CN214253879U - Solid state hard drives of high heat dissipating ability - Google Patents
Solid state hard drives of high heat dissipating ability Download PDFInfo
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- CN214253879U CN214253879U CN202120144547.4U CN202120144547U CN214253879U CN 214253879 U CN214253879 U CN 214253879U CN 202120144547 U CN202120144547 U CN 202120144547U CN 214253879 U CN214253879 U CN 214253879U
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- heat dissipation
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- state disk
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Abstract
The utility model provides a solid state hard drives of high heat dissipating ability. The solid state disk comprises: casing, chip subassembly, air-cooled subassembly. The utility model discloses technical scheme is through seting up the heat dissipation breach on the surface at the casing, it is understood, it has the back and openly to set for the casing, and enclose four sides of establishing between front and the back, wherein, the back is used for settling whole casing, and the heat dissipation breach is seted up on openly, the inside fixed chip subassembly that is used for of cavity, and the chip subassembly extends and runs through to the outside formation data connector of side, in order to give the inside heat dissipation of cavity, can set up the forced air cooling subassembly on openly, utilize the forced air cooling subassembly to dispel the heat, reduce the inside temperature of cavity, improve the heat-sinking capability of solid state hard disk when its high load function.
Description
Technical Field
The utility model relates to a mould equipment technical field, in particular to solid state hard drives of high heat dissipating ability.
Background
A Solid State Disk (SSD), which is a computer storage device mainly using a Flash memory (NAND Flash) as a permanent memory. The solid state disk is composed of a control unit and a storage unit (a FLASH chip and a DRAM chip), and is widely applied to the fields of industrial control, video monitoring, network terminals, navigation equipment and the like. Compared with a mechanical hard disk, the solid state disk has higher read-write speed, but the cost is also higher. The new generation solid state disk adopts interfaces of SATA-III, PCIex8 or mSATA, M.2, ZIF, IDE, U.2, CF, CFast and the like.
However, the current solid state disk in the market often has insufficient heat dissipation capability during high load operation, resulting in a reduction in operation speed.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a solid state hard drives of high heat dissipating ability aims at solving the technical problem that solid state hard drives on the market often heat-sinking capability leads to its operation speed decline inadequately when its high load function.
In order to achieve the above object, the utility model provides a solid state hard drives of high heat dissipating ability, solid state hard drives includes:
the heat dissipation device comprises a shell, wherein a cavity is formed in the shell, a heat dissipation notch is formed in the surface of one side of the shell, and the heat dissipation notch is communicated with the cavity;
the chip assembly is arranged in the cavity, one end of the chip assembly in the length direction penetrates through the shell and extends to the outside of the shell to form a data connector, and the data connector is used for being connected with an external main board;
the air cooling assembly is arranged on the surface of the shell and covers the heat dissipation notch, and the air cooling assembly is used for dissipating heat inside the cavity.
Preferably, the air-cooling assembly includes:
the heat dissipation plate is characterized in that a fan is embedded in the middle of the heat dissipation plate, the heat dissipation plate is fixed to the shell, the heat dissipation notch is formed in the surface of the shell and covers the heat dissipation notch, and the fan is located in the heat dissipation notch.
Preferably, a plurality of first radiating grooves are further formed in the radiating plate, and the first radiating grooves are communicated with the radiating notches.
Preferably, a plurality of second heat dissipation grooves are further formed in the heat dissipation plate, and the second heat dissipation grooves are communicated with the heat dissipation notches.
Preferably, the first heat dissipation grooves and the second heat dissipation grooves are distributed along the ring of the fan.
Preferably, the side wall of the shell is provided with a plurality of heat dissipation holes, and the heat dissipation holes are communicated with the cavity.
Preferably, each heat dissipation hole is covered with a dust screen.
Preferably, the heat dissipation plate is an aluminum plate.
Preferably, an insulating graphite heat dissipation film is attached to the inside of the cavity.
Preferably, the housing is made of an aluminum material.
The utility model discloses technical scheme is through seting up the heat dissipation breach on the surface at the casing, it is understood, it has the back and openly to set for the casing, and enclose four sides of establishing between front and the back, wherein, the back is used for settling whole casing, and the heat dissipation breach is seted up on openly, the inside fixed chip subassembly that is used for of cavity, and the chip subassembly extends and runs through to the outside formation data connector of side, in order to give the inside heat dissipation of cavity, can set up the forced air cooling subassembly on openly, utilize the forced air cooling subassembly to dispel the heat, reduce the inside temperature of cavity, improve the heat-sinking capability of solid state hard disk when its high load function.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a solid state disk of the present invention;
fig. 2 is a schematic structural diagram of another embodiment of the solid-state hard disk of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
10 | |
| 20 | |
21 | |
| 30 | Air cooling assembly | 31 | |
| 32 | Fan with |
40 | Dust-proof net |
| A | Heat dissipation gap | B | First heat sink |
| C | Second heat sink | D | Heat dissipation hole |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
A Solid State Disk (SSD), which is a computer storage device mainly using a Flash memory (NAND Flash) as a permanent memory. The solid state disk is composed of a control unit and a storage unit (a FLASH chip and a DRAM chip), and is widely applied to the fields of industrial control, video monitoring, network terminals, navigation equipment and the like. Compared with a mechanical hard disk, the solid state disk has higher read-write speed, but the cost is also higher. The new generation solid state disk adopts interfaces of SATA-III, PCIex8 or mSATA, M.2, ZIF, IDE, U.2, CF, CFast and the like.
However, the current solid state disk in the market often has insufficient heat dissipation capability during high load operation, resulting in a reduction in operation speed.
Therefore, the heat dissipation performance of the solid state disk is improved, and the problem that the operation speed of the solid state disk is reduced can be effectively solved.
As shown in fig. 1 to fig. 2, the utility model provides a solid state hard drive 100 with high heat dissipation performance, solid state hard drive 100 includes: the heat dissipation device comprises a shell 10, wherein a cavity (not marked in the figure) is arranged in the shell 10, a heat dissipation notch A is formed in the surface of one side of the shell 10, and the heat dissipation notch A is communicated with the cavity; the chip assembly 20 is arranged in the cavity, one end of the chip assembly 20 in the length direction penetrates through the shell 10 and extends to the outside of the shell 10 to form a data connector 21, and the data connector 21 is used for being connected with an external mainboard; and the air cooling assembly 30 is arranged on the surface of the shell 10, the heat dissipation notch A is covered, and the air cooling assembly 30 is used for dissipating heat inside the cavity.
In this embodiment, by forming the heat dissipation notch a on the surface of the casing 10, it should be understood that the casing 10 is configured to have a back surface and a front surface, and four side surfaces enclosed between the front surface and the back surface, wherein the back surface is used for accommodating the whole casing 10, the heat dissipation notch a is formed on the front surface, the inside of the cavity is used for fixing the chip assembly 20, and the chip assembly 20 extends to the outside of the side surface to form the data connector 21, in order to dissipate heat inside the cavity, the air cooling assembly 30 may be disposed on the front surface, and the air cooling assembly 30 is used for dissipating heat, so as to reduce the temperature inside the cavity, and improve the heat dissipation capability of the solid state disk 100 during high-load operation.
Specifically, the air cooling module 30 includes: the heat dissipation plate 31, the fan 32 is embedded in the middle of the heat dissipation plate 31, the heat dissipation plate 31 is fixed in the shell 10, the heat dissipation notch a is formed in the surface of the shell 10, the heat dissipation notch a is covered with the heat dissipation plate 31, and the fan 32 is located in the heat dissipation notch a. In this embodiment, the air cooling assembly 30 may include a heat dissipation plate 31 and a micro fan 32, wherein the fan 32 is embedded in the center of the heat dissipation plate 31, and when the heat dissipation plate 31 is fixed on the front surface of the casing 10, the fan 32 is located in the center of the heat dissipation gap a, so as to rapidly suck hot air inside the cavity, and input outside air to cool down, thereby reducing the temperature inside the cavity and improving the heat dissipation capability of the solid state disk 100 during high load operation.
Specifically, the heat dissipation plate 31 is further provided with a plurality of first heat dissipation grooves B, and the first heat dissipation grooves B are communicated with the heat dissipation notches a. In this embodiment, in order to improve the heat dissipation effect of the air cooling assembly 30, a plurality of first heat dissipation grooves B may be formed on the heat dissipation plate 31, so that the fan 32 can input the external air into the cavity, reduce the temperature inside the cavity, and improve the heat dissipation capability of the solid state disk 100 during high load operation.
Specifically, a plurality of second heat dissipation grooves C are further formed in the heat dissipation plate 31, and the second heat dissipation grooves C are communicated with the heat dissipation notches a. In this embodiment, in order to improve the heat dissipation effect of the air cooling assembly 30, a plurality of second heat dissipation grooves C may be formed on the heat dissipation plate 31, so that the fan 32 can input the external air into the cavity, reduce the temperature inside the cavity, and improve the heat dissipation capability of the solid state disk 100 during high load operation.
The first radiating grooves B are of strip-shaped structures, and the second radiating grooves C are of arc-shaped structures.
Specifically, the first heat dissipation grooves B and the second heat dissipation grooves C are annularly arranged along the fan 32. In this embodiment, in order to further improve the heat dissipation effect inside the cavity, the first heat dissipation grooves B and the second heat dissipation grooves C may be annularly distributed along the fan 32.
Specifically, a plurality of heat dissipation holes D are formed in the side wall of the housing 10, and the heat dissipation holes D are all communicated with the cavity. In this embodiment, a plurality of heat dissipation holes D may be formed in the side wall of the casing 10, that is, the side surface of the casing 10, so as to improve the air circulation speed inside the cavity, reduce the temperature inside the cavity, and improve the heat dissipation capability of the solid state disk 100 during high load operation.
Specifically, each heat dissipation hole D is covered with a dust screen 40. In this embodiment, in order to prevent external dust from entering the cavity, the fan 32 may generate suction force, the heat dissipation notch a is used as an air outlet, the heat dissipation hole D is used as an air inlet, and the dust screen 40 is irradiated at the heat dissipation hole D, so as to prevent the dust from entering the cavity.
Specifically, the heat dissipation plate 31 is an aluminum plate. In the present embodiment, in order to further improve the heat dissipation effect, the heat dissipation plate 31 is preferably an aluminum plate, or may be a water-cooled plate or the like.
Specifically, an insulating graphite heat dissipation film is attached to the inside of the cavity. In this embodiment, an insulating graphite heat dissipation film (not shown) is attached to the inside of the cavity, so that the heat dissipation effect inside the cavity can be effectively improved, the temperature inside the cavity can be reduced, and the heat dissipation capability of the solid state disk 100 during high-load operation can be improved.
Specifically, the housing 10 is made of an aluminum material. In this embodiment, the housing 10 is made of aluminum for easy processing and heat dissipation.
The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application is included in other related technical fields in the patent protection scope of the present invention.
Claims (10)
1. The solid state disk with high heat dissipation performance is characterized by comprising:
the heat dissipation device comprises a shell, wherein a cavity is formed in the shell, a heat dissipation notch is formed in the surface of one side of the shell, and the heat dissipation notch is communicated with the cavity;
the chip assembly is arranged in the cavity, one end of the chip assembly in the length direction penetrates through the shell and extends to the outside of the shell to form a data connector, and the data connector is used for being connected with an external main board;
the air cooling assembly is arranged on the surface of the shell and covers the heat dissipation notch, and the air cooling assembly is used for dissipating heat inside the cavity.
2. The solid state disk with high heat dissipation performance of claim 1, wherein the air cooling assembly comprises:
the heat dissipation plate is characterized in that a fan is embedded in the middle of the heat dissipation plate, the heat dissipation plate is fixed to the shell, the heat dissipation notch is formed in the surface of the shell and covers the heat dissipation notch, and the fan is located in the heat dissipation notch.
3. The solid state disk with high heat dissipation performance as claimed in claim 2, wherein the heat dissipation plate further has a plurality of first heat dissipation grooves, and the first heat dissipation grooves are connected to the heat dissipation notches.
4. The solid state disk with high heat dissipation performance as claimed in claim 3, wherein the heat dissipation plate further has a plurality of second heat dissipation grooves, and the second heat dissipation grooves are connected to the heat dissipation notches.
5. The solid state disk with high heat dissipation performance of claim 4, wherein a plurality of first heat dissipation grooves and a plurality of second heat dissipation grooves are distributed along the ring of the fan.
6. The solid state disk with high heat dissipation performance as claimed in any one of claims 2 to 5, wherein a plurality of heat dissipation holes are formed in a sidewall of the casing, and the plurality of heat dissipation holes are all communicated with the cavity.
7. The solid state disk with high heat dissipation performance as claimed in claim 6, wherein each heat dissipation hole is covered with a dust screen.
8. The solid state disk with high heat dissipation performance according to any one of claims 2 to 5, wherein the heat dissipation plate is an aluminum plate.
9. The solid state disk with high heat dissipation performance as claimed in any one of claims 1 to 5, wherein an insulating graphite heat dissipation film is attached to the inside of the cavity.
10. The high heat dissipation solid state disk of claim 9, wherein the housing is fabricated from an aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120144547.4U CN214253879U (en) | 2021-01-19 | 2021-01-19 | Solid state hard drives of high heat dissipating ability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120144547.4U CN214253879U (en) | 2021-01-19 | 2021-01-19 | Solid state hard drives of high heat dissipating ability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214253879U true CN214253879U (en) | 2021-09-21 |
Family
ID=77751217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120144547.4U Active CN214253879U (en) | 2021-01-19 | 2021-01-19 | Solid state hard drives of high heat dissipating ability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214253879U (en) |
-
2021
- 2021-01-19 CN CN202120144547.4U patent/CN214253879U/en active Active
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