CN214956806U - Interposer and placement device including the same - Google Patents

Abstract

An interposer (100) for arrangement between a vacuum suction device (102) having a plurality of main vacuum channels (104) for providing a vacuum force and a component carrier structure (106) to be processed, wherein the interposer (100) comprises an interposer layer (108) for mounting on the vacuum suction device (102) and for carrying the component carrier structure (106), and a network (190) of secondary vacuum channels (110) formed between opposite major surfaces of the intermediate laminate (108), and the network (110) of secondary vacuum channels (110) is configured to spatially redirect vacuum forces provided by the primary vacuum channels (104) of the vacuum suction device (102) at the bottom surface (116) of the intermediate laminate (108) into a redirected vacuum force pattern at the top surface (118) of the intermediate laminate (108). An arrangement (124) comprising the vacuum suction device (102) and the above-mentioned interposer (108) is also provided.

Description

Interposer and placement device including the same

Technical Field

The present invention relates to an interposer, a vacuum suction arrangement, a method of handling a component carrier structure and a method of use.

Background

In the case of increasing product functions of component carriers equipped with one or more components and increasing miniaturization of such components and increasing number of components to be mounted or embedded in component carriers such as printed circuit boards, increasingly powerful array-like components or packages with several components are used, which have a plurality of contact portions or connection portions, the spacing between which is increasingly small. The removal of heat generated by such components and the component carriers themselves during operation is becoming an increasingly serious problem. At the same time, the component carrier should have mechanical strength and electrical reliability in order to be operable even under severe conditions.

In particular, accurately processing the component carrier structures (e.g. dividing the plate into individual component carriers at the end of the manufacturing process) may comprise mounting the component carrier structures on a vacuum suction device during processing. The vacuum force of the main vacuum channel of such a vacuum suction device may hold the component carrier structure in a defined position and in a flat configuration during processing. Therefore, a spatial error of a minute processing structure of the component carrier structure due to warpage, wrinkling, bending, or the like of the component carrier structure can be suppressed.

However, if through-holes are formed in the component carrier structure, for example by laser processing, undesirable gas communication paths may be formed which would connect the vacuum suction channels of the vacuum suction device with the through-holes in the component carrier structure. This may lead to a break of the vacuum and in turn to undesired spatial errors of the minute handling structures of the component carrier structure due to warping, wrinkling, bending etc. of the component carrier structure.

A manufacturing architecture may be needed that allows for high precision processing of the component carrier structure.

SUMMERY OF THE UTILITY MODEL

According to an example embodiment of the present invention, there is provided an interposer arranged between a vacuum suction device having a plurality of main vacuum channels for providing vacuum force and a component carrier structure to be processed, wherein the interposer comprises: an intermediate laminate mounted on the vacuum suction device for carrying the component carrier structure; and a network of secondary vacuum channels formed between the opposing major surfaces of the intermediate laminate and configured to spatially redirect (or redistribute or rearrange) the vacuum force provided by the primary vacuum channels of the vacuum suction device at the bottom surface of the intermediate laminate to a redirected (or redistributed or rearranged) vacuum force pattern at the top surface of the intermediate laminate.

According to another example embodiment of the present invention, there is provided an arrangement apparatus, comprising: a vacuum suction device having a plurality of primary vacuum channels for providing a vacuum force to the component carrier structure to be processed; and an interposer having the above features, mounted on the vacuum suction device and configured for carrying and retaining the component carrier structure by a vacuum force provided by the vacuum suction device and spatially redirected (or redistributed or rearranged) by the interposer.

According to a further exemplary embodiment of the present invention, a method of processing a component carrier structure (in particular during processing of a component carrier structure) is provided, wherein the method comprises mounting an interposer on a vacuum suction device providing a vacuum force by: the method comprises the steps of generating a vacuum in a plurality of main vacuum channels of a vacuum suction device, mounting the component carrier structure on the interposer, and spatially modifying (in particular by redirecting, redistributing or rearranging) a vacuum force pattern provided by the main vacuum channels of the vacuum suction device at a bottom surface of an interposer's interposer layer into a modified (in particular redirected, redistributed or rearranged) vacuum force pattern at a top surface of the interposer layer, thereby retaining the component carrier structure by secondary vacuum channels formed between opposite main surfaces of the interposer layer and arranged to decouple through-holes extending through the component carrier structure (in particular formed during processing) from the main vacuum channels.

According to a further exemplary embodiment of the present invention, the network of secondary vacuum channels of the interposer having the above-described features is used for spatially redirecting (or redistributing or rearranging) the vacuum force provided by the main vacuum channels of the vacuum suction device at the top surface of the interposer board to a redirected (or redistributed or rearranged) vacuum force pattern at the top surface of the interposer board on which the component carrier structure is arranged and processed.

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and/or therein to provide mechanical support and/or electrical connectivity. In other words, the component carrier may be configured as a mechanical and/or electronic carrier for the component. The component carrier may comprise a laminated layer stack. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board, which mixes different types of the above-mentioned types of component carriers.

In the context of the present application, the term "component carrier structure" may particularly denote a sheet material which is handled and processed during and/or after the manufacturing of the component carrier, e.g. a plate, an array or the component carrier itself. Thus, the component carrier structure may particularly represent: a board comprising a plurality of connected preforms of a component carrier, an array of a plurality of connected preforms comprising a component carrier (e.g. a quarter-plate), a preform of a component carrier (i.e. a component carrier that has not yet been completely manufactured), or a completely manufactured component carrier (e.g. a Printed Circuit Board (PCB) or an Integrated Circuit (IC) substrate).

In the context of the present application, the term "interposer" may particularly denote a physical body, particularly a plate-like physical body, which is configured for being inserted between the vacuum suction device and the component carrier structure and is configured for establishing a controlled gas communication between the vacuum suction device and the component carrier structure, thereby fixing the component carrier structure on the surface of the interposer due to the vacuum force generated by the vacuum suction device. Thus, the interposer may be provided with at least one through hole, preferably a plurality of through holes, defining a spatial pattern of vacuum forces applied to the component carrier structure. In particular, the interposer may define one or more portions of the component carrier structure that may be subjected to vacuum forces and may define one or more other portions of the component carrier structure that are not subjected to vacuum forces.

In the context of the present application, the term "vacuum suction device" may particularly denote a device configured for generating a spatial pattern of vacuum forces by generating a vacuum or negative pressure in a plurality of main vacuum channels of the vacuum suction device, which are formed as through holes in a mounting table of the vacuum suction device. For example, the main vacuum channels of the vacuum suction device may be arranged in a regular two-dimensional pattern, e.g. equidistantly arranged in rows and columns. In one embodiment, the vacuum suction device may be configured to suction the component carrier structure onto the mounting table with an intermediary layer between the vacuum suction device and the component carrier structure during the forming of the laser through holes. The vacuum suction mechanism may be at least partially integrated in a mounting plate of the vacuum suction device, and a vacuum suction force that reliably holds the preform of the component carrier on the mounting table may be generated during the formation of the laser through-hole. There may be several through holes in a part of the mounting table, above which the component carrier structure is placed during laser via formation. By applying suction to these through holes in the mounting table, the component carrier structure can be reliably held on the mounting table during laser processing.

In the context of the present application, the term "main vacuum channel" may particularly denote a vacuum channel of the vacuum suction arrangement which is in gas communication with a vacuum source (e.g. a vacuum pump) of the vacuum suction arrangement for generating a negative pressure in the main vacuum channel. For example, all main vacuum channels may be arranged parallel to each other in a mounting plate or mounting table of the vacuum suction device. The main vacuum channels may be arranged in a regular pattern, in particular independent of any characteristics of the component carrier structure to be processed.

In the context of the present application, the term "secondary vacuum channel" may particularly denote a plurality of channels in an interposer. Such secondary vacuum channels may extend vertically, but may also comprise one or more portions in the horizontal plane. At least one primary vacuum channel may be in gaseous communication with at least one secondary vacuum channel, while at least one other primary vacuum channel may be decoupled from each secondary vacuum channel. The spatial pattern according to which the secondary vacuum channels are arranged may be different from the spatial pattern according to which the primary vacuum channels are arranged. The spatial pattern according to which the secondary vacuum channels are arranged may be irregular and/or asymmetric and may be specifically adapted to the characteristics of the component carrier structure to be processed.

In the context of the present application, the term "network of secondary vacuum channels" may particularly denote an array of at least partially interconnected secondary vacuum channels. Such a network of secondary vacuum channels may extend at least partially vertically, but may also have one or more horizontal portions. This may redirect, redistribute or rearrange the vacuum force pattern provided by the vacuum suction device at the bottom side of the interposer to a modified vacuum force pattern provided at the top side of the interposer. For example, a first set of secondary vacuum channels may interconnect with each other, while a second set of secondary vacuum channels may extend through the interposer independently of the first set. The interconnected secondary vacuum channels may form a network with at least one division point or area where the secondary vacuum channel is divided into several individual sub-channels and/or at least one connection point or area where a plurality of individual sub-channels are connected or combined into one common secondary vacuum channel.

In the context of the present application, the term "spatially redirecting the vacuum force" may particularly denote the fact that: the array of secondary vacuum channels may change a plurality of locations in the two-dimensional area where vacuum forces are generated, wherein the change may be made when comparing a mounting surface of the vacuum suction device for mounting the interposer, at which the primary vacuum channels are exposed, with another mounting surface of the interposer, at which at least part of the secondary vacuum channels are exposed, for mounting the component carrier structure. By such a spatial redirection of the vacuum force distribution, the interposer may adapt the universal vacuum suction device (having an array of primary vacuum channels that is not specific with respect to the component carrier structure to be processed) to the specific characteristics, properties and attributes of the component carrier structure to be processed. Spatially redirecting or redistributing the vacuum force may involve changing the vacuum force intensity pattern (e.g., by combining a greater number of primary vacuum channels into a lesser number of secondary vacuum channels) and/or changing the spatial vacuum force pattern (e.g., by increasing the spatial distance between different secondary vacuum channels as compared to the spatial distance between different primary vacuum channels).

In the context of the present application, the term "vacuum force pattern" may particularly denote a two-dimensional arrangement of force points at which a vacuum force is provided on the interposer mounting surface of the vacuum suction device and on the mounting surface of the component carrier structure of the interposer, respectively.

In the context of the present application, the term "spatially varying vacuum force pattern" may particularly denote that the spatial properties of the array of primary vacuum channels acting on the interposer may differ from the spatial properties of the array of secondary vacuum channels acting on the component carrier structure. Such spatial modification may be a reorientation, redistribution or rearrangement of the vacuum force pattern.

According to an exemplary embodiment of the present invention, a component carrier structure, such as a board for manufacturing a printed circuit board, may be processed with excellent spatial accuracy during processing, for example during laser processing. This can be achieved by sandwiching the interposer between the component carrier structure and the vacuum suction means on the one hand and for holding the component carrier structure in place by vacuum force on the other hand. Although the vacuum force is provided by the primary vacuum channels of the vacuum suction device, the interposer may be particularly suitable for an array of secondary vacuum channels specifically designed according to the properties of the component carrier structure to be handled and processed. In particular, the secondary vacuum channels extending through the interposer may spatially modify or redistribute the vacuum force pattern (e.g., generic or non-specific) provided by the primary vacuum channels into a modified or redistributed vacuum force pattern applied to the component carrier structure. In particular, the vacuum forces may be redirected along a network of interconnected or cross-linked secondary vacuum channels, thereby concentrating and/or spatially modulating the vacuum forces acting on the component carrier structure. This makes it possible, highly advantageously, to apply and increase the vacuum force in areas where precise spatial accuracy of the component carrier structure is particularly important. Furthermore, this may also keep other parts of the component carrier structure free of vacuum forces, thereby reliably preventing loss of vacuum in critical areas. For example in the region of the component carrier structure in which the through-holes are formed or are to be formed by laser cutting or laser drilling, which may, without an intermediate layer, produce an undesired gas communication between one or more main vacuum channels of the vacuum suction device and the through-holes in the component carrier structure. An interposer may be arranged between the vacuum suction device and the component carrier structure to suppress a corresponding loss of vacuum. The interposer may not have exposed secondary vacuum channels in this area and thus may maintain a suitable vacuum. As a result, undesired phenomena caused by vacuum loss or deterioration, such as warping, wrinkling, bending, etc. of the component carrier structure held on the support by vacuum forces during processing, can be reliably prevented. This can prevent vacuum leakage, can ensure high accuracy during processing of the component carrier structure, and can improve the yield of the produced component carrier. Furthermore, sandwiching the interposer between the component carrier structure-specific and thus application-specific array of secondary vacuum channels may allow the mentioned advantages to be obtained in a simple manner with low effort. Example embodiments may also avoid stress concentrations in the component carrier structure, which may improve the reliability of the manufactured component carrier. Advantageously, the interposer and its secondary vacuum channels may provide a redistribution channel network for vacuum flow control. Advantageously, the secondary vacuum channel may be arranged to decouple one or more through holes extending through the component carrier structure from the primary vacuum channel. Thus, the cut-out region of the component carrier structure may be blocked by the vacuum intermediary layer to prevent vacuum leakage.

In the following, further example embodiments of the interposer, the arrangement apparatus and the method will be explained.

In one embodiment, the network of secondary vacuum channels is a network of diverging vacuum channels. At least some of the secondary vacuum channels may thus be arranged so as to interconnect with at least one dividing point or region and/or at least one joining point or region. At the dividing point or region, the vacuum provided by the connected primary vacuum channels may be divided into two or more separate paths by a diverging network of secondary vacuum channels. At the connection points or areas, the vacuum provided by the connected primary vacuum channels may combine into a common path through a bifurcated network of secondary vacuum channels. Thereby, an application specific combination and/or division of the vacuum forces may be achieved.

In one embodiment, the network of secondary vacuum channels comprises at least one vacuum collection cavity configured for collecting vacuum forces from at least two primary vacuum channels of the vacuum suction device. The at least one vacuum collection cavity may be in gaseous communication with at least one through-hole of the interposer, the at least one through-hole extending from the vacuum collection cavity up to a major surface of the interposer facing the component carrier structure. The exposed area of the vacuum collection chamber may face the vacuum suction device. The number of said through holes of the secondary vacuum channels may be smaller than the number of main vacuum channels connected via the assigned vacuum collection chamber. For example, the vacuum collection cavity may be implemented as a slot in an interposer. In one embodiment, the interposer may include a plurality of vacuum collection cavities or even one annular vacuum collection cavity surrounding the vacuum-free channel region of the interposer. However, the vacuum channel-free region may correspond to a portion of the component carrier structure in which a through-hole is to be formed during processing, in particular laser processing.

In one embodiment, the network of secondary vacuum channels is formed by at least one slot (which may be formed as a blind hole) in the intermediate layer plate and/or by at least one through hole extending through the intermediate layer plate or a part of the intermediate layer plate. Preferably, the network comprises at least one slot in gaseous communication with at least one through-hole extending through the intermediate laminate. Even more particularly, the network of secondary vacuum channels may comprise at least one vacuum collection cavity (in particular at least one slot) in gaseous communication with at least one through hole extending through the network of secondary vacuum channels of the intermediate layer plate. The slots may form laterally extending cavities. The slot may be located at a major surface of the intermediate laminate facing the vacuum suction device. In particular, such a groove may be in gaseous communication with a plurality of primary vacuum channels. The groove may also be in gas communication with at least one through hole of the secondary vacuum channel, which may extend up to the main surface of the intermediate layer plate facing the component carrier structure. The lateral extension of the grooves may be larger than the lateral extension of any through holes of the network of secondary vacuum channels. Descriptively, such a slot may collect vacuum from a plurality of primary vacuum channels, wherein the collected vacuum force may be applied to a smaller number of secondary vacuum channels. Thus, the slot in connection with the at least one through hole of the intermediate layer plate may redirect and/or concentrate the vacuum force provided by the plurality of main vacuum channels to one or more defined positions of the component carrier structure.

In one embodiment, the network of secondary vacuum channels is configured for: the vacuum force between the bottom surface and the top surface is redistributed for holding the component carrier structure during processing. For example, the spatial distribution of the vacuum force on the surface of the vacuum suction device on which the interposer is mounted may be according to a regular spatial pattern, in particular an equidistant arrangement of main vacuum channels along rows and columns. The distribution of the vacuum force on the mounting surface of the interposer on which the component carrier structure is mounted may be according to another spatial pattern, in particular an irregular spatial pattern, i.e. a non-equidistant arrangement of secondary vacuum channels. A surface portion of the mounting surface of the interposer may be free of secondary vacuum channels, while the number of secondary vacuum channels per unit area in another surface portion of the mounting surface of the interposer may be locally increased compared to the regular pattern of primary vacuum channels. By such a spatial rearrangement of the interposer, the spatial distribution of the vacuum force can be adapted to the characteristics of the component carrier structure.

In one embodiment, the network is configured to concentrate the vacuum force in a direction from a bottom surface to a top surface of the interposer. Such a concentration may reduce the number of secondary vacuum channels at the mounting surface of the interposer for mounting the component carrier structure compared to the number of primary vacuum channels at the mounting surface of the vacuum suction device at which the interposer is mounted. This may allow for the creation of areas of locally increased vacuum suction force in surface portions of the component carrier structure where suppression of e.g. warpage is crucial. At the same time, this may allow for the creation of areas of locally reduced vacuum suction forces, for example in surface portions of the component carrier structure where through-holes should be formed (e.g. for separating the component carrier from the component carrier structure) and where loss of vacuum should be prevented.

In one embodiment, the intermediate laminate comprises or consists of a fully cured resin, such as an epoxy resin. Such an intermediate laminate may even be free of reinforcing structures such as glass fibers or the like. The intermediate laminate made of cured resin can be manufactured with low effort and can have a soft surface for a sealed connection with the vacuum suction device and the component carrier structure.

In another embodiment, the intermediate layer comprises or consists of a plastic, in particular a polyimide. Furthermore, the plastic interposer may show advantageous properties in terms of softness and surface smoothness, so that a significant loss of vacuum at the interface between the interposer on the one hand and the vacuum suction means and on the other hand the component carrier structure may be prevented.

In a further embodiment, the intermediate layer plate comprises a metal layer, in particular a patterned metal layer. Also, the metal interposer can be fabricated with reasonable effort. In addition, such a metal layer may serve as a laser stop layer during laser processing (e.g. laser cutting, laser drilling, etc.) of the component carrier structure on the metal layer. More specifically, the laser beam directed onto the component carrier structure during processing, in particular for forming through holes in the component carrier structure, can be automatically stopped when it reaches the metal interposer. This may simplify process control.

In yet another embodiment, the interposer includes a resin (e.g., an epoxy), reinforcing particles in the resin (e.g., glass fibers or glass spheres), and at least one electrically conductive layer structure (e.g., a copper layer and/or copper vias). In particular, the interposer may be configured as a patterned component carrier structure, in particular a fully cured core of FR4, with FR4 forming the secondary vacuum channels. For example, the intermediate laminate may be made of FR4 and copper, i.e. may be another board.

In one embodiment, the intermediate laminate is provided at its top surface with at least one recess, which is decoupled from the vacuum channel network. Preferably, the intermediate laminate comprises at least one residual material collecting cavity at its top surface, in particular at least one recess, which is not in gas communication with the network of secondary vacuum channels and which is adapted to accommodate residual material that may be generated during processing of the component carrier structure. Thus, the at least one recess may be formed at a main surface of the interposer facing the component carrier structure and may provide an accommodation space. Such a recess may be used, for example, for collecting dust generated during handling of the component carrier structure on top of the recess. For example, dust may be generated by laser treatment of the organic material of the component carrier structure.

In one embodiment, the intermediate laminate is made of a material having antistatic properties. The antistatic interlayer sheet can reduce or eliminate static electricity build up on the component carrier structure. This is crucial for preventing the generation of electrical defects in component carriers manufactured on the basis of the component carrier structure.

In one embodiment, the intermediate laminate is made of an elastic material that is deformable by vacuum force. The intermediate layer plate can thus contribute to the formation of a sealed or vacuum-tight connection between the vacuum suction device and the intermediate layer plate on the one hand and the component carrier structure on the other hand.

In one embodiment, the top surface of the intermediate laminate on which the component carrier structure is to be mounted has a reduced roughness (in particular a roughness Rz or Ra) compared to another surface area of the intermediate laminate. Thus, the main surface of the interposer layer facing the component carrier structure may be smoother than the opposite main surface of the interposer layer facing the vacuum suction device. By taking such measures, vacuum losses on the bottom surface of the component carrier structure, which may reduce the accuracy of the processing, can be strongly suppressed.

In one embodiment, the thickness of the interposer is in the range from 0.5mm to 10mm, in particular in the range from 1mm to 5 mm. Thus, the intermediate deck may have a vertically compact design. However, in the horizontal plane, the size of the interposer board may exceed the size of the component carrier structure (e.g., a typical size of a PCB board may be 12 × 18 square inches or 18 × 18 square inches). In particular, the size of the intermediate plies in the horizontal plane may be greater than 12 x 18 square inches or greater than 18 x 18 square inches.

In one embodiment, the network of secondary vacuum channels is configured to combine the vacuum forces of a set of primary vacuum channels in the vacuum pumping arrangement at one or more vacuum outlets on the top surface of the intermediate laminate. Thus, the vacuum force may be spatially concentrated in a direction from the vacuum suction device via the intermediate layer plate to the component carrier structure. In particular, the vacuum force of the secondary vacuum channels at their outlets facing the component carrier structure may be greater than the vacuum force of the primary vacuum channels at their outlets facing the intermediate layer plate. Such a force concentration for reliably preventing warping of the component carrier structure in critical areas may be achieved by the interposer and may be designed in accordance with the characteristics of the component carrier structure to be processed.

In one embodiment, the number of primary vacuum channels in the set is greater than the number of vacuum outlets. In particular, each subset of primary vacuum channels may be in gaseous communication with each smaller subset of secondary vacuum channels. By this architecture, the local high vacuum force at the lower main surface of the component carrier structure can be combined with other regions at the lower main surface of the component carrier structure where no secondary suction channels are provided.

In one embodiment, the arrangement means comprises a component carrier structure carried and held on the interposer by vacuum force. More specifically, the component carrier structure mounted on the interposer may comprise at least one of: at least one through-hole, cutout region, and groove portion in the following region; in said area the network of secondary vacuum channels does not extend through the entire intermediate laminate and in said area at least one of the primary vacuum channels is exposed at the upper main surface of the vacuum suction device.

In an embodiment, the arrangement device comprises a processing unit configured for processing the component carrier structure while carrying and holding the component carrier structure on the interposer by vacuum force. For example, the processing unit is a laser processing apparatus, in particular at least one of a laser cutting apparatus and a laser drilling apparatus. During laser processing of the component carrier structure, through holes may be formed in the component carrier structure by impingement of laser energy. For example, such vias may be subsequently filled with a metal, such as for forming copper-filled laser vias. The individual component carrier can also be cut out by laser cutting in order to singulate the individual component carriers, in particular the printed circuit boards. During laser processing, the through-holes formed in the component carrier structure often lead to a loss of vacuum due to an undesired gas communication between these through-holes and the vacuum channels of the vacuum suction device. According to an exemplary embodiment, such an undesired vacuum loss may be prevented by redirecting the vacuum force generated by the main vacuum channel of the vacuum suction device away from the area of the component carrier structure where the through-holes are formed during processing, in particular during laser processing.

In one embodiment, the main vacuum channels of the vacuum suction device are arranged in a regular pattern, in particular in an equidistant pattern. In contrast, the secondary vacuum channels of the interposer may be arranged in an irregular or non-uniform pattern to meet the application-specific requirements of the component carrier structure to be processed and to avoid vacuum losses.

In an embodiment, the method comprises configuring the network of secondary vacuum channels to provide a locally increased holding force to the component carrier structure around a region of the component carrier structure that is treated, in particular subjected to laser treatment. Such locally increased holding forces may be advantageous in areas where a significant accuracy of the component carrier structure is particularly important. For example, the region of locally increased holding force may be arranged around a portion of the component carrier structure currently being processed. If such a part of the component carrier is accurately fixed in place during the treatment, the region of interest of the treatment surrounded by the locally strongly fixed part can be treated with high accuracy.

In an embodiment, the method comprises configuring a network of secondary vacuum channels for disabling vacuum connection of the region of the component carrier structure being processed, in particular the cutout region of the component carrier structure. This prevents loss of vacuum at the processing location where high alignment accuracy is most important.

In one embodiment, the method comprises processing the component carrier structure while holding the component carrier structure by a vacuum force provided by a vacuum suction device and an interposer. For example, the laser beam may be directed onto a surface portion of the component carrier structure while the combination of the primary and secondary vacuum channels fixes the critical portion of the component carrier structure with a locally increased vacuum suction force and while a currently laser-treated portion of the component carrier structure is decoupled from the secondary vacuum channel to avoid local breaking of the vacuum. This may allow accuracy problems to be eliminated.

In one embodiment, the method comprises processing the component carrier structure by at least one of: laser cutting, laser drilling, screen printing, component assembly, cutting, routing, visual inspection, electromagnetic radiation exposure, and metrology. However, example embodiments of the present invention may also support other processing stages, particularly all processing stages related to dry films.

In one embodiment, the method comprises using the metal layer of the interposer as a laser stop layer during laser processing of the component carrier structure. This may simplify the control of the laser process, since the laser beam may stop automatically on the metal layer (in particular the copper layer) on the upper main surface of the interposer.

In one embodiment, the method includes designing the interposer based on a set of design parameters indicative of characteristics of the component carrier structures and characteristics of processing of the component carrier structures. Thus, the command sequence and the set of parameters for processing the component carrier structure during manufacturing may comprise all necessary information for designing the interposer to comply with the application specific characteristics of the component carrier structure to be processed. Thus, the interposer may be automatically configured for forming the secondary vacuum channels in accordance with the mentioned set of parameters, e.g. by a processor executing a corresponding computer program. Manual design of the interposer may then be unnecessary.

In one embodiment, the component carrier structure or the layer stack of individual component carriers comprises only a laminated layer structure. In particular, the stack may be free of molding compound. By laminating (i.e. applying heat and/or pressure) instead of interconnecting all layer structures of the individual stacks by moulding, the introduction of further material types (in particular moulding compounds) into the component carrier can be avoided, which maintains thermal stresses with small temperature variations.

In one embodiment, the component carrier structure comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier structure may be a laminate of the above-described electrically insulating layer structure(s) and electrically conductive layer structure(s), in particular a laminate formed by applying mechanical pressure and/or thermal energy. The stack may provide a plate-like component carrier structure which is able to provide a large mounting surface for other components and which is still very thin and compact.

In one embodiment, the component carrier structure is shaped as a plate-like piece. This contributes to a compact design, wherein the component carrier structure still provides a large basis for mounting components on the component carrier. Furthermore, particularly bare dies, such as those used for embedded electronic components, can be easily embedded in a thin plate such as a printed circuit board or the like due to their small thickness.

In one embodiment, the component carrier manufactured on the basis of the component carrier structure is configured as one of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a disc shaped component carrier formed by laminating a number of electrically conductive layer structures with a number of electrically insulating layer structures (e.g. by applying pressure and/or by providing thermal energy). As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg or FR4 material. The various electrically conductive layer structures may be connected to each other in a desired manner by forming holes through the laminate, for example by laser drilling or mechanical drilling, and filling these holes partially or completely with an electrically conductive material, in particular copper, thus forming vias or any other through-hole connection. The filled vias connect the entire stack (the through-hole connections extend through several layers or the entire stack), or the filled vias connect at least two electrically conductive layers, called vias. Similarly, optical interconnects may be formed through the various layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that may be embedded in the printed circuit board, the printed circuit board is typically configured to receive one or more components on one or both of the opposing surfaces of the disk-shaped printed circuit board. They may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may comprise a resin with reinforcing fibers, such as glass fibers.

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a relatively small component carrier with respect to the PCB on which one or more components may be mounted, and may serve as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same size as the size of a component (particularly, an electronic component) to be mounted on the substrate (for example, in the case of a Chip Scale Package (CSP)). More particularly, a baseplate may be understood as a carrier for electrical connections or electrical networks, and a component carrier comparable to a Printed Circuit Board (PCB), but with a considerably higher density of connections arranged laterally and/or vertically. The transverse connections are, for example, conductive paths, while the vertical connections may be, for example, boreholes. These lateral and/or vertical connections are arranged within the substrate and may be used to provide electrical, thermal and/or mechanical connection of the encased or un-encased component (such as a bare die), in particular an IC chip, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrates". The dielectric portion of the substrate may comprise a resin with reinforcing particles, such as reinforcing spheres, in particular glass spheres.

The substrate or interposer may comprise or comprise at least one layer of glass, silicon (Si) and/or photo-imageable or dry-etchable organic material, such as an epoxy-based build-up material (e.g. an epoxy-based build-up film) or a polymer compound (which may or may not comprise photosensitive and/or thermo-sensitive molecules), such as polyimide or polybenzoxazole.

In one embodiment, the at least one electrically insulating layer structure comprises at least one of: resins or polymers such as epoxy resins, cyanate ester resins, benzocyclobutene resins, bismaleimide triazine resins, polyphenylene derivatives (e.g. based on polyphenylene ether, PPE), Polyimides (PI), Polyamides (PA), Liquid Crystal Polymers (LCP), Polytetrafluoroethylene (PTFE) and/or combinations thereof. Reinforcing structures, for example made of glass (multiple layer glass), such as meshes, fibers, spheres or other kinds of filler particles, may also be used in order to form composites. The semi-cured resin is combined with a reinforcing agent, for example, fibers impregnated with the above resin are called prepregs. These prepregs are often named for their properties, for example FR4 or FR5, which describe their flame retardant properties. Although prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based build-up materials (e.g. build-up films) or photoimageable dielectric materials, may be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins may be preferred. In addition to these polymers, low temperature co-fired ceramics (LTCC) or other low, very low, or ultra low DK materials can be applied as electrically insulating structures in component carriers.

In one embodiment, the at least one electrically conductive layer structure comprises at least one of copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coated versions thereof may also be used, particularly coated with a superconducting material or conductive polymer, such as graphene or poly (3, 4-ethylenedioxythiophene) (PEDOT), respectively.

The at least one component may be embedded in the component carrier structure and/or may be surface mounted on the component carrier structure. Such a component may be selected from a non-electrically conductive inlay (inlay), an electrically conductive inlay (e.g. a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g. a heat pipe), a light guiding element (e.g. a light guide or light conductor connection), an electronic component or a combination thereof. For example, the inlay may be a metal block (IMS inlay) with or without a coating of insulating material, which may be embedded or surface mounted in order to facilitate heat dissipation. Suitable materials are defined in terms of the thermal conductivity of the material, which should be at least 2W/mK. Such materials are typically based on, but not limited to, metals, metal oxides and/or ceramics, such as copper, alumina (Al)₂O₃) Or aluminum nitride (AlN). Other geometries with increased surface area are also often used in order to increase the heat exchange capacity. Furthermore, the component may be an active electronic component (implementing at least one p-n junction), a passive electronic componentSuch as resistors, inductors or capacitors, electronic chips, memory devices (e.g. DRAM or another data storage), filters, integrated circuits (e.g. Field Programmable Gate Arrays (FPGA), Programmable Array Logic (PAL), Generic Array Logic (GAL) and Complex Programmable Logic Devices (CPLD)), signal processing components, power management components (e.g. Field Effect Transistors (FET), Metal Oxide Semiconductor Field Effect Transistors (MOSFET), Complementary Metal Oxide Semiconductor (CMOS), Junction Field Effect Transistors (JFET) or Insulated Gate Field Effect Transistors (IGFET)), all based on semiconductor materials, such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga)₂O₃) Indium gallium arsenide (InGaAs) and/or any other suitable inorganic compound), optoelectronic interface elements, light emitting diodes, opto-couplers, voltage converters (e.g., DC/DC converters or AC/DC converters), cryptographic components, transmitters and/or receivers, electromechanical transducers, sensors, actuators, micro-electromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components may be embedded in the component carrier. For example, a magnetic element may be used as the component. Such magnetic elements may be permanent magnetic elements (e.g. ferromagnetic, antiferromagnetic, multiferroic or ferrimagnetic elements, such as ferrite cores) or paramagnetic elements. However, the component may also be an IC substrate, an interposer, or another component carrier, for example in a board-in-board configuration. The component may be surface mounted on the component carrier and/or may be embedded inside the component carrier. In addition, other components, in particular those which generate and emit electromagnetic radiation and/or which are sensitive to electromagnetic radiation propagating from the environment, may also be used as components.

In one embodiment, the component carrier manufactured on the basis of the component carrier structure is a laminate-type component carrier. In such embodiments, the component carrier is a multi-layered structure of compounds that are stacked and joined together by the application of pressure and/or heat.

After processing the inner layer structure of the component carrier, one or both of the opposite major surfaces of the processed layer structure may be covered (in particular by lamination) symmetrically or asymmetrically with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, lamination may continue until the desired number of layers is obtained.

After completion of the formation of the stack of the electrically insulating layer structure and the electrically conductive layer structure, the obtained layer structure or component carrier may be subjected to a surface treatment.

In particular, in terms of surface treatment, electrically insulating solder resist may be applied to one or both of the opposite main surfaces of the layer stack or the component carrier. For example, such a solder resist may be formed on the entire main surface and the solder resist layer is subsequently patterned in order to expose one or more electrically conductive surface portions which should be used for electrically coupling the component carrier to the electronic periphery. The surface portion of the component carrier that is left covered with the solder resist can be effectively prevented from oxidation or corrosion, particularly a surface portion containing copper.

In the case of surface treatment, a surface finish may also be selectively applied to exposed electrically conductive surface portions of the component carrier. Such surface finish may be an electrically conductive covering material on exposed electrically conductive layer structures (e.g., pads, conductive tracks, etc., particularly comprising or comprising copper) on the component carrier surface. If the electrically conductive layer structure so exposed is not protected, the exposed electrically conductive component carrier material (especially copper) may oxidize, reducing the reliability of the component carrier. A surface finish may then be formed, for example as an interface between the surface mount component and the component carrier. The surface finish has the function of protecting the exposed electrically conductive layer structure (in particular the copper circuit) and enables a bonding process with one or more components, for example by soldering. Examples of suitable materials for surface polishing are Organic Solderability Preservative (OSP), Electroless Nickel Immersion Gold (ENIG), Electroless Nickel Immersion Palladium Immersion Gold (ENIPIG), gold (especially hard gold), electroless tin, nickel gold, nickel palladium, and the like.

The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.

Drawings

Fig. 1 shows a cross-sectional view of an arrangement comprising a vacuum suction device, an interposer and a component carrier structure in a first operating state according to an exemplary embodiment of the present invention.

Fig. 2 shows the arrangement according to fig. 1 in a second operating state.

Fig. 3 shows a cross-sectional view of an arrangement comprising a vacuum suction device, an interposer and a component carrier structure according to another exemplary embodiment of the present invention.

Fig. 4 shows a three-dimensional view of an arrangement comprising a vacuum suction device, an interposer and a component carrier structure according to a further exemplary embodiment of the present invention.

Fig. 5, 6 and 7 show cross-sectional views of a deployment apparatus, such as the deployment apparatus according to fig. 4, in three different operating states.

Detailed Description

The illustration in the drawings is schematically. In different drawings, similar or identical elements are provided with the same reference signs.

Before referring to the drawings, example embodiments will be described in more detail, which will be summarized based on some basic considerations that the example embodiments of the present invention have been developed.

The conventional method of handling component carrier structures enables a versatile vacuum suction device. However, when mounting and handling the component carrier structure on such a general vacuum suction device, vacuum losses may occur. This may result in a low yield of component carriers. Therefore, when the component carrier structure to be processed is mounted on a vacuum suction device, it is often not always possible to ensure a reliable vacuum without the risk of leakage.

In other conventional approaches, warpage may be avoided by securing the component carrier structure during the vacuum suction process using application specific vacuum suction devices. Therefore, each vacuum suction apparatus must be separately developed for each product, which requires a great deal of effort. Therefore, only very expensive specially designed vacuum tables can be used to cope with the leakage problem.

According to an exemplary embodiment of the invention, an application-specific interposer may be arranged between the generic vacuum suction device and a user-defined or application-specific component carrier structure (e.g. a plate) to ensure a high spatial accuracy and a strong suppression of manual factors such as warpage during processing of the component carrier structure (e.g. during laser processing). This can be achieved by: the array of secondary vacuum channels extending through the interposer is adjusted with respect to the array of primary vacuum channels in the vacuum suction device and with respect to the characteristics of the component carrier structure to be processed (e.g. with respect to a portion of one or more through holes to be formed in the component carrier structure by the processing). This allows the use of generic or universal vacuum suction means with, for example, an array of equidistant primary suction channels, and can be made application specific as necessary to avoid vacuum losses caused by the arrangement of secondary suction channels extending through the interposer. Accordingly, an interposer having the above-described features may overcome the above-described disadvantages of conventional approaches, particularly for use in any dry processing station during printed circuit board manufacturing. Illustratively, such an intermediate laminate may be designed to have application-specific or product-specific properties.

With an interposer according to an exemplary embodiment of the invention, a complete vacuum performance on the printed circuit board type component carrier structure from the central cutout area during production can be ensured. Such a cut-out region typically results in vacuum leakage and may reduce the accuracy of the process or metrology. Advantageously, example embodiments of the present invention may enable stable processing conditions of a component carrier, such as a printed circuit board (particularly with embedded components), to be ensured. Accordingly, example embodiments of the present invention may ensure stable processing conditions for any PCB from which a portion of the area has been removed. Embodiments of the present invention may also be advantageous in terms of laser segmentation.

According to an exemplary embodiment of the invention, an interposer is arranged between the vacuum suction device (e.g. vacuum table) and the PCB-type component carrier structure, wherein the interposer may be provided with secondary vacuum channels to adapt the vacuum suction device with its main vacuum channels to the application-specific component carrier structure. Advantageously, adapting the vacuum interposer to PCB properties and PCB processing tasks of the component carrier structure may be performed. More specifically, an example embodiment of the present invention may provide a vacuum interposer interposed between a board and a vacuum table, wherein the vacuum interposer may be patterned to redirect vacuum flow (particularly in a vertical direction and also optionally in a horizontal plane) to the board in accordance with a particular PCB application. In particular, the redirection of the vacuum flow may be controlled depending on the application specific task, e.g. suppressing warpage of the component carrier structure and/or achieving a high precision handling of the component carrier structure.

For example, the interposer may be provided with a metal layer (e.g., a copper layer) that acts as a laser stop layer during laser processing. The interposer may also be configured to have a mechanically soft nature, which may enable the interposer to adjust itself to pressure conditions, in particular those defined by vacuum suction means. The interposer may also be configured to have a smooth or low roughness property, particularly at the major surface of the interposer facing the vacuum suction device, to avoid vacuum loss due to excessive roughness. Preferably, the vacuum interposer may have antistatic properties to avoid charge accumulation thereon. It is also possible to equip the vacuum intermediary layer with one or more other functions, such as recesses for collecting dust facing the component carrier structure, which recesses can be produced, for example, by laser cutting or laser drilling of the component carrier structure. More specifically, the vacuum interposer may be configured to collect dust generated during a micro-laser (pico-laser) process. In particular, the interposer may have an upwardly directed counter cavity (e.g. embodied as a slot) in which dust generated during processing of the component carrier structure may collect. In a preferred embodiment, the secondary vacuum channels may also be adapted to collect vacuum flows from a plurality of primary vacuum channels to enhance or concentrate the vacuum fixing force exerted on the component carrier structure at a specific location. In yet another embodiment, the secondary vacuum channels of the interposer may be configured for isolating the plurality of primary vacuum channels from critical locations of the component carrier structure, e.g. locations where laser cutting procedures are to be performed at the component carrier structure, thereby avoiding vacuum leakage at such critical locations through parasitic flow paths extending along the one or more primary vacuum channels and through-holes cut in the component carrier structure. In another embodiment, such a critical position of the component carrier structure being processed while being held by vacuum suction may be a position where a component should be embedded in the component carrier structure. Also from such a critical position, the vacuum force provided by the main vacuum channel can be redirected. Advantageously, the interposer may be adjusted to close the recess to prevent warpage of the board.

For example, the interposer may be made of a soft epoxy-based core (e.g., without copper), which may be adapted to conform to the component carrier structure to be processed. The material of the interposer may be a fully cross-linked resin. Such a material selection may be suitably compatible with laser processing of the component carrier structure.

In yet another embodiment, the interposer may be made of a material that includes or includes metal. For example, during laser processing of the component carrier structure, a patterned copper layer at the top side of the interposer may be selectively present in the region that serves as a laser stop layer. Alternatively, there may be a continuous copper layer for the purpose.

In an embodiment, computer-aided manufacturing data relating to the component carrier structure may be used to design a vacuum interposer. This may allow, for example, an automated manufacturing of an interposer, which is configured according to the specific properties of the component carrier structure to be processed.

According to an example embodiment of the present invention, a vacuum interposer clamp specific to a component carrier may be applied to PCB processing and metrology tools. More specifically, example embodiments of the present invention provide a method for obtaining high precision performance during processing of a component carrier structure, particularly during dry film processing or metrology processing. Especially when the component carrier structure (e.g. comprising a plurality of printed circuit boards or preforms thereof still integrally connected) comprises through-holes, cut-out areas or grooves, adhesion on the vacuum table may be reduced or vacuum leakage may result.

According to an example embodiment of the present invention, a vacuum interposer clamp system is provided that improves (particularly optimizes) vacuum performance in places at risk of vacuum leakage during component carrier structure processing, such as laser cutting, laser drilling, assembly, metrology tool processing, and the like. In particular, an interposer specific to the component carrier structure is introduced into the vacuum system, more particularly between the vacuum suction device and the component carrier structure. Thus, a jig design associated with a particular process can be introduced on the process side of the interposer. In an embodiment, a specific vacuum collection chamber and additional vacuum distribution channels may be introduced starting from the vacuum side of the interposer. In particular, soft, non-durable material choices may be applied to the interposer clip to produce the interposer clip with less effort.

According to an example embodiment of the present invention, a vacuum interposer clamp for PCB processing is provided. Conventional stationary production or metrology equipment may require product-specific vacuum fixtures to ensure flatness during processing or measurement. For high fixture-to-machine table alignment requirements and to avoid vacuum leaks, conventional approaches have been to utilize expensive precision-manufactured fixture systems for this purpose.

An example embodiment of the present invention overcomes this drawback by utilizing the softer PCB material of one or more vacuum collection cavities and interposers in the interposer to enable flexible and rapidly manufacturable vacuum interposers to be manufactured and operated with little effort. Example applications of example embodiments of the present invention may be used for laser cutting and laser drilling processes. Advantageously, the design and manufacture of an interposer according to an example embodiment of the present invention may be accomplished easily and with little effort. Further advantageously, no high registration requirements and no risk of vacuum leakage occur. A preferred embodiment involves the use of a vacuum intermediary layer with one or more collection chambers. Furthermore, the vacuum suction device may remain versatile, i.e. not necessarily adapted to the specific application or characteristics of the component carrier structure to be processed. Thus, an example embodiment may employ a vacuum station equipped with an interposer to process a PCB-type component carrier structure. In particular, the example embodiments may be advantageously applied to all PCB dry processing stages requiring vacuum. A corresponding example embodiment may relate to one or more vacuum chambers in an interposer board for collecting vacuum and providing flexible possibilities for an interposer clamp.

A vacuum intermediary laminate according to an example embodiment of the present invention may comprise a vacuum collection cavity (in particular a large opening for collecting vacuum from a universal vacuum table). The vacuum interposer may be manufactured based on a flexible polymeric material (continuous or discontinuous), particularly based on the ASTM D785-98 standard, which material preferably has a hardness value of less than 100 on the Rockwell R scale.

Advantageously, one or more cut-out regions of the component carrier structure may be blocked by a vacuum intermediary layer. Further, the interposer may be configured to create a spatial redistribution of vacuum to the PCB board. The interposer may be made of a soft, non-durable, and cost-effective material.

Fig. 1 shows a cross-sectional view of an arrangement 124 comprising a vacuum suction device 102, an interposer 100 and a component carrier structure 106 in a first operating state according to an example embodiment of the invention. Fig. 2 shows the arranging device 124 according to fig. 1 in a second operating state.

The illustrated placement device 124 includes a vacuum suction device 102 having a mounting block 150 with a plurality of parallel primary vacuum channels 104 extending through the mounting block 150. A vacuum source (not shown), such as a vacuum pump, may be connected to the main vacuum channels 104 to create a negative pressure in each main vacuum channel 104. Thus, the vacuum suction device 102 is configured to provide a vacuum force at the upper mounting surface of the vacuum suction device 102 where all of the main vacuum channels 104 are open. As described in further detail below, this vacuum suction force holds the component carrier structure 106 to be processed in place and in particular will prevent it from warping during processing. Thus, the two-dimensional equidistant array of primary vacuum channels 104 of the vacuum suction device 102 is configured for generating a two-dimensional spatial pattern of locations or points at which the vacuum suction device 102 pulls the upper component carrier structure 106 in a downward manner, thus stabilizing the flatness of the component carrier structure 106.

Advantageously, the planar interposer 100 with the integrated network 190 of interconnected secondary vacuum channels 110 may be mounted as a single individual on a mounting surface of the mounting table 150 of the vacuum suction device 102 such that the individual primary vacuum channels or groups of primary vacuum channels 104 are aligned and in gaseous communication with the individual secondary vacuum channels or groups of secondary vacuum channels 110. The other primary vacuum channels 104 are disconnected from the secondary vacuum channels 110 and thus have open ends that are closed and thus blocked by the interposer 100. Furthermore, as may be taken from fig. 1, the spatial pattern according to which the secondary vacuum channels 110 are arranged differs from the spatial pattern according to which the primary vacuum channels 104 are arranged. A greater number of primary vacuum channels 104 per unit surface area of the vacuum suction device 102 may be provided compared to the number of secondary vacuum channels 110 per unit surface area of the interposer 100. Although the primary vacuum channels 104 may be arranged equidistantly along two orthogonal horizontal directions and/or may be arranged parallel to each other, the secondary vacuum channels 110 may be arranged at varying distances and/or densities in different areas of the interposer 100. All primary vacuum channels 104 may have the same dimensions, however, different secondary vacuum channels 110 may have different dimensions. As a result, the interposer 100 is configured to carry and hold the component carrier structure 106 at the top side of the interposer 100 by the vacuum force provided by the vacuum suction device 102 on the bottom side of the interposer 100 and redistributed by the array of secondary vacuum channels 110 of the interposer 100.

As also shown in fig. 1, the component carrier structure 106 forms part of the placement device 124, is carried by the interposer 100, and is held in place by vacuum forces generated by the vacuum suction device 102 and transmitted to the interposer 100 through the selective gas communication described between the primary vacuum channels 104 and the secondary vacuum channels 110. For example, the component carrier structure 106 may be a thin planar laminate of an electrically conductive layer structure 152 and an electrically insulating layer structure 154 (see detail 156 in fig. 1), such as a board used to manufacture a plurality of component carriers, such as a Printed Circuit Board (PCB). In other words, the individual component carriers may still form an integral part of the integrally connected component carrier structure 106, which integrally connected component carrier structure 106 is currently processed to manufacture the component carrier to be separated from the board. Thus, the illustrated component carrier structure 106 may comprise a plurality of connected preforms of component carriers. Referring again to detail 156 in fig. 1, electrically-conductive layer structure 152 may include a patterned or continuous copper foil and vertical through-connections, such as copper-filled laser vias that may be formed by plating. The electrically insulating layer structure 154 may comprise a corresponding resin (e.g. a corresponding epoxy resin), preferably comprising reinforcing particles (e.g. glass fibers or glass spheres) therein. For example, electrically insulating layer structure 154 may be made of prepreg or FR 4.

In particular, fig. 2 shows the component carrier structure 106 in an operating mode in which it is currently processed by a processing unit 128, such as a laser cutter. During laser cutting for separating the individual printed circuit boards from the previously integrated component carrier structures 106, it is of utmost importance that the component carrier structures 106 are correctly positioned and maintained in a precise planar configuration, i.e. without wrinkling, warping or bending. Otherwise, the cutting position may be incorrect or inaccurate, and the separated printed circuit boards may be erroneous. Advantageously, the vacuum suction device 102 may be integrated in the arrangement device 124 and may be configured to suction the plate-shaped component carrier structure 106 onto the mounting table 150 of the vacuum suction device 102 during the formation of the laser through holes in the cutting area 130 of the component carrier structure 106, or only during a part of the laser through hole formation process. The laser device shown only in fig. 2 as an example for the processing unit 128 may also form part of the arranging device 124. The laser device may be configured for forming laser through holes in the component carrier structure 106 for separating the component carrier structure into individual component carriers. Due to the fixed vacuum force provided by the vacuum suction means 102 and transmitted to the component carrier structure 106 through the interposer 100, it can be ensured that the component carrier structure 106 remains flat and in the correct spatial position during the processing by laser cutting. At the same time, a local loss of vacuum suction force due to parasitic connections of the main vacuum channel 104, the secondary vacuum channel 110 and the through-holes in the cut region 130 of the component carrier structure 106 may be ensured. This may be achieved by the design of the network 190 of interconnected secondary vacuum channels 110 in the interposer 100, as described below. From the description, the mentioned design may depend on the characteristics of the component carrier structure 106, i.e. the position of the cutting area 130 and the position of the individual component carriers of the component carrier structure 106. The primary vacuum channels 104 of the vacuum suction device 102 are arranged in a generally regular equidistant pattern and the secondary vacuum channels 110 of the interposer 100 are arranged in an irregular non-equidistant pattern, which is adapted to the specific properties of the component carrier structure 106 and its processing by the processing unit 128, thereby preventing partial vacuum losses.

In the embodiment of fig. 1 and 2, the network 190 of secondary vacuum channels 110 is configured to combine the vacuum forces of the primary vacuum channels 104 to provide a combined vacuum force at the vacuum outlets 126 on the top surface 118 of the interposer 108 of the interposer 100.

More specifically, the secondary vacuum channels 110 (e.g., four) in the first set 140 on the left side of fig. 1 and 2 are in gas communication with a greater number (seven in the illustrated embodiment) of primary vacuum channels 104. Thus, the number of primary vacuum channels 104 in the first group 140 is greater than the number of vacuum outlets 126. This gas communication is established by a laterally elongated vacuum collection cavity, here embodied as a groove 112 formed in the lower main surface of the interposer 100 facing the vacuum suction device 102. A lateral extension of the cavity, here embodied as a slot 112, covers each secondary vacuum channel 110 of the first set 140 and each primary vacuum channel 104 of said first set 140.

In the configuration shown in fig. 1, a first number (four in the illustrated embodiment) of through-holes 114 of the secondary vacuum channels 110 are coupled to (or in fluid communication with) each vacuum collection cavity embodied as a slot 112. A second number (six or seven in the illustrated embodiment) of primary vacuum channels 104 are coupled to (or in fluid communication with) each vacuum collection cavity embodied as a slot 112. Since the first number is smaller than the second number, an increase in vacuum suction force occurs on the top side of the interposer 100.

Since a smaller number of secondary vacuum channels 110 in the first group 140 are provided with vacuum suction force from a larger number of main vacuum channels 104 in gaseous communication via the cavity embodied as the slot 112, the vacuum suction force at the upper open end of the secondary vacuum channels 110 in the first group 140 is increased compared to the vacuum suction force at the respective main vacuum channels 104 in the first group 140.

Accordingly, the (e.g., four) secondary vacuum channels 110 in the second set 162 on the right side of fig. 1 and 2 are in gaseous communication with a larger number (seven in the illustrated embodiment) of additional primary vacuum channels 104. This gas communication is achieved by a further laterally elongated vacuum collection cavity implemented as a groove 112 formed in the lower main surface of the interposer 100 facing the vacuum suction device 102. The lateral extension of the further cavity, embodied as a slot 112, covers each secondary vacuum channel 110 of the second set 162 and each further primary vacuum channel 104 in gaseous communication with a secondary vacuum channel 110 of said second set 162. Since a smaller number of secondary vacuum channels 110 in the second group 162 are provided with vacuum suction force from a larger number of further main vacuum channels 104 in gaseous communication via a further cavity embodied as a slot 112, the vacuum suction force at the upper open ends of the secondary vacuum channels 110 in the second group 162 is increased compared to the vacuum suction force at each of the further main vacuum channels 104 coupled with these secondary vacuum channels 110.

In descriptive terms, each slot 112 may form a vacuum channel collection cavity that collects vacuum from the plurality of distributed primary vacuum channels 104 and carries the collected vacuum to a smaller number of vias 114 that form part of the secondary vacuum channels 110 of the interposer 100. Thus, the described configuration of the interposer 100 spatially concentrates or focuses vacuum forces toward particular design locations of the component carrier structures 106 in areas corresponding to the first set 140 of secondary vacuum channels 110 and the second set 162 of secondary vacuum channels 110.

Further, the interposer 100 includes a vacuum-channel-free region 160 between the secondary vacuum channels 110 of the first group 140 and the secondary vacuum channels 110 of the second group 162. As shown, the channel-free region 160 surrounds the cut-out region 130 of the component carrier structure 106. In other words, in the interposer 100, no secondary vacuum channels 110 are foreseen in the areas where there are through-holes cut through the component carrier structure 106 during processing by the processing unit 128. Accordingly, the secondary vacuum channel 110 is arranged to decouple one or more through-holes in the cutting area 130 extending through the component carrier structure 106 from the primary vacuum channel 104. Thus, the cut-out region of the component carrier structure 106 may be blocked by the vacuum interposer 100 to prevent vacuum leakage.

The described measures have the following effects: first, concentrating or focusing the vacuum force around the cutting region 130 may ensure excellent spatial accuracy and a warp-free configuration of the component carrier structure 106 in this region that is critical for the processing by the processing unit 128. Second, providing the interposer 100 with channel-free regions 160 in the cutting regions 130 (or more generally processing regions) may prevent vacuum loss at the locations where the component carrier structures 106 are processed. This ensures labor-saving high precision and enables the component carrier to be manufactured on an industrial scale with excellent reliability and high yield.

As shown in fig. 2, in the cut-out region 130 of the component carrier structure 106, the processing unit 128 builds through-holes, cut-out regions and/or slots. Although the primary vacuum channels 104 are also exposed in the channel-free region 160 at the upper major surface of the vacuum suction device 102, in the channel-free region 160, the network 190 of secondary vacuum channels 110 does not extend through the entire intermediate laminate 108. Thus, the region 142 prone to vacuum loss can reliably prevent such vacuum loss due to blockage of the primary vacuum channel 104 (or due to reorientation of the secondary vacuum channel 110) away from the region 142.

As already mentioned, and as shown in fig. 2, the arrangement device 124 comprises a processing unit 128, which processing unit 128 is configured to process the component carrier structure 106 while carrying and holding the component carrier structure 106 on the interposer 100 by means of vacuum forces. The processing unit 128 is embodied here as a laser processing device, in particular a laser cutting device for producing cutting lines for separating component carriers or as a laser drilling device for drilling laser vias to be filled with copper plating.

The plate interposer 100 is inserted between the plate mount 150 of the vacuum suction device 102 and the plate-type PCB-type component carrier structure 106. The vacuum suction device 102 is provided with a primary vacuum channel 104 for providing a vacuum force to the component carrier structure 106 through the interposer 100. The interposer 100 includes an interposer board 108 mounted on the vacuum suction device 102 and carrying the component carrier structure 106. The interconnected network 190 of secondary vacuum channels 110 is formed between opposing major surfaces of the interposer web 108 and is configured to spatially redirect vacuum forces provided by the primary vacuum channels 104 of the vacuum suction device 102 at the bottom surface 116 of the interposer web 108 into a redirected vacuum force pattern at the top surface 118 of the interposer web 108. As shown, the network 190 of secondary vacuum channels 110 is a bifurcated network 190 of secondary vacuum channels 110. More specifically, the network 190 of secondary vacuum channels 110 is formed by slots 112 (or other types of vacuum collection cavities) facing the vacuum suction device 102 and through-holes 114 extending through the interposer 108 and in gaseous communication with respective ones of the slots 112. The network 190 of secondary vacuum channels 110 shown is configured for: the vacuum force between the bottom surface 116 and the top surface 118 is redistributed for holding the component carrier structure 106 during processing. To this end, the network 190 is configured to focus the vacuum force in a direction from the bottom surface 116 to the top surface 118.

For example, the interposer laminate 108 may be made of a fully cured epoxy. Alternatively, the interposer laminate 108 may be a polyimide sheet. In yet another embodiment, the interposer 108 includes epoxy, glass fiber reinforced in epoxy, and electrically conductive layer structure (e.g., one or more patterned copper layers and/or one or more copper-filled laser vias), such as FR4 with copper structures. Such material of the intermediate laminate 108 may be sufficiently resilient to be slightly deformed by the applied vacuum force. Thus, this material selection promotes sealed gas communication between the vacuum suction device 102 and the interposer 100 and between the interposer 100 and the component carrier structure 106.

Advantageously, the interlayer sheet 108 is made of a material having antistatic properties. This reliably prevents the component carrier structure 106 from being charged by the charged carrier.

As shown in detail 192 of fig. 2, the interposer 108 may also include a patterned metal layer 120 (e.g., a patterned copper foil), which patterned metal layer 120 may serve as a stop layer for the laser beam 164 emitted by the processing unit 128 for laser cutting. When the laser beam 164 impinges on the metal layer 120, it will be prevented from penetrating further into the interposer 100.

Preferably and as shown in detail 168 in fig. 2, the roughness R1 of the top surface 118 of the interposer board 108 on which the component carrier structure 106 is to be mounted is less than the roughness R2 at another surface area of the interposer board 108. This may be accomplished, for example, by polishing the top surface 118. In other words, the surface of the interposer 100 facing the component carrier structure 106 may be smoother than the surface facing the vacuum suction device 102. In particular, the connection between the interposer 100 and the component carrier structure 106 is airtight, so that a vacuum suction force can be transmitted with no or only little loss.

As shown, the horizontal extension of the interposer 100 may be larger than the horizontal extension of the component carrier structure 106. For example, the component carrier structure 106, which may be a board used to manufacture a PCB, may have a surface area of 12 x 18 square inches. For example, the interposer 100 may then have a surface area of 14 x 20 square inches. The thickness d of the interposer 100 may be as small as, for example, 2mm, so that the arrangement 124 may have a high compactness in the vertical direction. For example, the interposer 100 may be configured as a patterned component carrier structure 106, e.g., slightly larger than the board dimensions.

Hereinafter, the operation of the arranging device 124 according to an example embodiment of the present invention as shown in fig. 1 and 2 will be explained: the arrangement device 124 may be used for processing the component carrier structure 106, which is here embodied as a PCB board, during laser processing of the component carrier structure 106 using the laser processing unit 128.

To do so, the interposer 100 is mounted on a mounting table 150 of a vacuum suction device 102 that provides a vacuum force by creating a vacuum or negative pressure in each of the plurality of main vacuum channels 104. Further, the component carrier structure 106 is mounted on the interposer 100. Further, the method includes spatially modifying a vacuum force pattern provided by the primary vacuum channels 104 of the vacuum suction device 102 at the bottom surface 116 of the interposer layer 108 of the interposer 100 to a modified vacuum force pattern at the top surface 118 of the interposer layer 108, thereby retaining the component carrier structure 106 through the secondary vacuum channels 110 formed between the opposing major surfaces of the interposer layer 108. This spatial redistribution of vacuum forces may be achieved by designing the interposer 100 accordingly. More specifically, the interposer 100 is provided with a network 190 of secondary vacuum channels 110 formed between opposing major surfaces of the interposer sheet 108. The design is adapted to spatially redirect the vacuum force provided by the primary vacuum channels 104 of the vacuum suction device 102 at the bottom surface 116 of the intermediate layer plate 108 into a redirected vacuum force pattern at the top surface 118 of the intermediate layer plate 108, thereby retaining the component carrier structure 106. More specifically, the network 190 of secondary vacuum channels 110 may be configured to provide a locally increased holding force to the component carrier structure 106 around the region 130 of the component carrier structure 106 that is subjected to the laser treatment by the laser treatment unit 128 (instead of at the region 130). Advantageously, the network 190 of secondary vacuum channels 110 may be configured to disable vacuum connection of the processed regions 130 of the component carrier structure 106 (which may be the cut-out regions 130 of the component carrier structure 106). The reliable fixation obtained by the combination of the groups 140, 162 with concentrated vacuum force and the vacuum channel-free regions 160 between the groups 140, 162 and in relation to the processed regions of the component carrier structure 106, the component carrier can be processed by laser cutting using the laser processing unit 128 while the component carrier structure 106 is held by the vacuum force provided by the vacuum suction device 102 and the interposer 100. During laser processing, the metal layer 120 of the interposer 100 may serve as a laser stop layer during laser processing of the component carrier structure 106, since the laser beam does not pass through the metal layer 120 when the laser beam is irradiated.

Advantageously, the interposer 100 may be designed according to the characteristics of the component carrier structure 106 to be handled and processed. As shown in fig. 1 and 2, the design of the features according to the reference numerals 140, 162, 160 is particularly suitable for the region 130 of the component carrier structure 106 to be laser-treated and for adjacent regions of the component carrier structure 106 which are not to be laser-treated. Thus, the design of the interposer 100 to be used in connection with a particular component carrier structure 106 to be manufactured may be determined based on a set of design parameters indicative of characteristics of the component carrier structure 106 and characteristics of processing of the component carrier 106. The product-specific design of the interposer 100 may be determined by computer-aided manufacturing data. Thus, software that knows the characteristics of the component carrier structures 106 to be manufactured and knows the characteristics of the generic vacuum suction device 102 to be used may automatically determine a set of parameters for manufacturing the interposer 100. This may make the fabrication process of the interposer 100 particularly simple.

Thus, the embodiments of fig. 1 and 2 show cross-sectional views of a vacuum interposer 100 for PCB processing. Such an interposer 100 may be flexibly used with a variety of processing and metrology devices, such as in the case of laser cutting. Such embodiments may be applied to, but are not limited to, laser drilling, assembly, cutting, wiring, visual inspection, photo exposure, other metrology, and the like. Illustratively, the interposer 100 may redistribute the vacuum onto the PCB board. A vacuum chamber may be used to collect the vacuum. The cut-out regions of the component carrier structure 106 may be blocked by the vacuum interposer 100. Advantageously, this can reliably prevent vacuum leakage. At the same time, many different component carrier structures 106 (and correspondingly adapted interposers 100) may be used with one and the same universal vacuum suction device 100. The interposer 100 may be represented as a product-specific vacuum interposer clamp.

Fig. 3 shows a cross-sectional view of an arrangement 124 comprising a vacuum suction device 102, an interposer 100 and a component carrier structure 106 according to another example embodiment of the present invention.

The embodiment of fig. 3 differs from the embodiment of fig. 1 and 2 in particular in that, according to fig. 3, the number of through-holes 114 in the secondary vacuum channels 110 in the groups 140, 162 is smaller than in fig. 1 and 2. This results in an even greater concentration of vacuum forces in the through hole 114 according to fig. 3.

Fig. 4 shows a three-dimensional view of an arrangement 124 comprising a vacuum suction device 102, an interposer 100 and a component carrier structure 106 according to yet another example embodiment of the present invention. Fig. 5, 6 and 7 show cross-sectional views of the placement device 124 corresponding to fig. 4 in three different operating states. In the embodiment of fig. 4-7, the intermediate laminate 108 is provided with two trough-shaped recesses 122 at its top surface 118, which recesses 122 are decoupled (i.e. not in gas or vacuum communication) from the network 190 of secondary vacuum channels 110.

Referring to fig. 5, a continuous component carrier structure 106 is shown prior to laser processing.

Referring to fig. 6, through holes 170 have been formed in the component carrier structure 106 and directly above the recesses 122 by laser processing. During laser processing, the material of the component carrier structures 106 removed from the component carrier structures 106 by the laser processing may be converted into residual material, such as dust, carbon black and/or other solid particles. Such dust or solid particles may be contained in the respective recess 122, which may thus serve as a residual material collecting chamber.

Referring to fig. 7, a block 174 of material (such as a component carrier, e.g. a printed circuit board) of the component carrier structure 106 that has been separated by laser processing has been removed.

In the following, further aspects according to example embodiments of the present invention are disclosed:

aspect 1 a method of handling a component carrier structure (106), wherein the method comprises:

mounting the interposer (100) on a vacuum suction device (102), the vacuum suction device (102) providing a vacuum force by generating a vacuum in a plurality of main vacuum channels (104) of the vacuum suction device (102);

mounting a component carrier structure (106) on an interposer (100); and

the vacuum force pattern provided by the primary vacuum channels (104) of the vacuum suction device (102) at the bottom surface (116) of the interposer (108) of the interposer (100) is spatially modified to a modified vacuum force pattern at the top surface (118) of the interposer (108) to retain the component carrier structure (106) by secondary vacuum channels (110) formed between opposing major surfaces of the interposer (108) and arranged to decouple through-holes extending through the component carrier structure (106) from the primary vacuum channels (104).

Aspect 2. a method according to aspect 1, wherein the method comprises providing the interposer (100) with a network (190) of secondary vacuum channels (110) formed between opposite major surfaces of the interposer sheet (108).

Aspect 3. method according to aspect 2, wherein the method comprises configuring a network (190) of secondary vacuum channels (110) to provide a locally increased holding force to the component carrier structure (106) around the area (130) of the component carrier structure (106) being processed.

Aspect 4. method according to aspect 2 or 3, wherein the method comprises configuring the network (190) of secondary vacuum channels (110) to disable vacuum connection of the regions (130) of the component carrier structure (106) being processed.

Aspect 5. method according to any of aspects 1 to 4, wherein the method comprises handling the component carrier structure (106) while holding the component carrier structure (106) by a vacuum force provided by the vacuum suction device (102) and the intermediate layer (100).

Aspect 6. a method according to any of aspects 1 to 5, wherein the method comprises processing the component carrier structure (106) by at least one of: laser cutting, laser drilling, screen printing, component assembly, cutting, wiring, visual inspection, electromagnetic radiation exposure, and metrology.

Aspect 7. the method according to any of aspects 1 to 6, wherein the method comprises using the metal layer (120) of the interposer (100) as a laser stop layer during laser processing of the component carrier structure (106).

Aspect 8 the method according to any one of aspects 1 to 7, wherein the method comprises: the interposer (100) is designed based on a set of design parameters that indicate characteristics of the component carrier structures (106) and characteristics of processing of the component carrier structures (106).

Aspect 9. the method according to any one of aspects 1 to 8, wherein the method comprises:

coupling a first number of through holes (114) of the secondary vacuum channel (110) with a vacuum collection cavity; and

coupling a second number of primary vacuum channels (104) with the vacuum collection cavity;

wherein the first number is less than the second number.

Aspect 10 the method according to aspect 9, wherein the vacuum collection chamber comprises at least one groove (112).

Aspect 11 a method of using a network (190) of secondary vacuum channels (110) of an interposer (100) having the above features for spatially redirecting vacuum forces provided by primary vacuum channels (104) of a vacuum suction device (102) at a bottom surface (116) of the interposer sheet (108) to a redirected vacuum force pattern at a top surface (118) of the interposer sheet (108) where component carrier structures (106) are arranged and processed.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined.

It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.

The practice of the invention is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, even in the case of substantially different embodiments, it is possible to use the solution shown and a plurality of variants according to the principles of the invention.

Claims (22)

1. An interposer (100), the interposer (100) for being arranged between a vacuum suction device (102) having a plurality of main vacuum channels (104) for providing a vacuum force and a component carrier structure (106) to be processed, characterized in that the interposer (100) comprises:

an intermediate layer plate (108), the intermediate layer plate (108) being for mounting on the vacuum suction device (102) and for carrying the component carrier structure (106); and

a network (190) of secondary vacuum channels (110), the network (190) of secondary vacuum channels (110) being formed between opposing major surfaces of the interposer web (108) and configured for spatially redirecting the vacuum force provided by the primary vacuum channels (104) of the vacuum suction device (102) at a bottom surface (116) of the interposer web (108) into a redirected vacuum force pattern at a top surface (118) of the interposer web (108).

2. The interposer (100) according to claim 1, wherein the network (190) of secondary vacuum channels (110) is a bifurcated network of secondary vacuum channels (110).

3. The interposer (100) according to claim 1 or 2, wherein the network (190) of secondary vacuum channels (110) comprises at least one vacuum collection cavity.

4. The interposer (100) according to claim 3, wherein the at least one vacuum collection cavity is formed as at least one groove (112).

5. The interposer (100) according to claim 3, wherein the at least one vacuum collection cavity is formed in the interposer board (108).

6. The interposer (100) according to claim 3, wherein the network (190) of secondary vacuum channels (110) comprises at least one through hole (114) extending through the interposer board (108).

7. The interposer (100) according to claim 6, wherein the at least one vacuum collection cavity is in gaseous communication with the at least one via (114).

8. The interposer (100) according to claim 1 or 2, wherein the network (190) of secondary vacuum channels (110) is configured for: redistributing the vacuum force between the bottom surface (116) and the top surface (118) for holding the component carrier structure (106) during processing.

9. The interposer (100) according to claim 1 or 2, wherein the interposer (100) comprises at least one of the following features:

wherein the intermediate laminate (108) is composed of a fully cured resin or plastic;

wherein the interposer laminate (108) comprises a metal layer (120);

wherein the interposer (100) is configured as a patterned component carrier structure.

10. The interposer (100) according to claim 1 or 2, wherein the interposer (100) comprises at least one of the following features:

wherein the intermediate laminate (108) is made of a material having antistatic properties;

wherein the intermediate laminate (108) is made of an elastic material that is deformable by the vacuum force.

11. The interposer (100) according to claim 1 or 2, wherein the top surface (118) of the interposer board (108) to which the component carrier structure (106) is to be mounted has a reduced roughness compared to another surface area.

12. The interposer (100) according to claim 1 or 2, wherein the interposer layer (108) has a thickness (d) in a range from 0.5mm to 10 mm.

13. The interposer (100) according to claim 1 or 2, wherein the interposer layer (108) comprises at least one residual material collection cavity at a top surface (118) of the interposer layer, the at least one residual material collection cavity being decoupled from the network (190) of secondary vacuum channels (110) and adapted to accommodate residual material generated during processing of the component carrier structure (106).

14. The interposer (100) according to claim 1 or 2, wherein the interposer layer (108) comprises a laser stop layer configured for stopping a laser beam during laser processing.

15. An arrangement apparatus (124), characterized in that the arrangement apparatus (124) comprises:

a vacuum suction device (102), the vacuum suction device (102) having a plurality of main vacuum channels (104) for providing a vacuum force to a component carrier structure (106) to be processed; and

the interposer (100) according to any one of claims 1 to 14, the interposer (100) being mounted on the vacuum suction device (102) and configured for carrying and holding the component carrier structure (106) by a vacuum force provided by the vacuum suction device (102) and spatially redirected by the interposer (100).

16. The arrangement device (124) according to claim 15, wherein the network (190) of secondary vacuum channels (110) is configured for bonding vacuum forces of groups (140, 162) of primary vacuum channels (104) in the vacuum suction device (102) at one or more vacuum outlets (126) on the top surface (118) of the intermediate laminate (108).

17. The arrangement (124) according to claim 16, wherein the number of primary vacuum channels (104) in the group (140, 162) is greater than the number of vacuum outlets (126) in the group (140, 162).

18. The arrangement (124) according to any of claims 15 to 17, characterized in that the arrangement (124) comprises the component carrier structure (106) carried and held on the interposer (100) by the vacuum force.

19. The arrangement device (124) according to claim 18, wherein the component carrier structure (106) comprises at least one of: at least one through-hole, cutout region, and slot in the region (160); in the area (160), the network (190) of secondary vacuum channels (110) does not extend through the entire intermediate laminate (108), and in the area (160) at least one of the primary vacuum channels (104) is exposed at an upper main surface of the vacuum suction device (102).

20. The arrangement device (124) according to any one of claims 15 to 17, characterized in that the arrangement device (124) comprises a processing unit (128), the processing unit (128) being configured for processing the component carrier structure (106) while carrying and holding the component carrier structure (106) on the interposer (100) by the vacuum force.

21. The arranging device (124) according to any one of claims 15 to 17, characterized in that the arranging device (124) comprises at least one of the following features:

wherein the plurality of main vacuum channels (104) of the vacuum suction device (102) are arranged in an equidistant pattern;

wherein the plurality of main vacuum channels (104) of the vacuum suction device (102) are arranged in a parallel manner.

22. The arrangement (124) according to claim 20, wherein the processing unit (128) is a laser processing device.

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