CN213106278U

CN213106278U - Chemical mechanical planarization equipment

Info

Publication number: CN213106278U
Application number: CN202020596937.0U
Authority: CN
Inventors: 李婷; 岳爽; 尹影; 崔凯; 蒋锡兵; 靳阳
Original assignee: Beijing Semicore Microelectronics Equipment Co Ltd
Current assignee: Beijing Jingyi Precision Technology Co ltd
Priority date: 2020-04-20
Filing date: 2020-04-20
Publication date: 2021-05-04
Anticipated expiration: 2030-04-20

Abstract

The utility model relates to a semiconductor device technical field, concretely relates to chemical machinery flattening equipment, when wafer and polishing pad contact, contact area has on the wafer, is equipped with hydrojet subassembly on this flattening equipment, hydrojet subassembly has at least one liquid outlet, follows liquid outlet spun liquid distributes uniformly on the contact area. The utility model provides a chemical mechanical planarization equipment of wafer surface degree of consistency has been improved.

Description

Chemical mechanical planarization equipment

Technical Field

The utility model relates to a semiconductor equipment technical field, concretely relates to chemical machinery flattening equipment.

Background

With the development of moore's law, the role of chemical mechanical planarization equipment in the semiconductor manufacturing process flow becomes more and more important, and the requirements for the process performance of the equipment also become higher and higher. In the process performance of chemical mechanical planarization, the most critical factor is the surface topography of the wafer, and whether the surface topography of the wafer is smooth or not directly affects the subsequent process, and may cause the electrical performance of the final chip to be affected, so effectively improving the surface topography of the wafer is one of the most important targets for optimizing the performance of the chemical mechanical planarization equipment.

When the existing chemical mechanical planarization equipment is used for polishing, the wafer and the polishing pad are used for mutual grinding, polishing liquid is conveyed while grinding, so that the polishing liquid and the surface of the wafer are subjected to chemical reaction, and therefore the surface of the wafer is planarized.

SUMMERY OF THE UTILITY MODEL

Therefore, the to-be-solved technical problem of the utility model lies in solving the chemical mechanical planarization equipment among the prior art polishing back, the poor problem of wafer surface degree of consistency to a chemical mechanical planarization equipment that has improved the wafer surface degree of consistency is provided.

In order to solve the above technical problem, the present invention provides a chemical mechanical planarization apparatus, wherein when a wafer contacts a polishing pad, the wafer has a contact area, the planarization apparatus is provided with a liquid spraying assembly, the liquid spraying assembly has at least one liquid outlet, and liquid sprayed from the liquid outlet is uniformly distributed on the contact area;

the liquid spraying assembly is movably arranged relative to the polishing pad, and the moving track of the liquid spraying assembly is the same as the moving track of the wafer relative to the polishing pad.

Further, the liquid spraying assembly is located in front of the wafer on the moving track relative to the wafer.

Further, the liquid ejection assembly oscillates at the periphery of the contact area.

Further, the spray assembly includes a conditioning end in contact with the polishing pad, and the spray outlet is located on the conditioning end.

Further, the liquid outlet is arranged on the peripheral wall of the trimming end.

Further, the liquid outlet is a plurality of, and follows the periphery wall evenly distributed of repairing the end.

Further, the liquid outlet is arranged at the bottom of the trimming end.

Further, the hydrojet subassembly still includes relatively the shifting arm that the polishing pad removed, be provided with on the shifting arm the end of repairing, be provided with in the shifting arm with the infusion pipeline of liquid outlet intercommunication.

Further, the moving arm is provided with the liquid outlet.

The utility model also provides a chemical mechanical planarization device, when the wafer contacts with the polishing pad, a contact area is arranged on the wafer, a liquid spraying component is arranged on the planarization device, the liquid spraying component is provided with at least one liquid outlet, and the liquid sprayed out from the liquid outlet is uniformly distributed on the contact area;

the liquid ejecting assembly oscillates at the periphery of the contact area, and the peripheral oscillation is that the liquid ejecting assembly oscillates at a predetermined period in the vicinity of the contact area.

The utility model discloses technical scheme has following advantage:

1. the utility model provides a chemical machinery flattening equipment, during wafer and polishing pad contact, contact area has on the wafer, is equipped with hydrojet subassembly on this flattening equipment, hydrojet subassembly has at least one liquid outlet, follows liquid outlet spun liquid distributes uniformly on the contact area for the wafer can be even with liquid contact, the chemical reaction that takes place between wafer and the liquid is also more even, and then has improved the degree of consistency on wafer surface, avoids the sudden change of polishing rate of wafer edge, appears sharply reducing then increase, or the direct condition that increases by a wide margin, thereby has improved the yields of wafer, has reduced the waste because of the processing problem causes.

2. The utility model provides a chemical machinery flattening equipment, the liquid outlet is a plurality of, and follows the periphery wall evenly distributed of finishing end for every liquid outlet spouts the liquid volume the same and even on the polishing pad, makes spun liquid distribute more evenly on the contact area of polishing pad.

3. The utility model provides a chemical machinery flattening equipment, hydrojet subassembly is still including relative the shifting arm that the polishing pad removed, be provided with on the shifting arm the maintenance end, be provided with in the shifting arm with the infusion pipeline of liquid outlet intercommunication. Through setting up the infusion pipeline in moving the arm, hidden the infusion pipeline, prevented the removal of infusion pipeline on moving the arm, lead to the fluctuation of the inside liquid of infusion pipeline, and then guaranteed the homogeneity of blowout liquid.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a chemical mechanical planarization apparatus provided by the present invention;

FIG. 2 is a cross-sectional view of the liquid spray assembly;

FIG. 3 is a sectional view of the holder;

FIG. 4 is a bottom view of the diamond wheel;

fig. 5 is a schematic structural diagram of another embodiment.

Description of reference numerals:

1-a polishing pad; 2-a wafer; 3-a contact area; 4-a liquid spray assembly; 41-trimming end; 411-a fixed seat; 412-diamond wheel; 413-storage space; 42-a frame; 43-a moving arm; 44-a shunting block; 5-a liquid outlet; 6-conveying pipeline; 61-main line; 62-branch lines;

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

When the chemical mechanical planarization equipment in the prior art performs polishing treatment on the wafer 2, the wafer 2 is placed on the polishing pad 1 for trimming, polishing liquid is conveyed to the surface of the polishing pad 1, and the purpose of polishing and leveling the surface of the wafer 2 is achieved through chemical reaction between the polishing liquid and the surface of the wafer 2.

Referring to fig. 1 to 5, the present embodiment provides a chemical mechanical planarization apparatus for polishing a wafer 2 in a polishing work area. When the wafer 2 is in contact with the polishing pad 1, the wafer 2 is provided with a contact area 3, and the polishing pad 1 grinds the wafer 2 through the contact area 3, so that the surface of the wafer 2 is subjected to chemical mechanical planarization process. The chemical mechanical planarization device is provided with a liquid spraying assembly 4, liquid is contained in the liquid spraying assembly 4, the liquid is polishing liquid which reacts with the surface of the wafer 2, the liquid spraying assembly 4 is provided with at least one liquid outlet 5, and the liquid sprayed out of the liquid outlet 5 is uniformly distributed on the contact area 3.

Through hydrojet subassembly 4's setting, and be equipped with liquid outlet 5 on hydrojet subassembly 4, make spun liquid can distribute uniformly on wafer 2 and polishing pad 1's contact area 3, the liquid on this contact area 3 can be even with wafer 2 contact, the chemical reaction that takes place between wafer 2 and the liquid is also more even, and then 2 surperficial degrees of consistency of wafer has been improved, avoid 2 edge polishing rate sudden change of wafer, and sharply reduce then increase appears, or the direct condition that increases by a wide margin, thereby wafer 2's yields has been improved, the waste because of the processing problem causes has been reduced.

Specifically, the liquid ejecting assembly 4 can be movably disposed relative to the polishing pad 1, that is, the liquid ejecting assembly 4 moves on the polishing pad 1, wherein a moving track of the liquid ejecting assembly 4 is the same as a moving track of the wafer 2 relative to the polishing pad 1, the moving track can be a moving track of the wafer 2 along the circumference of the polishing pad 1, or a moving track of the wafer 2 alone according to a fixed shape, for example, the moving track of the wafer 2 on the polishing pad 1 is V-shaped or L-shaped; the liquid ejected from the liquid ejecting unit 4 is uniformly ejected onto the contact area 3 by the movement of the liquid ejecting unit 4 with the movement of the wafer 2.

As an alternative embodiment, the liquid spraying assembly 4 is located on the moving track relative to the wafer 2 and in front of the wafer 2, that is, when the wafer 2 moves on the polishing pad 1 according to the predetermined moving track, the liquid spraying assembly 4 sprays the liquid onto the pre-contact area 3 in advance, where the wafer 2 is to be moved, so as to ensure the uniformity of the liquid at the contact area 3 between the wafer 2 and the polishing pad 1.

As an alternative embodiment, liquid ejection assembly 4 uniformly ejects liquid onto contact area 3 while oscillating at the periphery of contact area 3, that is, liquid ejection assembly 4 oscillates in the vicinity of contact area 3 at a predetermined period, thereby ensuring uniformity of liquid at contact area 3. The period may be set according to the actual movement track of the wafer 2.

Specifically, as shown in fig. 2, liquid ejecting assembly 4 includes a dressing end 41 in contact with polishing pad 1, and liquid outlet 5 is located at dressing end 41. When grinding between wafer 2 and polishing pad 1, will remain the impurity after grinding on polishing pad 1, dressing end 41 can be timely clear away remaining impurity on polishing pad 1, through setting up liquid outlet 5 on dressing end 41, dressing end 41 is when clearing away remaining impurity on polishing pad 1, can also spout liquid on polishing pad 1 uniformly, make liquid evenly distributed on polishing pad 1, make and fully grind between wafer 2 and polishing pad 1, the grinding effect between polishing pad 1 and wafer 2 has been guaranteed, thereby the degree of consistency on wafer 2 surface has been improved.

Specifically, the dressing end 41 comprises a fixed seat 411 and a diamond wheel 412 arranged at the bottom of the fixed seat 411, the polishing pad 1 is dressed by the diamond wheel 412, and the liquid outlet 5 is arranged on the peripheral wall of the fixed seat 411, so that liquid can be sprayed out while the polishing pad 1 is dressed by the diamond wheel 412, and the liquid can be uniformly sprayed on the polishing pad 1 through the peripheral wall of the fixed seat 411.

In the present embodiment, the number of the liquid outlets 5 is five, and the liquid outlets are uniformly distributed along the outer peripheral wall of the fixing base 411, and the amount of the liquid sprayed onto the polishing pad 1 by each liquid outlet 5 is the same and uniform, so that the sprayed liquid is more uniformly distributed on the contact area 3 of the polishing pad 1.

As an alternative embodiment, the number of the liquid outlets 5 is five, and the five liquid outlets are unevenly distributed along the outer peripheral wall of the fixed seat 411.

As an alternative embodiment, as shown in fig. 4, at least one liquid outlet 5 is provided at the bottom of the diamond wheel 412, and when the diamond wheel 412 dresses the polishing pad 1, liquid is sprayed from the bottom of the diamond wheel 412 onto the polishing pad 1, so that the sprayed liquid is distributed more uniformly over the contact area 3 of the polishing pad 1.

As an alternative embodiment, the number of the liquid outlets 5 is five, and the liquid outlets are uniformly arranged at the bottom center of the diamond wheel.

As an alternative embodiment, the number of the liquid outlets 5 is five, and the liquid outlets are uniformly arranged at the bottom edge of the diamond wheel.

As an alternative embodiment, the number of the liquid outlets 5 is five, and the liquid outlets are not uniformly arranged at the bottom of the diamond wheel.

As shown in fig. 2, in the present embodiment, liquid ejecting assembly 4 further includes a moving arm 43 that moves relative to polishing pad 1, and a frame 42 that drives moving arm 43 to rotate, and a dressing end 41 is provided on moving arm 43, and a liquid supply line 6 that communicates with liquid outlet 5 is provided in moving arm 43 and frame 42. The infusion pipeline 6 comprises a main pipeline 61 and a branch pipeline 62 communicated with the main pipeline 61, the main pipeline 61 is arranged in the frame 42 and the moving arm 43, one end of the main pipeline 61 is communicated with a liquid container (not shown in the figure), and the liquid container is filled with liquid; the other end of the main conduit 61 is connected to the liquid outlet 5 provided on the fixing base 411, a branch conduit 62 is provided at the liquid outlet 5, the branch conduit 62 is provided toward the polishing pad 1, and the liquid in the liquid container is uniformly sprayed on the contact area 3 of the polishing pad 1 through the main conduit 61 and the branch conduit 62.

As shown in fig. 5, as an alternative embodiment, the bottom of the moving arm 43 is provided with the liquid outlet 5, in this case, a main pipeline 61 is disposed in the frame 42 and the moving arm 43, a diversion block 44 is disposed in the moving arm 43, one end of the main pipeline 61 is connected to the liquid container, and the other end is communicated with the diversion block 44, and the liquid in the main pipeline 61 is uniformly and equally distributed to a plurality of branch pipelines 62 by the arrangement of the diversion block 44, wherein the branch pipelines 62 are disposed toward the polishing pad 1, so that the liquid can be uniformly sprayed on the contact region 3 of the polishing pad 1.

As shown in fig. 3, as an alternative embodiment, a main conduit 61 and a branch conduit 62 are provided on the outer circumferential wall of the fixed base 411, a storage space 413 is opened inside the fixed base 411, and the main conduit 61 and the branch conduit 62 are communicated with the storage space 413, the main conduit 61 delivers liquid into the storage space 413, and the liquid is uniformly sprayed on the contact area 3 of the polishing pad 1 by the branch conduit 62.

The specific working process is as follows: the wafer 2 is placed on the polishing pad 1 for polishing, impurities left on the surface of the polishing pad 1 after the wafer 2 is ground are removed through the liquid spraying assembly 4 in the polishing process, and the liquid in the liquid container is uniformly sprayed on the contact area 3 of the polishing pad 1 through the main pipeline 61 in the moving process of the liquid spraying assembly 4, so that the uniformity of the distribution of the liquid on the polishing pad 1 is ensured.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. A chemical mechanical planarization device, when a wafer (2) contacts with a polishing pad (1), the wafer (2) is provided with a contact area (3), characterized in that the planarization device is provided with a liquid spraying component (4), the liquid spraying component (4) is provided with at least one liquid outlet (5), and liquid sprayed from the liquid outlet (5) is uniformly distributed on the contact area (3);

the liquid spraying assembly (4) is movably arranged relative to the polishing pad (1), and the moving track of the liquid spraying assembly (4) is the same as the moving track of the wafer (2) relative to the polishing pad (1).

2. The chemical mechanical planarization apparatus of claim 1, wherein said liquid spray assembly (4) is located in front of said wafer (2) on said moving trajectory with respect to said wafer (2).

3. The chemical mechanical planarization apparatus of claim 2, wherein the liquid spray assembly (4) comprises a conditioning end (41) in contact with the polishing pad (1), and the liquid outlet (5) is located on the conditioning end (41).

4. The chemical mechanical planarization apparatus of claim 3, wherein said liquid outlet (5) is provided on a peripheral wall of said trimming end (41).

5. The chemical mechanical planarization apparatus of claim 4, wherein the liquid outlet (5) is plural and uniformly distributed along the peripheral wall of the trimming end (41).

6. The chemical mechanical planarization apparatus of claim 5, wherein the liquid outlet (5) is disposed at the bottom of the trimming end (41).

7. The chemical mechanical planarization apparatus of any one of claims 3-6, wherein said liquid spray assembly (4) further comprises a moving arm (43) moving relative to said polishing pad (1), said moving arm (43) having said conditioning end (41) disposed thereon, said moving arm (43) having an infusion line disposed therein communicating with said liquid outlet (5).

8. The chemical mechanical planarization apparatus of claim 7, wherein said moving arm (43) is provided with said liquid outlet (5).

9. A chemical mechanical planarization device, when a wafer (2) contacts with a polishing pad (1), the wafer (2) is provided with a contact area (3), characterized in that the planarization device is provided with a liquid spraying component (4), the liquid spraying component (4) is provided with at least one liquid outlet (5), and liquid sprayed from the liquid outlet (5) is uniformly distributed on the contact area (3);

the liquid ejecting assembly (4) oscillates at the periphery of the contact area (3), and the peripheral oscillation is that the liquid ejecting assembly (4) oscillates at a predetermined period in the vicinity of the contact area (3).