CN214473538U - Probe apparatus - Google Patents

Abstract

The utility model provides a probe device, which comprises a signal transmission element, a probe, a first transmission part, a second transmission part, a first through hole and a first groove, wherein one end of the probe is electrically connected and arranged below the second transmission part; the lower fixing element compensates the mechanical strength of the signal transmission element, so that the width of the signal transmission element can be reduced, and the effect of densely arranging the probe devices is achieved.

Description

Probe apparatus

Technical Field

The present invention relates to a probe apparatus, and more particularly to a probe apparatus having a signal transmission device and upper and lower fixing members.

Background

The inspection items of the integrated circuit are full of traces, such as electrical characteristics including short circuit, open circuit, signal distortion, voltage level, impedance and the like, and element functions, and because the integrated circuit has a large number of contacts, the inspection cannot be performed one by one, so that a probe card is disclosed; in addition, the array substrate of the display panel is also covered with a large number of transistors, wires and pads, and a probe card is also required to be used for detecting finished products and semi-finished products.

The design of the probe card is that a probe is arranged according to the relative position of each node to be checked, and a contraposition symbol is arranged corresponding to an identification symbol on a circuit to be checked; when the probe card is used, the alignment mark on the probe card is aligned to the identification mark on the tested circuit to complete alignment, then the probes apply various test signals to various electronic elements and wires in the integrated circuit through the nodes, and the response signals are received and then the computer program is used for calculating to generate the detection result.

The probe card has a main length part extending towards the pad of the circuit to be tested in a horizontal direction, and the tail end of the probe card is bent at an angle or directly contacted with the pad of the circuit to be tested in a horizontal posture.

When the cantilever type probe is applied to the detection of the high-frequency electronic element with the high-density connecting pads, in order to make the cantilever type probe not easy to deform and influence the detection result, the cantilever type probe must keep a certain thickness or diameter to maintain proper rigidity and elasticity of the probe, so that the cantilever type probe cannot be arranged densely and cannot be corresponding to the detection of the high-frequency electronic element with the high-density connecting pads, although the high-density arrangement of a large number of probes is achieved by developing a three-dimensional alternative arrangement mode of the probes with different lengths, the problem that the connecting pads of the element to be detected are punctured due to uneven stress of the probes is caused.

With the benefit of the progress of the photolithography technique, other manufacturers develop micro electro mechanical probe cards to produce probes in large batches, which utilize the electroplating step and the photolithography technique to achieve the manufacture of high-precision micro probes, and combine with the piezoelectric material, so that each probe has the design of pressure forced feedback, thereby ensuring consistent probe contact force, minimizing unnecessary influence factors, and improving the reliability of the test result. However, as the density of the pads of the high frequency electronic device is more and more dense, and the flatness of the surface of the circuit to be tested is not uniform, the height difference of the contacts is caused, and the probes must be able to correspond to each contact with different heights and still maintain good electrical contact, so the design of each probe must have elasticity to avoid the chip damage or the probe damage caused by too large contact force difference of the probe and the misalignment of the detection result. However, the height difference-compliant probes must be manufactured by electroplating and photolithography, which is difficult to manufacture and thus expensive to manufacture, and a special mask, which is expensive, must be customized, which is always costly.

In view of the above-mentioned problems of the prior art, there is a need in the market for a high-density probe arrangement that is easy to maintain, less prone to damage the circuit pads to be tested, and has low manufacturing cost and low operation cost. In view of this, the utility model provides a probe device has multistage elastic buffer and perpendicular butt characteristic concurrently, can satisfy the maintenance easily, do not harm the circuit under test, high density range and low-cost demand.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a probe device, it is divided into with probe device: a signal deriving device, a signal transmitting device, a lower fixing device and a probe; the signal transmission element is arranged above the lower fixing element to reinforce the mechanical strength of the signal transmission element with reduced width and thickness, so that the probe can be applied to finer probes to achieve the purposes of easy maintenance, no damage to the tested circuit, high-density arrangement and low cost.

Another object of the present invention is to provide a probe apparatus, which utilizes a signal transmission device including a first transmission portion and a second transmission portion with different widths to make the elasticity of the first transmission portion better than that of the second transmission portion, and a probe is disposed under the first transmission portion with elasticity to avoid the probe from damaging the circuit to be tested.

To achieve the above objects and advantages, one embodiment of the present invention provides a probe apparatus, comprising: a signal transmission element arranged below the upper fixing element and comprising a first transmission part and a second transmission part, wherein a first width of the first transmission part is greater than a second width of the second transmission part; one end of the probe is electrically connected and arranged below the second transmission part; the lower fixing element is arranged below the signal transmission element, one end of the lower fixing element is provided with a first through hole, one lower part of one end of the lower fixing element is provided with a first groove, the probe penetrates through the first through hole of the lower fixing element, and the probe is positioned in the first groove.

In an embodiment of the present invention, a first groove is formed below one end of the lower fixing element, and the probe is located in the first groove.

In an embodiment of the present invention, the apparatus further includes a signal deriving element electrically connected to and disposed above the first transmission portion.

In an embodiment of the present invention, the device further includes an upper fixing element disposed above the signal transmission element.

An embodiment of the present invention further includes a substrate and a position-limiting element, the substrate is disposed below the lower fixing element and has an opening, the position-limiting element is disposed in the opening of the substrate corresponding to the first groove, and the probe is disposed through the position-limiting element.

In an embodiment of the present invention, the second through hole further has a first aperture portion and a second aperture portion, and a first aperture of the first aperture portion is smaller than a second aperture of the second aperture portion.

In an embodiment of the present invention, the signal deriving element has a first diameter portion and a second diameter portion, a first diameter of the first diameter portion corresponds to the first aperture of the first aperture portion, and a second diameter of the second diameter portion corresponds to the second aperture of the second aperture portion.

In an embodiment of the present invention, the first through hole further has a third aperture portion and a fourth aperture portion, and a third aperture of the third aperture portion is larger than a fourth aperture of the fourth aperture portion.

In an embodiment of the present invention, the probe has a third diameter portion and a fourth diameter portion, a third diameter of the third diameter portion corresponds to the third aperture of the third aperture portion, and a fourth diameter of the fourth diameter portion corresponds to the fourth aperture of the fourth aperture portion.

Drawings

FIG. 1: which is an exploded view of an embodiment of the present invention;

FIG. 2: which is a front view schematic diagram of an embodiment of the present invention;

FIG. 3: it is another front view schematic diagram of an embodiment of the present invention;

FIG. 4: it is another front view schematic diagram of an embodiment of the present invention; and

FIG. 5: it is another schematic front view of an embodiment of the present invention.

[ brief description of the drawings ]

A probe device

10.. a signal deriving device

A lead-out part

A first diameter portion

A second diameter portion

Bottom part

A fixation element

A second groove

A second through hole

A first aperture portion

A second aperture portion

30.. signal transmission element

A first transmission part

A second transmission part

Lower fixation element

A first groove

A first through-hole

A third aperture portion

444

A probe

52.. output part

A third diameter portion

56.. fourth diameter portion

58.. detection part

A substrate

Opening 62

A stop member

A third through hole

80.

82.. pad

A first diameter

D2.. second diameter

Third diameter

D4.. fourth diameter

First aperture

Second aperture

E3.. third aperture

E4.. fourth aperture

First width of

Second width

Detailed Description

In order to further understand and appreciate the structural features and functions of the present invention, preferred embodiments and associated detailed descriptions are provided below:

hereinafter, the present invention will be described in detail by illustrating various embodiments of the present invention with reference to the drawings. The inventive concept may, however, be embodied in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein.

Although certain terms are used herein to refer to particular elements, those skilled in the art will understand that various terms are used herein to describe various elements, components, groups, layers and sections. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to.

In view of the disadvantages of the conventional probe card, such as difficulty in maintenance, high cost and difficulty in densification, the present invention provides a probe apparatus, which is divided into: the signal guiding element, the upper fixing element, the signal transmission element, the lower fixing element and the probe are clamped by the upper fixing element and the lower fixing element to reinforce the mechanical strength of the signal transmission element with reduced width and thickness, so that the probe card is applicable to finer probes, and the defects of difficult maintenance, easy damage to the contact of a tested circuit, high cost, difficult densification and the like of the conventional probe card are overcome.

The present invention will be further explained below with reference to the following description of the features and arrangements of the probe apparatus: first, please refer to fig. 1, which is an exploded view of an embodiment of the present invention. As shown in the drawings, the probe apparatus 1 of the present embodiment includes a signal transmission element 30, such as an elastic steel sheet, including a first transmission portion 32 having a first width W1, and a second transmission portion 34 having a second width W2 opposite to the first transmission portion 32, so that the elasticity and flexibility of the first transmission portion 32 are better than those of the second transmission portion 34; a lower fixing element 40, such as a heat-resistant ceramic material, insulating engineering plastic material strip, in the embodiment, one end of the lower fixing element 40 has a first through hole 44 and a lower portion of the one end has a first groove 42; the probe 50 is a spring probe with a spring attached to a hollow portion, for example, a double-ended solid copper needle, and has an output portion 52, a third diameter portion 54, a fourth diameter portion 56, and a detection portion 58.

In the present embodiment, the signal leading-out device 10 further includes a signal leading-out element 10 and an upper fixing element 20, wherein the signal leading-out element 10 is, for example, a copper thimble, which has a leading-out portion 12 for welding a signal line, a first diameter portion 14, a second diameter portion 16 and a bottom portion 18; the upper fixing element 20 is, for example, a heat-resistant ceramic material, insulating engineering plastic material strip, and in the present embodiment, the upper fixing element 20 has a second groove 22 at a lower portion of one end and a second through hole 24 at the other end.

In the present embodiment, the package further includes a substrate 60 and a limiting member 70, wherein the substrate 60 is, for example, a teflon sheet or a ceramic sheet, and has an opening 62; the limiting member 70 is, for example, an impact-resistant bump or a ceramic block made of ABS engineering plastic, and the limiting member 70 has a third through hole 72.

Referring to fig. 2 and 3, fig. 2 is a schematic front view of an embodiment of the present invention, and fig. 3 is a schematic front view of another embodiment of the present invention. As shown, in the present embodiment, the first through hole 24 of the upper fixing element 20 has a first aperture portion 242 having a first aperture E1, and a second aperture portion 244 having a second aperture E2; the second through hole 44 of the lower fixing member 40 has a third bore 442 having a third bore E3 and a fourth bore 444 having a fourth bore E4.

The connection relationship and the resulting effect of the elements are described below; the lower fixing element 40 is disposed below the signal transmitting element 30, the first through hole 44 at one end of the lower fixing element 40 is used for the probe 50 to pass through, and provides additional supporting force to reinforce the mechanical strength of the first transmitting portion 32 and the second transmitting portion 34, and the first width W1 of the first transmitting portion 32 is greater than the second width W2 of the second transmitting portion 34, so as to fix, for example, screw, and adhere, at least one point of the second transmitting portion 34 with a wider width to the lower fixing element 40, thereby avoiding the problem of the signal transmitting element 30 slipping and loosening.

In the present embodiment, the other end of the lower fixing element 40 can provide a support when the signal guiding element 10 is inserted and disposed above the first transmitting portion 32, and the signal transmitting element 30 can be clamped by the upper fixing element 20 and the lower fixing element 40, so as to provide a more stable structure.

The signal leading-out element 10 is inserted into the second through hole 24 of the first end of the upper fixing element 20, and is inserted into an upper part of the first transmission part 32 and electrically connected with the first transmission part 32; the first diameter portion 14 of the signal deriving element 10 has a first diameter D1 corresponding to the first aperture portion 242 of the second through hole 24, and the second diameter portion 16 of the signal deriving element 10 has a second diameter D2 corresponding to the second aperture portion 244 of the second through hole 24; the signal transmission element 30 is disposed below the upper fixing element 20 and the signal deriving element 10, and the second transmission portion 34 thereof is exposed to the second groove 22 of the upper fixing element 20.

Continuing with the above, because the first diameter D1 is approximately the first aperture E1 and the second diameter D2 is approximately the second aperture E2. Therefore, the guiding element 10 is loosely fitted with the first diameter portion 14 and the second diameter portion 16 and the first aperture portion 242 and the second aperture portion 244 of the second through hole 24 respectively; moreover, since the first diameter D1 is smaller than the second diameter D2, and the first aperture E1 is smaller than the second aperture E2, the second diameter portion 16 of the signal deriving element 10 abuts against the first aperture portion 242 of the second through hole 24, and the bottom 18 of the signal deriving element 10 is forced to be inserted and disposed above the first transmission portion 32, so that the signal deriving element is firmly inserted and well electrically connected to the first transmission portion 32.

Similarly, third diameter portion 54 has a first diameter D3, fourth diameter portion 56 has a fourth diameter D4, third diameter D3 is similar to third diameter E3 and fourth diameter D4 is similar to fourth diameter E4. Therefore, the probe 50 is loosely fitted with the third and fourth hole parts 442 and 444 of the first through hole 44 through the third and fourth diameter parts 54 and 56, respectively; moreover, since the third diameter D3 is larger than the fourth diameter D4, and the third aperture E3 is larger than the fourth aperture E4, the third diameter portion 54 of the probe 50 abuts against the fourth aperture 444 of the first through hole 44, and at the same time, the output portion 52 of the probe 50 is forced to abut against a lower portion of the second transmission portion 34, and is retained in the first through hole 44 and is electrically connected to the first transmission portion 32 of the signal transmission device 30.

Finally, the substrate 60 is located below the probes 50 and the lower fixing member 40, and has an opening 62 identical to the limiting member 70; the limiting member 70 is fixed on the substrate 60 by the insertion opening 62, and has a third through hole 72 for the probe 50 to pass through.

Please refer to fig. 4, which is a schematic front view of an embodiment of the present invention. As shown in the drawings, in the embodiment, when the probe apparatus 1 moves toward the pad 82 of the circuit board 80 to be tested, the detecting portion 58 of the probe 50 abuts against the pad 82, the probe 50 is pushed by the reaction force of the pad 82 to move toward the second transmission portion 34, and the second transmission portion 34 is bent toward the second groove 22 of the upper fixing element 20, so that the elastic force of the second transmission portion 34 provides a restoring force to ensure that the detecting portion 58 abuts against the pad 82 and then the electrical connection is good, and the limiting member 70 abuts against the lower fixing element 40 at the first groove 42, so that the probe 50 is limited from stopping rising to keep the second transmission portion 34 of the signal transmission element 30 to be repeatedly used within the elastic deformation range, thereby preventing the probe from being damaged due to plastic deformation.

Referring to fig. 4 and 5 again, fig. 5 is a schematic front view of an embodiment of the present invention. As shown in the drawings, in the present embodiment, after the detection is completed, the probe apparatus 1 moves in a direction away from the pad 82 of the circuit board 80 to be tested, and the elasticity of the second transmission portion 34 provides the restoring force again to restore the probe 50 to the original position.

In this embodiment, the lower fixing element supports the signal transmission element to reinforce the mechanical strength of the signal transmission element with reduced width and thickness, so that the probe device of the present invention can be reduced in width and can be applied to finer probes, and the probe device of the present invention can realize a high-density array of probe cards for high-frequency electronic element detection, and further avoid the welding between the signal transmission element and the signal derivation element and the welding between the signal transmission element and the probe by the lower fixing element, so that the structure of the present embodiment can be applied to a high-temperature environment higher than the melting point of the welding point; in addition, the probe of the utility model can keep not being inclined vertically with the connecting pad of the tested circuit through the limit of the first through hole and the third through hole, the probe is not easy to be worn and form an acute angle and is not easy to pierce or scratch the connecting pad, and the limit part limits the pressing stroke of the probe module not to generate overvoltage so as not to damage the tested circuit element or the connecting pad; furthermore, the utility model discloses a probe device circuit is established ties by signal derivation component, signal transmission component and 3 sections of probe and is formed, and each component all can make respectively and be in the equipment of going and need not adopt expensive photoetching process, only need during its maintenance to go up the fault person that fixed component and signal transmission component separation can change among the above-mentioned three components, and reach the easy low cost's of maintenance utility model purpose.

The signal leading-out element and the probe are provided with two ends of solid metal and a hollow middle section, the elastic body is arranged on the middle section, one end of the signal transmission element corresponding to the probe is exposed out of the second groove, and the limiting element is provided with a through hole to protect the probe and keep vertical when the needle enters and exits; when the probe device is used for detecting and pressing a circuit to be detected, the elastic body in the middle section of the probe provides a first section of buffer, the elastic body in the middle section of the signal leading-out element provides a second section of buffer, and one end of the signal transmission element, corresponding to the probe, is abutted against the probe and then elastically deforms towards the second groove, so that an additional third section of buffer is generated; the limiting element solves the problem that the probe is worn to generate an acute angle so as to avoid damaging a tested circuit; and because of the utility model discloses an elastic deformation position takes place in the one end that signal transmission component corresponds the probe, no matter wearing and tearing or fatigue deformation scheduling problem all mainly take place here, consequently only need take out and trade signal transmission component and can restore whole probe device, the maintenance is simple and can be accomplished fast by the user and need not purchase the spare parts, and also only need replace the probe when changing probe device and not necessarily need all change in the lump together with signal transmission component and signal derivation component, the preparation of probe also need not to carry out the photoetching process via the light shield, in all can reach reduce cost's purpose.

To sum up, the utility model provides a probe device, it utilizes fixed component and lower fixed component to put between signal transmission component and with reinforcement signal transmission component mechanical strength to reduce probe device's width and reach the purpose of easy, high-density arrangement of maintenance and low cost, in addition, still control signal transmission component and produce the elastic deformation that is controlled and reach the purpose that does not harm the circuit under test in probe testing process.

The foregoing is merely a preferred embodiment of the invention and is not intended to limit the scope of the invention, which is defined by the appended claims.

Claims (10)

1. A probe apparatus, comprising:

a signal transmission element, which comprises a first transmission part and a second transmission part, wherein a first width of the first transmission part is larger than a second width of the second transmission part;

one end of the probe is electrically connected and arranged below the second transmission part; and

the lower fixing element is arranged below the signal transmission element, one end of the lower fixing element is provided with a first through hole, and the probe penetrates through the first through hole of the lower fixing element.

2. The probe apparatus of claim 1, wherein a first groove is formed below an end of the lower fixing member, and the probe is disposed in the first groove.

3. The probe apparatus according to claim 1, further comprising a signal deriving element electrically connected to and disposed above the first transmitting portion.

4. The probe apparatus of claim 1, further comprising an upper mounting element disposed above the signal transmission element.

5. The probe apparatus according to claim 4, wherein one end of the upper fixing element has a second groove, the probe is located below the second groove, and the signal deriving element is disposed through a second through hole at the other end of the upper fixing element.

6. The probe apparatus of claim 2, further comprising:

a substrate, which is arranged below the lower fixing element and is provided with an opening; and

a limiting member disposed in the opening of the substrate corresponding to the first groove, wherein the probe penetrates through the limiting member.

7. The probe apparatus of claim 5, wherein the second through hole further has a first aperture portion and a second aperture portion, and a first aperture of the first aperture portion is smaller than a second aperture of the second aperture portion.

8. The probe apparatus according to claim 7, wherein the signal deriving element has a first diameter portion and a second diameter portion, a first diameter of the first diameter portion corresponds to the first aperture of the first aperture portion, and a second diameter of the second diameter portion corresponds to the second aperture of the second aperture portion.

9. The probe apparatus of claim 1, wherein the first through hole further has a third aperture portion and a fourth aperture portion, and a third aperture of the third aperture portion is larger than a fourth aperture of the fourth aperture portion.

10. The probe apparatus of claim 9, wherein the probe has a third diameter portion and a fourth diameter portion, a third diameter of the third diameter portion corresponding to the third aperture of the third aperture portion, and a fourth diameter of the fourth diameter portion corresponding to the fourth aperture of the fourth aperture portion.

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