CN214481845U - High-reliability pin lead soldering lug fusion sealing process structure - Google Patents
High-reliability pin lead soldering lug fusion sealing process structure Download PDFInfo
- Publication number
- CN214481845U CN214481845U CN202120539969.1U CN202120539969U CN214481845U CN 214481845 U CN214481845 U CN 214481845U CN 202120539969 U CN202120539969 U CN 202120539969U CN 214481845 U CN214481845 U CN 214481845U
- Authority
- CN
- China
- Prior art keywords
- insulator
- metallization layer
- pin lead
- inner hole
- process structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 24
- 238000007789 sealing Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 15
- 230000008569 process Effects 0.000 title claims abstract description 15
- 230000004927 fusion Effects 0.000 title claims description 12
- 239000012212 insulator Substances 0.000 claims abstract description 81
- 239000000919 ceramic Substances 0.000 claims abstract description 58
- 238000001465 metallisation Methods 0.000 claims abstract description 55
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 239000002002 slurry Substances 0.000 claims description 24
- 238000003466 welding Methods 0.000 claims description 19
- 229910000914 Mn alloy Inorganic materials 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 6
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims description 6
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 claims description 6
- BJBUTJPAZHELKY-UHFFFAOYSA-N manganese tungsten Chemical compound [Mn].[W] BJBUTJPAZHELKY-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 238000007665 sagging Methods 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 5
- 230000004907 flux Effects 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical group [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 description 17
- 238000000576 coating method Methods 0.000 description 17
- 229910000679 solder Inorganic materials 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 229910000975 Carbon steel Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010962 carbon steel Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000004100 electronic packaging Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004021 metal welding Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Landscapes
- Ceramic Products (AREA)
Abstract
The utility model relates to a high reliability pin lead soldering lug melt-sealing process structure, which comprises a ceramic insulator; an insulator inner hole is formed in the ceramic insulator and used for inserting a pin lead; at least one end face of the inner hole of the insulator is provided with a first metallization layer; the upper surface of the first metallization layer is provided with the lower surface of a metal soldering lug, and an inner hole of the soldering lug of the metal soldering lug is used for inserting a pin lead; a corner part is arranged at the joint of one end surface of the ceramic insulator, which is provided with the first metallization layer, and an inner hole of the insulator; the first metallization layer of the ceramic insulator is welded with the metal soldering lug and the pin lead; the utility model relates to a rationally, compact structure and convenient to use.
Description
Technical Field
The utility model relates to a high reliability pin lead bonding pad melt-sealing process structure.
Background
The electronic packaging metal shell is widely applied to various military and civil fields such as aviation, aerospace, ships, radars, missiles, weapons, instruments and meters, communication and the like. Therefore, higher requirements are placed on the high reliability of the electronic package. At present, electronic package housings are mostly sealed by a metal base, a metal pin and an insulator in a melting way, for example, the insulator is a ceramic or glass insulator.
The ceramic insulator, the metal matrix and the metal pin are sealed and fixed by the alloy solder through high-temperature brazing; the glass insulator, the metal base body and the metal pin are fixedly sealed by the auxiliary force of high-temperature infiltration among the materials. The welding receiving materials are limited by mismatching of factors such as different expansion coefficients and the like, so that the metal shell is poor in easy sealing performance after being sealed by melting, namely, the metal shell is easy to be corroded by invasion of gas, liquid and the like, and the metal shell is unqualified in easy sealing performance after being bent by stress; low mechanical strength, poor mechanical impact resistance, thermal shock resistance, high and low temperature cyclic impact resistance, constant acceleration resistance and other performance, and unqualified insulation resistance, medium voltage resistance and other electrical properties. Therefore, the reliability and the service life of the electronic packaging shell are greatly reduced, and the reliable stability of electronic components in the metal shell is seriously threatened.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a high reliability pin lead bonding pad melt-sealing technology structure is provided overall. The utility model discloses mainly used has the ceramic of metal pin to melt on the metal casing who seals, uses the utility model discloses for metal pin and ceramic insulator melt the position bonding strength height, the leakproofness is good, has reduced the metal casing pin and has brazed or the unqualified phenomenon of electric characteristic sealed when bending many times, has improved electronic packaging shell's reliable stability and life.
In order to solve the above problems, the utility model adopts the following technical proposal:
a high-reliability pin lead soldering lug fusion sealing process structure comprises a ceramic insulator; an insulator inner hole is formed in the ceramic insulator and used for inserting a pin lead;
at least one end face of the inner hole of the insulator is provided with a first metallization layer; the upper surface of the first metallization layer is provided with the lower surface of a metal soldering lug, and an inner hole of the soldering lug of the metal soldering lug is used for inserting a pin lead;
a corner part is arranged at the joint of one end surface of the ceramic insulator, which is provided with the first metallization layer, and an inner hole of the insulator;
the first metallization layer of the ceramic insulator is welded with the metal soldering lug and the pin lead.
As a further improvement of the above technical solutions, the following technical features are given as one technical solution with a semicolon or a period, and may be reasonably combined or used alone.
The first metallization layer extends to the inner side wall of the inner hole of the insulator from one end face of the inner hole of the insulator, and the first metallization layer is partially coated, sagging or fully coated on the inner side wall of the inner hole of the insulator.
A second metallization layer which is partially coated, sagging or fully coated is arranged on the other end face of the inner hole of the insulator; a second metallization layer which is partially coated, sagging or fully coated is arranged in the inner side wall of the other port of the inner hole of the insulator;
the second metallization layer is soldered to the pin leads to form a second solder layer.
The outer side wall of the ceramic insulator is sleeved with the inner side wall of the metal substrate;
and a third metallization layer is arranged on the outer side wall of the ceramic insulator to be in contact welding with the inner side wall of the metal base body to form a third welding layer.
The first metallization layer is partially or fully coated on one end face of the inner hole of the insulator.
The metal matrix is iron-nickel alloy, iron-cobalt-nickel alloy, carbon steel, iron, nickel or copper. The metal welding pieces are respectively iron-nickel alloy, iron-cobalt-nickel alloy, carbon steel, iron, nickel or copper.
A nickel plating layer is arranged on the first metallization layer; the slurry of the first metallization layer mainly comprises tungsten-manganese alloy slurry or molybdenum-manganese alloy.
The welding is sealing and brazing, and the welding flux is silver-copper alloy welding flux.
The corner portion has no chamfer; the joint of one end face of the ceramic insulator and the excircle part is not provided with an outer chamfer.
The corner part is a right angle or a round angle; the joint of one end face of the ceramic insulator and the excircle part is a right angle or a fillet.
The utility model has the effects that: use the utility model discloses the sealing reliability after improvement metal casing melt-sealing that can be very big has strengthened the intensity of melt-sealing between pin lead and the ceramic insulator. The utility model discloses a metal casing is respectively through pin lead bending, mechanical shock, thermal shock, high low temperature cycle impact, inspection operations such as constant acceleration after, ceramic insulator can not produce the line and split and cracked, and the leakproofness is still good, and insulating resistance, medium withstand voltage electrical characteristics such as are also good, satisfy and use high reliability, high stability requirement.
The utility model relates to a rationally, low cost, durable, safe and reliable, easy operation, labour saving and time saving, saving fund, compact structure and convenient to use.
Drawings
Fig. 1 is a schematic diagram of the application structure of this embodiment 1.
FIG. 2 is a schematic view of the ceramic use structure of this example 1.
Fig. 3 is a schematic diagram of the application structure of the present embodiment 2.
Fig. 4 is a schematic diagram of the application structure of the present embodiment 3.
Fig. 5 is a schematic diagram of the application structure of this embodiment 4.
Wherein: 1. a metal substrate; 2. a ceramic insulator; 3. a pin lead; 4. a metal lug; 5. a first metallization layer; 6. a second metallization layer; 7. a third metallization layer; 8. inner holes of soldering lugs; 9. an inner hole of the insulator; 10. a corner portion.
Detailed Description
The utility model relates to a high reliability pin lead bonding pad seals technology structure by fusing, including metal base 1, ceramic insulator 2, pin lead wire 3 and metal bonding pad 4. Wherein the content of the first and second substances,
the metal matrix 1 is a single metal material such as iron-nickel alloy, iron-cobalt-nickel alloy, carbon steel, iron, nickel, copper and the like;
the ceramic insulator 2 is provided with an insulator inner hole 9; the inner hole 9 of the insulator is single or multiple. And (3) partially coating a metallization layer on the ceramic surface of the ceramic insulator 2, and plating nickel of 2-5 um. The ceramic insulator 2 is made of aluminum oxide or aluminum nitride or beryllium oxide, wherein the content of AI2O3 in the aluminum oxide ceramic is 60-99.7%. The surface of the metallized layer on the ceramic surface is covered with solder when being sealed by melting, and the solder seals and fixes the metal soldering lug 4, the pin lead 3 and the first metallized layer 5 on the end surface of the ceramic insulator 2 at high temperature to form a first welding layer; the inner circles of the end parts of the two ends of the inner hole 9 of the insulator are not provided with inner chamfers, inner collapse angles and the like, and are in right-angle or fillet smooth transition, and the preferred ranges of the arcs are R0.01mm-R0.04 mm and R0.05 mm-0.5 mm.
The third metalized layer 7 on the outer side wall of the ceramic insulator 2 and the inner side wall of the metal base 1 are brazed by solder to form a third solder layer.
The metal soldering lug 4 is provided with a soldering lug inner hole 8, the pin lead 3 penetrates through the insulator inner hole 9 and the soldering lug inner hole 8, and is welded on one end part or two end parts of the ceramic in a high-temperature brazing mode by using welding materials;
when the other end of the metal soldering lug 4 does not exist, the solder seals and fixes the pin lead 3 and the second metallization layer 6 at the end part of the ceramic insulator 2 at high temperature to form a second welding layer, so that the fixation is realized;
the metal welding sheet 4 is made of single metal materials such as iron-nickel alloy, iron-cobalt-nickel alloy, carbon steel, iron or nickel, copper and the like, and the thickness is 0.05 mm-1.0 mm;
the solder is silver-copper alloy solder or other high-temperature and low-temperature solders.
Example 1, as shown in fig. 1-2, a ceramic insulator 2 is a porous structure. The metallization layer is an alloy layer coated on the surface of the ceramic insulator 2 after a metal slurry is coated on the surface of the ceramic insulator 2 and is sintered at high temperature, the surface of the metallization layer is coated with nickel, the thickness of the metallization layer is 2-5 mu m, and the main component of the slurry is tungsten-manganese alloy slurry or molybdenum-manganese alloy slurry. According to the requirement of melt sealing, a first metallization layer 5 is formed by coating one end part and an inner hole (coating part) of the ceramic insulator 2, and a third metallization layer 7 is formed by coating a melt sealing part (coating part) of an outer circle. The metal lug 4 is soldered to the first metallization layer 5 with a solder of suitable shape and weight. The other parts are sealed by welding materials with different shapes and weights according to requirements, so that the reliable stability of the metal shell is ensured.
In example 2, as shown in fig. 3, compared with example 1, the two ends of the ceramic insulator 2 are coated, in the figure, the metallization layer is formed by coating a metal slurry on the surface of the ceramic insulator 2, and then coating an alloy layer on the surface of the ceramic after high-temperature sintering, the surface of the metallization layer is coated with nickel plating, the thickness is 2-5 um, and the slurry mainly comprises tungsten-manganese alloy slurry or molybdenum-manganese alloy slurry. According to the sealing requirement, a first metallization layer 5 is formed by coating on one end portion (full coating) and an inner hole (partial coating) of the ceramic insulator 2, a third metallization layer 7 is formed by coating on the sealing part of the outer circle, a second metallization layer 6 is formed by coating on the other end face of the ceramic insulator 2 and the inner hole according to the requirement, and partial slurry of the second metallization layer 6 is made to flow on the inner hole wall of the inner hole 9 of the insulator. A metal lug 4 is brazed to one end of the ceramic full-coated metallization with a suitably shaped and suitably weighted amount of solder. The other parts are sealed by welding materials with different shapes and weights according to requirements, so that the reliable stability of the metal shell is ensured.
Example 3, fig. 4, in contrast to example 2, shows the insulator bore 9 without partial coating of the upper bore and only a small amount of slurry is allowed to flow on the inner side wall at both ends of the insulator bore 9. In the figure, the metallization layer is an alloy layer coated on the surface of the ceramic insulator 2 after a metal slurry is coated on the surface of the ceramic insulator 2 and is sintered at a high temperature, the surface of the metallization layer is coated with nickel, the thickness of the metallization layer is 2-5 microns, and the main component of the slurry is tungsten-manganese alloy slurry or molybdenum-manganese alloy slurry. According to the sealing requirement, the metalized slurry is coated on one end part (full coating) of the ceramic to form a first metalized layer 5, the sealing part of the excircle is coated to form a third metalized layer 7, at least the other end surface of the ceramic insulator 2 and the part around the inner hole according to the requirement are coated to form a second metalized layer 6, and a small amount of slurry flows at the two end parts of the ceramic insulator 2 and is hung on the edge of the inner hole wall of the inner hole 9 of the insulator. A metal lug 4 is formed by brazing an end of the ceramic full-coat metallization to an appropriately shaped and weight amount of solder. The other parts are sealed by welding materials with different shapes and weights according to requirements, so that the reliable stability of the metal shell is ensured.
In example 4, as shown in fig. 5, the inner hole 9 of the insulator in this embodiment is an inner hole full-coating, the metallization layer is an alloy layer coated on the surface of the ceramic after a metal slurry is coated on the surface of the ceramic, and is sintered at a high temperature, the surface of the metallization layer is coated with a nickel plating layer, the thickness of the nickel plating layer is 2 to 5 μm, and the slurry mainly contains a tungsten-manganese alloy slurry or a molybdenum-manganese alloy slurry. According to the sealing requirement, the metalized slurry is coated on one end part of the ceramic (coating part around the inner hole) and the inner hole (full coating) forms a first metalized layer 5, and the sealing part of the outer circle forms a third metalized layer 7. The metallic lug 4 is soldered to the end of the ceramic insulator 2 having metallization by means of a solder of suitable shape and weight. The other parts are sealed by welding materials with different shapes and weights according to requirements, so that the reliable stability of the metal shell is ensured.
The present invention has been fully described for a clear disclosure, and is not further described in detail in the prior art. Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; it is obvious to those skilled in the art that a plurality of embodiments of the present invention may be combined. Such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present invention.
Claims (10)
1. A high reliability pin lead soldering lug melt-sealing process structure which characterized in that: comprises a ceramic insulator (2); an insulator inner hole (9) is formed in the ceramic insulator (2), and the insulator inner hole (9) is used for inserting the pin lead (3);
at least one end face of the inner hole (9) of the insulator is provided with a first metallization layer (5); the lower surface of the metal soldering lug (4) is arranged on the upper surface of the first metallization layer (5), and a soldering lug inner hole (8) of the metal soldering lug (4) is used for inserting the pin lead (3);
a corner part (10) is arranged at the joint of one end surface of the ceramic insulator (2) with the first metallization layer (5) and the insulator inner hole (9);
the first metallization layer (5) of the ceramic insulator (2) is welded with the metal soldering lug (4) and the pin lead (3).
2. The high reliability pin lead bonding pad fusion bonding process structure of claim 1, wherein:
the first metallization layer (5) extends to the inner side wall of the insulator inner hole (9) from one end face of the insulator inner hole (9), and the first metallization layer (5) is partially coated, sagging or fully coated on the inner side wall of the insulator inner hole (9).
3. The high reliability pin lead bonding pad fusion bonding process structure of claim 1, wherein: a second metallization layer (6) which is partially coated, sagging or fully coated is arranged on the other end face of the inner hole (9) of the insulator; a second metallization layer (6) which is partially coated, sagging or fully coated is arranged in the inner side wall of the other port of the inner hole (9) of the insulator;
the second metallization layer (6) is welded with the pin lead (3) to form a second welding layer.
4. The high reliability pin lead bonding pad fusion bonding process structure of claim 1, wherein: the outer side wall of the ceramic insulator (2) is sleeved with the inner side wall of the metal substrate (1);
and a third metallization layer (7) is arranged on the outer side wall of the ceramic insulator (2) and is in contact welding with the inner side wall of the metal base body (1) to form a third welding layer.
5. The high reliability pin lead bonding pad fusion bonding process structure of claim 1, wherein: the first metallization layer (5) is partially or fully coated on one end face of the insulator inner hole (9).
6. The high reliability pin lead bonding pad fusion bonding process structure of claim 1, wherein: the metal soldering lug (4) is iron-nickel alloy or iron-cobalt-nickel alloy;
the metal matrix (1) is iron-nickel alloy or iron-cobalt-nickel alloy.
7. The high reliability pin lead bonding pad fusion bonding process structure of claim 1, wherein: a nickel plating layer is arranged on the first metallization layer (5); the slurry of the first metallization layer (5) comprises a tungsten manganese alloy or a molybdenum manganese alloy.
8. The high reliability pin lead bonding pad fusion bonding process structure of claim 1, wherein: the welding is sealing and brazing, and the welding flux is silver-copper alloy welding flux.
9. The high reliability pin lead bonding pad fusion bonding process structure of claim 1, wherein: the corner part (10) has no chamfer; the joint of one end face of the ceramic insulator (2) and the excircle part is not provided with an external chamfer.
10. The high reliability pin lead bonding pad fusion bonding process structure of claim 1, wherein: the corner part (10) is a right angle or a round angle; the joint of one end face of the ceramic insulator (2) and the excircle part is a right angle or a fillet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120539969.1U CN214481845U (en) | 2021-03-16 | 2021-03-16 | High-reliability pin lead soldering lug fusion sealing process structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120539969.1U CN214481845U (en) | 2021-03-16 | 2021-03-16 | High-reliability pin lead soldering lug fusion sealing process structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214481845U true CN214481845U (en) | 2021-10-22 |
Family
ID=78155978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120539969.1U Active CN214481845U (en) | 2021-03-16 | 2021-03-16 | High-reliability pin lead soldering lug fusion sealing process structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214481845U (en) |
-
2021
- 2021-03-16 CN CN202120539969.1U patent/CN214481845U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5368220A (en) | Sealed conductive active alloy feedthroughs | |
| CN104779464A (en) | Metal brazing sealing type airtight electric connector and manufacturing process thereof | |
| CN106505360A (en) | Transitional type lightweight shell hermetically-sealed electrical connector | |
| JP2015537381A (en) | Resistor and manufacturing method thereof | |
| CN110797308A (en) | Ceramic leadless chip type packaging shell with leads and power device | |
| CN112072375A (en) | Micro-rectangular multi-core connector with air seal and manufacturing method thereof | |
| CN109465564A (en) | The zinc-aluminium medicine core solder that a kind of soldering strength is high, corrosion resistance is strong | |
| CN214481845U (en) | High-reliability pin lead soldering lug fusion sealing process structure | |
| US4446502A (en) | Metallurgical contacts in hermetically sealed glass encapsulated ceramic capacitors | |
| US3507979A (en) | High strength ceramic standoff | |
| CN101190480A (en) | Lead free tin soldering solder composition | |
| TWI488393B (en) | Surge absorber and manufacturing method thereof | |
| JP2005039168A (en) | Ceramic package and tantalum electrolytic capacitor using the same | |
| CN203732184U (en) | Pressure sensitive component tube shell | |
| CN212695359U (en) | Welding structure | |
| CN111785570A (en) | Sealed electromagnetic relay casing with high current and low lead resistance | |
| CN210403699U (en) | Reduce encapsulation shell of lead wire root crackle | |
| CN113097822B (en) | Connecting device and connecting equipment comprising same | |
| CN112951454B (en) | Connection assembly and reactor containment vessel comprising the same | |
| CN108461451B (en) | Sealing structure and preparation method thereof | |
| CN106007409A (en) | Method for low-temperature melting sealing of device to be packaged and glass insulating terminal and application of method | |
| CN218159833U (en) | Lead wire ceramic insulator seal structure | |
| CN218159834U (en) | Low stress lead wire ceramic insulator seal structure | |
| CN214957809U (en) | Ceramic electrode plug | |
| CN218730964U (en) | Metal ceramic insulator sealing shell |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211201 Address after: 266000 No. 4, Liuyang Road, Licang District, Qingdao, Shandong Patentee after: Qingdao Huasheng Huifeng Electronics Co.,Ltd. Address before: 266000 7-2-1003, Yuexiu phase I, No. 79, Jinzhong Road, Licang District, Qingdao, Shandong Patentee before: Huang Baomin |
|
| TR01 | Transfer of patent right |