CN213888739U - Laser cutting adsorbs tool with covering copper base plate warpage blank pressing - Google Patents
Laser cutting adsorbs tool with covering copper base plate warpage blank pressing Download PDFInfo
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- CN213888739U CN213888739U CN202022415104.2U CN202022415104U CN213888739U CN 213888739 U CN213888739 U CN 213888739U CN 202022415104 U CN202022415104 U CN 202022415104U CN 213888739 U CN213888739 U CN 213888739U
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Abstract
The utility model relates to the technical field of machinery. A copper-clad substrate warping and edge pressing adsorption jig for laser cutting comprises a bottom plate and an object stage, wherein the object stage is provided with mounting holes and adsorption holes, and two sides of the bottom plate are provided with symmetrically-arranged pressing plate clamping grooves; the copper-clad ceramic substrate is characterized by also comprising two pressing plates for pressing down the edges of two sides of the short edge of the copper-clad ceramic substrate, wherein the bottoms of the pressing plates are movably arranged in the clamping grooves of the pressing plates, and the two pressing plates are positioned on two sides of the objective table; the positioning pin is arranged on the bottom plate and is positioned on the long side of the adjacent object stage, and the top of the positioning pin is higher than that of the object stage. This patent is pressed down and dowel's spacing to the gravity that covers copper ceramic substrate edge through adsorption affinity, the clamp plate at the edge of adsorption orifice pair copper ceramic substrate, realizes that the copper substrate warpage obviously reduces and firmly adsorbs on the objective table.
Description
Technical Field
The utility model relates to the technical field of machinery, specifically adsorb the tool.
Background
When the product is cut by laser, the product needs to be fixed in advance by adopting a vacuum adsorption mode, and when the operation piece is a flat plate, if the levelness of the flat plate is poor, the two sides are tilted, the stability of adsorption and the precision and the quality of the laser cutting workpiece are obviously affected.
The copper-clad substrate (especially the copper-clad ceramic substrate) is the most excellent packaging material for high-voltage high-power modules in the field of semiconductors. And after the copper-clad ceramic substrate is adsorbed and fixed by the adsorption jig, the copper-clad ceramic substrate is cut into small pieces by a laser cutting mode. Because the copper-clad substrate preparation in-process, face both sides perk slightly, produce certain warpage, this type of copper-clad pottery that has the warpage is when normal cutting, and the steadiness is poor, and the marking off cutting depth is uneven, breaks off the piece when the piece is broken off with the fingers and thumb to the base plate, causes the ceramic chip to be broken easily, takes the manual work to press and makes it level and smooth when adsorbing, but manual process may cause the copper face fish tail, and the damage is done hard and is likely to cause the porcelain to split to also can cause the deformation of operation panel in pressing the in-process. In the prior art, there is no absorption jig improved for a copper-clad substrate with a certain warping degree to solve the above problems.
SUMMERY OF THE UTILITY MODEL
Problem to prior art existence, the utility model provides a laser cutting adsorbs tool with covering copper base plate warpage blank pressing to solve above at least one technical problem.
In order to achieve the purpose, the utility model provides a copper-clad substrate warping and edge pressing adsorption jig for laser cutting, which comprises a bottom plate and an object stage, wherein the object stage is provided with a mounting hole and an adsorption hole;
the copper-clad ceramic substrate clamping groove is characterized by also comprising two pressing plates for pressing the edges of two sides of the short edge of the copper-clad ceramic substrate downwards, the bottoms of the pressing plates are movably arranged in the pressing plate clamping groove, and the two pressing plates are positioned on two sides of the objective table;
still include two at least dowel pins, dowel pin installs on the bottom plate, just dowel pin is located the neighbouring the long avris of objective table, dowel pin's top is higher than the top of objective table.
This patent is pressed down and dowel's spacing to the gravity that covers copper ceramic substrate edge through adsorption affinity, the clamp plate at the edge of adsorption orifice pair copper ceramic substrate, realizes that the copper substrate warpage obviously reduces and firmly adsorbs on the objective table. The cutting quality is ensured, and the copper surface is not scratched or scratched. By adopting the structure, the operation is simple, the use is convenient, and the reduction of the warping degree of the copper-clad ceramic substrate with the warping amount of 1-2mm can be realized.
Further preferably, the pressure plate comprises a lower part and an upper part which are connected in sequence, and the included angle between the lower part and the upper part is 150-170 degrees.
Further preferably, a strip-shaped protrusion is arranged at the top of the upper part. The dead weight of the top is convenient to increase.
Or the top of the upper part is provided with an arc-shaped flanging bent outwards. The sharpness of the outer edge of the pressing plate is avoided while the self weight of the top is increased.
Further preferably, the pressing plate clamping groove is a cuboid groove body, the length of the groove body is larger than that of the pressing plate, the difference value is 2-3mm, and the width of the groove body is 1.5-2.2 times of the thickness of the pressing plate.
The pressing plate can move in the clamping groove of the pressing plate conveniently.
Further preferably, a rubber pad is adhered to the side of the pressure plate adjacent to the stage.
Reduce the abrasion of the ceramic chip at the outer edge of the copper-clad ceramic substrate.
Further preferably, the inner diameter of the mounting hole is larger than that of the adsorption hole, and the object stage is detachably connected with the bottom plate through a screw penetrating through the mounting hole.
The installation is convenient.
Further preferably, there is a gap of 0.5-3mm between the dowel pin and the stage.
Is convenient for ensuring the positioning with the copper-clad ceramic substrate.
Further preferably, the length of the platen is longer than the length of the stage in the front-rear direction.
The pressing effect of the copper-clad ceramic substrate is convenient to ensure.
Drawings
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;
FIG. 2 is a schematic view of a copper-clad substrate according to embodiment 1 of the present invention;
fig. 3 is a schematic structural view of a supporting member and a hollow screw according to embodiment 2 of the present invention in a matching state.
Wherein: 1 is the bottom plate, and 1a is the bottom plate mounting hole, and 1b is the shop bolt, and 2 is the objective table, and 2a is the mounting hole, and 2b is the absorption hole, and 3 is the clamp plate, and 4 are the clamp plate draw-in groove, and 5 are covering the copper base plate, and 6 are the cavity screw, and 61 is the air vent, and 7 is support piece.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
Referring to fig. 1 to 2, in embodiment 1, a copper-clad substrate warping, edge pressing and adsorbing jig for laser cutting includes a base plate 1 and an object stage 2, wherein the object stage 2 is provided with a mounting hole 2a and an adsorbing hole 2b, and two sides of the base plate 1 are provided with pressing plate clamping grooves 4; the copper-clad ceramic substrate clamping device further comprises two pressing plates 3 used for pressing the edges of the two sides of the short edge of the copper-clad ceramic substrate 5 downwards, the bottoms of the pressing plates 3 are movably arranged in the pressing plate clamping grooves 4, and the two pressing plates 3 are located on the two sides of the objective table 2; the positioning device further comprises at least two positioning pins 1b, the positioning pins 1b are installed on the bottom plate 1, the positioning pins 1b are located on the long side adjacent to the object stage 2, and the top of the positioning pins 1b is higher than that of the object stage 2. This patent is through adsorbing the adsorption affinity at hole 2b to the edge of covering copper ceramic substrate 5, clamp plate 3 to covering copper 5 marginal gravity of ceramic substrate and push down and the spacing of dowel 1b, realizes covering copper the obvious reduction of base plate angularity and firmly adsorbs on objective table 2. The cutting quality is ensured, and the copper surface is not scratched or scratched.
By adopting the structure, the operation is simple, the use is convenient, and the reduction of the warping degree of the copper-clad ceramic substrate 5 with the warping amount of 1-2mm can be realized.
The bottom plate 1 is provided with a bottom plate mounting hole 1 a.
The pressing plate 3 comprises a lower part and an upper part which are connected in sequence, and the included angle between the lower part and the upper part is 150-170 degrees.
The top of the upper part is provided with a strip-shaped protrusion. The dead weight of the top is convenient to increase. Or the top of the upper part is provided with a flanging bent outwards in an arc shape. While increasing the top dead weight, avoid the sharpness of the outer edge of the pressing plate 3.
The pressing plate clamping groove 4 is a cuboid groove body, the length of the groove body is larger than that of the pressing plate 3, the difference value is 2-3mm, and the width of the groove body is 1.5-2.2 times of the thickness of the pressing plate 3. The pressing plate 3 can move in the pressing plate clamping groove 4 conveniently.
A rubber pad is adhered to the side of the platen 3 adjacent to the stage 2. Reducing the abrasion of the ceramic sheets at the outer edge of the copper-clad ceramic substrate 5.
The inner diameter of the mounting hole 2a is larger than that of the adsorption hole 2b, and the objective table 2 is detachably connected with the bottom plate 1 through a screw passing through the mounting hole 2 a. The installation is convenient.
A gap of 0.5-3mm is reserved between the positioning pin 1b and the object stage 2. The positioning of the copper-clad ceramic substrate 5 is convenient to ensure.
The length of the platen 3 is longer than the length of the stage 2 in the front-rear direction. The pressing effect of the copper-clad ceramic substrate 5 is convenient to ensure.
The pressing plates are positioned on the left side and the right side of the objective table. The bottom of the pressing plate can be rotationally connected with the pressing plate clamping groove by taking the front and back directions as a rotating center line. For example, the bottom of the pressing plate is provided with an arc-shaped clamping jaw, and a cylindrical clamping block for clamping the arc-shaped clamping jaw is arranged in the clamping groove of the pressing plate. Thereby realizing the free turnover of the pressing plate.
The distance between the clamp groove of the pressure plate and the objective table is 5mm-2 cm. The adsorption holes at the left and right edges are positioned below the upper part of the pressure plate. The adsorption holes at the left edge and the right edge can generate adsorption force on the pressure plate.
When the device is used, a copper-clad substrate (comprising a copper-clad layer and a ceramic chip with the size larger than that of the copper-clad layer) is placed on an object stage, the edge of the copper-clad substrate is tilted upwards, at the moment, a pressing plate is far away from a product to prevent the copper surface from being scratched, the lower part of the pressing plate is vertical to a bottom plate, the upper part of the pressing plate and the bottom plate form an included angle of 0-60 degrees, after a vacuum system is started, under the action of negative pressure or manually stirring the pressing plate, the lower part of the pressing plate and the bottom plate form an included angle of 60-80 degrees, the upper part of the pressing plate moves to and presses the porcelain edge (not contacting with the copper surface) of the copper-clad substrate, the suction force of the vacuum system to the pressing plate is gradually enhanced, the pressure of the pressing plate to the copper-clad substrate is enhanced, the curvature of the copper-clad substrate is reduced, in the process, the suction force of the vacuum system to the edge of the copper-clad substrate is gradually increased, and finally the warping degree of the copper-clad substrate is obviously reduced and is firmly adsorbed on the objective table.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. A copper-clad substrate warping and edge pressing adsorption jig for laser cutting comprises a bottom plate and an object stage, wherein the object stage is provided with a mounting hole and an adsorption hole;
the copper-clad ceramic substrate clamping groove is characterized by also comprising two pressing plates for pressing the edges of two sides of the short edge of the copper-clad ceramic substrate downwards, the bottoms of the pressing plates are movably arranged in the pressing plate clamping groove, and the two pressing plates are positioned on two sides of the objective table;
still include two at least dowel pins, dowel pin installs on the bottom plate, just dowel pin is located the neighbouring the long avris of objective table, dowel pin's top is higher than the top of objective table.
2. The copper-clad substrate warping and edge pressing adsorption jig for laser cutting according to claim 1, characterized in that: the pressure plate comprises a lower part and an upper part which are sequentially connected, and an included angle between the lower part and the upper part is 150-170 degrees.
3. The copper-clad substrate warping and edge pressing adsorption jig for laser cutting according to claim 2, characterized in that: the top of the upper part is provided with a strip-shaped protrusion.
4. The copper-clad substrate warping and edge pressing adsorption jig for laser cutting according to claim 2, characterized in that: the top of the upper part is provided with an arc-shaped flanging bent towards the outside.
5. The copper-clad substrate warping and edge pressing adsorption jig for laser cutting according to claim 1, characterized in that: the pressing plate clamping groove is a cuboid groove body, the length of the groove body is larger than that of the pressing plate, the difference value is 2-3mm, and the width of the groove body is 1.5-2.2 times of the thickness of the pressing plate.
6. The copper-clad substrate warping and edge pressing adsorption jig for laser cutting according to claim 1, characterized in that: and a rubber pad is adhered to the side surface of the pressing plate, which is adjacent to the object stage.
7. The copper-clad substrate warping and edge pressing adsorption jig for laser cutting according to claim 1, characterized in that: the internal diameter of mounting hole is greater than the internal diameter of absorption hole, the objective table through pass the screw of mounting hole with the bottom plate can be dismantled and be connected.
8. The copper-clad substrate warping and edge pressing adsorption jig for laser cutting according to claim 1, characterized in that: a gap of 0.5-3mm is reserved between the positioning pin and the objective table.
9. The copper-clad substrate warping and edge pressing adsorption jig for laser cutting according to claim 1, characterized in that: the length of the pressing plate is greater than the length of the object stage in the front-back direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022415104.2U CN213888739U (en) | 2020-10-27 | 2020-10-27 | Laser cutting adsorbs tool with covering copper base plate warpage blank pressing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022415104.2U CN213888739U (en) | 2020-10-27 | 2020-10-27 | Laser cutting adsorbs tool with covering copper base plate warpage blank pressing |
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| Publication Number | Publication Date |
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| CN213888739U true CN213888739U (en) | 2021-08-06 |
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| CN202022415104.2U Active CN213888739U (en) | 2020-10-27 | 2020-10-27 | Laser cutting adsorbs tool with covering copper base plate warpage blank pressing |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113798709A (en) * | 2021-10-19 | 2021-12-17 | 华天科技(南京)有限公司 | Semi-automatic laser cutting presss from both sides tool |
| CN113911737A (en) * | 2021-11-05 | 2022-01-11 | 华天科技(南京)有限公司 | Overcome guide rail of warpage area baffle |
| CN115954314A (en) * | 2023-03-08 | 2023-04-11 | 四川富乐华半导体科技有限公司 | Pressing jig for ceramic copper-clad substrate |
-
2020
- 2020-10-27 CN CN202022415104.2U patent/CN213888739U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113798709A (en) * | 2021-10-19 | 2021-12-17 | 华天科技(南京)有限公司 | Semi-automatic laser cutting presss from both sides tool |
| CN113911737A (en) * | 2021-11-05 | 2022-01-11 | 华天科技(南京)有限公司 | Overcome guide rail of warpage area baffle |
| CN115954314A (en) * | 2023-03-08 | 2023-04-11 | 四川富乐华半导体科技有限公司 | Pressing jig for ceramic copper-clad substrate |
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Address after: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee after: Jiangsu fulehua Semiconductor Technology Co.,Ltd. Address before: 224200 No. 18 Hongda Road, Chengdong New District, Dongtai City, Yancheng City, Jiangsu Province Patentee before: JIANGSU FULEDE SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |