CN215222627U - Carrier heat dissipation device for PCBA reflow soldering - Google Patents
Carrier heat dissipation device for PCBA reflow soldering Download PDFInfo
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- CN215222627U CN215222627U CN202121782032.3U CN202121782032U CN215222627U CN 215222627 U CN215222627 U CN 215222627U CN 202121782032 U CN202121782032 U CN 202121782032U CN 215222627 U CN215222627 U CN 215222627U
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Abstract
The utility model discloses a carrier heat abstractor for PCBA reflow soldering relates to PCBA heat dissipation technical field. The utility model discloses a heat extraction box, horizontal carrier store up a position isolated column, vertical carrier store up a position isolated column and heat conduction fin, heat extraction box side is provided with the storage storehouse, heat extraction box lower surface is provided with a plurality of device location feet, the inside safety isolation net that is provided with in storage storehouse, safety isolation net lower surface is provided with the contact plate, the contact plate lower surface is provided with a plurality of heat conduction fins, heat conduction fins below is provided with the heat extraction storehouse, the inside air suction fan that is provided with in heat extraction storehouse, air suction fan lower surface is provided with the copper sheet. The utility model discloses a set up the safety separation net and place the carrier and provide the guard action on it, store up the distance between the position isolated column through setting up horizontal perforation adjustable vertical carrier and make the heat fully give off.
Description
Technical Field
The utility model belongs to the technical field of the PCBA heat dissipation, especially, relate to a carrier heat abstractor for PCBA reflow soldering.
Background
PCBA is the short name of English Printed Circuit Board Assembly, that is to say PCB blank Board through SMT upper part, or through the whole process of DIP plug-in components, short name PCBA. this is domestic commonly used writing method, wherein PCB refers to Printed Circuit Board, also known as Printed Circuit Board, commonly uses English abbreviation PCB (Printed Circuit Board), is important electronic part, is the supporter of electronic component, is the provider of electronic components Circuit connection.
Need carry out electrical heating to the PCB board and can give off a large amount of heats when carrying out the PCBA operation, if wait for its natural cooling can lead to the work progress slow, consequently need use special heat abstractor when carrying out the PCBA preparation, traditional heat abstractor is bulky and radiating efficiency is lower.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a carrier heat abstractor for PCBA reflow soldering has solved the problem that current heat abstractor radiating efficiency is low and has adopted vertical heat dissipation mode to reduce the space and occupy.
In order to solve the technical problem, the utility model discloses a realize through following technical scheme:
the utility model relates to a carrier heat abstractor for PCBA reflow soldering, including heat extraction box, horizontal carrier storage position isolated column, vertical carrier storage position isolated column and heat conduction fin, horizontal carrier storage position isolated column and vertical carrier storage position isolated column all are located the top of heat extraction box, and a side of heat extraction box is provided with the deposit storehouse, heat extraction box lower surface is provided with a plurality of device location feet;
the storage bin is located inside the heat extraction box body, the safety isolation net is arranged inside the storage bin, the contact plate is arranged on the lower surface of the safety isolation net, the plurality of heat conduction fins are arranged on the lower surface of the contact plate and are in contact with the contact plate, the two side surfaces of the inside of the storage bin are provided with clamping grooves, the two ends of the contact plate are fixedly connected with clamping blocks, the clamping blocks are clamped and matched with the clamping grooves, the heat exhaust bin is arranged below the heat conduction fins, the air suction fan is arranged inside the heat exhaust bin, the lower surface of the air suction fan is provided with a copper sheet, heat emitted by equipment above the safety isolation net is conducted through the heat conduction fins, and then the air suction fan is started to discharge the heat through the copper sheet and the heat extraction holes, and therefore the heat dissipation effect is improved.
Preferably, the lower surface in the storage bin is provided with a heat exhaust hole, and the heat exhaust hole is communicated with the copper sheet.
Preferably, a safety isolation net is arranged inside the heat extraction box body, the safety isolation net is located above the heat conduction fins, and the carrier can be placed on the safety isolation net.
Preferably, a transverse through hole is formed in one side face of the longitudinal carrier storage position isolation fence, and the transverse carrier storage position isolation fence is in sliding fit with the transverse through hole to adjust the distance between the longitudinal carrier storage position isolation fences, so that heat can be fully dissipated.
Preferably, the two ends of the transverse carrier storage isolation fence are provided with bumps, the upper surface of the heat extraction box body is provided with a plurality of sliding grooves, and the bumps and the sliding grooves are in sliding fit to facilitate the disassembly and replacement of the transverse carrier storage isolation fence.
The utility model discloses following beneficial effect has:
the utility model discloses a set up the heat that heat conduction fin sent the equipment of safety separation net top and conduct and then start the suction fan and discharge the heat through copper sheet and heat extraction hole, improved the radiating effect, through setting up the distance between the adjustable vertical carrier storage position isolated column of horizontal perforation, and then fully separate between the carrier and make the heat give off.
Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a right side view A-A cross-sectional view of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
fig. 3 is a top view of the present invention;
fig. 4 is a right side view of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below: 1. a bump; 2. a transverse carrier storage isolation fence; 3. a storage bin; 4. a handle; 5. a device positioning foot; 6. a heat extraction box body; 7. a chute; 8. Transversely perforating; 9. a longitudinal carrier storage isolation fence; 10. a security isolation net; 11. a card slot; 12. heat-conducting fins; 13. a heat discharging bin; 14. heat removal holes; 15. a copper sheet; 16. an air suction fan; 17. a clamping block; 18. a contact plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", "lower", and the like, indicate positional or positional relationships, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Referring to fig. 1-4, the present invention relates to a carrier heat dissipation device for PCBA reflow soldering, which comprises a heat extraction box body 6, a transverse carrier storage isolation bar 2, a longitudinal carrier storage isolation bar 9 and heat conduction fins 11, wherein the transverse carrier storage isolation bar 2 and the longitudinal carrier storage isolation bar 9 are both located above the heat extraction box body 6, a storage bin 3 is arranged on one side surface of the heat extraction box body 6, and a plurality of device positioning pins 5 are arranged on the lower surface of the heat extraction box body 6;
the storage bin 3 is located inside the heat extraction box body 6, the safety isolation net 10 is arranged inside the storage bin 3, the contact plate 18 is arranged on the lower surface of the safety isolation net 10, the heat conduction fins 12 are arranged on the lower surface of the contact plate 18, the heat conduction fins 12 are in contact with the contact plate 18, the clamping grooves 11 are formed in the two side surfaces inside the storage bin 3, the clamping blocks 17 are fixedly connected to the two ends of the contact plate 18, the clamping blocks 17 are in clamping fit with the clamping grooves 11, the heat exhaust bin 13 is arranged below the heat conduction fins 12, the air suction fan 16 is arranged inside the heat exhaust bin 13, the copper sheet 15 is arranged on the lower surface of the air suction fan 16, heat emitted by equipment above the safety isolation net 10 is conducted through the heat conduction fins 12, the air suction fan 16 is started to discharge the heat through the copper sheet 15 and the heat exhaust hole 14, and the heat dissipation effect is improved.
Further, the lower surface inside the storage bin 3 is provided with a heat exhaust hole 14, and the heat exhaust hole 14 is communicated with the copper sheet 15.
Further, a safety isolation net 10 is arranged inside the heat extraction box body 6, the safety isolation net 10 is located above the heat conduction fins 11, and a carrier can be placed on the safety isolation net 10.
Furthermore, a transverse through hole 8 is formed in one side face of the longitudinal carrier storage position isolation fence 9, and the transverse carrier storage position isolation fence 2 is in sliding fit with the transverse through hole 8 to adjust the distance between the longitudinal carrier storage position isolation fence 9, so that heat can be fully dissipated.
Furthermore, the two ends of the transverse carrier storage isolation fence 2 are both provided with the bumps 1, the upper surface of the heat extraction box body 6 is provided with the plurality of sliding grooves 7, and the bumps 1 and the sliding grooves 7 are in sliding fit to facilitate the disassembly and replacement of the transverse carrier storage isolation fence 2.
One specific application of this embodiment is: the user places the material that the heat dissipation needs on safety separation net 10, conducts the heat that equipment above safety separation net 10 sent through heat conduction fin 12 and then starts air suction fan 16 and discharges the heat through copper sheet 15 and heat extraction hole 14, has improved the radiating effect, still can slide horizontal carrier storage position isolated column 2 and vertical carrier storage position isolated column 9 according to the quantity of carrier when using and adjust the distance between the carrier and guarantee that the heat can fully distribute away.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.
Claims (5)
1. A carrier heat dissipation device for PCBA reflow soldering comprises a heat extraction box body (6), a transverse carrier storage position isolation fence (2), a longitudinal carrier storage position isolation fence (9) and heat conduction fins (12), and is characterized in that the transverse carrier storage position isolation fence (2) and the longitudinal carrier storage position isolation fence (9) are both located above the heat extraction box body (6), a storage bin (3) is arranged on one side face of the heat extraction box body (6), and a plurality of device positioning pins (5) are arranged on the lower surface of the heat extraction box body (6);
the storage bin (3) is located inside the heat exhaust box body (6), a safety isolation net (10) is arranged inside the storage bin (3), a contact plate (18) is arranged on the lower surface of the safety isolation net (10), a plurality of heat conduction fins (12) are arranged on the lower surface of the contact plate (18), the heat conduction fins (12) are in contact with the contact plate (18), clamping grooves (11) are formed in two side surfaces inside the storage bin (3), clamping blocks (17) are fixedly connected to two ends of the contact plate (18), the clamping blocks (17) are in clamping fit with the clamping grooves (11), a heat exhaust bin (13) is arranged below the heat conduction fins (12), an air suction fan (16) is arranged inside the heat exhaust bin (13), and a copper sheet (15) is arranged on the lower surface of the air suction fan (16).
2. A carrier heat sink for PCBA reflow soldering in accordance with claim 1, wherein: the lower surface in the storage bin (3) is provided with a heat discharge hole (14), and the heat discharge hole (14) is communicated with the copper sheet (15).
3. A carrier heat sink for PCBA reflow soldering in accordance with claim 1, wherein: a safety isolation net (10) is arranged in the heat exhaust box body (6), and the safety isolation net (10) is located above the heat conduction fins (12).
4. A carrier heat sink for PCBA reflow soldering in accordance with claim 1, wherein: one side of the longitudinal carrier storage position isolation fence (9) is provided with a transverse through hole (8), and the transverse carrier storage position isolation fence (2) is in sliding fit with the transverse through hole (8).
5. A carrier heat sink for PCBA reflow soldering in accordance with claim 1, wherein: the transverse carrier storage position isolation fence is characterized in that two ends of the transverse carrier storage position isolation fence (2) are respectively provided with a bump (1), the upper surface of the heat extraction box body (6) is provided with a plurality of sliding grooves (7), and the bumps (1) are in sliding fit with the sliding grooves (7).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202121782032.3U CN215222627U (en) | 2021-08-02 | 2021-08-02 | Carrier heat dissipation device for PCBA reflow soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202121782032.3U CN215222627U (en) | 2021-08-02 | 2021-08-02 | Carrier heat dissipation device for PCBA reflow soldering |
Publications (1)
Publication Number | Publication Date |
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CN215222627U true CN215222627U (en) | 2021-12-17 |
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CN202121782032.3U Active CN215222627U (en) | 2021-08-02 | 2021-08-02 | Carrier heat dissipation device for PCBA reflow soldering |
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CN (1) | CN215222627U (en) |
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2021
- 2021-08-02 CN CN202121782032.3U patent/CN215222627U/en active Active
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