CN214378355U - Packaging device with good substrate fixing effect for chip processing - Google Patents

Packaging device with good substrate fixing effect for chip processing Download PDF

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Publication number
CN214378355U
CN214378355U CN202120682874.5U CN202120682874U CN214378355U CN 214378355 U CN214378355 U CN 214378355U CN 202120682874 U CN202120682874 U CN 202120682874U CN 214378355 U CN214378355 U CN 214378355U
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CN
China
Prior art keywords
limiting plate
chip
shell
threaded rod
box
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Expired - Fee Related
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CN202120682874.5U
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Chinese (zh)
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不公告发明人
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Xuzhou Shengke Semiconductor Technology Co ltd
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Xuzhou Shengke Semiconductor Technology Co ltd
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Priority to CN202120682874.5U priority Critical patent/CN214378355U/en
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Publication of CN214378355U publication Critical patent/CN214378355U/en
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Abstract

The utility model discloses a chip processing is with fixed effectual packaging hardware of base plate, including conveyer belt and box, the stabilizer blade is all installed to the both sides of box bottom, the pivot is all installed to the inside both sides of conveyer belt, the bottom of pivot is provided with the chain, the drive belt is installed in the outside of pivot, the ultrasonic packaging machine is installed to the intermediate position department on conveyer belt top. The utility model discloses an install second servo motor in the bottom of shell, second servo motor work just can drive the threaded rod rotatory, threaded rod and limiting plate are threaded connection, the threaded rod is rotatory just can drive and its limiting plate that is threaded connection goes up and down, limiting plate and shell mutually support, the limiting plate can be along the inside use of shell, the limiting plate descends and just can fix the chip that conveys the top, prevent that the chip from appearing the skew man-hour, reach the purpose that the packaging hardware is convenient for carry out the fixing to the chip that needs processing with this.

Description

Packaging device with good substrate fixing effect for chip processing
Technical Field
The utility model relates to a chip processing technology field, in particular to chip processing is with fixed effectual packaging hardware of base plate.
Background
A chip is a way of miniaturizing a circuit in electronics and is often manufactured on a surface of a semiconductor wafer, a chip package means a package for mounting a semiconductor integrated circuit chip, and plays a role of mounting, fixing, sealing, protecting the chip and enhancing a heating performance, and also a bridge for communicating the internal world of the chip with an external circuit, and a contact on the chip is connected to a pin of the package by a wire, and the pin is connected to other devices by a wire on a printed board, and thus the package plays an important role for a CPU and other LSI integrated circuits.
Therefore, a chip packaging device is disclosed in patent specification with publication number CN109326543A, which comprises a transportation mechanism, a grabbing mechanism, a packaging platform and a dispensing mechanism, wherein the transportation mechanism is used for transporting chips; a plurality of supporting blocks for placing chips are arranged on the conveying mechanism at equal intervals, and a clamping groove for placing a card base is formed in the upper end of the packaging platform; the glue dispensing mechanism is suitable for dripping glue into the mounting groove on the card base; the grabbing mechanism is suitable for grabbing the chip on the supporting block and placing the chip in a mounting groove on the card base, the grabbing mechanism adsorbs the chip through negative pressure, meanwhile, the glue dispensing mechanism dispenses the mounting groove in the card base, and the chip is placed in the card base mounting groove on the packaging platform through the grabbing mechanism to complete packaging operation.
The prior art described above has the following drawbacks: the packaging device in the technology is difficult to fix the chip to be processed, the chip is easy to deviate during processing, and the chip deviation can influence the processing quality of the device, so that the chip is required to be limited.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model aims at providing a chip processing is with fixed effectual packaging hardware of base plate for solve current packaging hardware and be difficult to carry out the defect fixed to the chip that needs processing.
(II) contents of utility model
In order to solve the technical problem, the utility model provides a following technical scheme: a packaging device with a good fixing effect for a substrate for chip processing comprises a conveyor belt and a box body, wherein supporting legs are arranged on two sides of the bottom end of the box body, a limiting structure is arranged at one end of the top end of the box body and comprises a second servo motor, a shell, a threaded rod, a limiting plate and an anti-slip pad, the shell is arranged at the top end of the box body, a first servo motor is arranged on one side inside the box body, and the conveyor belt is arranged at the top end of the box body;
the conveying belt is characterized in that rotating shafts are installed on two sides of the interior of the conveying belt, a chain is arranged at the bottom end of each rotating shaft, a conveying belt is installed on the outer side of each rotating shaft, and an ultrasonic packaging machine is installed in the middle of the top end of the conveying belt.
Preferably, drying mechanism is installed to one side on box top, and drying mechanism includes stoving case, heater strip, fan and louvre, the stoving case is installed in one side on box top, the fan is installed on the inside top of stoving case.
Preferably, heating wires are embedded at two ends of the drying box, and the heating wires are snake-shaped.
Preferably, the top end of the drying box is provided with heat dissipation holes which are arranged at equal intervals on the top end of the drying box.
Preferably, a second servo motor is installed to the bottom of shell, the internally mounted of shell has the threaded rod, the one end of shell is provided with the limiting plate.
Preferably, the outer side wall of the threaded rod is uniformly provided with external threads, the inner side wall of the limiting plate is uniformly provided with internal threads matched with the external threads, and the threaded rod is in threaded connection with the limiting plate.
Preferably, the non-slip mat is all installed to the both sides of limiting plate bottom, the non-slip mat is the symmetric distribution about the axis of limiting plate.
(III) advantageous effects
The utility model provides a chip processing is with fixed effectual packaging hardware of base plate, its advantage lies in: the second servo motor is arranged at the bottom end of the shell, the second servo motor can drive the threaded rod to rotate when working, the threaded rod is in threaded connection with the limiting plate, the threaded rod can drive the limiting plate in threaded connection with the threaded rod to lift, the limiting plate and the shell are matched with each other, the limiting plate can be used along the interior of the shell, the chip at the top end of the conveyor belt can be fixed when the limiting plate descends, the chip is prevented from deviating during processing, and therefore the purpose that the packaging device can fix the chip to be processed conveniently is achieved;
by installing the drying box at one end of the top end of the box body, after the chips enter the drying box through the conveyor belt, the heating wires at the two ends of the drying box can heat the interior of the drying box by working, and meanwhile, the hot air in the drying box can be blown to the chips by working of the fan to dry the glue on the chips, so that the purpose that the chips are convenient to dry by the packaging device is achieved;
the chain is installed through the one end at first servo motor, and first servo motor work just can drive the pivot rotation of conveyer belt one side through the chain, and the pivot rotation of one side just can drive the pivot rotation of opposite side through the drive belt, and the pivot is rotatory just can drive the conveyer belt and remove, puts the chip on conveyer belt top back, and the conveyer belt removes the chip that just can drive its top and removes to this reaches the purpose that the packaging hardware chip of being convenient for removed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;
fig. 2 is a schematic top view of the cross-sectional structure of the present invention;
fig. 3 is an enlarged partial sectional view of the utility model at a in fig. 1;
fig. 4 is a schematic view of a front view partial section structure of the limiting structure of the present invention;
fig. 5 is a schematic view of the front view partial section structure of the drying mechanism of the present invention.
The reference numerals in the figures illustrate: 1. a conveyor belt; 2. a box body; 3. a support leg; 4. a first servo motor; 5. a chain; 6. a limiting structure; 601. a second servo motor; 602. a housing; 603. a threaded rod; 604. a limiting plate; 605. a non-slip mat; 7. a rotating shaft; 8. a drying mechanism; 801. a drying box; 802. heating wires; 803. a fan; 804. heat dissipation holes; 9. an ultrasonic packaging machine; 10. a transmission belt.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-5, the present invention provides an embodiment: a packaging device with a good fixing effect of a substrate for chip processing comprises a conveyor belt 1 and a box body 2, support legs 3 are mounted on two sides of the bottom end of the box body 2, a drying mechanism 8 is mounted on one side of the top end of the box body 2, the drying mechanism 8 comprises a drying box 801, heating wires 802, a fan 803 and radiating holes 804, the drying box 801 is mounted on one side of the top end of the box body 2, the fan 803 is mounted on the top end of the interior of the drying box 801, the type of the fan 803 can be TA12025, the heating wires 802 are inlaid at two ends of the drying box 801, and the heating wires 802 are snake-shaped;
the top end of the drying box 801 is provided with heat dissipation holes 804, and the heat dissipation holes 804 are arranged at equal intervals at the top end of the drying box 801;
specifically, when the structure is used, firstly, after the chips enter the drying box 801 through the conveyor belt 1, the heating wires 802 at the two ends of the drying box 801 work to heat the inside of the drying box 801, and meanwhile, the fan 803 works to blow hot air in the drying box 801 to the chips to dry glue on the chips;
a limiting structure 6 is mounted at one end of the top end of the box body 2, the limiting structure 6 comprises a second servo motor 601, a shell 602, a threaded rod 603, a limiting plate 604 and a non-slip mat 605, the shell 602 is mounted at the top end of the box body 2, the second servo motor 601 is mounted at the bottom end of the shell 602, the model of the second servo motor 601 can be EDSMT-2T, the threaded rod 603 is mounted inside the shell 602, external threads are uniformly arranged on the outer side wall of the threaded rod 603, internal threads matched with the external threads are uniformly arranged on the inner side wall of the limiting plate 604, and the threaded rod 603 is in threaded connection with the limiting plate 604;
a limiting plate 604 is arranged at one end of the housing 602, anti-skid pads 605 are mounted on two sides of the bottom end of the limiting plate 604, and the anti-skid pads 605 are symmetrically distributed about the central axis of the limiting plate 604;
specifically, when the structure is used, firstly, the second servo motor 601 works to drive the threaded rod 603 to rotate, the threaded rod 603 is in threaded connection with the limiting plate 604, the threaded rod 603 can drive the limiting plate 604 in threaded connection with the threaded rod to lift, the limiting plate 604 is matched with the shell 602, the limiting plate 604 can be used along the inside of the shell 602, the limiting plate 604 can fix the chip at the top end of the conveyor belt 1 when descending, the chip is prevented from shifting during processing, the anti-slip pad 605 can enhance the friction force of the limiting plate 604, and the chip can be fixed more stably;
a first servo motor 4 is installed on one side inside the box body 2, the type of the first servo motor 4 can be ASD-A2, and a conveyor belt 1 is installed at the top end of the box body 2;
the inside both sides of conveyer belt 1 all install pivot 7, and the bottom of pivot 7 is provided with chain 5, and drive belt 10 is installed in the outside of pivot 7, and ultrasonic packaging machine 9 is installed to the intermediate position department on conveyer belt 1 top.
The working principle is as follows: when the device is used, firstly, the device is externally connected with a power supply, the second servo motor 601 can drive the threaded rod 603 to rotate when working, the threaded rod 603 is in threaded connection with the limiting plate 604, the threaded rod 603 can drive the limiting plate 604 in threaded connection with the threaded rod to lift, the limiting plate 604 is matched with the shell 602, the limiting plate 604 can be used along the inside of the shell 602, the chip at the top end of the conveyor belt 1 can be fixed when the limiting plate 604 descends, the chip is prevented from deviating during processing, the anti-skid pad 605 can enhance the friction force of the limiting plate 604, and the chip can be fixed more stably;
secondly, before the chip is packaged, the shell is generally adhered to the chip through glue, after the chip enters the drying box 801 through the conveyor belt 1, the heating wires 802 at the two ends of the drying box 801 work to heat the inside of the drying box 801, and meanwhile, the fan 803 works to blow hot air in the drying box 801 to the chip to dry the glue on the chip;
finally, the first servo motor 4 can drive the rotating shaft 7 on one side of the conveying belt 1 to rotate through the chain 5, the rotating shaft 7 on one side can drive the rotating shaft 7 on the other side to rotate through the conveying belt 10, the rotating shaft 7 can drive the conveying belt 1 to move in a rotating mode, the chip is placed on the top end of the conveying belt 1, the conveying belt 1 can drive the chip on the top end to move, and after the chip moves to the bottom end of the ultrasonic packaging machine 9, the ultrasonic packaging machine 9 can fix the chip.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (7)

1. The utility model provides a chip processing is with fixed effectual packaging hardware of base plate, includes conveyer belt (1) and box (2), its characterized in that: the supporting feet (3) are mounted on two sides of the bottom end of the box body (2), the limiting structure (6) is mounted at one end of the top end of the box body (2), the limiting structure (6) comprises a second servo motor (601), a shell (602), a threaded rod (603), a limiting plate (604) and an anti-slip pad (605), the shell (602) is mounted at the top end of the box body (2), a first servo motor (4) is mounted on one side of the interior of the box body (2), and the conveying belt (1) is mounted at the top end of the box body (2);
pivot (7) are all installed to the inside both sides of conveyer belt (1), the bottom of pivot (7) is provided with chain (5), drive belt (10) are installed in the outside of pivot (7), ultrasonic packaging machine (9) are installed to the intermediate position department on conveyer belt (1) top.
2. The packaging device with good fixing effect for the substrate for chip processing according to claim 1, wherein: drying mechanism (8) are installed to one side on box (2) top, and drying mechanism (8) are including stoving case (801), heater strip (802), fan (803) and louvre (804), one side on box (2) top is installed in stoving case (801), fan (803) are installed on the inside top of stoving case (801).
3. The packaging device with good fixing effect for the substrate for chip processing according to claim 2, wherein: heating wires (802) are inlaid at two ends of the drying box (801), and the shape of the heating wires (802) is snake-shaped.
4. The packaging device with good fixing effect for the substrate for chip processing according to claim 2, wherein: the top end of the drying box (801) is provided with heat dissipation holes (804), and the heat dissipation holes (804) are arranged at equal intervals on the top end of the drying box (801).
5. The packaging device with good fixing effect for the substrate for chip processing according to claim 1, wherein: second servo motor (601) is installed to the bottom of shell (602), the internally mounted of shell (602) has threaded rod (603), the one end of shell (602) is provided with limiting plate (604).
6. The packaging device with good fixing effect for the substrate for chip processing according to claim 1, wherein: the outer side wall of the threaded rod (603) is evenly provided with external threads, the inner side wall of the limiting plate (604) is evenly provided with internal threads matched with the external threads, and the threaded rod (603) is in threaded connection with the limiting plate (604).
7. The packaging device with good fixing effect for the substrate for chip processing according to claim 1, wherein: non-slip pads (605) are all installed to the both sides of limiting plate (604) bottom, non-slip pads (605) are the symmetric distribution about the axis of limiting plate (604).
CN202120682874.5U 2021-04-03 2021-04-03 Packaging device with good substrate fixing effect for chip processing Expired - Fee Related CN214378355U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120682874.5U CN214378355U (en) 2021-04-03 2021-04-03 Packaging device with good substrate fixing effect for chip processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120682874.5U CN214378355U (en) 2021-04-03 2021-04-03 Packaging device with good substrate fixing effect for chip processing

Publications (1)

Publication Number Publication Date
CN214378355U true CN214378355U (en) 2021-10-08

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CN202120682874.5U Expired - Fee Related CN214378355U (en) 2021-04-03 2021-04-03 Packaging device with good substrate fixing effect for chip processing

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115267512A (en) * 2022-08-22 2022-11-01 深圳市睿智科精密科技有限公司 Detection device and detection method for chip packaging part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115267512A (en) * 2022-08-22 2022-11-01 深圳市睿智科精密科技有限公司 Detection device and detection method for chip packaging part

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Granted publication date: 20211008