer 4 to be detected can be correspondingly loaded onto the suction cup 202 after being taken from the material box, and the calibration in the detection direction of the wafer 4 to be detected can be realized by using the corresponding matching between the calibrator 201 and the detection module 3, so that the wafers 4 to be detected loaded onto the detection station can keep the consistency in the detection direction, and further the arrangement of the rotary displacement mechanism at the detection station is reduced.
The calibrating mechanism suitable for the wafer appearance detection is simple in structure and simple and convenient to set, can accurately and quickly realize direction calibration after different wafers to be detected are taken and before detection, ensures that the wafers to be detected for wafer detection can ensure the consistency of detection directions, reduces the setting of a rotary correcting mechanism at a detection station, simplifies the structural design of wafer appearance detection equipment, improves the efficiency and the precision of the wafer appearance detection, and has better practical value and application prospect.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the utility model, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A calibration mechanism suitable for wafer appearance detection is characterized by comprising a calibration module and a detection module;
the calibration module comprises a sucker and a calibrator; the sucking disc is used for adsorbing and supporting a wafer to be tested, is connected with the calibrator in a matching way, and can drive the wafer to be tested to translate and/or rotate under the driving of the calibrator;
the detection module is arranged on one side of the calibration module and used for identifying the positioning identification on the wafer to be tested and completing positioning calibration of the wafer to be tested by matching with the calibrator.
2. The calibration mechanism suitable for wafer appearance inspection according to claim 1, wherein the positioning mark is at least one of a positioning notch, a positioning code, and a characteristic stripe;
the positioning notch is formed in the periphery of the wafer to be detected, and the positioning code and the characteristic stripes are formed on the top surface of the wafer to be detected respectively.
3. The alignment mechanism for wafer appearance inspection as claimed in claim 2, wherein the positioning notch comprises a flat cut notch and an arc notch.
4. The alignment mechanism for wafer appearance inspection as claimed in any one of claims 1 to 3, wherein the inspection module comprises a camera; the camera is supported by the supporting frame and arranged on one side of the calibration module and used for identifying the positioning mark.
5. The alignment mechanism for wafer appearance inspection as claimed in claim 4, wherein the inspection module further comprises a coaxial light source for providing illumination for inspection by the camera.
6. The alignment mechanism for wafer appearance inspection as claimed in claim 5, wherein the inspection module further comprises a backlight source for providing illumination to the bottom surface of the wafer to be inspected, so that one side of the wafer to be inspected on the chuck extends between the coaxial light source and the backlight source.
7. The calibration mechanism suitable for wafer appearance inspection according to claim 5, wherein an adjustment unit is disposed on the supporting frame corresponding to the camera and/or the coaxial light source for adjusting the relative position of the camera and/or the coaxial light source.
8. The alignment mechanism for wafer appearance inspection as claimed in claim 7, wherein the adjustment manner of the adjustment unit comprises a lifting adjustment, a translation adjustment and/or a rotation adjustment.
9. The alignment mechanism suitable for wafer appearance inspection as claimed in claim 5, wherein a lens is disposed between the coaxial light source and the camera.
10. An apparatus suitable for wafer appearance inspection, comprising the calibration mechanism suitable for wafer appearance inspection as claimed in any one of claims 1 to 9, wherein the alignment mechanism can perform direction calibration on the wafer to be inspected before inspection after the wafer is taken out of the inspection chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121993679.0U CN215525502U (en) | 2021-08-23 | 2021-08-23 | Calibration mechanism and equipment suitable for wafer appearance detection |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121993679.0U CN215525502U (en) | 2021-08-23 | 2021-08-23 | Calibration mechanism and equipment suitable for wafer appearance detection |
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| CN215525502U true CN215525502U (en) | 2022-01-14 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114361093A (en) * | 2022-03-11 | 2022-04-15 | 立川(深圳)智能科技设备有限公司 | Feeding and pre-positioning device on wafer |
| CN117347390A (en) * | 2023-12-06 | 2024-01-05 | 成都博视达科技有限公司 | Glass cover plate edge detection device |
-
2021
- 2021-08-23 CN CN202121993679.0U patent/CN215525502U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114361093A (en) * | 2022-03-11 | 2022-04-15 | 立川(深圳)智能科技设备有限公司 | Feeding and pre-positioning device on wafer |
| CN114361093B (en) * | 2022-03-11 | 2022-05-27 | 立川(深圳)智能科技设备有限公司 | Feeding and pre-positioning device on wafer |
| CN117347390A (en) * | 2023-12-06 | 2024-01-05 | 成都博视达科技有限公司 | Glass cover plate edge detection device |
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