CN210403699U - Reduce encapsulation shell of lead wire root crackle - Google Patents
Reduce encapsulation shell of lead wire root crackle Download PDFInfo
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- CN210403699U CN210403699U CN201921689935.XU CN201921689935U CN210403699U CN 210403699 U CN210403699 U CN 210403699U CN 201921689935 U CN201921689935 U CN 201921689935U CN 210403699 U CN210403699 U CN 210403699U
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- lead wire
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Abstract
The utility model provides a reduce encapsulation shell of lead wire root crackle, the encapsulation shell include with the insulating encapsulation that the lead wire is connected and with the metal package that insulating encapsulation is connected, offer on the metal package and be used for sealing-in the sealing-in hole of lead wire, the lead wire root is provided with an arch. The utility model discloses a root at the lead wire sets up a arch to use ceramic pearl as insulating encapsulation, under the condition that satisfies the gas tightness, effectively increased the cohesion between lead wire and the insulating encapsulation, greatly reduced the crackle of lead wire root.
Description
Technical Field
The patent of the utility model relates to an electronic product and mixed electronic product gas tightness encapsulation field, concretely relates to reduce encapsulation shell of lead wire root crackle.
Background
With the rapid development of integrated circuit technology in recent years, metals and ceramics have excellent properties such as high strength, wear resistance, corrosion resistance, low expansion coefficient and the like, so that the metals and ceramics are more and more widely applied to high-reliability and high-power electronic devices.
In the prior art, metal and glass are generally used as packages, but the metal and glass packages have the problems that the root of a lead is easy to crack and the air tightness is invalid due to the fact that the lead is easily subjected to external pressure in the chip assembling process, and meanwhile, the metallization in a ceramic insulator hole with the inner hole diameter of 0.50 +/-0.02 mm has the defects of high cost, high process difficulty, incapability of large-scale production and the like.
SUMMERY OF THE UTILITY MODEL
The problems that in the prior art, metal and glass are used for sealing, the lead is easy to crack at the root of the lead and the air tightness is invalid due to the fact that the lead is subjected to external pressure in the chip assembling process when the metal and glass are used for sealing, and meanwhile due to the fact that the metallization in the ceramic insulator hole with the inner hole diameter of 0.50 +/-0.02 mm is high in cost, large in process difficulty and incapable of being produced in large scale are solved. The utility model discloses a root at the lead wire sets up a arch to use ceramic pearl as insulating encapsulation, under the condition that satisfies the gas tightness, effectively increased the cohesion between lead wire and the insulating encapsulation, greatly reduced the crackle of lead wire root.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a packaging shell capable of reducing cracks at the root of a lead comprises an insulating package connected with the lead and a metal package connected with the insulating package, wherein a sealing hole used for sealing the lead is formed in the metal package, and a protrusion is arranged at the root of the lead.
Further, the insulating package adopts ceramic beads.
Preferably, the axial length of the bump is 0.20 ± 0.02mm smaller than the thickness of the package housing, and the diameter of the lead at the bump is increased by 0.5 ± 0.02 mm.
Preferably, the lead is made of kovar alloy or kovar copper core composite material.
According to the above technical scheme, the utility model discloses fine solution under the prior art, use metal and glass as sealing-in, metal and glass package lead wire receive outside power easily in the chip assembly process and lead wire root crackle and the gas tightness scheduling problem that became invalid, simultaneously because the downthehole metallization of the ceramic insulator that the hole diameter is 0.50 +/-0.02 mm exists with high costs, the technology degree of difficulty is big, unable mass production scheduling problem, the utility model discloses a root at the lead wire sets up an arch to use ceramic pearl as insulating encapsulation, under the condition that satisfies the gas tightness, effectively increased the cohesion between lead wire and the insulating encapsulation, greatly reduced the crackle of lead wire root.
Drawings
Fig. 1 is a cross-sectional view of the overall structure of the present invention;
fig. 2 is a top view of the overall structure of the present invention;
fig. 3 is a schematic view of the package structure of the present invention;
in the figure, 1, a package shell; 2. a lead wire; 3. packaging with ceramics; 4. metal packaging; 5. sealing the hole; 6. and (4) protruding.
Detailed Description
A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, a package casing 1 for reducing cracks at the root of a lead includes an insulating package 3 connected to the lead 2 and a metal package 4 connected to the insulating package, wherein a sealing hole 5 for sealing the lead is formed in the metal package, a protrusion 6 is disposed at the root of the lead, and the root of the lead is a portion of the lead contacting the insulating package.
Under the prior art, the diameter of a lead exposed on the surface of a shell is usually 0.50 +/-0.02 mm, the chip assembly requirement can only be met, the metallization in a ceramic insulator hole with the inner hole diameter of 0.50 +/-0.02 mm has the defects of high cost, high process difficulty, incapability of large-scale production and the like, the axial length of a bulge 6 in the preferred embodiment is 0.20 +/-0.02 mm smaller than the sealing thickness of a packaging shell 2, the diameter of the lead at the bulge is increased by 0.5 +/-0.02 mm, so that the lead can be matched with the existing ceramic insulator with the inner hole diameter of 1.05 +/-0.03, the direct bonding force between the lead and an insulating package 3 can be increased, the number of cracks at the root of the lead can be reduced in specific use, the utility model meets the requirements that the root of the lead is free from cracks after the lead is bent at 45 degrees in the middle of the lead and then is folded back to be tested and the airtightness is met, and the requirements of chip pasting on, can be stably produced in batches.
As shown in fig. 3, in the preferred embodiment, the bumps 6 are sealed with the insulating package 3 and the insulating package 4 by silver-based solder, which is a solder made of silver or silver-based solid solution, and has excellent processing performance, good wettability, gap filling capability, low melting point, high strength, good plasticity, and excellent conductivity and corrosion resistance, and can be used for soldering all ferrous and nonferrous metals, and can be widely applied to the industrial manufacturing fields of refrigeration, lighting, hardware and electrical appliances, instruments and meters, chemical industry, aerospace, and the like.
The lead wire of the preferred embodiment is made of kovar alloy or kovar copper core composite materials, the insulating package 3 is made of ceramic beads, the kovar alloy has a linear expansion coefficient close to that of hard glass within the range of 20-450 ℃, effective sealing matching can be achieved, the lead wire further has a high Curie point and good low-temperature structure stability, an oxide film of the alloy is compact, welding and fusing are easy, good plasticity is achieved, cutting processing can be achieved, the lead wire is widely used for manufacturing electric vacuum elements, transmitting tubes, picture tubes, switch tubes, transistors, sealing plugs, relay shells and the like, and meanwhile, the kovar alloy contains cobalt components, and the manufactured product is wear-resistant.
The package housing 1 of the preferred embodiment is fixed by a ring frame, and the ring frame is made of a material with good steel plasticity and toughness, such as oxygen-free copper, 10# steel, stainless steel or tungsten copper.
The above-mentioned embodiments are only to describe the preferred embodiments of the present invention, but not to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art without departing from the design spirit of the present invention should fall into the protection scope defined by the claims of the present invention.
Claims (4)
1. A packaging shell (1) capable of reducing cracks at the root of a lead wire comprises an insulating package (3) connected with the lead wire (2) and a metal package (4) connected with the insulating package, wherein a sealing hole (5) used for sealing the lead wire is formed in the metal package, and the packaging shell is characterized in that a protrusion (6) is arranged at the root of the lead wire.
2. The package housing for reducing root cracks of lead wires as claimed in claim 1, wherein said insulating package (3) is made of ceramic beads.
3. The package housing for reducing the root crack of the lead wire as recited in claim 1, characterized in that the axial length of the bump (6) is 0.20 ± 0.02mm smaller than the thickness of the package housing (1), and the diameter of the lead wire (2) at the bump is increased by 0.5 ± 0.02 mm.
4. The package shell for reducing the crack at the root of the lead wire as claimed in claim 1, wherein the lead wire (2) is made of kovar alloy or kovar copper core composite material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921689935.XU CN210403699U (en) | 2019-10-11 | 2019-10-11 | Reduce encapsulation shell of lead wire root crackle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921689935.XU CN210403699U (en) | 2019-10-11 | 2019-10-11 | Reduce encapsulation shell of lead wire root crackle |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210403699U true CN210403699U (en) | 2020-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921689935.XU Active CN210403699U (en) | 2019-10-11 | 2019-10-11 | Reduce encapsulation shell of lead wire root crackle |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113745170A (en) * | 2021-08-30 | 2021-12-03 | 西安微电子技术研究所 | Metal casing lead structure capable of reducing glass cracks |
-
2019
- 2019-10-11 CN CN201921689935.XU patent/CN210403699U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113745170A (en) * | 2021-08-30 | 2021-12-03 | 西安微电子技术研究所 | Metal casing lead structure capable of reducing glass cracks |
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