CN215010895U - Groove solder paste spray printing device of groove circuit board - Google Patents
Groove solder paste spray printing device of groove circuit board Download PDFInfo
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- CN215010895U CN215010895U CN202120354372.XU CN202120354372U CN215010895U CN 215010895 U CN215010895 U CN 215010895U CN 202120354372 U CN202120354372 U CN 202120354372U CN 215010895 U CN215010895 U CN 215010895U
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Abstract
A groove solder paste spray printing device of a groove circuit board is provided, wherein a Z-axis servo control conveying mechanism can move left and right and is arranged on an X-axis servo control conveying mechanism. The mobile jig can move back and forth and is arranged on the Y-axis servo control conveying mechanism. The visual detector is connected with X, Y shaft servo control conveying mechanism through the visual feedback device, so that the solder paste can be accurately spotted on the welding pads on the groove circuit board at the accurate X position and the accurate Y position. Z axle servo control transport mechanism drives visual detector, laser height measurement system and the perpendicular up-and-down action of tin cream adapter to in accurate Z position, to the accurate point tin cream of pad on the recess circuit board. The automation of the whole process of solder paste spray printing of the groove circuit board is completed. After the vision test and the height measurement test are finished, the tin point needles fixed on the tin paste adapter aim at the positions of the pads in the circuit boards of the grooves and sequentially spray and print tin points. The solder paste can be sprayed and printed on the solder pads in the grooves of the circuit board with the grooves, and the precise soldering project is completed.
Description
Technical Field
The utility model relates to a circuit board soldering tin device especially relates to an equipment electronic component's soldering tin device on the pad of recess circuit board.
Background
The existing SMT production process is an electronic assembly technology for assembling electronic elements on the surface of a circuit board by using professional automatic assembly equipment such as a solder paste printer, a chip mounter, a reflow welder and the like, wherein the electronic elements comprise resistors, capacitors, inductors and the like, and are directly attached/welded to the surface of the circuit board through soldering tin, and the SMT production process is the most popular technology and process in the electronic assembly industry at present.
In the solder paste printing process of the electronic component soldering process, solder paste is printed on a pad on a circuit board by using a steel plate mold. Referring to the planar circuit board 10 shown in fig. 7, after the conventional solder paste 20 is scraped off the steel plate mold 30 by reflow soldering once, the solder paste 20 is left on the pads 40 to complete pad dotting, and the solder paste 20 on the planar circuit board 10 is printed accurately and simply on the pads 40.
However, if the conventional steel plate mold 30 is used to print the solder paste for the spot soldering of the pads 40 in the grooves 51 of the grooved circuit board 50, it is obvious that the solder paste 20 cannot be printed on the pads 40. As shown in fig. 6, in the recessed circuit board 50, the solder pads 40 sink into the recesses 51 of the recessed circuit board 50, so that the solder paste 20 cannot be sprayed onto the solder pads 40 in the recesses 51 of the recessed circuit board by the conventional solder paste printing process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve the problem that exists among the prior art, provide a recess solder paste spouts seal device of recess circuit board. The automation of the whole process of solder paste spray printing of the groove circuit board is completed. The solder paste can be sprayed and printed on the solder pads in the grooves of the circuit board with the grooves, and the soldering project is completed.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a groove solder paste spray printing device of a groove circuit board comprises a three-axis servo control conveying mechanism, a visual positioning system, a laser height measuring system and a solder paste spray printing control system; a plurality of groove circuit boards are arranged in the flowing jig, and welding pads are fixed in the grooves of the groove circuit boards; wherein the content of the first and second substances,
the three-axis servo control conveying mechanism comprises an X-axis servo control conveying mechanism, a Y-axis servo control conveying mechanism and a Z-axis servo control conveying mechanism; the X-axis servo control conveying mechanism is arranged on a vertical surface, and the Y-axis servo control conveying mechanism is arranged on a horizontal plane; the Z-axis servo control conveying mechanism can move left and right and is arranged on the X-axis servo control conveying mechanism. The movable jig can be arranged on the Y-axis servo control conveying mechanism in a forward and backward moving mode;
a visual positioning system includes a visual detector, a visual display system, and a visual feedback device. The visual detector is connected with a visual display system through the visual feedback device, and the visual display system is connected with the X-axis servo control conveying mechanism and the Y-axis servo control conveying mechanism through the visual feedback device; the visual detector is mounted on the Z-axis servo control conveying mechanism, and the Z-axis servo control conveying mechanism drives the visual detector to vertically move up and down;
the laser height measuring system comprises a laser height measuring device and a height measuring feedback device; the laser height measuring device is connected with a visual display system through the height measuring feedback device, and the visual display system is connected with a Z-axis servo control conveying mechanism through the height measuring feedback device; the laser height measuring system is arranged on the Z-axis servo control conveying mechanism, and the Z-axis servo control conveying mechanism drives the laser height measuring system to vertically move up and down;
the solder paste spray printing control system comprises a solder paste adapter and a solder paste dispensing needle head, wherein the solder paste dispensing needle head is fixedly arranged on the solder paste adapter; the solder paste adapter is installed on the Z-axis servo control conveying mechanism, the Z-axis servo control conveying mechanism drives the solder paste adapter to vertically move up and down, and the solder is dispensed by aligning the solder dispensing needle to the position of the pad.
According to the groove solder paste spray printing device of the groove circuit board, the solder paste spray printing control system further comprises a solder paste spray printing controller, and the solder paste spray printing controller is connected with the solder paste adapter.
Compared with the prior art, the utility model provides a technical scheme has following beneficial effect:
firstly, the utility model discloses recess solder paste spouts seal device's Z axle servo control transport mechanism can remove the removal setting on X axle servo control transport mechanism. The mobile jig can move back and forth and is arranged on the Y-axis servo control conveying mechanism. The visual detector is connected with X, Y shaft servo control conveying mechanism through the visual feedback device, so that the solder paste can be accurately spotted on the welding pads on the groove circuit board at the accurate X position and the accurate Y position. Z axle servo control transport mechanism drives visual detector, laser height measurement system and the perpendicular up-and-down action of tin cream adapter to in accurate Z position, to the accurate point tin cream of pad on the recess circuit board. The automation of the whole process of solder paste spray printing of the groove circuit board is completed.
Secondly, after the vision test and the height measurement test are finished, the tin point needle head fixed on the tin paste adapter aims at the position of the welding disc in each groove circuit board of the flowing jig to sequentially spray and print tin points. The solder paste can be sprayed and printed on the solder pads in the grooves of the circuit board with the grooves, and the precise soldering project is completed.
Drawings
The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it. In the drawings:
FIG. 1 is a schematic perspective view of a solder paste jet printing apparatus for a recessed circuit board according to the present invention;
FIG. 2 is a schematic diagram of a side view of the solder paste jet printing apparatus for a recessed circuit board according to the present invention;
fig. 3 is a schematic view of the groove hot air soldering device of the groove circuit board according to the present invention;
fig. 4 is a schematic top view of the groove hot air soldering device of the groove circuit board of the present invention;
FIG. 5 is a schematic diagram of a spray printing spot soldering of the recessed circuit board of the present invention;
FIG. 6 is a schematic view of solder paste printing of a prior art recessed circuit board;
fig. 7 is a schematic view of solder paste printing of a prior art planar circuit board.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention clearer and more obvious, the following description of the present invention with reference to the accompanying drawings and embodiments is provided for further details. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
In the claims, the specification and the drawings, unless otherwise expressly limited, such terms as "front," "side," or "third," etc. are used for distinguishing between different elements and not for describing a particular sequence.
In the claims, the specification and the drawings, unless otherwise expressly limited, to the extent that directional terms such as "center", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "rear", "left", "right", "clockwise", "counterclockwise" and the like are used, the positional or orientational relationships illustrated in the drawings are based on the positional and orientational relationships illustrated in the drawings and are merely for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element so referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore should not be construed as limiting the scope of the present invention in any way.
In the claims, the description and the drawings of the present application, unless otherwise expressly limited, the term "fixedly connected" or "fixedly connected" is used, which is to be understood broadly, that is, any connection mode without displacement relation or relative rotation relation between the two, that is, including non-detachably fixed connection, integrated connection and fixed connection through other devices or elements.
In the claims, the specification and the drawings, the terms "including", "comprising" and variations thereof, if used, are intended to be inclusive and not limiting.
Fig. 1 to 5 are combined to describe the groove solder paste spray printing device of the groove circuit board of the present invention, which includes a three-axis servo control carrying mechanism 500, a vision positioning system 600, a laser height measuring system 700 and a solder paste spray printing control system 800. A plurality of groove circuit boards 200 are arranged in the flow fixture 100, and a pad 220 is fixed in a groove 210 of the groove circuit board 200.
The utility model discloses triaxial servo control removes and send mechanism 500, send mechanism 510, Y axle servo control to send mechanism 520 and Z axle servo control to send mechanism 530 including X axle servo control. The X-axis servo-controlled conveying mechanism 510 is disposed on a vertical surface, and the Y-axis servo-controlled conveying mechanism 520 is disposed on a horizontal surface. The Z-axis servo control conveyance mechanism 530 is provided on the X-axis servo control conveyance mechanism 510 so as to be movable left and right. The mobile jig 100 can move back and forth and is arranged on the Y-axis servo control conveying mechanism 520.
The utility model discloses visual positioning system 600, including visual detector 610, visual display system 620 and visual feedback device. The visual detector 610 is connected to a visual display system 620 through the visual feedback device, and the visual display system 620 is connected to the X-axis servo-controlled conveying mechanism 510 and the Y-axis servo-controlled conveying mechanism 520 through the visual feedback device. The vision detector 610 is installed on the Z-axis servo control conveying mechanism 530, and the Z-axis servo control conveying mechanism 530 drives the vision detector 610 to vertically move up and down.
When the vision test is started, the vision detector 610 is started, the X-axis servo control conveying mechanism 510, the Y-axis servo control conveying mechanism 520 and the Z-axis servo control conveying mechanism 530 synchronously cooperate to perform horizontal plane coordinate point tests on the bonding pads 220 in the grooves 210 of the groove circuit boards in the flow jig 100 at the X position and the Y position; then the visual tester 610 feeds back the horizontal position values of the bonding pads 220 of each groove circuit board at the X position and the Y position after the horizontal plane coordinate point test to the visual display system 620 through the visual feedback device, the visual display system 620 stores and feeds back the horizontal position values to the X-axis servo control conveying mechanism 510 and the Y-axis servo control conveying mechanism 520 for compensation control through the visual feedback device when the tin soldering is started, and the difference value of the corresponding horizontal position values is compensated through the left-right horizontal action of the X-axis servo control conveying mechanism 510 and the front-back horizontal action of the Y-axis servo control conveying mechanism 520, so that the bonding pads 220 on the groove circuit board 200 are accurately subjected to tin soldering at the accurate X position and Y position.
The laser height measuring system 700 includes a laser height measuring device 710 and a height measuring feedback device. The laser height measuring device 710 is connected with a visual display system 620 through the height measuring feedback device, and the visual display system 620 is connected with the Z-axis servo control conveying mechanism 530 through the height measuring feedback device. The laser height measuring system 700 is installed on the Z-axis servo control conveying mechanism 530, and the Z-axis servo control conveying mechanism 530 drives the laser height measuring system 700 to vertically move up and down.
After the vision test is completed, the vision tester 610 is turned off, and simultaneously the laser height measuring device 710 is turned on, and the X-axis servo control conveying mechanism 510, the Y-axis servo control conveying mechanism 520 and the Z-axis servo control conveying mechanism 530 are synchronously operated, so as to perform an ordered height measurement test on the Z position of the pad 220 in each groove circuit board groove 210 in the flow jig 100. Then the laser height measuring device 710 feeds back the vertical position values (height values) of the bonding pads 220 of each grooved circuit board at the Z position after the height measuring test to the visual display system 620 through the height measuring feedback device, the visual display system 620 stores the values, and when the solder dotting is started, the values are fed back to the Z-axis servo control conveying mechanism 530 through the height measuring feedback device for compensation control, and the difference value of the corresponding vertical position values is compensated through the up-and-down action of the Z-axis servo control conveying mechanism 530, so that the bonding pads 220 on the grooved circuit board 200 are accurately solder-dotted at the accurate Z position.
The solder paste spray printing control system 800 includes a solder paste spray printing controller 810, a solder paste adapter 820, and a solder paste needle 830. The solder paste spray printing controller 810 is connected with a solder paste adapter 820, the solder paste adapter 820 is installed on the Z-axis servo control conveying mechanism 530, and the Z-axis servo control conveying mechanism 530 drives the solder paste adapter 820 to vertically move up and down. The tin dispensing needle 830 is fixed on the solder paste adapter 820, the solder paste 400 is poured into the solder paste adapter 820, and the tin dispensing needle 830 extends into the groove 210 of each groove circuit board 200 to align with the position of the pad 220 for tin dispensing. The solder paste adapter 820 controls the size of solder spraying and the size speed of the solder spraying point through the solder paste spraying controller 810.
After the visual test and the height measurement test are completed, the horizontal position values of the X position and the Y position of each bonding pad 220 and the vertical position values of the Z position stored on the visual display system 620 are respectively and correspondingly fed back to the X-axis servo control conveying mechanism 510, the Y-axis servo control conveying mechanism 520 and the Z-axis servo control conveying mechanism 530, and then the solder paste jet printing control system 800 starts to start, and the solder paste jet heads 830 fixed on the solder paste adapter 820 are aligned with the bonding pads 220 in each groove circuit board 200 in the flow jig 100 to sequentially and accurately jet and print solder dots.
While the foregoing description shows and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not intended to be exhaustive or to exclude other embodiments and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.
Claims (2)
1. A groove solder paste spray printing device of a groove circuit board is characterized by comprising a three-axis servo control conveying mechanism (500), a visual positioning system (600), a laser height measurement system (700) and a solder paste spray printing control system (800); a plurality of groove circuit boards (200) are arranged in the flowing jig (100), and welding pads (220) are fixed in grooves (210) of the groove circuit boards (200); wherein the content of the first and second substances,
a three-axis servo control conveying mechanism (500) which comprises an X-axis servo control conveying mechanism (510), a Y-axis servo control conveying mechanism (520) and a Z-axis servo control conveying mechanism (530); the X-axis servo control conveying mechanism (510) is arranged on a vertical surface, and the Y-axis servo control conveying mechanism (520) is arranged on a horizontal surface; the Z-axis servo control conveying mechanism (530) can move left and right and is arranged on the X-axis servo control conveying mechanism (510); the flowing jig (100) can move back and forth and is arranged on the Y-axis servo control conveying mechanism (520);
a visual positioning system (600) comprising a visual detector (610), a visual display system (620), and a visual feedback device; the visual detector (610) is connected with a visual display system (620) through the visual feedback device, and the visual display system (620) is connected with an X-axis servo control conveying mechanism (510) and a Y-axis servo control conveying mechanism (520) through the visual feedback device; the visual detector (610) is mounted on the Z-axis servo control conveying mechanism (530), and the Z-axis servo control conveying mechanism (530) drives the visual detector (610) to vertically move up and down;
the laser height measuring system (700) comprises a laser height measuring device (710) and a height measuring feedback device; the laser height measuring device (710) is connected with a visual display system (620) through the height measuring feedback device, and the visual display system (620) is connected with a Z-axis servo control conveying mechanism (530) through the height measuring feedback device; the laser height measuring system (700) is arranged on the Z-axis servo control conveying mechanism (530), and the Z-axis servo control conveying mechanism (530) drives the laser height measuring system (700) to vertically move up and down;
the solder paste spray printing control system (800) comprises a solder paste adapter (820) and a solder paste dispensing needle head (830), wherein the solder paste dispensing needle head (830) is fixedly arranged on the solder paste adapter (820); the solder paste adapter (820) is installed on the Z-axis servo control conveying mechanism (530), the Z-axis servo control conveying mechanism (530) drives the solder paste adapter (820) to vertically move up and down, and the solder paste is dispensed by aligning the solder dispensing needle head (830) with the position of the pad (220).
2. The solder paste spraying and printing device for the grooves of the grooved circuit board as claimed in claim 1, wherein the solder paste spraying and printing control system (800) further comprises a solder paste spraying and printing controller (810), and the solder paste spraying and printing controller (810) is connected with a solder paste adapter (820).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120354372.XU CN215010895U (en) | 2021-02-08 | 2021-02-08 | Groove solder paste spray printing device of groove circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120354372.XU CN215010895U (en) | 2021-02-08 | 2021-02-08 | Groove solder paste spray printing device of groove circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN215010895U true CN215010895U (en) | 2021-12-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120354372.XU Active CN215010895U (en) | 2021-02-08 | 2021-02-08 | Groove solder paste spray printing device of groove circuit board |
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| CN (1) | CN215010895U (en) |
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2021
- 2021-02-08 CN CN202120354372.XU patent/CN215010895U/en active Active
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