CN214135627U - Novel special long-life grinding apparatus of sapphire polishing - Google Patents
Novel special long-life grinding apparatus of sapphire polishing Download PDFInfo
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- CN214135627U CN214135627U CN202023286424.9U CN202023286424U CN214135627U CN 214135627 U CN214135627 U CN 214135627U CN 202023286424 U CN202023286424 U CN 202023286424U CN 214135627 U CN214135627 U CN 214135627U
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Abstract
The utility model discloses a novel special long-life grinding apparatus of sapphire polishing, it includes base member, base and resin plate, the base member with be equipped with quick connect structure between the resin plate, the base member with be equipped with buffer structure between the base, the base is equipped with round hole and multilateral hole. The utility model has the advantages that the rapid connection structure is arranged to ensure that the base body and the resin disc are of the detachable connection structure, thereby facilitating the rapid connection and detachment between the base body and the resin disc, saving the operation steps, saving the time and ensuring the service efficiency of the long-life grinding tool; the buffer structure is used for reducing the influence of external vibration on the grinding tool, the service life, the machining efficiency and the effect of the grinding tool are improved, the round hole and the polygonal hole are arranged to form a double-hole structure, radial jumping of a base body is limited, vibration cannot be generated due to large fit clearance when the grinding tool rotates at a high speed, the grinding precision is improved, the safety performance is improved, the precision grinding effect is achieved, and the efficiency is improved.
Description
Technical Field
The utility model relates to a technical field of sapphire processing of polishing, concretely relates to novel special long-life grinding apparatus of sapphire polishing.
Background
The sapphire has excellent heat conductivity, electrical insulation, light transmission, chemical stability, a series of excellent characteristics of high temperature resistance, high strength, high hardness and the like, and can be widely applied to the fields with higher requirements such as national defense, scientific research, civil use and the like. However, sapphire is also one of the materials which are extremely difficult to process, and the requirement for the grinding tool for processing the material is very high. The more mature technology for polishing sapphire surface in the industry at present is diamond polishing technology (DMP) and chemical mechanical polishing (hereinafter referred to as CMP). The polishing principle is that the mirror polishing effect is achieved by high-speed rotation of the upper and lower disc surfaces and the action of polishing liquid. The existing carrier used for polishing is a grinding tool, the existing grinding tool for sapphire polishing processing adopts a diamond grinding tool, the existing diamond grinding tool is mostly of an integral structure, a base body and a grinding disc are undetachable and connected, when the loss of a grinding material layer on the surface of the grinding disc is too large, the grinding wheel needs to be integrally replaced, the grinding wheel base body cannot be reused, the grinding wheel needs to be integrally replaced, and the processing cost is high; in the polishing process of the existing diamond abrasive tool, vibration can be generated in the driving process of driving equipment, the diamond abrasive layer of the abrasive layer is easily influenced by the vibration, the vibration can cause the diamonds on the abrasive layer to continuously impact the surface, and the impact resistance of the diamonds is poor, so that the loss of the diamond abrasive layer is faster, the service life, the polishing quality and the polishing effect of the diamond abrasive layer are influenced, the smoothness of the surface of a polished product is influenced, and the noise is large; and the adhesion and the bonding force of diamond particles on the existing grinding disc are poor, and the diamond particles are easy to fall off, so that the use efficiency and the effect of the grinding tool are influenced.
The center mounting hole of the conventional grindstone is a circular hole, has a disk shape, and is generally used in a high-speed rotation state. Therefore, the matching of the hole and the assembling shaft is very important, and the mounting hole cracks when the matching gap is too small during assembling, so the use is unsafe; the too big meeting vibration of fit clearance can influence grinding effect when using, bumps moreover between grinding apparatus and the work piece, can cause when serious to burst, causes the injury for personnel and equipment. Therefore, the size of the mounting hole of the grinding tool is strictly required by both international standards and national standards. With the development of the machining industry, precision grinding is more and more widely applied, and the requirements of international standards and national standards on the size of a mounting hole cannot meet the requirements. However, the requirement of the over-precise aperture size makes the manufacture of the grinding tool more difficult.
Disclosure of Invention
The utility model discloses a to present technique not enough, provide a novel special long-life grinding apparatus of sapphire polishing.
The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is:
the utility model provides a novel special long-life grinding apparatus of sapphire polishing, novel special long-life grinding apparatus of sapphire polishing includes base member and resin dish, the base member with be equipped with quick connect structure between the resin dish, the resin dish is equipped with the abrasive material layer, the base member is equipped with the through-hole, the through-hole is equipped with the base, the base member with be equipped with buffer structure between the base, the base is equipped with the installation through-hole, the installation through-hole includes that it is the multilateral hole to be along thickness direction part, the part is the multilateral hole, the circle of round hole does the polygonal inscribed circle in multilateral hole.
The improved structure comprises a heat-resistant buffer layer and a plurality of buffer springs, wherein the heat-resistant buffer layer is arranged between a base and a base body, the base body is provided with a plurality of grooves, the base is provided with a plurality of grooves I, the grooves and the grooves form a placing cavity in a one-to-one correspondence mode, the buffer springs are arranged in the placing cavity respectively, the base is further provided with a plurality of groups of connecting rod groups, the connecting rod groups are arranged at the outer edge of the base in an annular array mode, the connecting rod groups are formed by two connecting rods, the annular array at the inner edge of the base body is provided with a plurality of groups of connecting groove groups, the connecting groove groups are formed by two connecting grooves, and the end parts of the connecting rods are inserted into the connecting grooves respectively.
The improved structure comprises a plurality of buckle hooks and a plurality of buckle holes, wherein the buckle holes are formed in the base body, and the buckle hooks are arranged on the resin disc.
The improved structure is characterized in that the resin disc is provided with a first through hole, the first through hole is inverted with an inclined plane, the grinding material layer comprises a resin combining layer and a diamond polishing layer, the diamond polishing layer is composed of a plurality of diamond particles, and the surfaces of the diamond particles are plated with metal clothes.
The further improvement is that the diamond particles are distributed in a lump shape, a column shape or a heap shape, and the particle size of the diamond particles is 160-850 mu m.
In a further improvement, the thickness of the substrate is 20mm, and the diameter of the substrate is 200 mm.
In a further improvement, the thickness of the resin disc is 10mm, the diameter of the resin disc is 200mm, and the diameter of the first through hole is 100 mm.
In a further improvement, the height of the circular hole is 1/2 of the thickness of the base body.
In a further improvement, the polygon of the polygonal hole is an even number polygon.
The utility model has the advantages that: the utility model discloses a set up quick connect structure and make base member and resin dish be removable connect structure, when the resin dish appears the loss and needs to be changed for a long time using, need not to dismantle long-life grinding apparatus wholly, when making the base member can reuse, reduce cost, and through the quick connect structure be convenient for the base member with resin dish between quick connect and dismantle, save the operating procedure, save time, guarantee the availability factor of long-life grinding apparatus; the heat-resistant buffer layer and the plurality of buffer springs form a multiple buffer structure, so that the buffer effect is greatly improved, the influence of external vibration on the long-life grinding tool is prevented, the processing efficiency and the effect of the long-life grinding tool are improved, the service life of the long-life grinding tool is prolonged, the plurality of groups of connecting rod groups are used for positioning, the motion synchronism of the base body and the base is ensured, and the grinding efficiency and the grinding quality are ensured; the double-hole structure is formed by arranging the round hole and the polygonal hole, when the double-hole structure is assembled, the main shaft penetrates through the installation through hole, and the special fixture is embedded in the polygonal hole and fixed on the main shaft, so that the radial run-out of a base body is limited, vibration caused by large fit clearance is avoided when the double-hole structure rotates at a high speed, the grinding precision is improved, the safety performance is improved, the precision grinding effect is achieved, and the efficiency is improved; make long-life grinding apparatus can be used to carry out certain chamfer processing to the edge of sapphire through setting up the inclined plane, improve the functionality, be used for improving the cohesion that the layer of polishing of diamond adheres to the resin bonding layer through plating the metallic clothing on diamond particle surface for the resin bonding layer firmly is held the diamond layer of polishing, thereby improves machining efficiency and effect.
The present invention will be further described with reference to the accompanying drawings and the following detailed description.
Drawings
Fig. 1 is a schematic view of an overall structure of the novel long-life grinding tool for sapphire polishing according to the embodiment;
FIG. 2 is a schematic sectional view of a-A of the novel long-life grinding tool for sapphire polishing in accordance with the present embodiment;
FIG. 3 is a schematic cross-sectional view of a novel long-life grinding tool B-B for sapphire polishing according to the present embodiment;
fig. 4 is an enlarged schematic view of C in this embodiment.
In the figure: 1. the grinding tool comprises a long-life grinding tool, 2 parts of a base body, 3 parts of a resin disc, 4 parts of a quick connection structure, 5 parts of an abrasive layer, 6 parts of a base, 7 parts of a buffer structure, 60 parts of an installation through hole, 600 parts of a round hole, 601 parts of a polygonal hole, 70 parts of a heat-resistant buffer layer, 71 parts of a buffer spring, 8 parts of a placement cavity, 61 parts of a connecting rod group, 40 parts of a buckling hook, 41 parts of a buckling hole, 30 parts of a first through hole, 300 parts of an inclined plane, 50 parts of a resin bonding layer and 51 parts of a diamond grinding layer.
Detailed Description
The following description is only a preferred embodiment of the present invention, and does not limit the scope of the present invention.
Example, referring to fig. 1 to 4, a novel long-life grinding tool 1 specially used for sapphire polishing comprises a base body 2 and a resin disc 3, a quick-connection structure 4 is arranged between the base body 2 and the resin disc 3, the resin disc 3 is provided with an abrasive layer 5, the base body 2 is provided with a through hole, the through hole is provided with a base 6, a buffer structure 7 is arranged between the base body 2 and the base 6, the base 6 is provided with a mounting through hole 60, the mounting through hole 60 comprises a circular hole 600 partially formed in the thickness direction and a polygonal hole 601 partially formed in the thickness direction, the circle of the circular hole 600 is an inscribed circle of a polygon of the polygonal hole 601, the circular hole 600 and the polygonal hole 601 form a double-hole structure, during assembly, a main shaft passes through the mounting through hole 60, and a special clamp is embedded in the polygonal hole 601 and fixed on the main shaft, so as to limit radial run-out of the base body 2, the grinding machine does not vibrate due to large fit clearance during high-speed rotation, improves the grinding precision, improves the safety performance, achieves the effect of precise grinding and improves the efficiency.
The buffer structure 7 comprises a heat-resistant buffer layer 70 and a plurality of buffer springs 71, the heat-resistant buffer layer 70 is arranged between the base 6 and the base body 2, the base body 2 is provided with a plurality of grooves, the base 6 is provided with a plurality of grooves I, the plurality of grooves and the grooves form a placing cavity 8 in a one-to-one correspondence manner, the plurality of buffer springs 71 are respectively arranged in the placing cavity 8, the base 6 is further provided with a plurality of groups of connecting rod groups 61, the plurality of groups of connecting rod groups 60 are arranged at the outer edge of the base 6 in an annular array manner, each group of connecting rod groups 61 is composed of two connecting rods, the annular array at the inner edge of the base body 2 is provided with a plurality of groups of connecting groove groups, each group of the connecting groove groups is composed of two connecting grooves, the end parts of the connecting rods are respectively inserted into the connecting grooves, and a multi-buffer structure is formed by arranging the heat-resistant buffer layer 70 and the plurality of buffer springs 71, improve buffering effect greatly to prevent that external vibration from moving the influence to long-life grinding apparatus 1, improve long-life grinding apparatus 1's machining efficiency and effect, and improve long-life grinding apparatus 1's life, multiunit connecting rod group 61 is used for the positioning action, guarantees base member 2 and base 4's motion synchronism, guarantees efficiency and the quality of polishing.
The diamond particles are distributed in a lump shape, a column shape or a heap shape, and the particle size of the diamond particles is 160-850 mu m.
The thickness of the substrate 2 is 20mm, and the diameter of the substrate 2 is 200 mm.
The thickness of the resin disc 3 is 10mm, the diameter of the resin disc 3 is 200mm, the diameter of the first through hole 30 is 100mm, and the height of the circular hole 600 is 1/2 of the thickness of the base body 2, namely the height of the circular hole 600 is 10 mm.
The polygon of the polygonal hole 601 is an even number polygon, and the polygonal hole 601 is an octagonal hole.
The utility model discloses a set up quick connect structure and make base member and resin dish be removable connect structure, when the resin dish appears the loss and needs to be changed for a long time using, need not to dismantle long-life grinding apparatus wholly, when making the base member can reuse, reduce cost, and through the quick connect structure be convenient for the base member with resin dish between quick connect and dismantle, save the operating procedure, save time, guarantee the availability factor of long-life grinding apparatus; the heat-resistant buffer layer and the plurality of buffer springs form a multiple buffer structure, so that the buffer effect is greatly improved, the influence of external vibration on the long-life grinding tool is prevented, the processing efficiency and the effect of the long-life grinding tool are improved, the service life of the long-life grinding tool is prolonged, the plurality of groups of connecting rod groups are used for positioning, the motion synchronism of the base body and the base is ensured, and the grinding efficiency and the grinding quality are ensured; the double-hole structure is formed by arranging the round hole and the polygonal hole, when the double-hole structure is assembled, the main shaft penetrates through the installation through hole, and the special fixture is embedded in the polygonal hole and fixed on the main shaft, so that the radial run-out of a base body is limited, vibration caused by large fit clearance is avoided when the double-hole structure rotates at a high speed, the grinding precision is improved, the safety performance is improved, the precision grinding effect is achieved, and the efficiency is improved; make long-life grinding apparatus can be used to carry out certain chamfer processing to the edge of sapphire through setting up the inclined plane, improve the functionality, be used for improving the cohesion that the layer of polishing of diamond adheres to the resin bonding layer through plating the metallic clothing on diamond particle surface for the resin bonding layer firmly is held the diamond layer of polishing, thereby improves machining efficiency and effect.
The utility model discloses be not limited to above-mentioned embodiment, adopt and the utility model discloses above-mentioned embodiment is the same or approximate structure or device, and other that obtain are used for novel special long-life grinding apparatus of sapphire polishing, all are in the utility model discloses an within the protection scope.
Claims (9)
1. The utility model provides a novel special long-life grinding apparatus of sapphire polishing, novel special long-life grinding apparatus of sapphire polishing includes base member and resin disk, its characterized in that: the base body and the resin disc are provided with a quick connection structure, the resin disc is provided with a grinding material layer, the base body is provided with a through hole, the through hole is provided with a base, a buffering structure is arranged between the base body and the base, the base is provided with an installation through hole, the installation through hole comprises a circular hole and a polygonal hole along the thickness direction, and the circle of the circular hole is a polygonal inscribed circle of the polygonal hole.
2. The novel special long-life grinding tool for sapphire polishing as claimed in claim 1, wherein: the buffer structure comprises a heat-resistant buffer layer and a plurality of buffer springs, the heat-resistant buffer layer is arranged between a base and a base body, the base body is provided with a plurality of grooves, the base is provided with a plurality of grooves I, the grooves and the grooves form a placing cavity in a one-to-one correspondence mode, the buffer springs are arranged in the placing cavity respectively, the base is further provided with a plurality of groups of connecting rod groups, the connecting rod groups are arranged at the outer edge of the base in an annular array mode, the connecting rod groups are formed by two connecting rods, the annular array at the inner edge of the base body is provided with a plurality of groups of connecting groove groups, the connecting groove groups are formed by two connecting grooves, and the end parts of the connecting rods are inserted into the connecting grooves respectively.
3. The novel special long-life grinding tool for sapphire polishing as claimed in claim 2, wherein: the quick connection structure comprises a plurality of buckles and a plurality of buckle holes, the buckle holes are formed in the base body, and the buckle hooks are arranged on the resin disc.
4. The novel special long-life grinding tool for sapphire polishing as claimed in claim 3, wherein: the resin dish is equipped with through-hole one, through-hole one is fallen the inclined plane, the abrasive material layer includes resin bonding layer and diamond layer of polishing, the diamond layer of polishing has many diamond particles to constitute, diamond particle surface all plates the metal clothing.
5. The novel special long-life grinding tool for sapphire polishing as claimed in claim 4, wherein: the diamond particles are distributed in a lump shape, a column shape or a heap shape, and the particle size of the diamond particles is 160-850 mu m.
6. The novel special long-life grinding tool for sapphire polishing as claimed in claim 5, wherein: the thickness of the substrate is 20mm, and the diameter of the substrate is 200 mm.
7. The novel special long-life grinding tool for sapphire polishing as claimed in claim 6, wherein: the thickness of the resin disc is 10mm, the diameter of the resin disc is 200mm, and the diameter of the first through hole is 100 mm.
8. The novel special long-life grinding tool for sapphire polishing as claimed in claim 7, wherein: the height of the circular hole is 1/2 of the thickness of the base body.
9. The novel special long-life grinding tool for sapphire polishing as claimed in claim 8, wherein: the polygon of the polygonal hole is an even number polygon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023286424.9U CN214135627U (en) | 2020-12-31 | 2020-12-31 | Novel special long-life grinding apparatus of sapphire polishing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023286424.9U CN214135627U (en) | 2020-12-31 | 2020-12-31 | Novel special long-life grinding apparatus of sapphire polishing |
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| CN214135627U true CN214135627U (en) | 2021-09-07 |
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| CN202023286424.9U Active CN214135627U (en) | 2020-12-31 | 2020-12-31 | Novel special long-life grinding apparatus of sapphire polishing |
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