CN214703692U - Test board - Google Patents
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- CN214703692U CN214703692U CN202023287697.5U CN202023287697U CN214703692U CN 214703692 U CN214703692 U CN 214703692U CN 202023287697 U CN202023287697 U CN 202023287697U CN 214703692 U CN214703692 U CN 214703692U
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Abstract
The utility model relates to the technical field of chip detection, in particular to a test board; the method comprises the following steps: a wafer bearing table; the copper object carrying plate is placed on the wafer bearing table and used for bearing the optical chip; the optical fiber fixing bracket is arranged above the copper object carrying plate and used for clamping the optical fiber adapter; the first probe is arranged above the copper object carrying plate through a first fine adjustment mechanism, and the first fine adjustment mechanism is used for driving the first probe to move along the Z axis so as to enable the free end of the first probe to be in contact with the P electrode of the optical chip; wherein, the first probe and the copper object carrying plate are externally connected with leads; the test bench can realize the relevant photoelectric performance test of the optical chip with the coplanar electrode and the non-coplanar electrode.
Description
Technical Field
The utility model relates to a chip detects technical field, concretely relates to testboard.
Background
Because the optical chip has a small size (usually less than 0.5mm x 0.5mm), and the electrode size is small (the electrode size is generally phi 60um), when the photoelectric performance test is performed on the optical chip, firstly, the optical chip needs to be cut into a plurality of pieces, each optical chip is packaged on a device, and the electrode is led out through the pin, so that the photoelectric performance test can be performed.
SUMMERY OF THE UTILITY MODEL
An object of this application is to provide a testboard to solve among the prior art to the loaded down with trivial details problem of optical chip testing procedure.
Technical scheme (I)
In order to achieve the above object, the utility model provides a test board, include:
a wafer bearing table;
the copper object carrying plate is placed on the wafer bearing table and used for bearing the optical chip;
the optical fiber fixing bracket is arranged above the copper object carrying plate and used for clamping the optical fiber adapter;
the first probe is arranged above the copper object carrying plate through a first fine adjustment mechanism, and the first fine adjustment mechanism is used for driving the first probe to move along the Z axis so as to enable the free end of the first probe to be in contact with the P electrode of the optical chip;
and the first probe and the copper carrying plate are externally connected with leads.
Optionally, the test bench further includes: and a second probe externally connected with a lead, wherein the second probe is arranged above the copper object carrying plate through a second fine adjustment mechanism, and the second fine adjustment mechanism is used for driving the second probe to move along the Z axis so as to enable the free end of the second probe to be in contact with the N electrode of the optical chip.
Optionally, the test bench further includes: the bottom plate, wafer stage, copper carry thing board, optic fibre fixed bolster, first probe and the second probe all install in on the bottom plate.
Optionally, the first fine adjustment mechanism and the second fine adjustment mechanism have the same or different structures; the first fine adjustment mechanism includes:
the upper wall surface of the fine adjustment sliding plate is fixedly connected with the first probe, and a stop block is arranged on the side wall surface of the fine adjustment sliding plate;
one side wall surface of the fixing plate is fixedly connected with the bottom plate through a fixing frame, the other side wall surface of the fixing plate is in sliding connection with the fine adjustment sliding plate, and a supporting block is arranged on the side wall surface corresponding to the stop block;
and the free end of the first micrometer is in threaded connection with the supporting block, and one end extending out of the supporting block is abutted to the stop block so as to drive the fine adjustment sliding plate to drive the first probe to move along the Z axis until the first probe is contacted with the P electrode of the optical chip.
Optionally, a locking assembly is further arranged between the fine adjustment sliding plate and the fixing plate.
Optionally, a third fine adjustment mechanism is further disposed on the sheet bearing table, and the third fine adjustment mechanism is used for driving the sheet bearing table to move along the X axis or the Y axis.
Optionally, one end of the optical fiber fixing support, which is far away from the copper object carrying plate, is further provided with a fourth fine adjustment mechanism, and the fourth fine adjustment mechanism is used for driving the optical fiber fixing support to move along an X axis or a Y axis.
Optionally, the third fine adjustment mechanism and the fourth fine adjustment mechanism have the same or different structures; the third fine adjustment mechanism includes:
the limiting plate is fixedly connected with the bottom plate, and a first L-shaped connecting plate is arranged on the side wall surface of the limiting plate;
the lower wall surface of the first moving plate is connected with the limiting plate in a sliding mode, and a second L-shaped connecting plate is arranged on the side wall surface of the first moving plate;
the upper wall surface of the second moving plate is fixedly connected with the wafer bearing table, and the lower wall surface of the second moving plate is in sliding connection with the upper wall surface of the first moving plate;
the free end of the third micrometer is in threaded connection with the first L-shaped connecting plate, and one end of the third micrometer, which extends out of the first L-shaped connecting plate, is abutted against the first moving plate so as to drive the first moving plate to drive the wafer bearing table to move along the X axis relative to the limiting plate;
and the free end of the fourth micrometer is in threaded connection with the second L-shaped connecting plate, and one end of the fourth micrometer, which extends out of the second L-shaped connecting plate, is abutted against the second moving plate so as to drive the second moving plate to drive the wafer bearing table to move along the Y axis relative to the limiting plate.
Optionally, a fifth fine adjustment mechanism is further disposed on the optical fiber fixing support, the fifth fine adjustment mechanism is fixedly connected to the fourth fine adjustment mechanism, and the fifth fine adjustment mechanism is used for driving the optical fiber fixing support to move along the Z axis so as to be close to the copper object carrying plate.
Optionally, the optical fiber fixing bracket includes: l type carriage, regulating block and regulation micrometer, the vertical section of L type carriage with fifth fine-tuning fixed connection, the horizontal segment of L type carriage set up in the top of copper year thing board, just the horizontal segment is seted up and is used for holding the chamber that holds of regulating block, the free end of adjusting micrometer passes horizontal segment wherein one end with regulating block fixed connection, the regulating block with form between the horizontal segment other end and be used for the centre gripping chamber of optic fibre adapter.
(II) advantageous effects
Compared with the prior art, the utility model, following beneficial effect has:
the utility model provides a for realize above-mentioned purpose, the utility model provides a testboard, include: a wafer bearing table; the copper object carrying plate is placed on the wafer bearing table and used for bearing the optical chip; the optical fiber fixing bracket is arranged above the copper object carrying plate and used for clamping the optical fiber adapter; the first probe is arranged above the copper object carrying plate through a first fine adjustment mechanism, and the first fine adjustment mechanism is used for driving the first probe to move along the Z axis so as to enable the free end of the first probe to be in contact with the P electrode of the optical chip; wherein, the first probe and the copper object carrying plate are externally connected with leads; illustratively, when an optical chip with an opposite electrode needs to be detected, a lead connected with the first probe and the copper object carrying plate is connected to a power supply; and then placing the optical chip on a copper object carrying plate, moving the optical chip to the lower part of the first probe by moving the copper object carrying plate, and finally driving the first probe to move along the Z axis by the first fine adjustment mechanism until the free end of the first probe is contacted with the P electrode of the optical chip, and at the moment, carrying out related photoelectric performance test on the optical chip.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained without inventive exercise, wherein:
FIG. 1 is a schematic structural diagram of a test board according to the present invention;
fig. 2 is a schematic structural diagram of a third fine adjustment mechanism in the present invention;
fig. 3 is a schematic structural diagram of a first fine adjustment mechanism in the present invention;
FIG. 4 is an exploded view of FIG. 3;
fig. 5 is a schematic structural diagram of the first probe and the second probe of the present invention.
In the figure: 1. a wafer bearing table; 2. a copper carrier plate; 3. an optical fiber fixing bracket; 4. a fiber optic adapter; 5. a first probe; 6. a first fine adjustment mechanism; 7. a second probe; 8. a base plate; 9. A third fine adjustment mechanism; 10. a fourth fine adjustment mechanism; 11. a limiting plate; 12. a first L-shaped connecting plate; 13. a first moving plate; 14. a second moving plate; 15. a third micrometer; 16. a fourth micrometer; 17. a second L-shaped connecting plate; 18. a fifth fine adjustment mechanism; 19. finely adjusting the sliding plate; 20. a stopper; 21. a fixing plate; 22. a support block; 23. a first micrometer; 24. adjusting the micrometer; 25. a second micrometer; 26. a fifth micrometer; 27. a sixth micrometer; 28. a seventh micrometer; 29. and a second fine adjustment mechanism.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The invention will be described in further detail with reference to the following drawings and embodiments:
in order to solve the problem that the testing steps for the optical chip are complicated in the prior art, as shown in fig. 1 to 5, the present application provides a testing table, which includes:
a wafer stage 1;
the copper object carrying plate 2 is placed on the wafer bearing table 1 and used for bearing the optical chip;
the optical fiber fixing bracket 3 is arranged above the copper object carrying plate 2 and used for clamping the optical fiber adapter 4;
the first probe 5 is arranged above the copper object carrying plate 2 through a first fine adjustment mechanism 6, and the first fine adjustment mechanism 6 is used for driving the first probe 5 to move along the Z axis so as to enable the free end of the first probe 5 to be in contact with the P electrode of the optical chip; preferably, as shown in fig. 5, the free end of the first probe 5 is bent so as to be in contact with the corresponding electrode;
wherein, the first probe 5 and the copper object carrying plate 2 are externally connected with leads.
Illustratively, when an optical chip with an opposite electrode (a P electrode is on the front side, and an N electrode is on the back side) needs to be detected, a lead connected with the first probe 5 and the copper object carrying plate 2 is firstly connected to a power supply; and then placing the optical chip on a copper object carrying plate 2, moving the optical chip to the lower part of a first probe 5 by moving the copper object carrying plate 2, and finally driving the first probe 5 to move along a Z axis through a first fine adjustment mechanism 6 until the free end of the first probe 5 is contacted with a P electrode of the optical chip, wherein the copper object carrying plate 2 is the N pole of the optical chip, and then carrying out related photoelectric performance test on the optical chip.
According to an embodiment of the present invention, as shown in fig. 3 and 4, the first fine adjustment mechanism 6 includes:
a fine adjustment slide plate 19, the upper wall surface of which is fixedly connected with the first probe 5 and the side wall surface of which is provided with a stop block 20;
one side wall surface of the fixing plate 21 is fixedly connected with the bottom plate 8 through a fixing frame, the other side wall surface is in sliding connection with the fine adjustment sliding plate 19, and a supporting block 22 is arranged on the side wall surface corresponding to the stop block 20;
the free end of the first micrometer 23 is connected with the supporting block 22 by screw threads, and one end extending out of the supporting block 22 is abutted against the stop 20, so as to drive the fine tuning slide plate 19 to drive the first probe 5 to move along the Z axis until the first probe is contacted with the P electrode of the optical chip.
Specifically, as shown in fig. 4, a slide rail is disposed on the fixing plate 21, and a slide slot matched with the slide rail is disposed on the fine adjustment slide plate 19, wherein the setting direction of the slide rail and the slide slot can be pre-designed according to the adjustment direction, in this embodiment, preferably, the setting direction of the slide rail and the slide slot is parallel to the first micrometer 23.
When the free end of the first probe 5 is required to be in contact with the P electrode of the optical chip, the first micrometer 23 is only required to rotate clockwise, at the moment, the first micrometer 23 gives thrust to the stop block 20, and meanwhile, the fine adjustment sliding plate 19 is driven to move towards the direction close to the copper object carrying plate 2 synchronously under the action of the stop block 20 until the free end of the first probe is in contact with the P electrode of the optical chip.
Further, in order to realize that the first probe 5 reciprocates along the Z axis, preferably, the free end of the first micrometer 23 is connected with a lead screw, the lead screw is connected with a nut in a sliding manner, during assembly, the free end of the first micrometer 23 is inserted into the stopper 20, and the nut is fixedly connected with the stopper 20, at this time, the first probe 5 can be driven to reciprocate along the Z axis through clockwise or counterclockwise rotation of the first micrometer 23 so as to be close to or far away from the P electrode.
According to an embodiment of the present invention, in order to reduce the manufacturing cost, a plurality of lightening holes are formed on the fixing plate 21 and the fine adjustment slide plate 19.
According to the utility model discloses an embodiment still is equipped with locking Assembly between fine setting slide 19 and the fixed plate 21, and is concrete, and locking Assembly includes: the far end of the fixing ring is rotatably connected to the fixing plate 21, and the other end of the fixing ring is a free end; when the current adjusting state needs to be fixed, the other end of the fixing ring is only required to be rotated to a position matched with the fine adjustment sliding plate 19, and the fixing is carried out through a fastening bolt; when the adjustment is needed, the fastening bolt is only required to be taken down.
According to the utility model discloses an embodiment, the testboard still includes: a second probe 7 externally connected with a lead, wherein the second probe 7 is arranged above the copper object carrying plate 2 through a second fine adjustment mechanism 29, and the second fine adjustment mechanism 29 is used for driving the second probe 7 to move along the Z axis so as to enable the free end of the second probe 7 to be in contact with the N electrode of the optical chip; preferably, as shown in fig. 5, the free end of the second probe 7 is bent so as to facilitate contact with the corresponding electrode;
in this embodiment, when the optical chip with the coplanar electrodes (P, N electrodes are on the front side) needs to be detected, the wires connected with the first probe 5 and the second probe 7 are connected to the power supply; then, the optical chip is placed on the copper object carrying plate 2, and the optical chip is moved to the positions below the first probe 5 and the second probe 7 by moving the copper object carrying plate 2, so that the P electrode of the optical chip corresponds to the first probe 5, and the N electrode of the optical chip corresponds to the second probe 7; at this time, the first fine adjustment mechanism 6 drives the first probe 5 to move along the Z axis until the free end of the first probe 5 contacts with the P electrode of the optical chip, and then the first fine adjustment mechanism 6 drives the second probe 7 to move along the Z axis until the free end of the second probe 7 contacts with the N electrode of the optical chip, at this time, the optical chip can be subjected to related photoelectric performance tests.
According to an embodiment of the present invention, the first fine adjustment mechanism 6 and the second fine adjustment mechanism 29 may be the same or different in structure;
specifically, the second fine adjustment mechanism 29 includes:
a fine adjustment slide plate 19, the upper wall surface of which is fixedly connected with the second probe 7 and the side wall surface of which is provided with a stop block 20;
one side wall surface of the fixing plate 21 is fixedly connected with the bottom plate 8 through a fixing frame, the other side wall surface is in sliding connection with the fine adjustment sliding plate 19, and a supporting block 22 is arranged on the side wall surface corresponding to the stop block 20;
the free end of the second micrometer 25 is connected with the supporting block 22 by screw threads, and one end extending out of the supporting block 22 is abutted against the stop 20, so as to drive the fine tuning slide plate 19 to drive the first probe 5 to move along the Z axis until the first probe is contacted with the N electrode of the optical chip.
When the free end of the second probe 7 is required to be in contact with the N electrode of the optical chip, the second micrometer 25 is only required to rotate clockwise, at the moment, the second micrometer 25 gives thrust to the stop block 20, and meanwhile, the fine adjustment sliding plate 19 is driven to move towards the direction close to the copper object carrying plate 2 synchronously under the action of the stop block 20 until the free end of the second probe is in contact with the N electrode of the optical chip.
According to the utility model discloses an embodiment, for the convenience of removing, the testboard still includes: the bottom plate 8, the wafer bearing table 1, the copper object carrying plate 2, the optical fiber fixing support 3, the first probe 5 and the second probe 7 are all installed on the bottom plate 8.
According to the utility model discloses an embodiment still is equipped with third fine-tuning 9 on the wafer stage 1, and third fine-tuning 9 is used for driving wafer stage 1 to remove along X axle or Y axle.
Specifically, as shown in fig. 2, the third fine adjustment mechanism 9 includes:
the limiting plate 11 is fixedly connected with the bottom plate 8, and a first L-shaped connecting plate 12 is arranged on the side wall surface of the limiting plate;
the lower wall surface of the first moving plate 13 is connected with the limiting plate 11 in a sliding mode, and a second L-shaped connecting plate 17 is arranged on the side wall surface;
a second moving plate 14, the upper wall surface of which is fixedly connected with the wafer bearing table 1, and the lower wall surface of which is connected with the upper wall surface of the first moving plate 13 in a sliding manner;
a free end of the third micrometer 15 is in threaded connection with the first L-shaped connecting plate 12, and one end extending out of the first L-shaped connecting plate 12 is abutted against the first moving plate 13 so as to drive the first moving plate 13 to drive the wafer bearing table 1 to move along the X axis relative to the limiting plate 11;
specifically, the upper wall surface of the limiting plate 11 is provided with a sliding rail parallel to the X axis, and the lower wall surface of the first moving plate 13 is provided with a sliding groove matched with the sliding rail.
And the free end of the fourth micrometer 16 is in threaded connection with the second L-shaped connecting plate 17, and one end of the fourth micrometer, which extends out of the second L-shaped connecting plate 17, is abutted against the second moving plate 14 so as to drive the second moving plate 14 to drive the wafer bearing table 1 to move along the Y axis relative to the limiting plate 11.
Specifically, the upper wall surface of the first moving plate 13 is provided with a slide rail parallel to the Y axis, and the lower wall surface of the second moving plate 14 is provided with a slide groove matched with the slide rail, in this embodiment, it is preferable that the arrangement direction of the slide rail and the slide groove is perpendicular to the fourth micrometer 16.
When the optical chip needs to be moved to the position below the first probe 5 and the second probe 7, the copper object carrying plate 2 can be manually moved, and the third micrometer 15 or the fourth micrometer 16 can be rotated; exemplarily, when the optical chip needs to be moved along the X axis, only the third micrometer 15 needs to be rotated, at this time, the third micrometer 15 drives the first moving plate 13 to move along the X axis, and at the same time, the wafer stage 1 is driven to synchronously move along the X axis through the force transmissibility until the optical chip moves to a desired position, and then the third micrometer 15 stops rotating; similarly, when the optical chip needs to be moved along the Y axis, only the fourth micrometer 16 needs to be rotated, at this time, the fourth micrometer 16 drives the second moving plate 14 to move along the Y axis, and meanwhile, the wafer bearing table 1 is driven to synchronously move along the Y axis through the force transmissibility until the optical chip moves to the required position, and then the fourth micrometer 16 stops rotating.
Further, in order to realize that the slide holder 1 can reciprocate along both the X axis and the Y axis, preferably, the free end of the third micrometer 15 is connected with a first lead screw, the first lead screw is connected with a first nut in a sliding manner, during assembly, the free end of the third micrometer 15 is inserted into the first moving plate 13, and the first nut is connected with the first moving plate 13, at this time, the slide holder 1 can be driven to reciprocate along the X axis by clockwise or counterclockwise rotation of the third micrometer 15;
the free end of the fourth micrometer 16 is connected with a second lead screw, the second lead screw is connected with a second nut in a sliding mode, during assembly, the free end of the fourth micrometer 16 is inserted into the second moving plate 14, the second nut is connected with the second moving plate 14, and at the moment, the bearing piece table 1 can be driven to reciprocate along the Y axis through clockwise or anticlockwise rotation of the fourth micrometer 16.
According to the utility model discloses an embodiment, the one end that copper was kept away from to optic fibre fixed bolster 3 carries thing board 2 still is equipped with fourth fine tuning 10, and fourth fine tuning 10 is used for driving optic fibre fixed bolster 3 and removes along X axle or Y axle. According to an embodiment of the present invention, the third fine adjustment mechanism 9 and the fourth fine adjustment mechanism 10 may be the same or different in structure;
the fourth fine adjustment mechanism 10 specifically includes:
the limiting plate 11 is fixedly connected with the bottom plate 8, and a first L-shaped connecting plate 12 is arranged on the side wall surface of the limiting plate;
the lower wall surface of the first moving plate 13 is connected with the limiting plate 11 in a sliding mode, and a second L-shaped connecting plate 17 is arranged on the side wall surface;
a second moving plate 14, a side wall surface of which is fixedly connected with the optical fiber fixing bracket 3, and a lower wall surface of which is slidably connected with the upper wall surface of the first moving plate 13;
a free end of the fifth micrometer 26 is in threaded connection with the first L-shaped connecting plate 12, and one end of the fifth micrometer extending out of the first L-shaped connecting plate 12 abuts against the first moving plate 13, so as to drive the first moving plate 13 to drive the optical fiber fixing bracket 3 to move along the X axis relative to the limiting plate 11;
the free end of the sixth micrometer 27 is in threaded connection with the second L-shaped connecting plate 17, and one end of the sixth micrometer extending out of the second L-shaped connecting plate 17 abuts against the second moving plate 14, so as to drive the second moving plate 14 to drive the optical fiber fixing support 3 to move along the Y axis relative to the limiting plate 11.
When the optical fiber needs to be moved along the X axis so that the optical fiber is aligned with the light incident surface of the optical chip, only the fifth micrometer 26 needs to be rotated, at the moment, the fifth micrometer 26 drives the first moving plate 13 to move along the X axis, and meanwhile, the optical fiber fixing support 3 is driven to synchronously move along the X axis through force transmissibility until the optical fiber is aligned with the light incident surface of the optical chip, and the fifth micrometer 26 stops rotating; similarly, when the optical fiber needs to be moved along the Y axis, only the sixth micrometer 27 needs to be rotated, at this time, the sixth micrometer 27 drives the second moving plate 14 to move along the Y axis, and meanwhile, the optical fiber fixing bracket 3 is driven to synchronously move along the Y axis through the force transmissibility until the optical fiber moves to the light incident surface of the optical chip, and the rotation of the sixth micrometer 27 is stopped.
According to an embodiment of the present invention, the optical fiber fixing bracket 3 is further provided with a fifth fine adjustment mechanism 18, the fifth fine adjustment mechanism 18 is fixedly connected to the fourth fine adjustment mechanism 10, and the fifth fine adjustment mechanism 18 is used for driving the optical fiber fixing bracket 3 to move along the Z-axis so as to be close to the copper object carrying plate 2;
specifically, the fifth fine adjustment mechanism 18 may be the same as or different from the first fine adjustment mechanism 6, and the fine adjustment mechanism includes:
one side wall surface of the fine adjustment sliding plate 19 is fixedly connected with the optical fiber fixing support 3, and a stop block 20 is arranged on the side wall surface vertical to the side wall surface;
one side wall surface of the fixing plate 21 is fixedly connected with the second moving plate 14 of the fourth fine adjustment mechanism 10, the other side wall surface is slidably connected with the fine adjustment sliding plate 19, and a supporting block 22 is arranged on the side wall surface corresponding to the stop block 20;
the free end of the seventh micrometer 28 is connected with the supporting block 22 by screw threads, and one end of the seventh micrometer extending out of the supporting block 22 is abutted against the stop block 20, so as to drive the fine adjustment sliding plate 19 to drive the optical fiber fixing bracket 3 to move along the Z axis until the free end is aligned with the light incident surface of the optical chip with the optical fiber fixing bracket 3.
According to an embodiment of the present invention, as shown in fig. 1, the optical fiber fixing bracket 3 includes: the vertical section of the L-shaped support frame is fixedly connected with the fifth fine adjustment mechanism 18, specifically, the side wall surface of the second moving plate 14; the horizontal section of the L-shaped supporting frame is arranged above the copper carrying plate 2, and the horizontal section is provided with a containing cavity for containing the adjusting block, the adjusting block is movably arranged in the containing cavity through an adjusting micrometer 24,
the free end of the adjusting micrometer 24 penetrates through one end of the horizontal section to be fixedly connected with the adjusting block, and a clamping cavity for clamping the optical fiber adapter 4 is formed between the adjusting block and the other end of the horizontal section.
When the light adapter of the bigger size of needs centre gripping, only need clockwise rotation adjust micrometer 24 can, this moment, the regulating block will be under the effect of adjusting micrometer 24 to the direction motion of being close to it, until with the increase of centre gripping chamber, after the centre gripping is accomplished, only need anticlockwise rotation to adjust micrometer 24 to make regulating block and light adapter laminate mutually, can its stable centre gripping.
The embodiments in the present description are all described in a progressive manner, and some of the embodiments are mainly described as different from other embodiments, and the same and similar parts among the embodiments can be referred to each other.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying importance; the words "bottom" and "top", "inner" and "outer" refer to directions toward and away from, respectively, a particular component geometry.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the communication may be direct, indirect via an intermediate medium, or internal to both elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The above description is only for the preferred embodiment of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. A test stand, comprising:
a wafer bearing table (1);
the copper object carrying plate (2) is placed on the wafer bearing table (1) and is used for bearing an optical chip;
the optical fiber fixing support (3) is arranged above the copper object carrying plate (2) and used for clamping an optical fiber adapter (4);
the first probe (5) is arranged above the copper object carrying plate (2) through a first fine adjustment mechanism (6), and the first fine adjustment mechanism (6) is used for driving the first probe (5) to move along the Z axis so as to enable the free end of the first probe (5) to be in contact with the P electrode of the optical chip;
wherein, the first probe (5) and the copper object carrying plate (2) are externally connected with leads.
2. The test bench of claim 1, further comprising: a second probe (7) externally connected with a lead, wherein the second probe (7) is arranged above the copper object carrying plate (2) through a second fine adjustment mechanism (29), and the second fine adjustment mechanism (29) is used for driving the second probe (7) to move along the Z axis so as to enable the free end of the second probe (7) to be in contact with the N electrode of the optical chip.
3. The test bench of claim 2, further comprising: the device comprises a bottom plate (8), wherein the wafer bearing table (1), the copper object carrying plate (2), the optical fiber fixing support (3), the first probe (5) and the second probe (7) are arranged on the bottom plate (8).
4. A test bench according to claim 3, characterized in that said first and second fine adjustment mechanisms (6, 29) are structurally identical or different; the first fine adjustment mechanism (6) includes:
the upper wall surface of the fine adjustment sliding plate (19) is fixedly connected with the first probe (5), and a stop block (20) is arranged on the side wall surface of the fine adjustment sliding plate;
one side wall surface of the fixing plate (21) is fixedly connected with the bottom plate (8) through a fixing frame, the other side wall surface of the fixing plate is slidably connected with the fine adjustment sliding plate (19), and a supporting block (22) is arranged on the side wall surface corresponding to the stop block (20);
and the free end of the first micrometer (23) is in threaded connection with the supporting block (22), and one end extending out of the supporting block (22) is abutted to the stop block (20) so as to drive the fine adjustment sliding plate (19) to drive the first probe (5) to move along the Z axis until the first probe is contacted with the P electrode of the optical chip.
5. Test bench according to claim 4, characterized in that a locking assembly is further provided between said fine tuning slide (19) and said fixed plate (21).
6. The test bench according to claim 3, characterized in that a third fine adjustment mechanism (9) is further disposed on the wafer support table (1), and the third fine adjustment mechanism (9) is used for driving the wafer support table (1) to move along the X axis or the Y axis.
7. The test bench according to claim 6, wherein a fourth fine adjustment mechanism (10) is further disposed at an end of the optical fiber fixing support (3) away from the copper object carrying plate (2), and the fourth fine adjustment mechanism (10) is used for driving the optical fiber fixing support (3) to move along the X axis or the Y axis.
8. Test bench according to claim 7, characterized in that said third and fourth fine tuning mechanisms (9, 10) are structurally identical or different; the third fine adjustment mechanism (9) includes:
the limiting plate (11) is fixedly connected with the bottom plate (8), and a first L-shaped connecting plate (12) is arranged on the side wall surface of the limiting plate;
the lower wall surface of the first moving plate (13) is connected with the limiting plate (11) in a sliding mode, and a second L-shaped connecting plate (17) is arranged on the side wall surface of the first moving plate;
the upper wall surface of the second moving plate (14) is fixedly connected with the wafer bearing table (1), and the lower wall surface of the second moving plate is in sliding connection with the upper wall surface of the first moving plate (13);
the free end of the third micrometer (15) is in threaded connection with the first L-shaped connecting plate (12), and one end, extending out of the first L-shaped connecting plate (12), of the third micrometer is abutted against the first moving plate (13) so as to drive the first moving plate (13) to drive the wafer bearing table (1) to move along the X axis relative to the limiting plate (11);
and the free end of the fourth micrometer (16) is in threaded connection with the second L-shaped connecting plate (17), and one end of the fourth micrometer, which extends out of the second L-shaped connecting plate (17), is abutted against the second moving plate (14) so as to drive the second moving plate (14) to drive the wafer bearing table (1) to move along the Y axis relative to the limiting plate (11).
9. The test bench according to claim 7, wherein a fifth fine adjustment mechanism (18) is further disposed on the optical fiber fixing bracket (3), the fifth fine adjustment mechanism (18) is fixedly connected to the fourth fine adjustment mechanism (10), and the fifth fine adjustment mechanism (18) is configured to drive the optical fiber fixing bracket (3) to move along the Z-axis to approach the copper object carrying plate (2).
10. Test bench according to claim 9, characterized in that said fiber holding bracket (3) comprises: l type carriage, regulating block and regulation micrometer (24), the vertical section of L type carriage with fifth fine-tuning (18) fixed connection, the horizontal segment of L type carriage set up in the top of copper year thing board (2), just the horizontal segment is seted up and is used for holding the chamber that holds of regulating block, the free end of adjusting micrometer (24) passes horizontal segment wherein one end with regulating block fixed connection, the regulating block with form between the horizontal segment other end and be used for the centre gripping chamber of optic fibre adapter (4).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202023287697.5U CN214703692U (en) | 2020-12-30 | 2020-12-30 | Test board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115144734A (en) * | 2022-07-29 | 2022-10-04 | 河北圣昊光电科技有限公司 | Swing adjusting device and chip testing machine with same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115144734A (en) * | 2022-07-29 | 2022-10-04 | 河北圣昊光电科技有限公司 | Swing adjusting device and chip testing machine with same |
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