CN214014723U

CN214014723U - High-power module heat dissipation shell

Info

Publication number: CN214014723U
Application number: CN202022970785.9U
Authority: CN
Inventors: 张忠臣; 张中彬
Original assignee: Anhui Anjing Semiconductor Co ltd
Current assignee: Anhui Anjing Semiconductor Co ltd
Priority date: 2020-12-11
Filing date: 2020-12-11
Publication date: 2021-08-20
Anticipated expiration: 2030-12-11

Abstract

The utility model discloses a high-power module heat dissipation shell belongs to power module heat dissipation technical field, including device casing and set up a plurality of vents at device casing both ends, the vent upper shield has the fin, and the inner wall top of device casing is equipped with first fan, and the inner wall bottom of device casing is equipped with the second fan. The utility model discloses a two fans blow towards high-power module, blow off hot-blastly through the vent, and hot-blastly blow off the dustproof sheet and circulate outside the device casing, and the fin of aluminium system and dustproof sheet are drawn the heat, play dustproof radiating effect, and the radiating effect is good, and the below opening part that the fin was blocked to the dustproof sheet plays dirt-proof effect, and graphite alkene heat-conducting layer has very good heat conductivility simultaneously, has the heat dissipation function concurrently.

Description

High-power module heat dissipation shell

Technical Field

The utility model relates to a heat dissipation shell especially relates to a high-power module heat dissipation shell, belongs to power module heat dissipation technical field.

Background

The power module is that power electronics encapsulates into a module again according to certain function combination, when the installation module, need not get into the dust in the inside of guaranteeing the shell, has good thermal diffusivity concurrently, the utility model discloses a new solution is proposed to above problem.

How to develop a heat dissipation housing for a high-power module is a problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The main objective of the present invention is to provide a heat dissipation housing for high power module in order to solve the disadvantages of the prior art.

The purpose of the utility model can be achieved by adopting the following technical scheme:

the utility model provides a high-power module heat dissipation shell, includes the device casing and sets up a plurality of vents at device casing both ends, the vent upper shield has the fin, the inner wall top of device casing is equipped with first fan, the inner wall bottom of device casing is equipped with the second fan, the fin includes the baffle and sets up go up the baffle both ends with the side shield that the device casing is connected, the below of fin be equipped with the device casing rotates the dustproof piece of connecting, dustproof piece includes the heat-conducting layer and sets up the outside heat-conducting layer shell of heat-conducting layer.

Preferably, the second fan is disposed directly below the first fan.

Preferably, the dustproof sheet is rotatably connected with the device shell through a rotating shaft.

Preferably, a torsion spring is arranged between the dustproof sheet and the device shell.

Preferably, the angle between the upper baffle and the device shell is 30-50 °.

Preferably, the upper baffle is a rectangular upper baffle, and the side baffles are triangular side blocking pieces.

Preferably, the heat sink is an aluminum heat sink.

Preferably, the dustproof sheet is a cuboid dustproof sheet.

Preferably, the heat conduction layer is a graphene heat conduction layer.

Preferably, the heat conduction layer shell is an aluminum heat conduction layer shell with a hollow interior.

The utility model has the advantages of: according to the utility model discloses a high-power module heat dissipation shell, this high-power module heat dissipation shell bloies towards high-power module through two fans, blows off hot-blast through the vent, hot-blast blow off the dustproof piece and circulate outside the device casing, the fin of aluminium system and dustproof piece are drawn the heat, play dustproof radiating effect, the radiating effect is good, the dustproof piece blocks the below opening part of fin, play dirt-proof effect, graphite alkene heat-conducting layer has very good heat conductivility simultaneously, have the heat dissipation function concurrently.

Drawings

Fig. 1 is a schematic diagram of the overall internal structure of a preferred embodiment of a high power module heat dissipation housing in accordance with the present invention;

fig. 2 is a schematic diagram of a device housing according to a preferred embodiment of the heat dissipation housing of the high power module of the present invention;

fig. 3 is a schematic view of a vent structure of a preferred embodiment of a high power module heat sink housing in accordance with the present invention;

fig. 4 is an enlarged view of the portion a of fig. 1 of a preferred embodiment of a high power module heat sink housing in accordance with the present invention;

fig. 5 is a schematic view of an opening structure of a dust-proof sheet according to a preferred embodiment of the heat dissipation housing of the high power module of the present invention;

fig. 6 is a sectional view of a dust-proof sheet structure according to a preferred embodiment of the heat dissipation housing of the high power module of the present invention.

In the figure: 1-device shell, 2-first fan, 3-second fan, 4-ventilation opening, 5-radiating fin, 6-dustproof fin, 7-upper baffle, 8-side baffle, 9-rotating shaft, 10-torsion spring, 11-heat conduction layer and 12-heat conduction layer shell.

Detailed Description

In order to make the technical solutions of the present invention clearer and clearer for those skilled in the art, the present invention will be described in further detail with reference to the following embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

As shown in fig. 1 to 6, the heat dissipation housing of the high power module provided in this embodiment includes a device housing 1 and a plurality of ventilation openings 4 formed at two ends of the device housing 1, the ventilation openings 4 are covered with heat dissipation fins 5, the top of the inner wall of the device housing 1 is provided with a first fan 2, the bottom of the inner wall of the device housing 1 is provided with a second fan 3, the heat dissipation fins 5 include an upper baffle 7 and side baffles 8 disposed at two ends of the upper baffle 7 and connected to the device housing 1, a dust prevention sheet 6 rotatably connected to the device housing 1 is disposed below the heat dissipation fins 5, and the dust prevention sheet 6 includes a heat conduction layer 11 and a heat conduction layer housing 12 disposed outside the heat conduction layer 11. This high-power module heat dissipation shell bloies towards high-power module through two fans, blow off hot-blast through vent 4, it is hot-blast blow off dustproof sheet 6 and circulate outside device casing 1, the fin 5 of aluminium system and dustproof sheet 6 are drawn the heat, play dustproof radiating effect, the radiating effect is good, dustproof sheet 6 blocks the below opening part of fin 5, play dirt-proof effect, graphite alkene heat-conducting layer has very good heat-conducting property simultaneously, have the heat dissipation function concurrently, second fan 3 sets up under first fan 2. This high-power module heat dissipation shell bloies towards high-power module through two fans, blows off hot-blast through vent 4, and hot-blast blow off dustproof sheet 6 and circulate outside device casing 1, and the fin 5 of aluminium system and dustproof sheet 6 are drawn the heat, play dustproof radiating effect, and the radiating effect is good, and dustproof sheet 6 blocks the below opening part of fin 5, plays dirt-proof effect, and graphite alkene heat-conducting layer has very good heat conductivility simultaneously, has the heat dissipation function concurrently.

In the present embodiment, as shown in fig. 1, 5 and 6, the dust-proof sheet 6 is rotatably connected to the apparatus case 1 through the rotating shaft 9, the torsion spring 10 is provided between the dust-proof sheet 6 and the apparatus case 1, the angle between the upper baffle 7 and the apparatus case 1 is 30 ° to 50 °, the upper baffle 7 is a rectangular upper baffle, and the side baffle 8 is a triangular side baffle. The heat radiating fins 5 are aluminum heat radiating fins, the dust-proof fins 6 are rectangular dust-proof fins, the heat conducting layer 11 is a graphene heat conducting layer, and the heat conducting layer shell 12 is an aluminum heat conducting layer shell with a hollow interior. The dustproof sheet 6 is kept in a horizontal position under the action of the torsion spring 10, convection air blown by the two fans blows the dustproof sheet 6 and blows the dustproof sheet 6 out from between the dustproof sheet 6 and the radiating fins 5, and the aluminum radiating fins 5 have the advantages of light weight, quick heat dissipation and low price. After the fan is turned off, the dustproof sheet 6 restores to the horizontal position under the action of the torsion spring 10, the heat conduction layer 11 of the graphene has very good heat conduction performance, heat generated by the high-power module is absorbed and dissipated outside the shell, and the normal temperature of the module is ensured.

In summary, in the present embodiment, according to the heat dissipation housing of the power module of the present embodiment, the horizontal position of the heat dissipation housing of the power module is maintained by the dust-proof sheet 6 under the action of the torsion spring 10, the convection wind from the two fans blows off the dust-proof sheet 6 and blows out from between the dust-proof sheet 6 and the heat dissipation sheet 5, and the heat dissipation sheet 5 made of aluminum has the advantages of light weight, fast heat dissipation and low cost. After the fan is turned off, the dustproof sheet 6 restores to the horizontal position under the action of the torsion spring 10, the heat conduction layer 11 of the graphene has very good heat conduction performance, heat generated by the high-power module is absorbed and dissipated outside the shell, and the normal temperature of the module is ensured.

The above description is only a further embodiment of the present invention, but the scope of protection of the present invention is not limited thereto, and any person skilled in the art can replace or change the technical solution and the concept of the present invention within the scope of the present invention.

Claims

1. The utility model provides a high-power module heat dissipation shell, includes device casing (1) and sets up a plurality of vents (4) at device casing (1) both ends, vent (4) upper shield has fin (5), its characterized in that, the inner wall top of device casing (1) is equipped with first fan (2), the inner wall bottom of device casing (1) is equipped with second fan (3), fin (5) include overhead gage (7) and set up and are in overhead gage (7) both ends with side shield (8) that device casing (1) is connected, the below of fin (5) be equipped with dust proof sheet (6) that device casing (1) rotated the connection, dust proof sheet (6) include heat-conducting layer (11) and set up heat-conducting layer shell (12) outside heat-conducting layer (11).

2. The heat dissipation housing for high power modules as claimed in claim 1, wherein the second fan (3) is disposed directly below the first fan (2).

3. The heat dissipation housing for high power modules as claimed in claim 1, wherein the dust-proof sheet (6) is rotatably connected to the device housing (1) via a shaft (9).

4. The heat dissipation housing for high power modules as claimed in claim 1, wherein a torsion spring (10) is provided between the dust-proof sheet (6) and the device housing (1).

5. The heat dissipation housing for high power modules as claimed in claim 1, wherein the angle between the upper baffle (7) and the device housing (1) is 30 ° to 50 °.

6. The heat dissipation housing for high power module as claimed in claim 1, wherein the top plate (7) is a rectangular top plate, and the side plates (8) are triangular side flaps.

7. The heat dissipation housing for high power modules as claimed in claim 1, wherein the heat sink (5) is an aluminum heat sink.

8. The heat dissipation housing for high power module as claimed in claim 1, wherein the dust-proof sheet (6) is a rectangular parallelepiped dust-proof sheet.

9. The heat sink housing for high power module according to claim 1, wherein the heat conducting layer (11) is a graphene heat conducting layer.

10. A high power module heat dissipation case as recited in claim 1, wherein the heat conductive layer case (12) is an aluminum heat conductive layer case with a hollow interior.