CN206196126U - High stability can circuit board - Google Patents
High stability can circuit board Download PDFInfo
- Publication number
- CN206196126U CN206196126U CN201621106321.0U CN201621106321U CN206196126U CN 206196126 U CN206196126 U CN 206196126U CN 201621106321 U CN201621106321 U CN 201621106321U CN 206196126 U CN206196126 U CN 206196126U
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- circuit board
- high stability
- layer
- insulating layer
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Abstract
The utility model discloses a high stability can circuit board, and simultaneously, one side of stereoplasm core is equipped with the draw -in groove that cooperatees and use with the buckle, two liang all be equipped with the heat dissipation post between the buckle, the other end of heat dissipation post passes a stereoplasm core, one in proper order to be prevented quiet electrically insulating layer, base plate, another stereoplasm core and another and prevents the quiet electrically insulating layer and the top surface of another copper foil layer and be connected, two all are connected through heat -conducting layer and cardboard joint in the both ends of the multistage circuit edition of books body the level that all is equipped with on the lateral wall of cardboard is the several heat dissipation wing of equidistance distribution inwards. The utility model discloses simple structure has very high stable ability to when strengthening whole circuit board stability, it can also be guaranteed and the insulating and heat dispersion of static is prevented, also reduced the manufacturing cost of circuit board.
Description
Technical field
The utility model is related to multistage circuit plate technique field, specially a kind of high stability energy circuit board.
Background technology
Circuit board (Printed Circuit Board, abbreviation PCB), also known as wiring board, pcb board, aluminium base, high frequency plate,
Ultra-thin wiring board, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..Circuit board it is main by pad, via, mounting hole,
Wire, component, connector, filling, electrical boundary etc. are constituted.Common layer structure includes lamina (Single Layer
PCB), three kinds of doubling plate (Double Layer PCB) and multi-layer sheet (Multi Layer PCB).And the existing circuit board for using
Due to a large amount of property, the high density of its circuit element, circuit board is caused operationally to produce substantial amounts of heat, and be difficult to obtain
Volatilization, can especially make the load of chips on circuit boards high, and working long hours can influence the stability of whole circuit board and use the longevity
Life, therefore, we provide a kind of high stability energy circuit board.
The content of the invention
The purpose of this utility model is to provide a kind of high stability energy circuit board, to solve to be proposed in above-mentioned background technology
Problem.
To achieve the above object, the utility model provides following technical scheme：
A kind of high stability energy circuit board, including multistage circuit plate body, the multistage circuit plate body include substrate, institute
The upper and lower surface for stating substrate is equipped with antistatic insulating layer, and it is inside that another side surface of antistatic insulating layer is provided with level
The several buckles being equally spaced, the outside of the antistatic insulating layer is provided with hard core plate, and the side of the hard core plate is provided with
The draw-in groove being used in combination with buckle, another side surface of the hard core plate is provided with copper foil layer, two-by-two between the buckle
Be equipped with thermal column, one end of the thermal column is connected with the bottom surface of one of copper foil layer, the other end of the thermal column according to
It is secondary pass through a hard core plate, antistatic insulating layer, substrate, another hard core plate and another antistatic insulating layer with
The top surface connection of another copper foil layer, the two ends of the multistage circuit plate body are connected by heat-conducting layer with clamp clamping, and
Heat-conducting layer is arranged on the madial wall of clamp, and two clamps are in the bag frame knot to multistage circuit plate body direction opening
Structure, several radiating fins that the level that is equipped with two lateral walls of the clamp is equally spaced inwards.
Preferably, screwed hole is equipped with two side plates up and down of the clamp, screw, institute is plugged with the screwed hole
The other end for stating screw is provided with resilient pressure pad, and resilient pressure pad is contacted with copper foil layer.
Preferably, the screw is connected by way of glue bonding with resilient pressure pad.
Preferably, the one side that the resilient pressure pad is contacted with copper foil layer is in circular arc.
Preferably, the thermal column uses copper post or aluminium post.
Preferably, the clamp is structure as a whole with radiating fin.
Compared with prior art, the beneficial effects of the utility model are：The utility model passes through between buckle and draw-in groove
It is used in conjunction with each other, strengthens the stability between hard core plate and substrate, by the two ends grafting in multistage circuit plate body
In clamp, and heat-conducting layer is provided with in-between, then thermal column and copper foil layer by being set in multistage circuit plate body,
The heat produced by multistage circuit plate body is accelerated to be able to distribute in time, and high temperature resistant, enhance dissipating for heating element high
Hot property, by screw and multistage circuit plate body contacts, the whole multistage electricity for further improving on the side plate up and down of clamp
The stability of road plate body, and the setting for passing through resilient pressure pad, will not also be to the damaged surfaces of multistage circuit plate body.This practicality
New structure is simple, with stability very high, and while whole circuit board stability is strengthened, moreover it is possible to ensure that it is prevented
Electrostatic insulate and heat dispersion, also reduces the production cost of circuit board.
Brief description of the drawings
Fig. 1 is the utility model structural representation.
In figure：1 multistage circuit plate body, 2 substrates, 3 antistatic insulatings layer, 4 buckles, 5 hard core plates, 6 draw-in grooves, 7 Copper Foils
Layer, 8 thermal columns, 9 heat-conducting layers, 10 clamps, 11 radiating fins, 12 screwed holes, 13 screws, 14 resilient pressure pads.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of the utility model protection.
Fig. 1 is referred to, the utility model provides a kind of technical scheme：
A kind of high stability energy circuit board, including multistage circuit plate body 1, it is characterised in that：Multistage circuit plate body 1 is wrapped
Include substrate 2, the upper and lower surface of substrate 2 is equipped with antistatic insulating layer 3, prevent because electrostatic and caused by circuit board short circuit, prevent quiet
Another side surface of electric insulation layer 3 is provided with several buckles 4 that level is inwardly equally spaced, and the outside of antistatic insulating layer 3 sets
There is hard core plate 5, the side of hard core plate 5 is provided with the draw-in groove 6 being used in combination with buckle 4, another side surface of hard core plate 5
Copper foil layer 7 is provided with, thermal column 8 is equipped between buckle 4 two-by-two, thermal column 8 uses copper post or aluminium post, improves the effect of radiating
Really, one end of thermal column 8 is connected with the bottom surface of one of copper foil layer 7, and the other end of thermal column 8 sequentially passes through a hard cores
5, antistatic insulating layer 3, substrate 2 of plate, another hard core plate 5 and another antistatic insulating layer 3 and another Copper Foil
The top surface connection of layer 7.
The two ends of multistage circuit plate body 1 are connected by heat-conducting layer 9 with the clamping of clamp 10, and heat-conducting layer 9 is arranged on card
On the madial wall of plate 10, accelerate radiating, two clamps 10 are in the structure of frame covered to the direction opening of multistage circuit plate body 1, two
Several radiating fins 11 that level is equally spaced inwards are equipped with the lateral wall of individual clamp 10, be easy to radiating, and clamp 10 with dissipate
Hot wing 11 is structure as a whole, and is equipped with two side plates up and down of clamp 10 in screwed hole 12, screwed hole 12 and is plugged with screw 13,
The other end of screw 13 is provided with resilient pressure pad 14, and screw 13 is connected with resilient pressure pad 14 by way of glue bonding, is easy to
Connect, and resilient pressure pad 14 is contacted with copper foil layer 7, the one side that resilient pressure pad 14 is contacted with copper foil layer 7 is in circular arc.
The utility model by being used in conjunction with each other between buckle 4 and draw-in groove 6, strengthen hard core plate 5 and substrate 2 it
Between stability, be plugged in clamp 10 by the two ends of multistage circuit plate body 1, and be provided with heat-conducting layer 9 in-between, then
By the thermal column 8 and copper foil layer 7 that are set in multistage circuit plate body 1, accelerate produced by multistage circuit plate body 1
Heat is able to distribute in time, and high temperature resistant, enhances the heat dispersion of heating element high, leads on the side plate up and down of clamp 10
Cross screw 13 to be contacted with multistage circuit plate body 1, the stability of the whole multistage circuit plate body 1 for further improving, and pass through
The setting of resilient pressure pad 14, will not also be to the damaged surfaces of multistage circuit plate body 1.The utility model simple structure, with very
Stability high, and while whole circuit board stability is strengthened, moreover it is possible to ensure its antistatic insulating and thermal diffusivity
Can, also reduce the production cost of circuit board.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out various changes in the case where principle of the present utility model and spirit is not departed from, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of high stability energy circuit board, including multistage circuit plate body (1), it is characterised in that：The multistage circuit plate sheet
Body (1) includes substrate (2), and the upper and lower surface of the substrate (2) is equipped with antistatic insulating layer (3), the antistatic insulating layer
(3) another side surface is provided with several buckles (4) that level is inwardly equally spaced, the outside of antistatic insulating layer (3)
Hard core plate (5) is provided with, the side of the hard core plate (5) is provided with the draw-in groove (6) being used in combination with buckle (4), described hard
Another side surface of matter core plate (5) is provided with copper foil layer (7), is equipped with thermal column (8) between the buckle (4) two-by-two, described
One end of thermal column (8) is connected with the bottom surface of one of copper foil layer (7), and the other end of the thermal column (8) sequentially passes through one
Individual hard core plate (5), antistatic insulating layer (3), substrate (2), another hard core plate (5) and another antistatic insulating
Layer (3) be connected with the top surface of another copper foil layer (7), the two ends of the multistage circuit plate body (1) pass through heat-conducting layer (9) and
Clamp (10) clamping is connected, and heat-conducting layer (9) is arranged on the madial wall of clamp (10), and two clamps (10) are in many
The structure of frame covered of rank circuit board body (1) direction opening, is equipped with level inwards etc. on two lateral walls of the clamp (10)
Away from several radiating fins (11) of distribution.
2. a kind of high stability energy circuit board according to claim 1, it is characterised in that：Two clamps (10) it is upper
It is equipped with lower side panel in screwed hole (12), the screwed hole (12) and is plugged with screw (13), the other end of the screw (13)
Resilient pressure pad (14) is provided with, and resilient pressure pad (14) is contacted with copper foil layer (7).
3. a kind of high stability energy circuit board according to claim 2, it is characterised in that：The screw (13) is by glue
The mode of bonding is connected with resilient pressure pad (14).
4. a kind of high stability energy circuit board according to claim 2, it is characterised in that：The resilient pressure pad (14) and copper
The one side of layers of foil (7) contact is in circular arc.
5. a kind of high stability energy circuit board according to claim 1, it is characterised in that：The thermal column (8) uses copper
Post or aluminium post.
6. a kind of high stability energy circuit board according to claim 1, it is characterised in that：The clamp (10) and radiating fin
(11) it is structure as a whole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621106321.0U CN206196126U (en) | 2016-09-30 | 2016-09-30 | High stability can circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621106321.0U CN206196126U (en) | 2016-09-30 | 2016-09-30 | High stability can circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206196126U true CN206196126U (en) | 2017-05-24 |
Family
ID=58730286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621106321.0U Expired - Fee Related CN206196126U (en) | 2016-09-30 | 2016-09-30 | High stability can circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206196126U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613270A (en) * | 2017-11-02 | 2018-01-19 | 南京船行天下信息科技有限公司 | A kind of inland navigation craft Big Dipper video monitoring video AIS mobile receivers all the way |
| CN112969328A (en) * | 2021-04-08 | 2021-06-15 | 保定巴迪智能科技有限公司 | IPM driving circuit board |
-
2016
- 2016-09-30 CN CN201621106321.0U patent/CN206196126U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613270A (en) * | 2017-11-02 | 2018-01-19 | 南京船行天下信息科技有限公司 | A kind of inland navigation craft Big Dipper video monitoring video AIS mobile receivers all the way |
| CN112969328A (en) * | 2021-04-08 | 2021-06-15 | 保定巴迪智能科技有限公司 | IPM driving circuit board |
| CN112969328B (en) * | 2021-04-08 | 2023-02-24 | 保定巴迪智能科技有限公司 | IPM driving circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170524 Termination date: 20190930 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |