CN214691793U

CN214691793U - Silicon wafer reforming mechanism

Info

Publication number: CN214691793U
Application number: CN202022478036.4U
Authority: CN
Inventors: 陈尧
Original assignee: Suzhou Chonton Machinery Equipment Co ltd
Current assignee: Suzhou Chonton Machinery Equipment Co ltd
Priority date: 2020-10-30
Filing date: 2020-10-30
Publication date: 2021-11-12
Anticipated expiration: 2030-10-30

Abstract

The utility model discloses a silicon chip mechanism of reforming relates to silicon chip processing technology, aims at solving the problem that current silicon chip mechanism of reforming precision is difficult to guarantee, and its technical scheme main points are: the silicon wafer conveying device comprises a rack, wherein a first guide wheel seat and a second guide wheel seat are connected to the rack in a relatively sliding mode, a driving assembly for driving the first guide wheel seat and the second guide wheel seat to move in opposite directions or back to back is arranged in the horizontal direction of the first guide wheel seat and the second guide wheel seat, a first guide wheel is connected to the top of the first guide wheel seat in a rotating mode, a second guide wheel is connected to the top of the second guide wheel seat in a rotating mode, and the horizontal plane where the first guide wheel and the second guide wheel are located is parallel and level with the conveying surface of a silicon wafer. The utility model discloses when the silicon chip was carried to between the guide pulley, the first guide pulley seat of drive assembly drive and second guide pulley seat were close to the silicon chip simultaneously, carried on spacingly and just righting the silicon chip, had improved precision and efficiency that the silicon chip was just right.

Description

Silicon wafer reforming mechanism

Technical Field

The utility model relates to a silicon chip processing technology, more specifically say, it relates to a silicon chip mechanism of reforming.

Background

In crystalline silicon's processing production, the silicon chip passes through the conveyer belt and transports when another station from a station, when the conveyer belt is in operation because the fast asynchronous emergence of area rocks, the skew about taking place very easily in the position of silicon chip on the conveyer belt, lead to the silicon chip to deviate from preset position when getting into next station, the silicon chip collides with silicon chip receiving mechanism easily, thereby cause the damage of silicon chip easily, the silicon chip that adopts at present reforms the method and mostly is artifical manual alignment, the inefficiency, and the improper operation causes the pollution of silicon chip easily, product quality can not be guaranteed.

In view of the above problems, corresponding solutions have been provided, such as the publication: CN208385381U, the chinese utility model discloses a silicon wafer reforming mechanism and a silicon wafer reforming system, which comprises a frame, wherein a first cylinder is fixedly arranged on the frame, the first cylinder is connected with a first push plate horizontally arranged above the first cylinder, and the first cylinder can drive the first push plate to horizontally move; a second cylinder is fixedly arranged on the first push plate, the telescopic end of the second cylinder is connected with a horizontally arranged second push plate, and the second cylinder can drive the second push plate to move horizontally; the tail end of the second push plate is connected with a vertically arranged correcting plate, and the correcting plate comprises a correcting surface and a mounting surface opposite to the correcting surface; the second push plate is connected to the mounting surface, and an upper blocking strip and a lower blocking strip which extend horizontally are arranged at the upper end and the lower end of the front surface of the front cover respectively.

The utility model discloses a although realized that the silicon chip among the silicon chip transportation process is automatic to be reformd, improved the work efficiency that the silicon chip was reformd, nevertheless drive first push pedal and second push pedal respectively through first cylinder and second cylinder and open and shut, first cylinder and second cylinder are difficult to accomplish completely synchronous among the work engineering, and the precision that the silicon chip was reformd is difficult to guarantee.

Therefore, a new solution is needed to solve this problem.

SUMMERY OF THE UTILITY MODEL

Not enough to prior art exists, the utility model aims to provide a silicon chip mechanism of reforming for it is spacing to reform transform the silicon chip in the silicon chip data send process, with the precision that improves the silicon chip and reforms, improves the qualification rate of silicon chip production and processing.

The above technical purpose of the present invention can be achieved by the following technical solutions: the utility model provides a silicon chip mechanism of reforming, includes the frame, relative sliding connection has first guide pulley seat and second guide pulley seat in the frame, is located the horizontal direction of first guide pulley seat and second guide pulley seat is provided with the drive assembly that drives first guide pulley seat and second guide pulley seat in opposite directions or back-to-back motion, the top of first guide pulley seat is rotated and is connected with first guide pulley, the top of second guide pulley seat is rotated and is connected with the second guide pulley, the horizontal plane at first guide pulley and second guide pulley place and the conveying face parallel and level of silicon chip.

The utility model discloses further set up to: drive assembly is including rotating first band pulley and the second band pulley of connection in the frame that is located first guide pulley seat and second guide pulley seat outside, fixedly connected with driving motor in the frame of first band pulley below, driving motor's output shaft and first band pulley fixed connection, first band pulley passes through belt transmission and connects in the second band pulley, first guide pulley seat passes through the joint subassembly with the input of second guide pulley seat respectively with belt fixed connection and be located the both sides of first band pulley and second band pulley place axis respectively.

Through adopting above-mentioned technical scheme, through the setting of band pulley and belt, first leading wheel seat and second leading wheel seat carry out the joint respectively with the belt and fix, and when driving motor drive belt during operation, synchronous motion is realized to first leading wheel seat and second leading wheel seat, and be close to each other or keep away from in order to reach the spacing and the returning of silicon chip, improved the precision that returns and returns in the silicon chip transfer process.

The utility model discloses further set up to: the clamping assembly comprises a clamping seat fixedly connected to the input ends of the first guide wheel seat and the second guide wheel seat and a clamping plate provided with a clamping groove, the belt is clamped in the clamping groove of the clamping plate, and the clamping plate is fixedly connected with the clamping seat.

Through adopting above-mentioned technical scheme, the setting of joint seat and joint board is conveniently fixed the belt with the input of guide holder fast, and through the setting of draw-in groove, the stability of belt and guide holder joint can be improved simultaneously.

The utility model discloses further set up to: the rack bottom surface fixedly connected with slide rail that is located under first band pulley and the second band pulley, the spout has all been seted up to first guide pulley seat and second guide pulley seat, spout and slide rail slip adaptation.

Through adopting above-mentioned technical scheme, through setting up spout and slide rail to carry on spacingly to the angle of leading wheel seat when making first leading wheel seat and second leading wheel seat take place horizontal displacement, avoid the leading wheel seat to take place the rotation of other directions, reinforcing leading wheel seat horizontal slip's stability.

The utility model discloses further set up to: the first guide wheel and the second guide wheel are both provided with a plurality of guide wheels.

By adopting the technical scheme, the guide contact surface of the silicon wafer is increased by arranging the first guide wheels and the second guide wheels, and the silicon wafer correcting precision is improved.

The utility model discloses further set up to: one side of the second guide wheel seat is fixedly connected with a limiting piece, and a limiting sensor is detachably connected to the rack right below the limiting piece.

Through adopting above-mentioned technical scheme, through spacing piece and spacing sensor's setting, can inject the position of first leading wheel seat and second leading wheel seat, avoided because the mechanism that the overstroke becomes to cause damages.

The utility model discloses further set up to: the limiting sensors are arranged in three groups along the same horizontal direction and comprise a left limiting sensor, an original point sensor and a right limiting sensor, and the limiting sheet can sequentially pass through the left limiting sensor, the original point sensor and the right limiting sensor and control the on-off of the driving assembly.

Through adopting above-mentioned technical scheme, when spacing piece was located left limit sensor position, reached the maximum value of stroke between first leading wheel seat and the second leading wheel seat, when spacing piece was located initial point sensor position, first leading wheel seat and second leading wheel seat were in initial point position, when spacing piece was located right limit sensor position, reached the minimum of stroke between first leading wheel seat and the second leading wheel seat.

The utility model discloses further set up to: the bottom surface fixedly connected with base of spacing sensor, base and fixed connection are in the mounting groove sliding connection in the frame, the guiding hole has been seted up to the base, the guiding hole endotheca is equipped with the guide shaft.

Through adopting above-mentioned technical scheme, through the setting of base and guiding axle, spacing sensor detachable installs in the frame, can carry out position adjustment to spacing sensor according to the size of silicon chip, has improved application scope.

To sum up, the utility model discloses following beneficial effect has: through adopting above-mentioned technical scheme, when needs transport the silicon chip to next station from a station, through the setting of first guide wheel seat and second guide wheel seat, rotate the connection guide pulley on first guide wheel seat and the second guide wheel seat, when the silicon chip was carried to between the guide pulley, drive assembly drive first guide wheel seat and second guide wheel seat were close to the silicon chip simultaneously, carry out spacing and the normalizing to the silicon chip, degree of automation is high, has improved the precision and the efficiency that the silicon chip was normalized.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of a driving assembly and a clamping assembly according to the present invention;

FIG. 3 is a schematic structural view of the middle slide block and the sliding chute of the present invention;

fig. 4 is a schematic structural view of the middle limiting plate and the limiting sensor of the present invention.

In the figure: 1. a frame; 2. a first guide wheel seat; 21. a first guide wheel; 3. a second guide wheel seat; 31. a second guide wheel; 41. a first pulley; 42. a second pulley; 43. a belt; 44. a drive motor; 5. a limiting sheet; 6. a limit sensor; 61. a left limit sensor; 62. an origin sensor; 63. a right limit sensor; 64. a guide shaft; 65. mounting grooves; 7. a clamping assembly; 71. a clamping and connecting plate; 72. a clamping seat; 8. A chute; 9. a slide rail; 10. a base.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

As shown in fig. 1, a silicon wafer aligning mechanism includes a frame 1, a first guide wheel seat 2 and a second guide wheel seat 3 are relatively slidably connected to the frame 1, a driving assembly for driving the first guide wheel seat 2 and the second guide wheel seat 3 to move in an opposite or reverse direction is disposed along a horizontal direction of the first guide wheel seat 2 and the second guide wheel seat 3, a plurality of first guide wheels 21 are rotatably connected to a top of the first guide wheel seat 2 through a rotating shaft, a plurality of second guide wheels 31 are rotatably connected to a top of the second guide wheel seat 3 through a rotating shaft, a horizontal plane where the first guide wheels 21 and the second guide wheels 31 are located is flush with a conveying surface of a silicon wafer, when the silicon wafer is conveyed between the guide wheels, the driving assembly drives the first guide wheel seat 2 and the second guide wheel seat 3 to simultaneously approach the silicon wafer, so as to limit and align the silicon wafer, and accuracy and efficiency of aligning the silicon wafer are improved.

As shown in fig. 2, the driving assembly includes a first belt wheel 41 and a second belt wheel 42 rotatably connected to the frame 1 at the outer side of the first guide wheel seat 2 and the second guide wheel seat 3, a driving motor 44 is fixedly connected to the frame 1 below the first belt wheel 41, an output shaft of the driving motor 44 is fixedly connected to the first belt wheel 41 and is respectively located at two sides of an axis where the first belt wheel (41) and the second belt wheel (42) are located, the first belt wheel 41 is connected to the second belt wheel 42 through a belt 43, input ends of the first guide wheel seat 2 and the second guide wheel seat 3 are respectively fixedly connected to the belt 43 through a clamping assembly 7, through the arrangement of the belt wheels and the belt 43, when the driving motor 44 drives the belt 43 to work, the first guide wheel seat 2 and the second guide wheel seat 3 realize synchronous movement, approach to or separate from each other to limit and align the silicon wafer, the clamping assembly 7 includes a clamping seat 72 fixedly connected to input ends of the first guide wheel seat 2 and the second guide wheel seat 3 and a clamping seat provided with a clamping groove Clamping plate 71, belt 43 joint are in clamping groove of clamping plate 71, and clamping plate 71 passes through bolt fixed connection with joint seat 72, simultaneously through the setting of clamping groove, can improve the stability of belt 43 and guide holder joint.

As shown in fig. 2 and 3, frame 1 bottom surface fixedly connected with slide rail 9 under first band pulley 41 and second band pulley 42, first leading wheel seat 2 and second leading wheel seat 3 have all been seted up spout 8 and with slide rail 9 adaptation, through setting up spout 8 and slide rail 9, thereby make first leading wheel seat 2 and second leading wheel seat 3 carry on spacingly to the angle of leading wheel seat when taking place horizontal displacement, avoid the leading wheel seat to take place the rotation of other directions, reinforcing leading wheel seat horizontal slip's stability.

As shown in fig. 4, one side of the second guide wheel seat 3 is fixedly connected with a limiting piece 5, a limiting sensor 6 is arranged on the frame 1 under the limiting piece 5, the bottom surface of the limiting sensor 6 is fixedly connected with a base 10, the base 10 is slidably connected with two mounting grooves 65 fixedly connected on the frame 1, the base 10 is provided with a guide hole, a guide shaft 64 is sleeved in the guide hole, the limiting sensor 6 is detachably mounted on the frame 1 through the mounting grooves 65, the base 10 and the guide shaft 64, the position of the limiting sensor 6 can be adjusted according to the size of a silicon wafer, the application range is improved, the limiting sensors 6 are arranged into three groups along the same horizontal direction, the limiting sensors 6 are a left limiting sensor 61, an origin sensor 62, a right limiting sensor 63, and the limiting piece 5 can sequentially pass through the left limiting sensor 61 from left to right, origin sensor 62, right limit sensor 63 and the break-make of control driving motor 44, when spacing piece 5 is located left limit sensor 61 position, reach the maximum value of stroke between first guide wheel seat 2 and the second guide wheel seat 3, when spacing piece 5 is located origin sensor 62 position, first guide wheel seat 2 and second guide wheel seat 3 are in the origin position, when spacing piece 5 is located right limit sensor 63 position, reach the minimum value of stroke between first guide wheel seat and the second guide wheel seat.

In a specific using process, when a silicon wafer is conveyed from one station to another station through a conveyor belt, a frame 1 is arranged at the output end of the first station, a first guide wheel seat 2 and a second guide wheel seat 3 are connected to the frame 1 in a relatively sliding manner, a plurality of first guide wheels 21 and a plurality of second guide wheels 31 are respectively connected to the tops of the first guide wheel seat 2 and the second guide wheel seat 3 in a rotating manner, the horizontal planes of the first guide wheels 21 and the second guide wheels 31 are flush with the conveying surface of the silicon wafer, a limiting sheet 5 is fixedly connected to one side of the second guide wheel seat 3, a left limit sensor 61, an origin sensor 62 and a right limit sensor 63 are detachably connected to the frame 1 under the limiting sheet 5 in sequence, before the silicon wafer is used, a driving assembly drives the first guide wheel seat 2 and the second guide wheel seat 3 to move, so that the limiting sheet 5 on the second guide wheel seat 3 is subjected to zero return operation through the origin sensor 62, at this time, when the silicon wafer passes between the first guide wheel 21 and the second guide wheel 31, the outer circumference of the silicon wafer contacts with the outer circumference of the first guide wheel 21 and the outer circumference of the second guide wheel 31, so that the silicon wafer is straightened and is conveyed to the next process along the specified direction, and the precision and the efficiency of the silicon wafer straightening are improved.

It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a silicon chip mechanism of reforming which includes frame (1), its characterized in that: the silicon wafer conveying mechanism is characterized in that a first guide wheel seat (2) and a second guide wheel seat (3) are connected to the frame (1) in a sliding mode relatively, a driving assembly for driving the first guide wheel seat (2) and the second guide wheel seat (3) to move in the opposite direction or in the opposite direction is arranged in the horizontal direction of the first guide wheel seat (2) and the second guide wheel seat (3), a first guide wheel (21) is connected to the top of the first guide wheel seat (2) in a rotating mode, a second guide wheel (31) is connected to the top of the second guide wheel seat (3) in a rotating mode, and the horizontal plane where the first guide wheel (21) and the second guide wheel (31) are located is flush with the conveying surface of a silicon wafer.

2. The silicon wafer reforming mechanism according to claim 1, wherein: drive assembly is including rotating first band pulley (41) and second band pulley (42) of connection on being located first leading wheel seat (2) and second leading wheel seat (3) outside frame (1), fixedly connected with driving motor (44) on frame (1) of first band pulley (41) below, the output shaft and first band pulley (41) fixed connection of driving motor (44), first band pulley (41) are connected in second band pulley (42) through belt (43) transmission, first leading wheel seat (2) and the input of second leading wheel seat (3) pass through joint subassembly (7) respectively with belt (43) fixed connection and be located the both sides of first band pulley (41) and second band pulley (42) place axis respectively.

3. The wafer reforming mechanism according to claim 2, wherein: joint subassembly (7) include joint seat (72) and the joint board (71) of seting up the draw-in groove of fixed connection in first leading wheel seat (2) and second leading wheel seat (3) input, belt (43) joint is in the draw-in groove of joint board (71), joint board (71) and joint seat (72) fixed connection.

4. The wafer reforming mechanism according to claim 2, wherein: the sliding rail is fixedly connected with a sliding rail (9) on the bottom surface of the rack (1) right below the first belt wheel (41) and the second belt wheel (42), sliding grooves (8) are formed in the first guide wheel seat (2) and the second guide wheel seat (3), and the sliding grooves (8) are matched with the sliding rail (9) in a sliding mode.

5. The silicon wafer reforming mechanism according to claim 1, wherein: the first guide wheel (21) and the second guide wheel (31) are arranged in a plurality of numbers.

6. The silicon wafer reforming mechanism according to claim 1, wherein: one side fixedly connected with spacing piece (5) of second guide wheel seat (3), be located frame (1) under spacing piece (5) go up detachable and be connected with spacing sensor (6).

7. The wafer reforming mechanism according to claim 6, wherein: spacing sensor (6) set up to three groups along same horizontal direction, spacing sensor (6) include left limit sensor (61), origin sensor (62), right limit sensor (63), spacing piece (5) can pass through left limit sensor (61), origin sensor (62), right limit sensor (63) and control drive assembly's break-make in proper order.

8. The wafer reforming mechanism according to claim 7, wherein: the bottom surface fixedly connected with base (10) of spacing sensor (6), base (10) and fixed connection mounting groove (65) sliding connection on frame (1), the guiding hole has been seted up in base (10), the guiding hole endotheca is equipped with guiding axle (64).