CN218122591U - Mainboard heat dissipation assembly and electronic product - Google Patents
Mainboard heat dissipation assembly and electronic product Download PDFInfo
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- CN218122591U CN218122591U CN202221708037.6U CN202221708037U CN218122591U CN 218122591 U CN218122591 U CN 218122591U CN 202221708037 U CN202221708037 U CN 202221708037U CN 218122591 U CN218122591 U CN 218122591U
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- heat dissipation
- heat
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- motherboard
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Abstract
The utility model discloses a mainboard radiator unit and electronic product, mainboard radiator unit includes the mainboard, first heat radiation structure and second heat radiation structure, the mainboard has relative first heat dissipation side and second heat dissipation side, first heat dissipation side is used for installing the treater, first heat radiation side is located to first heat radiation structure, be used for conducting the heat of first heat dissipation side to one side of electronic product, second heat radiation side is located to the second heat radiation structure, be used for conducting the heat of second heat dissipation side to electronic product's opposite side, so through first heat radiation structure and second heat radiation structure, conduct the casing of electronic product both sides with the heat of mainboard both sides simultaneously, be favorable to the quick reduction the temperature of mainboard to help improving electronic product's radiating effect.
Description
Technical Field
The utility model relates to an electronic product heat dissipation technical field, in particular to mainboard radiator unit and electronic product.
Background
At present, electronic products are thinner and thinner, for example, three-proofing tablet computers are smaller and more exquisite in structure and better in mobility and portability compared with three-proofing notebook computers, but the tablet computers are too high in temperature and may cause the computer to crash or even burn out due to the fact that the tablet computers are compact in structure and generally weak in heat dissipation function. Three proofings panel computer need be waterproof, dustproof, wholly is in a confined state, leads to the heat dissipation harder, so three proofings panel computer selects low-power consumption, low performance's treater more to ensure that three proofings panel computer can not have the too high risk of temperature, but can not satisfy the customer that has higher demand to three proofings panel computer performance. Therefore, how to improve the heat dissipation effect of the three-prevention tablet computer to meet the heat dissipation requirement of the high-performance three-prevention tablet computer is a problem which needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a mainboard radiator unit and electronic product, aim at solving the problem that how to improve the radiating effect of three proofings panel computer in order to satisfy the heat dissipation requirement of high performance three proofings panel computer.
In order to achieve the above object, the utility model provides a mainboard cooling module for the mainboard heat dissipation of electronic product, mainboard cooling module includes:
the main board is provided with a first heat dissipation side end and a second heat dissipation side end which are opposite, and the first heat dissipation side end is used for mounting the processor;
the first heat dissipation structure is arranged at the first heat dissipation side end and used for conducting heat of the first heat dissipation side end to one side of an electronic product; and the number of the first and second groups,
and the second heat dissipation structure is arranged at the second heat dissipation side end and used for transferring the heat of the second heat dissipation side end to the other side of the electronic product.
Optionally, the first heat dissipation structure includes:
the heat-conducting phase-change material is arranged at the first heat-radiating side end; and the number of the first and second groups,
and the heat conduction plate is arranged on one side of the heat conduction phase change material, which deviates from the first heat dissipation side end.
Optionally, the second heat dissipation structure includes:
the heat dissipation plate is arranged at the second heat dissipation side end; and the number of the first and second groups,
and the plurality of radiating fins are arranged on one side of the radiating plate, which deviates from the second radiating side end.
Optionally, a heat conducting silica gel is arranged on one side of the heat conducting plate, which is away from the first heat radiating side end; and/or the presence of a gas in the gas,
and heat-conducting silica gel is arranged between the mainboard and the heat dissipation plate.
Optionally, a positioning column is arranged at one end of the heat dissipation plate, which is far away from the heat dissipation fins, and the main board is provided with a positioning hole corresponding to the positioning column.
Optionally, the motherboard heat dissipation assembly further includes:
and the fixing structure is used for clamping and fixing the first heat dissipation structure and the second heat dissipation structure on the mainboard.
Optionally, the first heat dissipation structure is provided with a first through hole, the main board is provided with a second through hole, and the second heat dissipation structure is provided with a third through hole;
the fixing structure comprises a fixing bolt and a fixing nut, and the fixing bolt penetrates through the first through hole, the second through hole and the third through hole in sequence and then penetrates through the fixing nut.
Optionally, the first through hole extends horizontally and is disposed on the heat conducting plate;
the fixing structure further comprises an elastic sheet arranged on one side, away from the first heat dissipation side end, of the heat conduction plate, the elastic sheet is arranged corresponding to the first through hole, one end of the elastic sheet is fixed on the heat conduction plate, and the other end of the elastic sheet is installed on the fixing bolt.
Optionally, a support column is disposed at the first heat dissipation side end, and the support column is located between the motherboard and the first heat dissipation structure.
Furthermore, the utility model also provides an electronic product, electronic product includes foretell mainboard radiator unit.
The technical scheme of the utility model in, will through setting up first heat radiation structure the heat conduction of the first heat dissipation side of mainboard is to one side of electronic product, will through setting up the second heat radiation structure the heat conduction of the second heat dissipation side of mainboard is to the opposite side of electronic product, so pass through first heat radiation structure and second heat radiation structure will the heat of mainboard both sides is conducted to the casing of electronic product both sides simultaneously, is favorable to reducing fast the temperature of mainboard to help improving electronic product's radiating effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is an exploded schematic view of an embodiment of a motherboard heat dissipation assembly according to the present invention;
fig. 2 is a schematic cross-sectional structural view of the heat dissipation assembly of the motherboard in fig. 1;
fig. 3 is a schematic top view of the first heat dissipation structure in fig. 1;
fig. 4 is a schematic cross-sectional view of the second heat dissipation structure in fig. 1.
The reference numbers indicate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Mainboard |
32 | Heat radiation fin |
| 1 | |
33 | |
| 11 | First heat radiation side end | 4 | |
| 12 | Second heat |
41 | |
| 2 | First |
42 | |
| 21 | Thermally conductive |
5 | |
| 22 | |
6 | Heat-conducting |
| 3 | Second |
7 | Processor with a memory for storing a plurality of |
| 31 | |
8 | Shell body |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if the present invention relates to a directional indication, the directional indication is only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture, and if the specific posture is changed, the directional indication is changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
At present, electronic products are thinner and thinner, for example, three-proofing tablet computers are smaller and more exquisite in structure and better in mobility and portability compared with three-proofing notebook computers, but the tablet computers are too high in temperature and may cause the computer to crash or even burn out due to the fact that the tablet computers are compact in structure and generally weak in heat dissipation function. Three proofings panel computer need waterproof, dustproof, wholly is in a encapsulated situation, leads to the heat dissipation harder, so the treater of low-power consumption, low performance is selected to three proofings panel computer many to ensure that three proofings panel computer can not have the too high risk of temperature, but can not satisfy the customer that has higher demand to three proofings panel computer performance.
In view of this, the utility model provides a mainboard radiator unit aims at solving the problem that how to improve the radiating effect of three proofings panel computer in order to satisfy the heat dissipation requirement of high performance three proofings panel computer. Fig. 1 to 4 are schematic structural diagrams of an embodiment of the motherboard heat dissipation assembly provided in the present invention.
Referring to fig. 1 and 2, the motherboard heat dissipation assembly 100 includes a motherboard 1, a first heat dissipation structure 2 and a second heat dissipation structure 3, the motherboard 1 has a first heat dissipation side 11 and a second heat dissipation side 12 opposite to each other, the first heat dissipation side 11 is used for mounting a processor 7, the first heat dissipation structure 2 is disposed at the first heat dissipation side 11 and is used for transferring heat of the first heat dissipation side 11 to one side of an electronic product, and the second heat dissipation structure 3 is disposed at the second heat dissipation side 12 and is used for transferring heat of the second heat dissipation side 12 to the other side of the electronic product.
The technical scheme of the utility model in, will through setting up first heat radiation structure 2 the heat conduction of the first heat dissipation side 11 of mainboard 1 to one side of electronic product is through setting up second heat radiation structure 3 will the heat conduction of the second heat dissipation side 12 of mainboard 1 to the opposite side of electronic product, so pass through first heat radiation structure 2 and second heat radiation structure 3, will the heat of 1 both sides of mainboard conducts the casing 8 to the electronic product both sides simultaneously, is favorable to reducing fast the temperature of mainboard 1 to help improving electronic product's radiating effect.
Further, referring to fig. 1, fig. 2 and fig. 4, since the processor 7 with a large heat value is installed at the first heat dissipation side end 11, so that the temperature of the first heat dissipation side end 11 is high, in order to timely reduce the temperature of the first heat dissipation side end 11, in this embodiment, the first heat dissipation structure 2 includes a heat conduction phase change material 21 and a heat conduction plate 22, the heat conduction phase change material 21 is disposed at the first heat dissipation side end 11, and the heat conduction plate 22 is disposed at a side of the heat conduction phase change material 21 away from the first heat dissipation side end 11. Specifically, the heat-conducting phase-change material 21 is disposed between the processor 7 and the heat-conducting plate 22, and the processor 7, the heat-conducting phase-change material 21 and the heat-conducting plate 22 are sequentially stacked. It can be understood that, when the temperature of the first heat dissipation side end 11 reaches the phase transition temperature, the heat conduction phase change material 21 has good elasticity and plasticity similar to the heat conduction gasket, so that the processor 7 can be prevented from being in rigid contact with the heat conduction plate 22, and the risk of damage to the processor can be reduced; when the temperature of the first heat dissipation side end 11 rises to the phase transition temperature, the phase transition occurs to be a liquid state, which not only can absorb a large amount of heat, but also can effectively wet a thermal interface, has the same filling capability as that of a heat conductive paste, can fill interface gaps to the maximum extent, can greatly reduce the thermal resistance between the main board 1 and the heat conductive plate 22, so as to rapidly transfer the heat of the first heat dissipation side end 11 to the housing 8 of an electronic product, thereby being beneficial to rapidly reducing the temperature of the first heat dissipation side end 11.
It can be understood that the heat conducting plate 22 may be a metal such as iron or copper, and in this embodiment, the heat conducting plate 22 is a heat conducting copper plate, and since copper has excellent heat conductivity, the heat conducting copper plate is used to conduct the heat of the heat conducting phase change material 21 to the housing 8 of the electronic product in time, thereby helping to improve the heat dissipation effect of the first heat dissipation structure 2.
Further, the second heat dissipation structure 3 includes a heat dissipation plate 31 and a plurality of heat dissipation fins 32, the heat dissipation plate 31 is disposed at the second heat dissipation side end 12, the plurality of heat dissipation fins 32 are disposed at a side of the heat dissipation plate 31 away from the second heat dissipation side end 12, so as to set the heat dissipation plate 31 to conduct the heat of the second heat dissipation side end 12 to the heat dissipation fins 32, and meanwhile, by disposing the heat dissipation fins 32, the heat dissipation area of the heat dissipation plate 31 is increased, so as to improve the heat dissipation effect of the heat dissipation plate 31, thereby facilitating to conduct the heat of the second heat dissipation side end 12 to the other side of the electronic product quickly.
It should be noted that the heat dissipation plate 31 and the heat dissipation fins 32 may be integrally formed, or may be assembled, which is not limited by the present invention.
Compared with an active heat dissipation mode of dissipating heat by using a fan, in the embodiment, the heat-conducting phase-change material and the heat-conducting plate are matched to dissipate heat at one side of the electronic product, and the size of a passive heat dissipation mode of dissipating heat at the other side of the electronic product by matching the heat-dissipating plate 31 and the heat-dissipating fins 32 is smaller, so that the electronic product is thinned.
In order to improve the heat dissipation effect of the first heat dissipation structure 2, in some embodiments, one side of the heat conduction plate 22 away from the first heat dissipation side end 11 is provided with a heat conduction silica gel 6, and the heat conduction silica gel 6 is arranged to fill a gap between the heat conduction plate 22 and the casing 8 of the electronic product, so as to reduce the thermal resistance between the heat conduction plate 22 and the casing 8 of the electronic product, so that the heat of the heat conduction plate 22 is conducted to the casing 8 of the electronic product in time, thereby facilitating the improvement of the heat dissipation effect of the first heat dissipation structure 2.
In order to improve the heat dissipation effect of the second heat dissipation structure 3, in some embodiments, the heat conductive silica gel 6 is disposed between the main board 1 and the heat dissipation plate 31, and the heat conductive silica gel 6 is disposed to fill the gap between the heat dissipation plate 31 and the main board 1, so as to reduce the thermal resistance between the heat dissipation plate 31 and the main board 1, so as to conduct the heat of the main board 1 to the heat dissipation plate 31 in time, thereby facilitating the improvement of the heat dissipation effect of the second heat dissipation structure 3.
It should be noted that, according to the two related technical features, one side of the heat conducting plate 22 away from the first heat dissipation side end 11 is provided with the heat conducting silica gel 6, and the other side of the main board 1 and the heat dissipation plate 31 is provided with the heat conducting silica gel 6.
Furthermore, one end of the heat dissipation plate 31 away from the heat dissipation fins 32 is provided with positioning posts 33, the main board 1 is provided with positioning holes corresponding to the positioning posts 33, and the positioning posts 33 are arranged to cooperate with the positioning holes on the main board 1 so as to position the heat dissipation plate 31 at the second heat dissipation side end 12, thereby facilitating the quick installation of the heat dissipation plate 31 on the main board 1. Furthermore, a plurality of positioning columns 33 are provided, and the plurality of positioning columns 33 are provided at intervals on the heat dissipation plate 31, so as to improve positioning accuracy.
It can be understood that the positioning column 33 may be fixed to the heat dissipation plate 31 by adhesion, or may be fixed to the heat dissipation plate 31 by screws, and the present invention is not limited thereto.
Furthermore, the motherboard heat dissipation assembly further comprises a fixing structure 4, wherein the fixing structure 4 is used for clamping and fixing the first heat dissipation structure 2 and the second heat dissipation structure 3 to the host 1, and thus, the distances between the first heat dissipation structure 2 and the motherboard 1 and the distances between the second heat dissipation structure 3 and the motherboard 1 can be shortened, and the heat dissipation capability of the first heat dissipation structure 2 and the second heat dissipation structure 3 to the motherboard 1 can be improved; meanwhile, the fixing structure 4 fixes the first heat dissipation structure 2 and the second heat dissipation structure 3 to the motherboard 1, so as to avoid fixing the first heat dissipation structure 2 and the second heat dissipation structure 3, respectively, thereby facilitating simplification of the structure of the motherboard heat dissipation assembly 100.
Further, first heat radiation structure 2 is equipped with first through-hole, mainboard 1 is equipped with the second through-hole, second heat radiation structure 3 is equipped with the third through-hole, fixed knot constructs including fixing bolt 41 and fixation nut, fixing bolt passes in proper order wear to locate behind first through-hole, second through-hole and the third through-hole fixation nut, so set up, through mutually supporting fixing bolt 41 and fixation nut, in order with first heat radiation structure 2 with locking of second heat radiation structure 3 is fixed in mainboard 1.
Specifically, the first through hole is disposed in the heat conducting plate 22 of the first heat dissipation structure 2, and the third through hole is disposed in the heat dissipation plate 31 of the second heat dissipation structure 3.
Because the heat conducting plate 22 has a large mass, when a user falls off during use, a large impact is formed, and the components on the motherboard 1 are easily damaged, for this reason, please refer to fig. 1 and 3, the first through hole extends horizontally and is disposed in the heat conducting plate 22; the fixing structure 4 further comprises an elastic sheet 42 arranged on one side, away from the first heat dissipation side end 11, of the heat conduction plate 22, the elastic sheet 42 corresponds to the first through hole, one end of the elastic sheet 42 is fixed to the heat conduction plate 22, the other end of the elastic sheet 42 is arranged on the fixing bolt, and the heat conduction plate 22 is elastically pressed and held by the heat conduction phase change material 21 by the aid of elastic force of the elastic sheet 42, so that impact of the heat conduction plate 22 on the mainboard 1 is buffered, and damage to components on the mainboard 1 is avoided.
Because there are many components on the motherboard 1, such as the processor 7, in order to conveniently set up the components on the motherboard 1, a space needs to be left between the first heat dissipation structure 2 and the motherboard 1, for this reason, in this embodiment, the first heat dissipation side end 11 is provided with the support column 5, and the support column 5 is located between the motherboard 1 and the first heat dissipation structure 2. Specifically, support column 5 sets up between mainboard 1 and heat-conducting plate 22, so set up, can conveniently control the heat-conducting plate 22 with interval between the mainboard 1 avoids the heat-conducting plate 22 with the component contact on the mainboard 1. Furthermore, the supporting columns 5 are multiple, and the supporting columns are arranged at the first heat dissipation side end 11 at intervals.
It should be noted that, the connection mode between the support pillar 5 and the main board 1 has a plurality of, the support pillar 5 may be fixed to the main board 1 by welding, and may also be fixed to the main board 1 by screws, etc., and the present invention is not limited thereto.
In addition, in order to achieve the above object, the present invention further provides an electronic product, wherein the electronic product includes the motherboard heat sink assembly 100 as described above, and the motherboard heat sink assembly 100 is disposed in the housing 8 of the electronic product. It should be noted that, the structure of the motherboard heat dissipation assembly 100 in the electronic product may refer to the embodiment of the motherboard heat dissipation assembly 100, and details are not repeated here; because the utility model provides an above-mentioned mainboard radiator unit 100 has been used in the electronic product, consequently, the utility model provides an electronic product's embodiment includes all technical scheme of the whole embodiments of above-mentioned mainboard radiator unit 100, and the technological effect that reaches is also identical, no longer gives unnecessary details here. Further, the electronic product includes, but is not limited to, a tablet computer.
The above only be the preferred embodiment of the present invention, not consequently the restriction the patent scope of the present invention, all be in the utility model discloses a under the design, utilize the equivalent structure transform of doing of the content of the specification and the attached drawing, or direct/indirect application all includes in other relevant technical field the utility model discloses a patent protection is within scope.
Claims (10)
1. The utility model provides a mainboard heat dissipation assembly for the mainboard heat dissipation of electronic product, its characterized in that, mainboard heat dissipation assembly includes:
the main board is provided with a first heat dissipation side end and a second heat dissipation side end which are opposite, and the first heat dissipation side end is used for mounting the processor;
the first heat dissipation structure is arranged at the first heat dissipation side end and used for conducting heat of the first heat dissipation side end to one side of the electronic product; and the number of the first and second groups,
the second heat dissipation structure is arranged at the second heat dissipation side end and used for conducting the heat of the second heat dissipation side end to the other side of the electronic product.
2. A motherboard heat sink assembly as recited in claim 1 wherein said first heat dissipation structure comprises:
the heat-conducting phase-change material is arranged at the first heat-radiating side end; and the number of the first and second groups,
the heat conducting plate is arranged on one side, deviating from the first heat dissipation side end, of the heat conducting phase-change material.
3. A motherboard heat sink assembly as recited in claim 2 wherein said second heat dissipation structure comprises:
the heat dissipation plate is arranged at the second heat dissipation side end; and the number of the first and second groups,
and the plurality of radiating fins are arranged on one side of the radiating plate, which is deviated from the second radiating side end.
4. A motherboard heat sink assembly as recited in claim 3 wherein one side of said thermal conductive plate facing away from said first heat sink side end is provided with thermal conductive silicone; and/or the presence of a gas in the gas,
and heat-conducting silica gel is arranged between the main board and the heat dissipation plate.
5. The motherboard heat dissipation assembly as recited in claim 3, wherein a positioning post is disposed at an end of the heat dissipation plate away from the heat dissipation fins, and the motherboard has a positioning hole corresponding to the positioning post.
6. A motherboard heat sink assembly as recited in any of claims 3 to 5 further comprising:
and the fixing structure is used for clamping and fixing the first heat dissipation structure and the second heat dissipation structure on the mainboard.
7. A motherboard heat sink assembly as recited in claim 6 wherein said first heat dissipating structure is provided with a first through hole, said motherboard is provided with a second through hole, and said second heat dissipating structure is provided with a third through hole;
the fixing structure comprises a fixing bolt and a fixing nut, and the fixing bolt penetrates through the first through hole, the second through hole and the third through hole in sequence and then penetrates through the fixing nut.
8. A motherboard heat sink assembly as recited in claim 7, wherein said first through hole is provided in said heat conductive plate to extend in a horizontal direction;
the fixing structure further comprises an elastic sheet arranged on one side, deviating from the first heat dissipation side end, of the heat conduction plate, the elastic sheet corresponds to the first through hole, one end of the elastic sheet is fixed on the heat conduction plate, and the other end of the elastic sheet is installed on the fixing bolt.
9. A motherboard heat dissipation assembly as recited in claim 1, wherein the first heat dissipation side end is provided with a support post, and the support post is located between the motherboard and the first heat dissipation structure.
10. An electronic product, comprising the motherboard heat dissipation assembly as recited in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221708037.6U CN218122591U (en) | 2022-07-04 | 2022-07-04 | Mainboard heat dissipation assembly and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221708037.6U CN218122591U (en) | 2022-07-04 | 2022-07-04 | Mainboard heat dissipation assembly and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218122591U true CN218122591U (en) | 2022-12-23 |
Family
ID=84515578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221708037.6U Active CN218122591U (en) | 2022-07-04 | 2022-07-04 | Mainboard heat dissipation assembly and electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218122591U (en) |
-
2022
- 2022-07-04 CN CN202221708037.6U patent/CN218122591U/en active Active
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